ウェハーレベルパッケージングの世界市場規模調査＆予測、製品別、用途別、地域別分析、2022-2029年

世界のウエハーレベルパッケージング市場は、2021年に約150億3000万米ドルと評価され、予測期間2022-2029年には18.8％以上の健全な成長率で成長すると予想されています。

ウエハーレベルパッキング（WLP）は、トランジスタ、抵抗、コンデンサなどの電子部品を1つのチップに接続し、集積回路を構築するために、チップパッド上にはんだバンプを堆積させる技術です。製造工程を簡略化するために、ウエハー製造、テスト、パッケージング、バーンインを統合することが可能です。この市場は、エレクトロニクス産業の発展によって牽引されています。市場成長の明るい見通しを支える主な要因の1つは、世界のエレクトロニクス産業の著しい上昇です。さらに、より高速でコンパクトな消費者製品の需要が、市場の拡大に拍車をかけています。その結果、低コストで高性能なパッケージング・ソリューションに対するニーズが高まり、デバイスの機械的保護や構造的サポート、バッテリー寿命の延長が可能になりました。その他の成長促進要因としては、接続されたデバイスをつなぐモノのインターネット（IoT）など、多くの技術的進歩が挙げられます。

Statistaによると、2015年の世界のコンシューマーエレクトロニクス市場の売上は8793億3000万米ドルで、2026年には1兆1,357億2,000万米ドルに達すると予想されています。また、大規模な研究開発（R&D）活動により、予測期間中に市場の有利な成長機会が生まれると予想されています。しかし、初期投資額が高いため、2022年から2029年の予測期間を通じて市場成長は抑制されます。

世界のウエハーレベルパッケージング市場の調査において考慮された主要地域は、アジア太平洋、北米、欧州、中南米、世界のその他の地域です。北米は、この地域における多数の主要な市場プレイヤーの存在により、収益面で市場を独占しています。アジア太平洋地域は、予測期間中に最も高い成長率で成長すると予想されています。これは、アジア太平洋地域全体で世界のウエハーレベルパッケージング市場に有利な成長見通しを生み出す、家電製品の需要増加や技術進歩の高まりといった要因によるものです。

本調査の目的は、近年における様々なセグメントと国の市場規模を定義し、今後数年間の値を予測することです。本レポートは、調査対象国における産業の質的側面と量的側面の両方を取り込むように設計されています。

また、市場の将来的な成長を規定する促進要因や課題などの重要な側面に関する詳細な情報も提供しています。さらに、主要企業の競合情勢や製品提供の詳細な分析とともに、利害関係者が投資するためのミクロ市場の潜在的な機会も組み込んでいます。

目次

第1章 エグゼクティブサマリー

• 市場スナップショット
• 世界・セグメント別市場推定・予測、2019年～2029年
  • ウエハーレベルパッケージング市場：地域別、2019年～2029年
  • ウエハーレベルパッケージング市場：製品別、2019年～2029年
  • ウエハーレベルパッケージング市場：アプリケーション別、2019年～2029年
• 主な動向
• 調査手法
• 調査前提条件

第2章 ウエハーレベルパッケージングの世界市場定義と範囲

• 調査の目的
• 市場の定義と範囲
  • 調査対象範囲
  • 産業の進化
• 調査対象年
• 通貨換算レート

第3章 世界のウエハーレベルパッケージング市場力学

• ウエハーレベルパッケージング市場のインパクト分析（2019-2029年）
  • 市場促進要因
    • 電子産業の台頭
    • 成長する技術的進歩
  • 市場の課題
    • 高い初期投資
  • 市場機会
    • 広範な研究開発（R&D）活動

第4章 世界のウエハーレベルパッケージング市場の産業分析

• ポーターの5フォースモデル
  • 供給企業の交渉力
  • 買い手の交渉力
  • 新規参入業者の脅威
  • 代替品の脅威
  • 競争企業間の敵対関係
• ポーターの5フォースモデルへの未来的アプローチ（2019-2029年）
• PEST分析
  • 政治的
  • 経済的
  • 社会的
  • 技術的
• トップ投資機会
• 主要成功戦略
• 業界専門家別展望
• アナリストの結論・提言

第5章 リスク評価：COVID-19のインパクト

• COVID-19が業界に与える全体的な影響の評価
• COVID-19以前とCOVID-19以後の市場シナリオ

第6章 ウエハーレベルパッケージングの世界市場：製品別

• 市場スナップショット
• ウエハーレベルパッケージングの世界市場：製品別、性能別、ポテンシャル分析
• ウエハーレベルパッケージングの世界市場、製品別推定・予測2019～2029年
• ウエハーレベルパッケージング市場、サブセグメント分析
  • 3次元 TSV WLP
  • 2.5次元 TSV WLP
  • WLCSP
  • ナノWLP
  • その他

第7章 ウエハーレベルパッケージングの世界市場：アプリケーション別

• 市場スナップショット
• ウエハーレベルパッケージングの世界市場：アプリケーション別、性能別、ポテンシャル分析
• ウエハーレベルパッケージングの世界市場、アプリケーション別推定・予測2019-2029
• ウエハーレベルパッケージング市場、サブセグメント分析
  • エレクトロニクス
  • IT・通信分野
  • 産業用
  • 自動車
  • 航空宇宙・防衛
  • ヘルスケア
  • その他

第8章 ウエハーレベルパッケージングの世界市場：地域別分析

• ウエハーレベルパッケージング市場、地域別市場スナップショット
• 北米
  • 米国
    • 製品別の推定・予測、2019年～2029年
    • アプリケーション別の推定・予測、2019年～2029年
  • カナダ
• 欧州ウエハーレベルパッケージング市場スナップショット
  • 英国
  • ドイツ
  • フランス
  • スペイン
  • イタリア
  • その他の欧州地域
• アジア太平洋地域のウエハーレベルパッケージング市場のスナップショット
  • 中国
  • インド
  • 日本
  • オーストラリア
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカのウエハーレベルパッケージング市場のスナップショット
  • ブラジル
  • メキシコ
  • その他のラテンアメリカ地域
• 世界のその他の地域

第9章 競合情報

• トップ市場戦略
• 企業プロファイル
  • Amkor Technology, Inc.
    • 主要情報
    • 概要
    • 財務情報（データの入手状況により異なります）
    • 製品概要
    • 最近の動向
  • Fujitsu
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Deca Technologies
  • Qualcomm Technologies, Inc.
  • Toshiba Corporation
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • ASML Holding N.V
  • Lam Research Corporation

第10章 調査プロセス

• 調査プロセス
  • データマイニング
  • 分析
  • 市場推定
  • バリデーション
  • 出版
• 調査属性
• 調査の前提条件

LIST OF TABLES

• TABLE 1. Global Wafer Level Packaging Market, report scope
• TABLE 2. Global Wafer Level Packaging Market estimates & forecasts by Region 2019-2029 (USD Billion)
• TABLE 3. Global Wafer Level Packaging Market estimates & forecasts by Product 2019-2029 (USD Billion)
• TABLE 4. Global Wafer Level Packaging Market estimates & forecasts by Application 2019-2029 (USD Billion)
• TABLE 5. Global Wafer Level Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 6. Global Wafer Level Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 7. Global Wafer Level Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 8. Global Wafer Level Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 9. Global Wafer Level Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 10. Global Wafer Level Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 11. Global Wafer Level Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 12. Global Wafer Level Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 13. Global Wafer Level Packaging Market by segment, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 14. Global Wafer Level Packaging Market by region, estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 15. U.S. Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 16. U.S. Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 17. U.S. Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 18. Canada Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 19. Canada Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 20. Canada Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 21. UK Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 22. UK Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 23. UK Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 24. Germany Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 25. Germany Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 26. Germany Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 27. France Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 28. France Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 29. France Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 30. Italy Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 31. Italy Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 32. Italy Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 33. Spain Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 34. Spain Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 35. Spain Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 36. RoE Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 37. RoE Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 38. RoE Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 39. China Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 40. China Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 41. China Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 42. India Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 43. India Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 44. India Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 45. Japan Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 46. Japan Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 47. Japan Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 48. South Korea Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 49. South Korea Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 50. South Korea Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 51. Australia Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 52. Australia Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 53. Australia Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 54. RoAPAC Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 55. RoAPAC Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 56. RoAPAC Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 57. Brazil Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 58. Brazil Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 59. Brazil Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 60. Mexico Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 61. Mexico Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 62. Mexico Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 63. RoLA Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 64. RoLA Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 65. RoLA Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 66. Row Wafer Level Packaging Market estimates & forecasts, 2019-2029 (USD Billion)
• TABLE 67. Row Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 68. Row Wafer Level Packaging Market estimates & forecasts by segment 2019-2029 (USD Billion)
• TABLE 69. List of secondary sources, used in the study of global Wafer Level Packaging Market
• TABLE 70. List of primary sources, used in the study of global Wafer Level Packaging Market
• TABLE 71. Years considered for the study
• TABLE 72. Exchange rates considered

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

LIST OF FIGURES

List of figures

• FIG 1. Global Wafer Level Packaging Market, research methodology
• FIG 2. Global Wafer Level Packaging Market, Market estimation techniques
• FIG 3. Global Market size estimates & forecast methods
• FIG 4. Global Wafer Level Packaging Market, key trends 2021
• FIG 5. Global Wafer Level Packaging Market, growth prospects 2022-2029
• FIG 6. Global Wafer Level Packaging Market, porters 5 force model
• FIG 7. Global Wafer Level Packaging Market, pest analysis
• FIG 8. Global Wafer Level Packaging Market, value chain analysis
• FIG 9. Global Wafer Level Packaging Market by segment, 2019 & 2029 (USD Billion)
• FIG 10. Global Wafer Level Packaging Market by segment, 2019 & 2029 (USD Billion)
• FIG 11. Global Wafer Level Packaging Market by segment, 2019 & 2029 (USD Billion)
• FIG 12. Global Wafer Level Packaging Market by segment, 2019 & 2029 (USD Billion)
• FIG 13. Global Wafer Level Packaging Market by segment, 2019 & 2029 (USD Billion)
• FIG 14. Global Wafer Level Packaging Market, regional snapshot 2019 & 2029
• FIG 15. North America Wafer Level Packaging Market 2019 & 2029 (USD Billion)
• FIG 16. Europe Wafer Level Packaging Market 2019 & 2029 (USD Billion)
• FIG 17. Asia Pacific Wafer Level Packaging Market 2019 & 2029 (USD Billion)
• FIG 18. Latin America Wafer Level Packaging Market 2019 & 2029 (USD Billion)
• FIG 19. Global Wafer Level Packaging Market, company Market share analysis (2021)

List of tables and figures and dummy in nature, final lists may vary in the final deliverable

Global Wafer Level Packaging Market is valued at approximately USD 15.03 billion in 2021 and is anticipated to grow with a healthy growth rate of more than 18.8% over the forecast period 2022-2029. Wafer-level packing (WLP) is a technology that involves depositing solder bumps on the chip pads to connect electronic components like transistors, resistors, capacitors, and others onto a single chip to build an integrated circuit. To simplify the production process, it enables integration of the wafer fab, test, packaging, and burn-in. The market is being driven by rise in electronic industry. One of the major factors supporting a positive outlook on market growth is the significant rise of the electronics industry globally. Furthermore, the demand for faster and more compact consumer products is fueling the market's expansion. The overall need for low-cost, high-performance packaging solutions has increased as a result, allowing for the devices' better mechanical protection, structural support, and longer battery life. Other growth-promoting factors include a number of technological advancements, such as the Internet of Things (IoT), that connect connected devices.

According to Statista, in 2015, the revenue of the global consumer electronics market was USD 879.33 billion and the number is anticipated to reach USD 1135.72 billion by 2026. Also, extensive research and development (R&D) activities, are anticipated to create lucrative growth opportunities for the market during forecast period. However, the high initial investment stifles market growth throughout the forecast period of 2022-2029.

The key regions considered for the Global Wafer Level Packaging Market study include Asia Pacific, North America, Europe, Latin America, and Rest of the World. North America dominated the market in terms of revenue, owing to the presence of a large number of key market players in this region. Asia Pacific is expected to grow with the highest growth rate during the forecast period, owing to factors such as rising demand for consumer electronics and growing technological advancement that would create lucrative growth prospects for the global Wafer Level Packaging Market across the Asia Pacific region.

Major market players included in this report are:

Amkor Technology, Inc.

Fujitsu

Jiangsu Changjiang Electronics Technology Co. Ltd

Deca Technologies

Qualcomm Technologies, Inc.

Toshiba Corporation

Tokyo Electron Ltd.

Applied Materials, Inc.

ASML Holding N.V

Lam Research Corporation.

Recent Developments in the Market:

• In 2020, HyperRAM products with wafer-level chip scale packaging were launched by Winbond Electronics Corp., helping to achieve a very small form factor in embedded applications. The new HyperRAM 2.0 products run at a maximum frequency of 200MHz and have a maximum rate of data transmission of 400Mbps at operating voltages of 3V or 1.8V.
• In 2019, Deca Technologies, a provider of wafer-level electronic interconnect solutions, launched its M-Series Fan-out. Wafer Level Packaging (FOWLP) Technology has been utilised by Qualcomm for power management integrated circuit (PMIC) devices in Xiaomi Mi 9, LG G8, and Samsung S10 handsets.

Global Wafer Level Packaging Market Report Scope:

Historical Data: 2019-2020-2021

Base Year for Estimation: 2021

Forecast period: 2022-2029

Report Coverage: Revenue forecast, Company Ranking, Competitive Landscape, Growth factors, and Trends

Segments Covered: Product, Application, Region

Regional Scope: North America; Europe; Asia Pacific; Latin America; Rest of the World

Customization Scope: Free report customization (equivalent up to 8 analyst's working hours) with purchase. Addition or alteration to country, regional & segment scope*

The objective of the study is to define market sizes of different segments & countries in recent years and to forecast the values to the coming years. The report is designed to incorporate both qualitative and quantitative aspects of the industry within countries involved in the study.

The report also caters detailed information about the crucial aspects such as driving factors & challenges which will define the future growth of the market. Additionally, it also incorporates potential opportunities in micro markets for stakeholders to invest along with the detailed analysis of competitive landscape and product offerings of key players. The detailed segments and sub-segment of the market are explained below:

By Product:

3D TSV WLP

• 2.5D TSV WLP

WLCSP

Nano WLP

Others

By Application:

Electronics

IT & Telecommunication

Industrial

Automotive

Aerospace & Defense

Healthcare

Others

By Region:

North America

U.S.

Canada

Europe

UK

Germany

France

Spain

Italy

ROE

Asia Pacific

China

India

Japan

Australia

South Korea

RoAPAC

Latin America

Brazil

Mexico

ROLA

Rest of the World

Table of Contents

Chapter 1. Executive Summary

• 1.1. Market Snapshot
• 1.2. Global & Segmental Market Estimates & Forecasts, 2019-2029 (USD Billion)
  • 1.2.1. Wafer Level Packaging Market, by Region, 2019-2029 (USD Billion)
  • 1.2.2. Wafer Level Packaging Market, by Product, 2019-2029 (USD Billion)
  • 1.2.3. Wafer Level Packaging Market, by Application, 2019-2029 (USD Billion)
• 1.3. Key Trends
• 1.4. Estimation Methodology
• 1.5. Research Assumption

Chapter 2. Global Wafer Level Packaging Market Definition and Scope

• 2.1. Objective of the Study
• 2.2. Market Definition & Scope
  • 2.2.1. Scope of the Study
  • 2.2.2. Industry Evolution
• 2.3. Years Considered for the Study
• 2.4. Currency Conversion Rates

Chapter 3. Global Wafer Level Packaging Market Dynamics

• 3.1. Wafer Level Packaging Market Impact Analysis (2019-2029)
  • 3.1.1. Market Drivers
    • 3.1.1.1. Rise In Electronic Industry
    • 3.1.1.2. Growing Technological Advancements
  • 3.1.2. Market Challenges
    • 3.1.2.1. High Initial Investment
  • 3.1.3. Market Opportunities
    • 3.1.3.1. Extensive Research and Development (R&D) Activities

Chapter 4. Global Wafer Level Packaging Market Industry Analysis

• 4.1. Porter's 5 Force Model
  • 4.1.1. Bargaining Power of Suppliers
  • 4.1.2. Bargaining Power of Buyers
  • 4.1.3. Threat of New Entrants
  • 4.1.4. Threat of Substitutes
  • 4.1.5. Competitive Rivalry
• 4.2. Futuristic Approach to Porter's 5 Force Model (2019-2029)
• 4.3. PEST Analysis
  • 4.3.1. Political
  • 4.3.2. Economical
  • 4.3.3. Social
  • 4.3.4. Technological
• 4.4. Top investment opportunity
• 4.5. Top winning strategies
• 4.6. Industry Experts Prospective
• 4.7. Analyst Recommendation & Conclusion

Chapter 5. Risk Assessment: COVID-19 Impact

• 5.1. Assessment of the overall impact of COVID-19 on the industry
• 5.2. Pre COVID-19 and post COVID-19 Market scenario

Chapter 6. Global Wafer Level Packaging Market, by Product

• 6.1. Market Snapshot
• 6.2. Global Wafer Level Packaging Market by Product, Performance - Potential Analysis
• 6.3. Global Wafer Level Packaging Market Estimates & Forecasts by Product 2019-2029 (USD Billion)
• 6.4. Wafer Level Packaging Market, Sub Segment Analysis
  • 6.4.1. 3D TSV WLP
  • 6.4.2. 2.5D TSV WLP
  • 6.4.3. WLCSP
  • 6.4.4. Nano WLP
  • 6.4.5. Others

Chapter 7. Global Wafer Level Packaging Market, by Application

• 7.1. Market Snapshot
• 7.2. Global Wafer Level Packaging Market by Application, Performance - Potential Analysis
• 7.3. Global Wafer Level Packaging Market Estimates & Forecasts by Application 2019-2029 (USD Billion)
• 7.4. Wafer Level Packaging Market, Sub Segment Analysis
  • 7.4.1. Electronics
  • 7.4.2. IT & Telecommunication
  • 7.4.3. Industrial
  • 7.4.4. Automotive
  • 7.4.5. Aerospace & Defense
  • 7.4.6. Healthcare
  • 7.4.7. Others

Chapter 8. Global Wafer Level Packaging Market, Regional Analysis

• 8.1. Wafer Level Packaging Market, Regional Market Snapshot
• 8.2. North America Wafer Level Packaging Market
  • 8.2.1. U.S. Wafer Level Packaging Market
    • 8.2.1.1. Product breakdown estimates & forecasts, 2019-2029
    • 8.2.1.2. Application breakdown estimates & forecasts, 2019-2029
  • 8.2.2. Canada Wafer Level Packaging Market
• 8.3. Europe Wafer Level Packaging Market Snapshot
  • 8.3.1. U.K. Wafer Level Packaging Market
  • 8.3.2. Germany Wafer Level Packaging Market
  • 8.3.3. France Wafer Level Packaging Market
  • 8.3.4. Spain Wafer Level Packaging Market
  • 8.3.5. Italy Wafer Level Packaging Market
  • 8.3.6. Rest of Europe Wafer Level Packaging Market
• 8.4. Asia-Pacific Wafer Level Packaging Market Snapshot
  • 8.4.1. China Wafer Level Packaging Market
  • 8.4.2. India Wafer Level Packaging Market
  • 8.4.3. Japan Wafer Level Packaging Market
  • 8.4.4. Australia Wafer Level Packaging Market
  • 8.4.5. South Korea Wafer Level Packaging Market
  • 8.4.6. Rest of Asia Pacific Wafer Level Packaging Market
• 8.5. Latin America Wafer Level Packaging Market Snapshot
  • 8.5.1. Brazil Wafer Level Packaging Market
  • 8.5.2. Mexico Wafer Level Packaging Market
  • 8.5.3. Rest of Latin America Wafer Level Packaging Market
• 8.6. Rest of The World Wafer Level Packaging Market

Chapter 9. Competitive Intelligence

• 9.1. Top Market Strategies
• 9.2. Company Profiles
  • 9.2.1. Amkor Technology, Inc.
    • 9.2.1.1. Key Information
    • 9.2.1.2. Overview
    • 9.2.1.3. Financial (Subject to Data Availability)
    • 9.2.1.4. Product Summary
    • 9.2.1.5. Recent Developments
  • 9.2.2. Fujitsu
  • 9.2.3. Jiangsu Changjiang Electronics Technology Co. Ltd
  • 9.2.4. Deca Technologies
  • 9.2.5. Qualcomm Technologies, Inc.
  • 9.2.6. Toshiba Corporation
  • 9.2.7. Tokyo Electron Ltd.
  • 9.2.8. Applied Materials, Inc.
  • 9.2.9. ASML Holding N.V
  • 9.2.10. Lam Research Corporation

Chapter 10. Research Process

• 10.1. Research Process
  • 10.1.1. Data Mining
  • 10.1.2. Analysis
  • 10.1.3. Market Estimation
  • 10.1.4. Validation
  • 10.1.5. Publishing
• 10.2. Research Attributes
• 10.3. Research Assumption