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表紙：ウェハレベルパッケージング（WLP）の世界市場 - 機会分析・産業予測：技術別、タイプ別、エンドユーザー別（2020年～2030年）
市場調査レポート
商品コード
1097733

ウェハレベルパッケージング（WLP）の世界市場 - 機会分析・産業予測：技術別、タイプ別、エンドユーザー別（2020年～2030年）

Wafer Level Packaging Market By Technology, By Type, By End User : Global Opportunity Analysis and Industry Forecast, 2020-2030
出版日: | 発行: Allied Market Research | ページ情報: 英文 315 Pages | 納期: 2～3営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
ウェハレベルパッケージング（WLP）の世界市場 - 機会分析・産業予測：技術別、タイプ別、エンドユーザー別（2020年～2030年）
出版日: 2022年04月01日
発行: Allied Market Research
ページ情報: 英文 315 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のウェーハレベルパッケージ（WLP）の市場規模は、2020年に45億4,000万米ドルとなり、2021年～2030年の間にCAGR18.8%で成長し、2030年には235億6,000万米ドルに達すると予測されています。

市場を牽引しているのは、高速化、小型化、低価格化が進む電化製品の導入増加です。また、従来のパッケージング技術に対するウェーハレベルパッケージングの技術的優位性や、マイクロエレクトロニクス機器における回路の微細化の必要性が、市場の成長を後押ししています。しかし、製造工程が複雑であることが市場の抑制要因となっています。一方、自動車産業におけるウェーハの使用量は増加しており、予測期間中の市場成長を加速させると予想されます。

当レポートでは、世界のウェーハレベルパッケージ（WLP）市場を調査分析し、市場概要、セグメント別・地域別の市場分析、競合情勢、主要企業のプロファイルなどの情報を提供しています。

目次

第1章 イントロダクション

第2章 エグゼクティブサマリー

第3章 市場概要

  • 市場の定義と範囲
  • 主な調査結果
    • 主な投資ポケット
  • ポーターのファイブフォース分析
  • 主要企業のポジショニング
  • 市場力学
    • 促進要因
    • 抑制要因
    • 市場機会
  • 市場におけるCOVID-19の影響分析

第4章 ウェーハレベルパッケージング（WLP）市場：技術別

  • 概要
    • 市場規模と予測
  • ファンインウェーハレベルパッケージング
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • ファンアウトウェーハレベルパッケージング
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別

第5章 ウェーハレベルパッケージング（WLP）市場：タイプ別

  • 概要
    • 市場規模と予測
  • 3D TSV WLP
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • 2.5D TSV WLP
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • WLCSP
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • ナノWLP
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • その他
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別

第6章 ウェーハレベルパッケージング（WLP）市場：エンドユーザー別

  • 概要
    • 市場規模と予測
  • 家電
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • IT・通信
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • 自動車
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • ヘルスケア
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別
  • その他
    • 主要な市場動向、成長要因および機会
    • 市場規模と予測：地域別
    • 市場分析：国別

第7章 ウェーハレベルパッケージング（WLP）市場：地域別

  • 概要
    • 市場規模と予測
  • 北米
    • 主な動向と機会
    • 北米市場の規模と予測：技術別
    • 北米市場の規模と予測：タイプ別
    • 北米市場の規模と予測：エンドユーザー別
    • 北米市場の規模と予測：国別
      • 米国
      • カナダ
      • メキシコ
  • 欧州
    • 主な動向と機会
    • 欧州市場の規模と予測：技術別
    • 欧州市場の規模と予測：タイプ別
    • 欧州市場の規模と予測：エンドユーザー別
    • 欧州市場の規模と予測：国別
      • 英国
      • ドイツ
      • フランス
      • その他欧州
  • アジア太平洋
    • 主な動向と機会
    • アジア太平洋市場の規模と予測：技術別
    • アジア太平洋市場の規模と予測：タイプ別
    • アジア太平洋市場の規模と予測：エンドユーザー別
    • アジア太平洋市場の規模と予測：国別
      • 中国
      • 日本
      • 台湾
      • インド
      • 韓国
      • その他アジア太平洋地域
  • ラテンアメリカ・中東・アフリカ
    • 主な動向と機会
    • ラテンアメリカ・中東・アフリカ市場の規模と予測：技術別
    • ラテンアメリカ・中東・アフリカ市場の規模と予測：タイプ別
    • ラテンアメリカ・中東・アフリカ市場の規模と予測：エンドユーザー別
    • ラテンアメリカ・中東・アフリカ市場の規模と予測：国別
      • ラテンアメリカ
      • 中東
      • アフリカ

第8章 企業情勢

  • イントロダクション
  • 主な成功戦略
  • 主要10社の製品マッピング
  • 競合ダッシュボード
  • 競合ヒートマップ
  • 主な発展

第9章 企業プロファイル

  • Amkor Technology, Inc.
  • Fujitsu
  • Jiangsu Changjiang Electronics Technology Co. Ltd
  • Deca Technologies
  • Qualcomm Technologies, Inc.
  • Toshiba Corporation
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • ASML Holding N.V
  • Lam Research Corporation
図表

LIST OF TABLES

  • TABLE 1. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
  • TABLE 2. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN IN WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)
  • TABLE 3. WAFER LEVEL PACKAGING MARKET FAN IN WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 4. WAFER LEVEL PACKAGING MARKET REVENUE, FOR FAN OUT WAFER LEVEL PACKAGING, BY REGION , 2020-2030,($MILLION)
  • TABLE 5. WAFER LEVEL PACKAGING MARKET FAN OUT WAFER LEVEL PACKAGING BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 6. GLOBAL WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
  • TABLE 7. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 3D TSV WLP, BY REGION , 2020-2030,($MILLION)
  • TABLE 8. WAFER LEVEL PACKAGING MARKET 3D TSV WLP BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 9. WAFER LEVEL PACKAGING MARKET REVENUE, FOR 2.5D TSV WLP, BY REGION , 2020-2030,($MILLION)
  • TABLE 10. WAFER LEVEL PACKAGING MARKET 2.5D TSV WLP BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 11. WAFER LEVEL PACKAGING MARKET REVENUE, FOR WLCSP, BY REGION , 2020-2030,($MILLION)
  • TABLE 12. WAFER LEVEL PACKAGING MARKET WLCSP BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 13. WAFER LEVEL PACKAGING MARKET REVENUE, FOR NANO WLP, BY REGION , 2020-2030,($MILLION)
  • TABLE 14. WAFER LEVEL PACKAGING MARKET NANO WLP BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 15. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)
  • TABLE 16. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 17. GLOBAL WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
  • TABLE 18. WAFER LEVEL PACKAGING MARKET REVENUE, FOR CONSUMER ELECTRONICS, BY REGION , 2020-2030,($MILLION)
  • TABLE 19. WAFER LEVEL PACKAGING MARKET CONSUMER ELECTRONICS BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 20. WAFER LEVEL PACKAGING MARKET REVENUE, FOR IT AND TELECOMMUNICATION, BY REGION , 2020-2030,($MILLION)
  • TABLE 21. WAFER LEVEL PACKAGING MARKET IT AND TELECOMMUNICATION BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 22. WAFER LEVEL PACKAGING MARKET REVENUE, FOR AUTOMOTIVE, BY REGION , 2020-2030,($MILLION)
  • TABLE 23. WAFER LEVEL PACKAGING MARKET AUTOMOTIVE BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 24. WAFER LEVEL PACKAGING MARKET REVENUE, FOR HEALTHCARE, BY REGION , 2020-2030,($MILLION)
  • TABLE 25. WAFER LEVEL PACKAGING MARKET HEALTHCARE BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 26. WAFER LEVEL PACKAGING MARKET REVENUE, FOR OTHERS, BY REGION , 2020-2030,($MILLION)
  • TABLE 27. WAFER LEVEL PACKAGING MARKET OTHERS BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 28. WAFER LEVEL PACKAGING MARKET, BY REGION, 2020-2030,($MILLION)
  • TABLE 29. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
  • TABLE 30. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
  • TABLE 31. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
  • TABLE 32. NORTH AMERICA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 33. U.S. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 34. U.S. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 35. U.S. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 36. CANADA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 37. CANADA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 38. CANADA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 39. MEXICO WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 40. MEXICO WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 41. MEXICO WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 42. EUROPE WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
  • TABLE 43. EUROPE WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
  • TABLE 44. EUROPE WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
  • TABLE 45. EUROPE WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 46. U.K. WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 47. U.K. WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 48. U.K. WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 49. GERMANY WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 50. GERMANY WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 51. GERMANY WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 52. FRANCE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 53. FRANCE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 54. FRANCE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 55. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 56. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 57. REST OF EUROPE WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 58. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
  • TABLE 59. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
  • TABLE 60. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
  • TABLE 61. ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 62. CHINA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 63. CHINA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 64. CHINA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 65. JAPAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 66. JAPAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 67. JAPAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 68. TAIWAN WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 69. TAIWAN WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 70. TAIWAN WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 71. INDIA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 72. INDIA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 73. INDIA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 74. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 75. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 76. SOUTH KOREA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 77. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 78. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 79. REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 80. LAMEA WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY, 2020-2030,($MILLION)
  • TABLE 81. LAMEA WAFER LEVEL PACKAGING MARKET, BY TYPE, 2020-2030,($MILLION)
  • TABLE 82. LAMEA WAFER LEVEL PACKAGING MARKET, BY END USER, 2020-2030,($MILLION)
  • TABLE 83. LAMEA WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 2020-2030,($MILLION)
  • TABLE 84. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 85. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 86. LATIN AMERICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 87. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 88. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 89. MIDDLE EAST WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 90. AFRICA WAFER LEVEL PACKAGING MARKET BY TECHNOLOGY 2020-2030,($MILLION)
  • TABLE 91. AFRICA WAFER LEVEL PACKAGING MARKET BY TYPE 2020-2030,($MILLION)
  • TABLE 92. AFRICA WAFER LEVEL PACKAGING MARKET BY END USER 2020-2030,($MILLION)
  • TABLE 93.AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
  • TABLE 94.AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
  • TABLE 95.AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO
  • TABLE 96.AMKOR TECHNOLOGY, INC.: NET SALES,
  • TABLE 97.AMKOR TECHNOLOGY, INC.: KEY STRATERGIES
  • TABLE 98.FUJITSU: COMPANY SNAPSHOT
  • TABLE 99.FUJITSU: OPERATING SEGMENTS
  • TABLE 100.FUJITSU: PRODUCT PORTFOLIO
  • TABLE 101.FUJITSU: NET SALES,
  • TABLE 102.FUJITSU: KEY STRATERGIES
  • TABLE 103.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: COMPANY SNAPSHOT
  • TABLE 104.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: OPERATING SEGMENTS
  • TABLE 105.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: PRODUCT PORTFOLIO
  • TABLE 106.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: NET SALES,
  • TABLE 107.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD: KEY STRATERGIES
  • TABLE 108.DECA TECHNOLOGIES: COMPANY SNAPSHOT
  • TABLE 109.DECA TECHNOLOGIES: OPERATING SEGMENTS
  • TABLE 110.DECA TECHNOLOGIES: PRODUCT PORTFOLIO
  • TABLE 111.DECA TECHNOLOGIES: NET SALES,
  • TABLE 112.DECA TECHNOLOGIES: KEY STRATERGIES
  • TABLE 113.QUALCOMM TECHNOLOGIES, INC.: COMPANY SNAPSHOT
  • TABLE 114.QUALCOMM TECHNOLOGIES, INC.: OPERATING SEGMENTS
  • TABLE 115.QUALCOMM TECHNOLOGIES, INC.: PRODUCT PORTFOLIO
  • TABLE 116.QUALCOMM TECHNOLOGIES, INC.: NET SALES,
  • TABLE 117.QUALCOMM TECHNOLOGIES, INC.: KEY STRATERGIES
  • TABLE 118.TOSHIBA CORPORATION: COMPANY SNAPSHOT
  • TABLE 119.TOSHIBA CORPORATION: OPERATING SEGMENTS
  • TABLE 120.TOSHIBA CORPORATION: PRODUCT PORTFOLIO
  • TABLE 121.TOSHIBA CORPORATION: NET SALES,
  • TABLE 122.TOSHIBA CORPORATION: KEY STRATERGIES
  • TABLE 123.TOKYO ELECTRON LTD.: COMPANY SNAPSHOT
  • TABLE 124.TOKYO ELECTRON LTD.: OPERATING SEGMENTS
  • TABLE 125.TOKYO ELECTRON LTD.: PRODUCT PORTFOLIO
  • TABLE 126.TOKYO ELECTRON LTD.: NET SALES,
  • TABLE 127.TOKYO ELECTRON LTD.: KEY STRATERGIES
  • TABLE 128.APPLIED MATERIALS, INC.: COMPANY SNAPSHOT
  • TABLE 129.APPLIED MATERIALS, INC.: OPERATING SEGMENTS
  • TABLE 130.APPLIED MATERIALS, INC.: PRODUCT PORTFOLIO
  • TABLE 131.APPLIED MATERIALS, INC.: NET SALES,
  • TABLE 132.APPLIED MATERIALS, INC.: KEY STRATERGIES
  • TABLE 133.ASML HOLDING N.V: COMPANY SNAPSHOT
  • TABLE 134.ASML HOLDING N.V: OPERATING SEGMENTS
  • TABLE 135.ASML HOLDING N.V: PRODUCT PORTFOLIO
  • TABLE 136.ASML HOLDING N.V: NET SALES,
  • TABLE 137.ASML HOLDING N.V: KEY STRATERGIES
  • TABLE 138.LAM RESEARCH CORPORATION: COMPANY SNAPSHOT
  • TABLE 139.LAM RESEARCH CORPORATION: OPERATING SEGMENTS
  • TABLE 140.LAM RESEARCH CORPORATION: PRODUCT PORTFOLIO
  • TABLE 141.LAM RESEARCH CORPORATION: NET SALES,
  • TABLE 142.LAM RESEARCH CORPORATION: KEY STRATERGIES

LIST OF FIGURES

  • FIGURE 1.WAFER LEVEL PACKAGING MARKET SEGMENTATION
  • FIGURE 2.WAFER LEVEL PACKAGING MARKET,2020-2030
  • FIGURE 3.WAFER LEVEL PACKAGING MARKET,2020-2030
  • FIGURE 4. TOP INVESTMENT POCKETS, BY REGION
  • FIGURE 5.PORTER FIVE-1
  • FIGURE 6.PORTER FIVE-2
  • FIGURE 7.PORTER FIVE-3
  • FIGURE 8.PORTER FIVE-4
  • FIGURE 9.PORTER FIVE-5
  • FIGURE 10.TOP PLAYER POSITIONING
  • FIGURE 11.WAFER LEVEL PACKAGING MARKET:DRIVERS, RESTRAINTS AND OPPORTUNITIES
  • FIGURE 12.WAFER LEVEL PACKAGING MARKET,BY TECHNOLOGY,2020(%)
  • FIGURE 13.COMPARATIVE SHARE ANALYSIS OF FAN IN WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 14.COMPARATIVE SHARE ANALYSIS OF FAN OUT WAFER LEVEL PACKAGING WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 15.WAFER LEVEL PACKAGING MARKET,BY TYPE,2020(%)
  • FIGURE 16.COMPARATIVE SHARE ANALYSIS OF 3D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 17.COMPARATIVE SHARE ANALYSIS OF 2.5D TSV WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 18.COMPARATIVE SHARE ANALYSIS OF WLCSP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 19.COMPARATIVE SHARE ANALYSIS OF NANO WLP WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 20.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 21.WAFER LEVEL PACKAGING MARKET,BY END USER,2020(%)
  • FIGURE 22.COMPARATIVE SHARE ANALYSIS OF CONSUMER ELECTRONICS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 23.COMPARATIVE SHARE ANALYSIS OF IT AND TELECOMMUNICATION WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 24.COMPARATIVE SHARE ANALYSIS OF AUTOMOTIVE WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 25.COMPARATIVE SHARE ANALYSIS OF HEALTHCARE WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 26.COMPARATIVE SHARE ANALYSIS OF OTHERS WAFER LEVEL PACKAGING MARKET,2020-2030(%)
  • FIGURE 27.WAFER LEVEL PACKAGING MARKET BY REGION,2020
  • FIGURE 28.U.S. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 29.CANADA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 30.MEXICO WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 31.U.K. WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 32.GERMANY WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 33.FRANCE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 34.REST OF EUROPE WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 35.CHINA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 36.JAPAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 37.TAIWAN WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 38.INDIA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 39.SOUTH KOREA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 40.REST OF ASIA-PACIFIC WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 41.LATIN AMERICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 42.MIDDLE EAST WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 43.AFRICA WAFER LEVEL PACKAGING MARKET,2020-2030($MILLION)
  • FIGURE 44. TOP WINNING STRATEGIES, BY YEAR
  • FIGURE 45. TOP WINNING STRATEGIES, BY DEVELOPMENT
  • FIGURE 46. TOP WINNING STRATEGIES, BY COMPANY
  • FIGURE 47.PRODUCT MAPPING OF TOP 10 PLAYERS
  • FIGURE 48.COMPETITIVE DASHBOARD
  • FIGURE 49.COMPETITIVE HEATMAP OF TOP 10 KEY PLAYERS
  • FIGURE 50.AMKOR TECHNOLOGY, INC..: NET SALES ,($MILLION)
  • FIGURE 51.FUJITSU.: NET SALES ,($MILLION)
  • FIGURE 52.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO. LTD.: NET SALES ,($MILLION)
  • FIGURE 53.DECA TECHNOLOGIES.: NET SALES ,($MILLION)
  • FIGURE 54.QUALCOMM TECHNOLOGIES, INC..: NET SALES ,($MILLION)
  • FIGURE 55.TOSHIBA CORPORATION.: NET SALES ,($MILLION)
  • FIGURE 56.TOKYO ELECTRON LTD..: NET SALES ,($MILLION)
  • FIGURE 57.APPLIED MATERIALS, INC..: NET SALES ,($MILLION)
  • FIGURE 58.ASML HOLDING N.V.: NET SALES ,($MILLION)
  • FIGURE 59.LAM RESEARCH CORPORATION.: NET SALES ,($MILLION)
目次
Product Code: A01367

The global wafer level packaging market size was valued at $4.54 billion in 2020, and is projected to reach $23.56 billion by 2030, registering a CAGR of 18.8% from 2021 to 2030. Wafer-level packaging (WLP) is a technology of packaging an integrated circuit (IC) where all of the packaging process steps are carried out at the wafer level. The components used in assembly (such as bumps) are applied to the wafer pre-dicing in wafer level packaging. However, wafers are diced into independent dies and then combined into a semiconductor package in traditional semiconductor fabrication. WLP provides various benefits such as reduced testing time & cost, easier inventory management, among others.

Growth of the global wafer level packaging market is anticipated to be driven by factors such as rising adoption of high-speed, compact size, and less expensive electronic products. In addition, wafer level packaging's technological superiority over traditional packaging techniques and the impending need of circuit miniaturization in microelectronic devices boost the market growth. However, complexities in manufacturing process acts as a major restraint for the market. On the contrary, rise in use of wafers in the automotive industry is expected to fuel the market growth during the forecast period.

The global wafer level packaging market is segmented on the basis of technology, type, end user, and region. By technology, the market is classified into fan in wafer level packaging, and fan out wafer level packaging. Depending on type, it is categorized into 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and others. On the basis of end user, market is divided into consumer electronics, IT and telecommunication, automotive, healthcare, and others.

Region wise, the wafer level packaging market trends are analyzed across North America (U.S., Canada, and Mexico), Europe (UK, Germany, France, and rest of Europe), Asia-Pacific (China, Japan, Taiwan, India, South Korea, and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa). Asia-Pacific dominated the wafer level packaging market in 2020, and is projected to register significant growth rate during the forecast period, owing to growth in the automotive segment. Also, Asia-Pacific is expected to witnesses significant growth by the end of the forecast period, followed by LAMEA. The key players operating in the market include Amkor Technology Inc, Applied Materials Inc, ASML Holding N.V, Deca Technologies, Fujitsu, Jiangsu Changjiang Electronics Technology Co Ltd, Lam Research Corporation, Qualcomm Technologies Inc, Tokyo Electron Ltd, and Toshiba Corporation.

KEY BENEFITS FOR STAKEHOLDERS

  • This study comprises analytical depiction of the global wafer level packaging market size along with current trends and future estimations to depict imminent investment pockets.
  • The overall wafer level packaging market analysis is determined to understand the profitable trends to gain a stronger foothold.
  • The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
  • The current wafer level packaging market forecast is quantitatively analyzed from 2020 to 2030 to benchmark the financial competency.
  • Porter's five forces analysis illustrates the potency of the buyers and the wafer level packaging market share of key vendors.
  • The report includes the market trends and the market share of key vendors.

Key Market Segments

By Technology

  • Fan in wafer level packaging
  • Fan out wafer level packaging

By Type

  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others

By End User

  • Consumer Electronics
  • IT and Telecommunication
  • Automotive
  • Healthcare
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • U.K.
    • Germany
    • France
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • India
    • South Korea
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa
  • Key Market Players
    • Amkor Technology, Inc.
    • Fujitsu
    • Jiangsu Changjiang Electronics Technology Co. Ltd
    • Deca Technologies
    • Qualcomm Technologies, Inc.
    • Toshiba Corporation
    • Tokyo Electron Ltd.
    • Applied Materials, Inc.
    • ASML Holding N.V
    • Lam Research Corporation

TABLE OF CONTENTS

CHAPTER 1:INTRODUCTION

  • 1.1.Report description
  • 1.2.Key market segments
  • 1.3.Key benefits to the stakeholders
  • 1.4.Research Methodology
    • 1.4.1.Secondary research
    • 1.4.2.Primary research
    • 1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

  • 2.1.Key findings of the study
  • 2.2.CXO Perspective

CHAPTER 3:MARKET OVERVIEW

  • 3.1.Market definition and scope
  • 3.2.Key findings
    • 3.2.1.Top investment pockets
  • 3.3.Porter's five forces analysis
  • 3.4.Top player positioning
  • 3.5.Market dynamics
    • 3.5.1.Drivers
    • 3.5.2.Restraints
    • 3.5.3.Opportunities
  • 3.6.COVID-19 Impact Analysis on the market

CHAPTER 4: WAFER LEVEL PACKAGING MARKET, BY TECHNOLOGY

  • 4.1 Overview
    • 4.1.1 Market size and forecast
  • 4.2 Fan in wafer level packaging
    • 4.2.1 Key market trends, growth factors and opportunities
    • 4.2.2 Market size and forecast, by region
    • 4.2.3 Market analysis by country
  • 4.3 Fan out wafer level packaging
    • 4.3.1 Key market trends, growth factors and opportunities
    • 4.3.2 Market size and forecast, by region
    • 4.3.3 Market analysis by country

CHAPTER 5: WAFER LEVEL PACKAGING MARKET, BY TYPE

  • 5.1 Overview
    • 5.1.1 Market size and forecast
  • 5.2 3D TSV WLP
    • 5.2.1 Key market trends, growth factors and opportunities
    • 5.2.2 Market size and forecast, by region
    • 5.2.3 Market analysis by country
  • 5.3 2.5D TSV WLP
    • 5.3.1 Key market trends, growth factors and opportunities
    • 5.3.2 Market size and forecast, by region
    • 5.3.3 Market analysis by country
  • 5.4 WLCSP
    • 5.4.1 Key market trends, growth factors and opportunities
    • 5.4.2 Market size and forecast, by region
    • 5.4.3 Market analysis by country
  • 5.5 Nano WLP
    • 5.5.1 Key market trends, growth factors and opportunities
    • 5.5.2 Market size and forecast, by region
    • 5.5.3 Market analysis by country
  • 5.6 Others
    • 5.6.1 Key market trends, growth factors and opportunities
    • 5.6.2 Market size and forecast, by region
    • 5.6.3 Market analysis by country

CHAPTER 6: WAFER LEVEL PACKAGING MARKET, BY END USER

  • 6.1 Overview
    • 6.1.1 Market size and forecast
  • 6.2 Consumer Electronics
    • 6.2.1 Key market trends, growth factors and opportunities
    • 6.2.2 Market size and forecast, by region
    • 6.2.3 Market analysis by country
  • 6.3 IT and Telecommunication
    • 6.3.1 Key market trends, growth factors and opportunities
    • 6.3.2 Market size and forecast, by region
    • 6.3.3 Market analysis by country
  • 6.4 Automotive
    • 6.4.1 Key market trends, growth factors and opportunities
    • 6.4.2 Market size and forecast, by region
    • 6.4.3 Market analysis by country
  • 6.5 Healthcare
    • 6.5.1 Key market trends, growth factors and opportunities
    • 6.5.2 Market size and forecast, by region
    • 6.5.3 Market analysis by country
  • 6.6 Others
    • 6.6.1 Key market trends, growth factors and opportunities
    • 6.6.2 Market size and forecast, by region
    • 6.6.3 Market analysis by country

CHAPTER 7: WAFER LEVEL PACKAGING MARKET, BY REGION

  • 7.1 Overview
    • 7.1.1 Market size and forecast
  • 7.2 North America
    • 7.2.1 Key trends and opportunities
    • 7.2.2 North America Market size and forecast, by Technology
    • 7.2.3 North America Market size and forecast, by Type
    • 7.2.4 North America Market size and forecast, by End User
    • 7.2.5 North America Market size and forecast, by country
      • 7.2.5.1 U.S.
      • 7.2.5.1.1 Market size and forecast, by Technology
      • 7.2.5.1.2 Market size and forecast, by Type
      • 7.2.5.1.3 Market size and forecast, by End User
      • 7.2.5.2 Canada
      • 7.2.5.2.1 Market size and forecast, by Technology
      • 7.2.5.2.2 Market size and forecast, by Type
      • 7.2.5.2.3 Market size and forecast, by End User
      • 7.2.5.3 Mexico
      • 7.2.5.3.1 Market size and forecast, by Technology
      • 7.2.5.3.2 Market size and forecast, by Type
      • 7.2.5.3.3 Market size and forecast, by End User
  • 7.3 Europe
    • 7.3.1 Key trends and opportunities
    • 7.3.2 Europe Market size and forecast, by Technology
    • 7.3.3 Europe Market size and forecast, by Type
    • 7.3.4 Europe Market size and forecast, by End User
    • 7.3.5 Europe Market size and forecast, by country
      • 7.3.5.1 U.K.
      • 7.3.5.1.1 Market size and forecast, by Technology
      • 7.3.5.1.2 Market size and forecast, by Type
      • 7.3.5.1.3 Market size and forecast, by End User
      • 7.3.5.2 Germany
      • 7.3.5.2.1 Market size and forecast, by Technology
      • 7.3.5.2.2 Market size and forecast, by Type
      • 7.3.5.2.3 Market size and forecast, by End User
      • 7.3.5.3 France
      • 7.3.5.3.1 Market size and forecast, by Technology
      • 7.3.5.3.2 Market size and forecast, by Type
      • 7.3.5.3.3 Market size and forecast, by End User
      • 7.3.5.4 Rest of Europe
      • 7.3.5.4.1 Market size and forecast, by Technology
      • 7.3.5.4.2 Market size and forecast, by Type
      • 7.3.5.4.3 Market size and forecast, by End User
  • 7.4 Asia-Pacific
    • 7.4.1 Key trends and opportunities
    • 7.4.2 Asia-Pacific Market size and forecast, by Technology
    • 7.4.3 Asia-Pacific Market size and forecast, by Type
    • 7.4.4 Asia-Pacific Market size and forecast, by End User
    • 7.4.5 Asia-Pacific Market size and forecast, by country
      • 7.4.5.1 China
      • 7.4.5.1.1 Market size and forecast, by Technology
      • 7.4.5.1.2 Market size and forecast, by Type
      • 7.4.5.1.3 Market size and forecast, by End User
      • 7.4.5.2 Japan
      • 7.4.5.2.1 Market size and forecast, by Technology
      • 7.4.5.2.2 Market size and forecast, by Type
      • 7.4.5.2.3 Market size and forecast, by End User
      • 7.4.5.3 Taiwan
      • 7.4.5.3.1 Market size and forecast, by Technology
      • 7.4.5.3.2 Market size and forecast, by Type
      • 7.4.5.3.3 Market size and forecast, by End User
      • 7.4.5.4 India
      • 7.4.5.4.1 Market size and forecast, by Technology
      • 7.4.5.4.2 Market size and forecast, by Type
      • 7.4.5.4.3 Market size and forecast, by End User
      • 7.4.5.5 South Korea
      • 7.4.5.5.1 Market size and forecast, by Technology
      • 7.4.5.5.2 Market size and forecast, by Type
      • 7.4.5.5.3 Market size and forecast, by End User
      • 7.4.5.6 Rest of Asia-Pacific
      • 7.4.5.6.1 Market size and forecast, by Technology
      • 7.4.5.6.2 Market size and forecast, by Type
      • 7.4.5.6.3 Market size and forecast, by End User
  • 7.5 LAMEA
    • 7.5.1 Key trends and opportunities
    • 7.5.2 LAMEA Market size and forecast, by Technology
    • 7.5.3 LAMEA Market size and forecast, by Type
    • 7.5.4 LAMEA Market size and forecast, by End User
    • 7.5.5 LAMEA Market size and forecast, by country
      • 7.5.5.1 Latin America
      • 7.5.5.1.1 Market size and forecast, by Technology
      • 7.5.5.1.2 Market size and forecast, by Type
      • 7.5.5.1.3 Market size and forecast, by End User
      • 7.5.5.2 Middle East
      • 7.5.5.2.1 Market size and forecast, by Technology
      • 7.5.5.2.2 Market size and forecast, by Type
      • 7.5.5.2.3 Market size and forecast, by End User
      • 7.5.5.3 Africa
      • 7.5.5.3.1 Market size and forecast, by Technology
      • 7.5.5.3.2 Market size and forecast, by Type
      • 7.5.5.3.3 Market size and forecast, by End User

CHAPTER 8: COMPANY LANDSCAPE

  • 8.1. Introduction
  • 8.2. Top winning strategies
  • 8.3. Product Mapping of Top 10 Player
  • 8.4. Competitive Dashboard
  • 8.5. Competitive Heatmap
  • 8.6. Key developments

CHAPTER 9: COMPANY PROFILES

  • 9.1 Amkor Technology, Inc.
    • 9.1.1 Company overview
    • 9.1.2 Company snapshot
    • 9.1.3 Operating business segments
    • 9.1.4 Product portfolio
    • 9.1.5 Business performance
    • 9.1.6 Key strategic moves and developments
  • 9.2 Fujitsu
    • 9.2.1 Company overview
    • 9.2.2 Company snapshot
    • 9.2.3 Operating business segments
    • 9.2.4 Product portfolio
    • 9.2.5 Business performance
    • 9.2.6 Key strategic moves and developments
  • 9.3 Jiangsu Changjiang Electronics Technology Co. Ltd
    • 9.3.1 Company overview
    • 9.3.2 Company snapshot
    • 9.3.3 Operating business segments
    • 9.3.4 Product portfolio
    • 9.3.5 Business performance
    • 9.3.6 Key strategic moves and developments
  • 9.4 Deca Technologies
    • 9.4.1 Company overview
    • 9.4.2 Company snapshot
    • 9.4.3 Operating business segments
    • 9.4.4 Product portfolio
    • 9.4.5 Business performance
    • 9.4.6 Key strategic moves and developments
  • 9.5 Qualcomm Technologies, Inc.
    • 9.5.1 Company overview
    • 9.5.2 Company snapshot
    • 9.5.3 Operating business segments
    • 9.5.4 Product portfolio
    • 9.5.5 Business performance
    • 9.5.6 Key strategic moves and developments
  • 9.6 Toshiba Corporation
    • 9.6.1 Company overview
    • 9.6.2 Company snapshot
    • 9.6.3 Operating business segments
    • 9.6.4 Product portfolio
    • 9.6.5 Business performance
    • 9.6.6 Key strategic moves and developments
  • 9.7 Tokyo Electron Ltd.
    • 9.7.1 Company overview
    • 9.7.2 Company snapshot
    • 9.7.3 Operating business segments
    • 9.7.4 Product portfolio
    • 9.7.5 Business performance
    • 9.7.6 Key strategic moves and developments
  • 9.8 Applied Materials, Inc.
    • 9.8.1 Company overview
    • 9.8.2 Company snapshot
    • 9.8.3 Operating business segments
    • 9.8.4 Product portfolio
    • 9.8.5 Business performance
    • 9.8.6 Key strategic moves and developments
  • 9.9 ASML Holding N.V
    • 9.9.1 Company overview
    • 9.9.2 Company snapshot
    • 9.9.3 Operating business segments
    • 9.9.4 Product portfolio
    • 9.9.5 Business performance
    • 9.9.6 Key strategic moves and developments
  • 9.10 Lam Research Corporation
    • 9.10.1 Company overview
    • 9.10.2 Company snapshot
    • 9.10.3 Operating business segments
    • 9.10.4 Product portfolio
    • 9.10.5 Business performance
    • 9.10.6 Key strategic moves and developments