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ウエハーレベルパッケージング市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年予測

Wafer Level Packaging Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日: | 発行: IMARC | ページ情報: 英文 141 Pages | 納期: 2～3営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.76円
ウエハーレベルパッケージング市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年予測
出版日: 2023年03月18日
発行: IMARC
ページ情報: 英文 141 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

市場概要：

世界のウエハーレベルパッケージング市場規模は、2022年に48億米ドルに達しました。今後、IMARC Groupは、2023年から2028年の間に18.3%の成長率（CAGR）を示し、2028年までに132億米ドルに達すると予測しています。

ウエハーレベルパッケージング（WLP）とは、電子接続や集積回路（IC）の保護層を追加するために使用されるパッケージングソリューションのことを指します。マイクロフォン、圧力センサー、加速度計、ジャイロスコープ、コンデンサー、抵抗器、トランジスターなどのデバイスに使用されています。一般的に使用されるWLPの統合タイプには、ファンアウト（FO）、ファンイン（FI）、フリップチップ、3D FOWLPなどがあります。これらのソリューションは、ウエハーを個々のダイにダイシングしてパッケージングするのではなく、デバイスのウエハーレベルで使用されます。これにより、ウエハチップの小型化、製造プロセスの合理化、チップの機能向上など、さまざまなメリットが得られます。また、極薄ウエハーは、放熱性や性能の向上、フォームファクターの縮小、電力消費の最小化などを実現します。

世界中のエレクトロニクス産業の著しい成長は、市場成長に明るい展望をもたらす主要な要因の一つです。さらに、よりコンパクトで高速なコンシューマーエレクトロニクスへの要求が高まっていることも、市場の成長を後押ししています。また、機械的保護、構造的サポート、バッテリー寿命の延長を目的とした、コスト効率に優れた高性能パッケージング・ソリューションへの需要も高まっています。さらに、コネクテッドデバイスとモノのインターネット（IoT）の統合など、さまざまな技術的進歩が、他の成長促進要因として作用しています。例えば、WLPは、自動運転自動車のレーダーシステムの製造に広く使用されています。また、ヘルスケア分野では、さまざまなウェアラブルデバイスの製造に使用されています。その他の要因としては、マイクロエレクトロニクス機器における回路の微細化の進展や、広範な研究開発活動が挙げられ、市場をさらに牽引すると予想されます。

本レポートで回答した主な質問

  • ウエハーレベルパッケージングの世界市場はこれまでどのように推移し、今後数年間はどのように推移するのか？
  • COVID-19は世界のウエハーレベルパッケージング市場にどのような影響を与えたか？
  • 主要な地域市場とは？
  • パッケージングタイプに基づく市場の内訳は？
  • 最終使用産業に基づく市場の内訳は？
  • 業界のバリューチェーンにおける様々なステージは何か？
  • 業界における主要な促進要因と課題は何か？
  • 世界のウエハーレベルパッケージング市場の構造と主要企業は？
  • 業界における競合の程度は？

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査目的
  • 利害関係者
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 予測手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要産業動向

第5章 ウエハーレベルパッケージングの世界市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 パッケージング技術別の市場内訳

  • 3D TSV WLP
    • 市場動向
    • 市場予測
  • 2.5D TSV WLP
    • 市場動向
    • 市場予測
  • WLCSP
    • 市場動向
    • 市場予測
  • ナノWLP
    • 市場動向
    • 市場展望
  • その他
    • 市場動向
    • 市場予測

第7章 エンドユース産業別市場内訳

  • 航空宇宙・防衛
    • 市場動向
    • 市場予測
  • コンシューマーエレクトロニクス
    • 市場動向
    • 市場予測
  • IT・通信分野
    • 市場動向
    • 市場予測
  • ヘルスケア
    • 市場動向
    • 市場予測
  • 自動車関連
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第8章 地域別市場内訳

  • 北米
    • 米国
      • 市場動向
      • 市場予測
    • カナダ
      • 市場動向
      • 市場予測
  • アジア太平洋地域
    • 中国
      • 市場動向
      • 市場予測
    • 日本
      • 市場動向
      • 市場予測
    • インド
      • 市場動向
      • 市場予測
    • 韓国
      • 市場動向
      • 市場予測
    • オーストラリア
      • 市場動向
      • 市場予測
    • インドネシア
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • 欧州
    • ドイツ
      • 市場動向
      • 市場予測
    • フランス
      • 市場動向
      • 市場予測
    • 英国
      • 市場動向
      • 市場予測
    • イタリア
      • 市場動向
      • 市場予測
    • スペイン
      • 市場動向
      • 市場予測
    • ロシア
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • ラテンアメリカ
    • ブラジル
      • 市場動向
      • 市場予測
    • メキシコ
      • 市場動向
      • 市場予測
    • その他
      • 市場動向
      • 市場予測
  • 中東・アフリカ地域
    • 市場動向
    • 国別市場内訳
    • 市場予測

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の度合い
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Amkor Technology Inc.
    • China Wafer Level CSP Co. Ltd.
    • Chipbond Technology Corporation
    • Deca Technologies Inc.（Infineon Technologies AG）
    • Fujitsu Limited
    • IQE PLC
    • JCET Group Co. Ltd.
    • Siliconware Precision Industries Co. Ltd.（Advanced Semiconductor Engineering Inc.）
    • Tokyo Electron Ltd.
    • Toshiba Corporation
図表

List of Figures

  • Figure 1: Global: Wafer Level Packaging Market: Major Drivers and Challenges
  • Figure 2: Global: Wafer Level Packaging Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: Wafer Level Packaging Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: Wafer Level Packaging Market: Breakup by Packaging Technology (in %), 2022
  • Figure 5: Global: Wafer Level Packaging Market: Breakup by End Use Industry (in %), 2022
  • Figure 6: Global: Wafer Level Packaging Market: Breakup by Region (in %), 2022
  • Figure 7: Global: Wafer Level Packaging (3D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 8: Global: Wafer Level Packaging (3D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 9: Global: Wafer Level Packaging (2.5D TSV WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: Wafer Level Packaging (2.5D TSV WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: Wafer Level Packaging (WLCSP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: Wafer Level Packaging (WLCSP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: Wafer Level Packaging (Nano WLP) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: Wafer Level Packaging (Nano WLP) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: Wafer Level Packaging (Aerospace and Defense) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: Wafer Level Packaging (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: Wafer Level Packaging (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: Wafer Level Packaging (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: Wafer Level Packaging (IT & Telecommunication) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: Wafer Level Packaging (IT & Telecommunication) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: Wafer Level Packaging (Healthcare) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: Wafer Level Packaging (Healthcare) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: Global: Wafer Level Packaging (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: Global: Wafer Level Packaging (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: Global: Wafer Level Packaging (Others) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: Global: Wafer Level Packaging (Others) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: North America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: United States: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 31: United States: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 32: Canada: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 33: Canada: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 34: North America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Asia-Pacific: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: China: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 37: China: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 38: Japan: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 39: Japan: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 40: India: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 41: India: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 42: South Korea: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 43: South Korea: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 44: Australia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 45: Australia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 46: Indonesia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 47: Indonesia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 48: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 49: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 50: Asia-Pacific: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: Europe: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: Germany: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 53: Germany: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 54: France: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 55: France: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 56: United Kingdom: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 57: United Kingdom: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 58: Italy: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 59: Italy: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 60: Spain: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 61: Spain: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 62: Russia: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 63: Russia: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 64: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 65: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 66: Europe: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Latin America: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Brazil: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 69: Brazil: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 70: Mexico: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 71: Mexico: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 72: Others: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 73: Others: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 74: Latin America: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 75: Middle East and Africa: Wafer Level Packaging Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 76: Middle East and Africa: Wafer Level Packaging Market: Breakup by Country (in %), 2022
  • Figure 77: Middle East and Africa: Wafer Level Packaging Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 78: Global: Wafer Level Packaging Industry: SWOT Analysis
  • Figure 79: Global: Wafer Level Packaging Industry: Value Chain Analysis
  • Figure 80: Global: Wafer Level Packaging Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Wafer Level Packaging Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: Wafer Level Packaging Market Forecast: Breakup by Packaging Technology (in Million US$), 2023-2028
  • Table 3: Global: Wafer Level Packaging Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
  • Table 4: Global: Wafer Level Packaging Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 5: Global: Wafer Level Packaging Market: Competitive Structure
  • Table 6: Global: Wafer Level Packaging Market: Key Players
目次
Product Code: SR1623A186_Report

Market Overview:

The global wafer level packaging market size reached US$ 4.8 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 13.2 Billion by 2028, exhibiting a growth rate (CAGR) of 18.3% during 2023-2028.

The wafer-level packaging (WLP) refers to a packaging solution used for adding a protective layer of electronic connections and integrated circuits (ICs). It is used for devices, such as microphones, pressure sensors, accelerometers, gyroscopes, capacitors, resistors and transistors. Some of the commonly used WLP integration types include fan-out (FO), fan-in (FI), flip-chip, 3D FOWLP. These solutions are used at the wafer-level of the device, instead of dicing the wafer into the individual die and packaging them. This offers various benefits, such as a reduction in the size of the wafer chips, streamlining of the manufacturing processes and improvements in chip functionalities. The ultrathin wafers also provide improved heat dissipation and performance, form factor reduction and minimal power consumption.

Significant growth in the electronics industry across the globe represents one of the key factors creating a positive outlook on the market growth. Furthermore, the increasing requirement for more compact and faster consumer electronics is also driving the market growth. This has also enhanced the overall demand for cost-effective and high-performance packaging solutions for enhanced mechanical protection, structural support and extended battery life of the devices. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), are acting as other growth-inducing factors. For instance, WLP is widely used for the manufacturing of radar systems in self-driving automobiles. It is also used in the healthcare sector for the production of various wearable devices. Other factors, including increasing circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market further.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global wafer level packaging market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on packaging technology and end use industry.

Breakup by Packaging Technology:

  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others

Breakup by End Use Industry:

  • Aerospace and Defense
  • Consumer Electronics
  • IT & Telecommunication
  • Healthcare
  • Automotive
  • Others

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Amkor Technology Inc., China Wafer Level CSP Co. Ltd., Chipbond Technology Corporation, Deca Technologies Inc. (Infineon Technologies AG), Fujitsu Limited, IQE PLC, JCET Group Co. Ltd., Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.), Tokyo Electron Ltd. and Toshiba Corporation.

Key Questions Answered in This Report:

  • How has the global wafer level packaging market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global wafer level packaging market?
  • What are the key regional markets?
  • What is the breakup of the market based on the packaging type?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global wafer level packaging market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Wafer Level Packaging Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Packaging Technology

  • 6.1 3D TSV WLP
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 2.5D TSV WLP
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 WLCSP
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 Nano WLP
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 Others
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Aerospace and Defense
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Consumer Electronics
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IT & Telecommunication
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Healthcare
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Amkor Technology Inc.
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
      • 13.3.1.4 SWOT Analysis
    • 13.3.2 China Wafer Level CSP Co. Ltd.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 SWOT Analysis
    • 13.3.3 Chipbond Technology Corporation
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
      • 13.3.3.3 SWOT Analysis
    • 13.3.4 Deca Technologies Inc. (Infineon Technologies AG)
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Fujitsu Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
      • 13.3.5.4 SWOT Analysis
    • 13.3.6 IQE PLC
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
      • 13.3.6.3 SWOT Analysis
    • 13.3.7 JCET Group Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 SWOT Analysis
    • 13.3.8 Siliconware Precision Industries Co. Ltd. (Advanced Semiconductor Engineering Inc.)
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
      • 13.3.8.3 Financials
    • 13.3.9 Tokyo Electron Ltd.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Toshiba Corporation
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
      • 13.3.10.4 SWOT Analysis