ウエハーレベルパッケージング市場の2030年までの予測： パッケージタイプ別、相互接続技術別、エンドユーザー別、地域別の世界分析

Stratistics MRCによると、世界のウエハーレベルパッケージング市場は2024年に95億8,000万米ドルを占め、予測期間中のCAGRは20.8%で2030年には297億8,000万米ドルに達する見込みです。

ウエハーレベルパッケージング（WLP）は、チップを分離する前にウエハーレベルで封止する最先端の半導体パッケージング手法です。一般的にウエハー切断後に行われる従来のパッケージング手順を不要にすることで、この技術には小型化、性能向上、安価な生産コストといった利点があります。さらに、WLPはコンポーネントを近接して配置するため、高密度の相互接続、より優れた熱管理、より高速な信号伝送を可能にするため、ウェアラブル、スマートフォン、車載用電子機器のような小型で高性能なデバイスに特に適しています。

世界半導体貿易統計（WSTS）によると、ウエハーレベルパッケージングを含む世界の半導体市場は大幅な成長が見込まれ、2021年の売上高は5,510億米ドルに達すると予想されています。

優れた性能を持つチップへの需要

ウエハーレベルパッケージングの採用は、現代の電子機器に対する、より高い帯域幅、より速い処理速度、より低い消費電力への要求の高まりによって推進されています。特にゲーム、通信、高性能コンピューティングなどの業界では、チップが高度化するにつれて、これらの要求を満たすパッケージングソリューションが必要になっています。さらにWLPは、電力効率の改善、シグナルインテグリティの向上、電気的性能の向上など、従来のパッケージング技術にはない多くの利点を提供します。

高額な初期投資コスト

特殊なツールや技術にかかる高額な初期費用は、ウエハーレベルパッケージング採用の大きな障害の一つです。ウエハーレベルパッケージングを導入するには、ダイテスト、封止、ウエハーボンディング用の専用ツールなど、高度な製造インフラが必要です。さらに、これらのシステムは、特に必要な機械を購入する資金に乏しい中小企業にとっては、高額になる可能性があります。方法を改善し、目標とする性能基準を達成するために、このプロセスには高い研究開発（R&D）費用もかかります。

ウェアラブル技術と医療機器の開発

ウエハーレベルパッケージングは、特にウェアラブル医療技術の人気が高まっていることから、医療機器分野で大きな可能性を秘めています。これらの小型軽量機器は、血糖値、心拍数、脳活動などの健康情報を追跡するために、強力なセンサー、プロセッサー、通信モジュールを必要とします。非侵襲的なウェアラブル健康モニタリング・デバイスの開発は、これらの多様なコンポーネントを単一のコンパクトなパッケージにまとめる能力にかかっており、WLPはそれを可能にします。さらに、WLPは、限られたスペースに収まる小型の電子機器を必要とする診断機器や、限られたスペースで確実に機能しなければならない埋め込み型医療機器にも適用できます。

他のパッケージング技術からの競合圧力

同等の利点を提供できる代替の最先端パッケージング技術が、ウエハーレベルパッケージング市場に深刻な脅威を与えています。環境負荷の低減、性能の向上、費用対効果といった同等の利点を持つシステムインパッケージ（SiP）、3Dパッケージング、フリップチップ、チップオンボード（COB）といった技術が市場シェアを争っています。さらに、メモリモジュールや高性能コンピューティングのように、垂直統合が望まれるアプリケーションでは、複数のチップを垂直に積み重ねる3Dパッケージの方が適している場合もあります。

COVID-19の影響：

ウエハーレベルパッケージング（WLP）は、主に世界サプライチェーンと半導体製造プロセスを混乱させたCOVID-19パンデミックの影響を大きく受けた。労働力不足、渡航制限、工場閉鎖などにより、必要不可欠な材料の生産遅延やリードタイムの長期化が生じ、WLPソリューションのタイムリーな提供に影響が出ました。さらに、パンデミックの初期段階では、経済の不確実性とエレクトロニクス製品に対する消費者需要の低下により、市場の拡大が一時的に鈍化しました。しかし、企業が新常態に適応するにつれて、医療、自動車、民生用電子機器の需要が増加し、WLPのような最先端のパッケージング技術の使用が必要となった。

ウエハーレベルチップスケールパッケージング（WLCSP）セグメントが予測期間中最大となる見込み

ウエハレベルパッケージング（WLP）市場は、ウエハレベルチップスケールパッケージング（WLCSP）セグメントによって支配されると予想されます。WLCSPは、従来のパッケージング技術に代わる小型で手頃な価格の効果的なパッケージングソリューションを提供するため、広く利用されています。WLCSPは、余分な部品をほとんど使わず、チップをそのままパッケージに実装するため、デバイスのサイズと重量が大幅に削減され、ウェアラブル、スマートフォン、家電アプリケーションに最適です。さらに、WLCSPの普及は、より小型で高性能な電子機器に対する需要の高まりが後押ししています。

銅柱セグメントは予測期間中最も高いCAGRが見込まれる

ウエハーレベルパッケージング（WLP）市場において、銅柱セグメントはCAGRが最も高くなると予想されます。銅ピラー技術は半導体デバイスの性能と信頼性を高めることができるため、特に高密度で高性能なアプリケーションで急速に普及しています。さらにこのパッケージ技術は、従来のはんだバンプの代わりに銅ピラーを使うことで、優れた耐エレクトロマイグレーション性、機械的強度の向上、熱伝導率の改善をもたらします。このような利点から、銅ピラーパッケージングはハイパフォーマンスコンピューティング、車載エレクトロニクス、5Gなどの最先端用途に特に適しています。

最大のシェアを持つ地域：

アジア太平洋（APAC）地域は、中国、日本、韓国、台湾など重要な半導体製造拠点があるため、ウエハーレベルパッケージング（WLP）市場で最大のシェアを占めています。ASEグループ、サムスン、TSMCなど、電子・半導体分野の大企業はアジアに拠点を置いています。より速く、よりコンパクトで、より効果的な電子機器に対する需要の高まりに対応するため、これらの企業はWLPのような最先端のパッケージング技術に多額の投資を行っています。さらに、この地域の強固な製造基盤は、自動車、通信、家電産業における急速な技術革新と採用とともに、WLP市場におけるアジア太平洋地域の継続的な優位性を支えています。

CAGRが最も高い地域：

ウエハーレベルパッケージング（WLP）市場は、北米地域で最も高いCAGRで成長すると予測されています。特に5G、無人運転車、モノのインターネット（IoT）の普及に伴い、家電、ヘルスケア、自動車、通信などの分野で高度な半導体パッケージングに対する需要が高まっています。パッケージング技術革新の最前線に立つ数多くのトップ半導体企業や研究機関は北米に拠点を置いています。さらに、洗練されたWLPソリューションへのニーズは、データセンター、人工知能（AI）、高性能コンピューティングの利用拡大によってさらに加速しています。

無料のカスタマイズ提供：

本レポートをご購読のお客様には、以下の無料カスタマイズオプションのいずれかをご利用いただけます：

• 企業プロファイル
  • 追加市場企業の包括的プロファイリング（3社まで）
  • 主要企業のSWOT分析（3社まで）
• 地域セグメンテーション
  • 顧客の関心に応じた主要国の市場推計・予測・CAGR（注：フィージビリティチェックによる）
• 競合ベンチマーキング
  • 製品ポートフォリオ、地理的プレゼンス、戦略的提携に基づく主要企業のベンチマーキング

目次

第1章 エグゼクティブサマリー

第2章 序文

• 概要
• ステークホルダー
• 調査範囲
• 調査手法
  • データマイニング
  • データ分析
  • データ検証
  • 調査アプローチ
• 調査情報源
  • 1次調査情報源
  • 2次調査情報源
  • 前提条件

第3章 市場動向分析

• 促進要因
• 抑制要因
• 機会
• 脅威
• 技術分析
• エンドユーザー分析
• 新興市場
• COVID-19の影響

第4章 ポーターのファイブフォース分析

• 供給企業の交渉力
• 買い手の交渉力
• 代替品の脅威
• 新規参入業者の脅威
• 競争企業間の敵対関係

第5章 世界のウエハーレベルパッケージング市場：パッケージタイプ別

• ファンインウエハーレベルパッケージング（FI-WLP）
• ファンアウトウエハーレベルパッケージング（FO-WLP）
• 3D TSV ウエハーレベルパッケージング
• 2.5D TSV ウエハーレベルパッケージング
• ウエハーレベルチップスケールパッケージ（WLCSP）

第6章 世界のウエハーレベルパッケージング市場：相互接続技術別

• Si貫通電極（TSV）
• はんだバンプ
• 銅ピラー
• フリップチップ

第7章 世界のウエハーレベルパッケージング市場：エンドユーザー別

• 家電
• IT・通信
• 自動車
• 産業
• 航空宇宙および防衛
• ヘルスケア
• その他のエンドユーザー

第8章 世界のウエハーレベルパッケージング市場：地域別

• 北米
  • 米国
  • カナダ
  • メキシコ
• 欧州
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン
  • その他欧州
• アジア太平洋
  • 日本
  • 中国
  • インド
  • オーストラリア
  • ニュージーランド
  • 韓国
  • その他アジア太平洋地域
• 南米
  • アルゼンチン
  • ブラジル
  • チリ
  • その他南米
• 中東・アフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • カタール
  • 南アフリカ
  • その他中東とアフリカ

第9章 主な発展

• 契約、パートナーシップ、コラボレーション、合弁事業
• 買収と合併
• 新製品発売
• 事業拡大
• その他の主要戦略

第10章 企業プロファイリング

• Amkor Technology, Inc.
• Fujitsu Limited
• Nordson Corporation
• Toshiba Corporation
• Lam Research Corporation
• Qualcomm Technologies, Inc.
• Siliconware Precision Industries Co., Ltd.
• Deca Technologies, Inc
• Nemotek Technology Inc.
• Infineon Technologies AG
• Taiwan Semiconductor Manufacturing Company Limited
• KLA Corporation
• Applied Materials, Inc.
• ChipMOS Technologies Inc.
• Tokyo Electron Ltd.

List of Tables

• Table 1 Global Wafer Level Packaging Market Outlook, By Region (2022-2030) ($MN)
• Table 2 Global Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 3 Global Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 4 Global Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 5 Global Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 6 Global Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 7 Global Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 8 Global Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 9 Global Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 10 Global Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 11 Global Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 12 Global Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 13 Global Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 14 Global Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 15 Global Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 16 Global Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 17 Global Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 18 Global Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 19 Global Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 20 Global Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
• Table 21 North America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
• Table 22 North America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 23 North America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 24 North America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 25 North America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 26 North America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 27 North America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 28 North America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 29 North America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 30 North America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 31 North America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 32 North America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 33 North America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 34 North America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 35 North America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 36 North America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 37 North America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 38 North America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 39 North America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 40 North America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
• Table 41 Europe Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
• Table 42 Europe Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 43 Europe Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 44 Europe Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 45 Europe Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 46 Europe Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 47 Europe Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 48 Europe Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 49 Europe Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 50 Europe Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 51 Europe Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 52 Europe Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 53 Europe Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 54 Europe Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 55 Europe Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 56 Europe Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 57 Europe Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 58 Europe Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 59 Europe Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 60 Europe Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
• Table 61 Asia Pacific Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
• Table 62 Asia Pacific Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 63 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 64 Asia Pacific Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 65 Asia Pacific Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 66 Asia Pacific Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 67 Asia Pacific Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 68 Asia Pacific Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 69 Asia Pacific Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 70 Asia Pacific Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 71 Asia Pacific Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 72 Asia Pacific Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 73 Asia Pacific Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 74 Asia Pacific Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 75 Asia Pacific Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 76 Asia Pacific Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 77 Asia Pacific Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 78 Asia Pacific Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 79 Asia Pacific Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 80 Asia Pacific Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
• Table 81 South America Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
• Table 82 South America Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 83 South America Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 84 South America Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 85 South America Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 86 South America Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 87 South America Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 88 South America Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 89 South America Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 90 South America Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 91 South America Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 92 South America Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 93 South America Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 94 South America Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 95 South America Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 96 South America Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 97 South America Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 98 South America Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 99 South America Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 100 South America Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)
• Table 101 Middle East & Africa Wafer Level Packaging Market Outlook, By Country (2022-2030) ($MN)
• Table 102 Middle East & Africa Wafer Level Packaging Market Outlook, By Package Type (2022-2030) ($MN)
• Table 103 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-in Wafer Level Packaging (FI-WLP) (2022-2030) ($MN)
• Table 104 Middle East & Africa Wafer Level Packaging Market Outlook, By Fan-out Wafer Level Packaging (FO-WLP) (2022-2030) ($MN)
• Table 105 Middle East & Africa Wafer Level Packaging Market Outlook, By 3D TSV WLP (2022-2030) ($MN)
• Table 106 Middle East & Africa Wafer Level Packaging Market Outlook, By 2.5D TSV WLP (2022-2030) ($MN)
• Table 107 Middle East & Africa Wafer Level Packaging Market Outlook, By Wafer Level Chip Scale Package (WLCSP) (2022-2030) ($MN)
• Table 108 Middle East & Africa Wafer Level Packaging Market Outlook, By Interconnect Technology (2022-2030) ($MN)
• Table 109 Middle East & Africa Wafer Level Packaging Market Outlook, By Through-Silicon Via (TSV) (2022-2030) ($MN)
• Table 110 Middle East & Africa Wafer Level Packaging Market Outlook, By Solder Bumping (2022-2030) ($MN)
• Table 111 Middle East & Africa Wafer Level Packaging Market Outlook, By Copper Pillar (2022-2030) ($MN)
• Table 112 Middle East & Africa Wafer Level Packaging Market Outlook, By Flip Chip (2022-2030) ($MN)
• Table 113 Middle East & Africa Wafer Level Packaging Market Outlook, By End User (2022-2030) ($MN)
• Table 114 Middle East & Africa Wafer Level Packaging Market Outlook, By Consumer Electronics (2022-2030) ($MN)
• Table 115 Middle East & Africa Wafer Level Packaging Market Outlook, By IT and Telecommunication (2022-2030) ($MN)
• Table 116 Middle East & Africa Wafer Level Packaging Market Outlook, By Automotive (2022-2030) ($MN)
• Table 117 Middle East & Africa Wafer Level Packaging Market Outlook, By Industrial (2022-2030) ($MN)
• Table 118 Middle East & Africa Wafer Level Packaging Market Outlook, By Aerospace & Defense (2022-2030) ($MN)
• Table 119 Middle East & Africa Wafer Level Packaging Market Outlook, By Healthcare (2022-2030) ($MN)
• Table 120 Middle East & Africa Wafer Level Packaging Market Outlook, By Other End Users (2022-2030) ($MN)

According to Stratistics MRC, the Global Wafer Level Packaging Market is accounted for $9.58 billion in 2024 and is expected to reach $29.78 billion by 2030 growing at a CAGR of 20.8% during the forecast period. Wafer Level Packaging (WLP) is a state-of-the-art semiconductor packaging method that encapsulates chips at the wafer level prior to their separation into separate pieces. By doing away with the need for conventional packaging procedures, which are typically performed after the wafer is cut, this technique offers benefits like smaller size, improved performance, and cheaper production costs. Moreover, WLP is particularly well suited for small, high-performing devices like wearables, smartphones, and automotive electronics because it positions components close together, allowing for high-density interconnections, better thermal management, and faster signal transmission.

According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market, which includes wafer level packaging, is expected to grow significantly, with sales expected to reach $551 billion in 2021.

Market Dynamics:

Driver:

Demand for chips with superior performance

Wafer-level packaging adoption is being driven by the growing demand for modern electronics to have higher bandwidth, faster processing speeds, and lower power consumption. As chips get more sophisticated, particularly in industries like gaming, telecommunications, and high-performance computing, they need packaging solutions that can meet these demands. Additionally, WLP offers a number of advantages over conventional packaging techniques, including improved power efficiency, higher signal integrity, and better electrical performance.

Restraint:

Expensive initial investment costs

The high upfront cost of specialized tools and technologies is one of the major obstacles to Wafer Level Packaging adoption. Advanced manufacturing infrastructure, such as specialized tools for die testing, encapsulation, and wafer bonding, is required to implement WLP. Furthermore, these systems can be costly, especially for small and mid-sized businesses that might lack the funds to purchase the required machinery. In order to improve methods and reach targeted performance standards, the process also entails high research and development (R&D) expenses.

Opportunity:

Developments in wearable technology and medical devices

Wafer Level Packaging has significant prospects in the medical device sector, especially given the growing popularity of wearable medical technology. These small, light devices need powerful sensors, processors, and communication modules to track health information like blood sugar, heart rate, and even brain activity. The development of non-invasive, wearable health monitoring devices depends on the ability to combine these diverse components into a single, compact package, which WLP makes possible. Moreover, WLP is also applicable to diagnostic equipment that needs small electronics to fit into limited spaces and implantable medical devices that must function dependably in confined spaces.

Threat:

Competitive pressure from other packaging technologies

Alternative cutting-edge packaging technologies that can provide comparable advantages pose a serious threat to the wafer-level packaging market. With comparable benefits like lower environmental impact, enhanced performance, and cost-effectiveness, technologies like System-in-Package (SiP), 3D packaging, flip-chip, and Chip-on-Board (COB) are vying for market share. Additionally, in some applications, like memory modules or high-performance computing, where vertical integration is desired, 3D packaging, which entails stacking multiple chips vertically, may be more appropriate.

Covid-19 Impact:

Wafer Level Packaging (WLP) was significantly impacted by the COVID-19 pandemic, which mainly disrupted global supply chains and semiconductor manufacturing processes. Production delays and longer lead times for essential materials resulted from labor shortages, travel restrictions, and factory closures, which impacted the timely delivery of WLP solutions. Furthermore, a brief slowdown in market expansion was caused by the economic uncertainty and a decline in consumer demand for electronic products during the early stages of the pandemic. But as businesses adjusted to the new normal, the demand for medical, automotive, and consumer electronics devices increased, necessitating the use of cutting-edge packaging technologies like WLP.

The Wafer Level Chip Scale Packaging (WLCSP) segment is expected to be the largest during the forecast period

The Wafer Level Packaging (WLP) market is expected to be dominated by the Wafer Level Chip Scale Packaging (WLCSP) segment. Because it offers a small, affordable, and effective substitute for conventional packaging techniques, WLCSP is a widely used packaging solution. It entails putting the chip straight onto the package with few extra parts, greatly reducing the device's size and weight, making it perfect for wearables, smartphones, and consumer electronics applications. Moreover, the widespread use of WLCSP is being driven by the increasing demand for more compact, powerful electronic devices that perform better and use less energy.

The Copper Pillar segment is expected to have the highest CAGR during the forecast period

In the Wafer Level Packaging (WLP) market, the Copper Pillar segment is expected to have the highest CAGR. Because copper pillar technology can enhance semiconductor devices' performance and dependability, especially in high-density and high-performance applications, it is rapidly gaining popularity. Additionally, this packaging technique offers superior electro migration resistance, increased mechanical strength, and improved thermal conductivity by substituting copper pillars for conventional solder bumps. Because of these benefits, copper pillar packaging is especially well-suited for cutting-edge uses like high-performance computing, automotive electronics, and 5G.

Region with largest share:

Due to the presence of important semiconductor manufacturing hubs, such as China, Japan, South Korea, and Taiwan, the Asia-Pacific (APAC) region commands the largest share of the Wafer Level Packaging (WLP) market. Large companies in the electronics and semiconductor sectors, including ASE Group, Samsung, and TSMC, are based in Asia. To keep up with the increasing demand for faster, more compact, and more effective electronic devices, these companies make significant investments in cutting-edge packaging technologies like WLP. Furthermore, the region's robust manufacturing base, along with rapid technological innovation and adoption in the automotive, telecommunications, and consumer electronics industries, supports APAC's ongoing dominance in the WLP market.

Region with highest CAGR:

The Wafer Level Packaging (WLP) market is anticipated to grow at the highest CAGR in the North American region. The demand for sophisticated semiconductor packaging is rising in sectors like consumer electronics, healthcare, automotive, and telecommunications, especially as 5G, driverless cars, and the Internet of Things (IoT) become more prevalent. Numerous top semiconductor companies and research institutes that are at the forefront of packaging technology innovation are based in North America. Moreover, the need for sophisticated WLP solutions is further accelerated by the expanding use of data centers, artificial intelligence (AI), and high-performance computing.

Key players in the market

Some of the key players in Wafer Level Packaging market include Amkor Technology, Inc., Fujitsu Limited, Nordson Corporation, Toshiba Corporation, Lam Research Corporation, Qualcomm Technologies, Inc., Siliconware Precision Industries Co., Ltd., Deca Technologies, Inc, Nemotek Technology Inc., Infineon Technologies AG, Taiwan Semiconductor Manufacturing Company Limited, KLA Corporation, Applied Materials, Inc., ChipMOS Technologies Inc. and Tokyo Electron Ltd.

Key Developments:

In September 2024, Fujitsu Limited and Stellar Science Foundation, a General Incorporated Association have entered into a partnership focused on discovering and supporting the next generation of scientific researchers and fostering the creation of cutting-edge research topics.

In May 2024, Nordson Corporation announced that it has entered into a definitive agreement to acquire Atrion Corporation, a leader in proprietary medical infusion fluid delivery and niche cardiovascular solutions, for $460.00 per share in cash. This reflects a valuation of 15X Atrion's 2024 full-year estimated EBITDA, inclusive of synergies Nordson expects to generate in the first two years of its ownership.

In May 2024, Amkor Technology, Inc. announced that it has entered into a strategic long-term agreement with IBM for semiconductor assembly and test services. Under the long-term supply agreement, Amkor will receive the substantial majority of IBM's subcontract wire bond and flip chip assembly and final test.

Package Types Covered:

• Fan-in Wafer Level Packaging (FI-WLP)
• Fan-out Wafer Level Packaging (FO-WLP)
• 3D TSV WLP
• 2.5D TSV WLP
• Wafer Level Chip Scale Package (WLCSP)

Interconnect Technologies Covered:

• Through-Silicon Via (TSV)
• Solder Bumping
• Copper Pillar
• Flip Chip

End Users Covered:

• Consumer Electronics
• IT and Telecommunication
• Automotive
• Industrial
• Aerospace & Defense
• Healthcare
• Other End Users

Regions Covered:

• North America
  • US
  • Canada
  • Mexico
• Europe
  • Germany
  • UK
  • Italy
  • France
  • Spain
  • Rest of Europe
• Asia Pacific
  • Japan
  • China
  • India
  • Australia
  • New Zealand
  • South Korea
  • Rest of Asia Pacific
• South America
  • Argentina
  • Brazil
  • Chile
  • Rest of South America
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • Qatar
  • South Africa
  • Rest of Middle East & Africa

What our report offers:

• Market share assessments for the regional and country-level segments
• Strategic recommendations for the new entrants
• Covers Market data for the years 2022, 2023, 2024, 2026, and 2030
• Market Trends (Drivers, Constraints, Opportunities, Threats, Challenges, Investment Opportunities, and recommendations)
• Strategic recommendations in key business segments based on the market estimations
• Competitive landscaping mapping the key common trends
• Company profiling with detailed strategies, financials, and recent developments
• Supply chain trends mapping the latest technological advancements

Free Customization Offerings:

All the customers of this report will be entitled to receive one of the following free customization options:

• Company Profiling
  • Comprehensive profiling of additional market players (up to 3)
  • SWOT Analysis of key players (up to 3)
• Regional Segmentation
  • Market estimations, Forecasts and CAGR of any prominent country as per the client's interest (Note: Depends on feasibility check)
• Competitive Benchmarking
  • Benchmarking of key players based on product portfolio, geographical presence, and strategic alliances

Table of Contents

1 Executive Summary

2 Preface

• 2.1 Abstract
• 2.2 Stake Holders
• 2.3 Research Scope
• 2.4 Research Methodology
  • 2.4.1 Data Mining
  • 2.4.2 Data Analysis
  • 2.4.3 Data Validation
  • 2.4.4 Research Approach
• 2.5 Research Sources
  • 2.5.1 Primary Research Sources
  • 2.5.2 Secondary Research Sources
  • 2.5.3 Assumptions

3 Market Trend Analysis

• 3.1 Introduction
• 3.2 Drivers
• 3.3 Restraints
• 3.4 Opportunities
• 3.5 Threats
• 3.6 Technology Analysis
• 3.7 End User Analysis
• 3.8 Emerging Markets
• 3.9 Impact of Covid-19

4 Porters Five Force Analysis

• 4.1 Bargaining power of suppliers
• 4.2 Bargaining power of buyers
• 4.3 Threat of substitutes
• 4.4 Threat of new entrants
• 4.5 Competitive rivalry

5 Global Wafer Level Packaging Market, By Package Type

• 5.1 Introduction
• 5.2 Fan-in Wafer Level Packaging (FI-WLP)
• 5.3 Fan-out Wafer Level Packaging (FO-WLP)
• 5.4 3D TSV WLP
• 5.5 2.5D TSV WLP
• 5.6 Wafer Level Chip Scale Package (WLCSP)

6 Global Wafer Level Packaging Market, By Interconnect Technology

• 6.1 Introduction
• 6.2 Through-Silicon Via (TSV)
• 6.3 Solder Bumping
• 6.4 Copper Pillar
• 6.5 Flip Chip

7 Global Wafer Level Packaging Market, By End User

• 7.1 Introduction
• 7.2 Consumer Electronics
• 7.3 IT and Telecommunication
• 7.4 Automotive
• 7.5 Industrial
• 7.6 Aerospace & Defense
• 7.7 Healthcare
• 7.8 Other End Users

8 Global Wafer Level Packaging Market, By Geography

• 8.1 Introduction
• 8.2 North America
  • 8.2.1 US
  • 8.2.2 Canada
  • 8.2.3 Mexico
• 8.3 Europe
  • 8.3.1 Germany
  • 8.3.2 UK
  • 8.3.3 Italy
  • 8.3.4 France
  • 8.3.5 Spain
  • 8.3.6 Rest of Europe
• 8.4 Asia Pacific
  • 8.4.1 Japan
  • 8.4.2 China
  • 8.4.3 India
  • 8.4.4 Australia
  • 8.4.5 New Zealand
  • 8.4.6 South Korea
  • 8.4.7 Rest of Asia Pacific
• 8.5 South America
  • 8.5.1 Argentina
  • 8.5.2 Brazil
  • 8.5.3 Chile
  • 8.5.4 Rest of South America
• 8.6 Middle East & Africa
  • 8.6.1 Saudi Arabia
  • 8.6.2 UAE
  • 8.6.3 Qatar
  • 8.6.4 South Africa
  • 8.6.5 Rest of Middle East & Africa

9 Key Developments

• 9.1 Agreements, Partnerships, Collaborations and Joint Ventures
• 9.2 Acquisitions & Mergers
• 9.3 New Product Launch
• 9.4 Expansions
• 9.5 Other Key Strategies

10 Company Profiling

• 10.1 Amkor Technology, Inc.
• 10.2 Fujitsu Limited
• 10.3 Nordson Corporation
• 10.4 Toshiba Corporation
• 10.5 Lam Research Corporation
• 10.6 Qualcomm Technologies, Inc.
• 10.7 Siliconware Precision Industries Co., Ltd.
• 10.8 Deca Technologies, Inc
• 10.9 Nemotek Technology Inc.
• 10.10 Infineon Technologies AG
• 10.11 Taiwan Semiconductor Manufacturing Company Limited
• 10.12 KLA Corporation
• 10.13 Applied Materials, Inc.
• 10.14 ChipMOS Technologies Inc.
• 10.15 Tokyo Electron Ltd.