電子包装市場：材料、技術、用途別-2025-2030年の世界予測

電子包装市場は、2023年に31億9,000万米ドルと評価され、2024年には36億9,000万米ドルに達すると予測され、CAGR 16.55%で成長し、2030年には93億2,000万米ドルに達すると予測されています。

電子包装市場には、デバイス内の電子部品を保護し統合するために使用される材料と方法が含まれます。物理的、熱的、電磁的干渉から保護することで、機能性、信頼性、寿命を保証します。電子包装の必要性は、小型化、軽量化、より効率的な電子製品への需要の高まりから生じています。先進パッケージングは、民生用電子機器、自動車、ヘルスケア、航空宇宙、通信などさまざまな分野に応用されており、デバイスの性能を最適化するためには先進パッケージング技術が不可欠です。最終用途の範囲は幅広く、半導体、プリント基板（PCB）、センサー、光電子部品などが含まれます。主な市場促進要因には、急成長するコンシューマーエレクトロニクス市場、モノのインターネット（IoT）デバイスの先進化、パワーエレクトロニクスの高度なパッケージングソリューションを必要とする電気自動車の普及拡大などがあります。また、5GやAIなどの新興技術も市場を活性化させ、高密度集積や熱管理ソリューション強化の機会をもたらしています。しかし市場は、先進パッケージング技術に関連する高コストや、進化するデバイス要件に対応するための継続的な技術革新の必要性といった課題に直面しています。また、厳しい規制や、パッケージング材料に関連する環境への影響といった制約もあります。ビジネスチャンスは、3Dパッケージング、システムインパッケージ（SiP）ソリューション、ナノテクノロジーの進歩など、サイズとコストを削減しながら性能を向上させるイノベーションにあります。環境に優しく持続可能な包装材料もまた、市場の需要と規制の圧力の両方に対応する重要な研究手段です。企業が成長を求める中、スマートなパッケージング・ソリューションと環境に優しい代替品の研究開発への投資は極めて重要です。市場力学はダイナミックであり、動向は統合、小型化、持続可能性に傾いているため、競争力を維持するためには継続的な適応と最先端技術への投資が必要です。業界横断的なアプリケーションを模索し、カスタマイズに注力することで、この進化する分野における拡大と革新の新たな道も開けると思われます。

市場力学：急速に進化する電子包装市場の主要市場インサイトを公開

電子包装市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的決定の精緻化、そして新たなビジネスチャンスの獲得に備えることができます。こうした動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができるとともに、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • 半導体産業の成長による高度な電子包装の必要性
  • 電子部品とセンサーに重点を置いた自動車産業の拡大
  • 環境に優しい包装材料の開発につながる環境持続可能性への関心の高まり
  • 電子包装の信頼性と性能の向上を義務付ける政府の規制と規格
• 市場抑制要因
  • 電子包装の規格を維持するための課題となっている絶え間ない技術進歩
  • 電子包装市場全体の製造コストと価格安定性に影響を与える不安定な原材料価格
• 市場機会
  • 5G技術の拡大と電子包装要件への影響
  • 高性能アプリケーション向けシステムインパッケージ（SiP）技術の利用拡大
  • 過熱防止と信頼性向上のための電子包装向け熱管理ソリューションの革新
• 市場の課題
  • 高密度に実装された電子回路における電磁干渉とシグナルインテグリティの問題への対応
  • 業界特有の電子包装要件を満たすための先端材料とナノテクノロジーの統合

ポーターの5つの力：電子包装市場をナビゲートする戦略ツール

ポーターの5つの力フレームワークは、電子包装市場の競合情勢を理解するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：電子包装市場における外部からの影響の把握

外部マクロ環境要因は、電子包装市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析電子包装市場における競合情勢の把握

電子包装市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックス電子包装市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、電子包装市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨電子包装市場における成功への道筋を描く

電子包装市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を見直すことで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • 半導体産業の成長が高度な技術の必要性を促進
    • 電子部品とセンサーに重点を置いた自動車産業の拡大
    • 環境の持続可能性への関心が高まり、環境に優しい包装材料の開発につながっています。
    • 電子包装の信頼性とパフォーマンスの向上を義務付ける政府の規制と標準
  • 抑制要因
    • 絶え間ない技術の進歩により、電子包装標準に追いつくのが困難な環境が生まれています
    • 原材料価格の変動が製造コスト全体と価格の安定性に影響を及ぼしています。電子包装市場
  • 機会
    • 5G技術の拡大と電子包装要件への影響
    • 高性能アプリケーション向けシステムインパッケージ（SiP）技術の利用率向上
    • 過熱を防ぎ信頼性を向上させる電子包装の熱管理ソリューションの革新
  • 課題
    • 高密度に実装された電子回路における電磁干渉と信号整合性の問題に対処する
    • 業界固有の電子包装要件を満たすための先進材料とナノテクノロジーの統合
• 市場セグメンテーション分析
  • 材料：熱安定性により電子包装におけるガラスの用途が増加
  • アプリケーション：生体適合性パッケージングによるヘルスケアにおける電子包装の新たなアプリケーション
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 電子包装市場：素材別

• ガラス
• 金属
• プラスチック

第7章 電子包装市場：技術別

• チップオンボード
• 表面実装技術
• スルーホール技術

第8章 電子包装市場：用途別

• 自動車
• 家電
• ヘルスケア
• 産業
• 通信

第9章 南北アメリカの電子包装市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第10章 アジア太平洋地域の電子包装市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第11章 欧州・中東・アフリカの電子包装市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第12章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
  • スペシャライズド・パッケージング・グループがクラーク・フォームを買収し、フォームパッケージング分野の能力と市場リーチを強化
  • マイクロンとナムテックが協力して熟練労働者を育成し、インドの半導体パッケージング産業を強化
  • ショット、先進パッケージングソリューションで航空宇宙電子機器の信頼性を向上
• 戦略分析と提言

企業一覧

• Advanced Micro Devices, Inc.
• Amkor Technology, Inc.
• Analog Devices, Inc.
• ASE Technology Holding Co, Ltd
• Avnet, Inc.
• Broadcom Inc.
• DuPont de Nemours, Inc.
• Infineon Technologies AG
• Intel Corporation
• Jabil, Inc.
• Microchip Technology Inc.
• Micron Technology, Inc.
• NXP B.V.
• ON Semiconductor Corporation
• Power Integrations, Inc.
• Qualcomm Technologies, Inc
• Renesas Electronics Corporation
• ROHM Co., Ltd.
• Samsung Electronics Co., Ltd.
• Schott AG
• Skyworks Solutions, Inc.
• Smart Global Holdings, Inc
• Smurfit Kappa Group PLC
• Sonoco Products Company
• Specialized Packaging Group, Inc.
• STMicroelectronics International N.V.
• Taiwan Semiconductor Manufacturing Company, Ltd.
• Texas Instruments Incorporated
• Toshiba Corporation
• Vishay Intertechnology, Inc.

LIST OF FIGURES

• FIGURE 1. ELECTRONIC PACKAGING MARKET RESEARCH PROCESS
• FIGURE 2. ELECTRONIC PACKAGING MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 13. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 15. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 17. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 21. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. ELECTRONIC PACKAGING MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. ELECTRONIC PACKAGING MARKET DYNAMICS
• TABLE 7. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY GLASS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY METAL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY PLASTIC, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CHIP-ON-BOARD, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY SURFACE MOUNT TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY THROUGH-HOLE TECHNOLOGY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY AUTOMOTIVE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY CONSUMER ELECTRONICS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY HEALTHCARE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY INDUSTRIAL, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL ELECTRONIC PACKAGING MARKET SIZE, BY TELECOMMUNICATIONS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 22. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 23. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 24. AMERICAS ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 25. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 26. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 27. ARGENTINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 28. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 29. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 30. BRAZIL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 31. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 32. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 33. CANADA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 34. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 35. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 36. MEXICO ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 37. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 38. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 39. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 40. UNITED STATES ELECTRONIC PACKAGING MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 41. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 42. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 43. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 44. ASIA-PACIFIC ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 45. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 46. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 47. AUSTRALIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 48. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 49. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 50. CHINA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 51. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 52. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 53. INDIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 54. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 55. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 56. INDONESIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 57. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 58. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 59. JAPAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 60. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 61. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 62. MALAYSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 63. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 64. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 65. PHILIPPINES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 66. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 67. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 68. SINGAPORE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 69. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 70. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 71. SOUTH KOREA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 72. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 73. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 74. TAIWAN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 75. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 76. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 77. THAILAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 78. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 79. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 80. VIETNAM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 81. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 82. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 83. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 84. EUROPE, MIDDLE EAST & AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 85. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 86. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 87. DENMARK ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 88. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 89. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 90. EGYPT ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 91. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 92. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 93. FINLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 94. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 95. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 96. FRANCE ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 97. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 98. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 99. GERMANY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 100. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 101. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 102. ISRAEL ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 103. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 104. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 105. ITALY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 106. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 107. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 108. NETHERLANDS ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 109. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 110. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 111. NIGERIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 112. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 113. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 114. NORWAY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 115. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 116. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 117. POLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 118. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 119. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 120. QATAR ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 121. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 122. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 123. RUSSIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 124. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 125. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 126. SAUDI ARABIA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 127. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 128. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 129. SOUTH AFRICA ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 130. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 131. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 132. SPAIN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 133. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 134. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 135. SWEDEN ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 136. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 137. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 138. SWITZERLAND ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 139. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 140. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 141. TURKEY ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 142. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 143. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 144. UNITED ARAB EMIRATES ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 145. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY MATERIAL, 2018-2030 (USD MILLION)
• TABLE 146. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 147. UNITED KINGDOM ELECTRONIC PACKAGING MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 148. ELECTRONIC PACKAGING MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 149. ELECTRONIC PACKAGING MARKET, FPNV POSITIONING MATRIX, 2023

The Electronic Packaging Market was valued at USD 3.19 billion in 2023, expected to reach USD 3.69 billion in 2024, and is projected to grow at a CAGR of 16.55%, to USD 9.32 billion by 2030.

The electronic packaging market encompasses the materials and methods used to protect and integrate electronic components within devices. It ensures functionality, reliability, and longevity by shielding from physical, thermal, and electromagnetic interference. The necessity for electronic packaging arises from the growing demand for miniaturized, lightweight, and more efficient electronic products. Applications span across multiple sectors, including consumer electronics, automotive, healthcare, aerospace, and telecommunications, where advanced packaging technologies are crucial for optimal device performance. The end-use scope is broad, covering semiconductors, printed circuit boards (PCBs), sensors, and optoelectronic components. Key growth drivers include the burgeoning consumer electronics market, advancements in Internet of Things (IoT) devices, and the increasing adoption of electric vehicles, which demand sophisticated packaging solutions for power electronics. Emerging technologies such as 5G and AI also fuel the market, presenting opportunities for high-density integration and enhanced thermal management solutions. However, the market faces challenges such as high costs associated with advanced packaging technologies and the need for continuous innovation to meet evolving device requirements. Limitations include stringent regulations and the environmental impact associated with packaging materials. Opportunities lie in innovations like 3D packaging, system-in-package (SiP) solutions, and advancements in nanotechnology that can enhance performance while reducing size and cost. Eco-friendly and sustainable packaging materials also represent a critical research avenue, addressing both market demand and regulatory pressures. As businesses seek growth, investing in R&D for smart packaging solutions and eco-friendly alternatives will be pivotal. The electronic packaging market is dynamic, with trends leaning towards integration, miniaturization, and sustainability, necessitating continuous adaptation and investment in cutting-edge technology to maintain competitive edge. Exploring cross-industry applications and focusing on customization will also open new avenues for expansion and innovation in this evolving field.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Electronic Packaging Market

The Electronic Packaging Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Growth in semiconductor industry driving the need for advanced electronic packaging
  • Expansion of the automotive industry with emphasis on electronic components and sensors
  • Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
  • Government regulations and standards mandating improved reliability and performance of electronic packaging
• Market Restraints
  • Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
  • Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
• Market Opportunities
  • Expansion of 5G technology and its impact on electronic packaging requirements
  • Increased utilization of system-in-package (SiP) technology for high-performance applications
  • Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
• Market Challenges
  • Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
  • Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements

Porter's Five Forces: A Strategic Tool for Navigating the Electronic Packaging Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Electronic Packaging Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Electronic Packaging Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Electronic Packaging Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Electronic Packaging Market

A detailed market share analysis in the Electronic Packaging Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Electronic Packaging Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Electronic Packaging Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Electronic Packaging Market

A strategic analysis of the Electronic Packaging Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Electronic Packaging Market, highlighting leading vendors and their innovative profiles. These include Advanced Micro Devices, Inc., Amkor Technology, Inc., Analog Devices, Inc., ASE Technology Holding Co, Ltd, Avnet, Inc., Broadcom Inc., DuPont de Nemours, Inc., Infineon Technologies AG, Intel Corporation, Jabil, Inc., Microchip Technology Inc., Micron Technology, Inc., NXP B.V., ON Semiconductor Corporation, Power Integrations, Inc., Qualcomm Technologies, Inc, Renesas Electronics Corporation, ROHM Co., Ltd., Samsung Electronics Co., Ltd., Schott AG, Skyworks Solutions, Inc., Smart Global Holdings, Inc, Smurfit Kappa Group PLC, Sonoco Products Company, Specialized Packaging Group, Inc., STMicroelectronics International N.V., Taiwan Semiconductor Manufacturing Company, Ltd., Texas Instruments Incorporated, Toshiba Corporation, and Vishay Intertechnology, Inc..

Market Segmentation & Coverage

This research report categorizes the Electronic Packaging Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Material, market is studied across Glass, Metal, and Plastic.
• Based on Technology, market is studied across Chip-on-Board, Surface Mount Technology, and Through-Hole Technology.
• Based on Application, market is studied across Automotive, Consumer Electronics, Healthcare, Industrial, and Telecommunications.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Growth in semiconductor industry driving the need for advanced electronic packaging
    • 5.1.1.2. Expansion of the automotive industry with emphasis on electronic components and sensors
    • 5.1.1.3. Increased focus on environmental sustainability leading to the development of eco-friendly packaging materials
    • 5.1.1.4. Government regulations and standards mandating improved reliability and performance of electronic packaging
  • 5.1.2. Restraints
    • 5.1.2.1. Constant technological advancements creating a challenging environment for keeping up with electronic packaging standards
    • 5.1.2.2. Volatile raw material prices impacting the overall manufacturing costs and pricing stability in the electronic packaging market
  • 5.1.3. Opportunities
    • 5.1.3.1. Expansion of 5G technology and its impact on electronic packaging requirements
    • 5.1.3.2. Increased utilization of system-in-package (SiP) technology for high-performance applications
    • 5.1.3.3. Innovations in thermal management solutions for electronic packaging to prevent overheating and improve reliability
  • 5.1.4. Challenges
    • 5.1.4.1. Addressing issues of electromagnetic interference and signal integrity in densely packed electronic circuits
    • 5.1.4.2. Integration of advanced materials and nanotechnology to meet industry-specific electronic packaging requirements
• 5.2. Market Segmentation Analysis
  • 5.2.1. Material: Increasing applications of Glass in electronic packaging due to thermal stability
  • 5.2.2. Application: Emerging applications of electronic packaging in healthcare owing to biocompatible packaging
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Electronic Packaging Market, by Material

• 6.1. Introduction
• 6.2. Glass
• 6.3. Metal
• 6.4. Plastic

7. Electronic Packaging Market, by Technology

• 7.1. Introduction
• 7.2. Chip-on-Board
• 7.3. Surface Mount Technology
• 7.4. Through-Hole Technology

8. Electronic Packaging Market, by Application

• 8.1. Introduction
• 8.2. Automotive
• 8.3. Consumer Electronics
• 8.4. Healthcare
• 8.5. Industrial
• 8.6. Telecommunications

9. Americas Electronic Packaging Market

• 9.1. Introduction
• 9.2. Argentina
• 9.3. Brazil
• 9.4. Canada
• 9.5. Mexico
• 9.6. United States

10. Asia-Pacific Electronic Packaging Market

• 10.1. Introduction
• 10.2. Australia
• 10.3. China
• 10.4. India
• 10.5. Indonesia
• 10.6. Japan
• 10.7. Malaysia
• 10.8. Philippines
• 10.9. Singapore
• 10.10. South Korea
• 10.11. Taiwan
• 10.12. Thailand
• 10.13. Vietnam

11. Europe, Middle East & Africa Electronic Packaging Market

• 11.1. Introduction
• 11.2. Denmark
• 11.3. Egypt
• 11.4. Finland
• 11.5. France
• 11.6. Germany
• 11.7. Israel
• 11.8. Italy
• 11.9. Netherlands
• 11.10. Nigeria
• 11.11. Norway
• 11.12. Poland
• 11.13. Qatar
• 11.14. Russia
• 11.15. Saudi Arabia
• 11.16. South Africa
• 11.17. Spain
• 11.18. Sweden
• 11.19. Switzerland
• 11.20. Turkey
• 11.21. United Arab Emirates
• 11.22. United Kingdom

12. Competitive Landscape

• 12.1. Market Share Analysis, 2023
• 12.2. FPNV Positioning Matrix, 2023
• 12.3. Competitive Scenario Analysis
  • 12.3.1. Specialized Packaging Group Acquires Clark Foam to Boost Capabilities and Market Reach in Foam Packaging Sector
  • 12.3.2. Micron and Namtech Join Forces to Train Skilled Workforce, Strengthening India's Semiconductor Packaging Industry
  • 12.3.3. Schott Enhances Reliability of Aerospace Electronics with Advanced Packaging Solution
• 12.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. Advanced Micro Devices, Inc.
• 2. Amkor Technology, Inc.
• 3. Analog Devices, Inc.
• 4. ASE Technology Holding Co, Ltd
• 5. Avnet, Inc.
• 6. Broadcom Inc.
• 7. DuPont de Nemours, Inc.
• 8. Infineon Technologies AG
• 9. Intel Corporation
• 10. Jabil, Inc.
• 11. Microchip Technology Inc.
• 12. Micron Technology, Inc.
• 13. NXP B.V.
• 14. ON Semiconductor Corporation
• 15. Power Integrations, Inc.
• 16. Qualcomm Technologies, Inc
• 17. Renesas Electronics Corporation
• 18. ROHM Co., Ltd.
• 19. Samsung Electronics Co., Ltd.
• 20. Schott AG
• 21. Skyworks Solutions, Inc.
• 22. Smart Global Holdings, Inc
• 23. Smurfit Kappa Group PLC
• 24. Sonoco Products Company
• 25. Specialized Packaging Group, Inc.
• 26. STMicroelectronics International N.V.
• 27. Taiwan Semiconductor Manufacturing Company, Ltd.
• 28. Texas Instruments Incorporated
• 29. Toshiba Corporation
• 30. Vishay Intertechnology, Inc.