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市場調査レポート
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1561418

フリップチップ技術市場レポート：製品、パッケージング技術、バンプ技術、業界別、地域別、2024年～2032年

Flip Chip Technology Market Report by Product, Packaging Technology, Bumping Technology, Industry Vertical, and Region 2024-2032

出版日
発行
IMARC
ページ情報
英文 139 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=143.57円
フリップチップ技術市場レポート：製品、パッケージング技術、バンプ技術、業界別、地域別、2024年～2032年
出版日: 2024年09月10日
発行: IMARC
ページ情報: 英文 139 Pages
納期: 2～3営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界のフリップチップ技術市場の市場規模は2023年に311億米ドルに達しました。今後、IMARC Groupは、2032年には514億米ドルに達し、2024～2032年の成長率（CAGR）は5.5%になると予測しています。

フリップチップ（Direct Chip Attach）技術は、チップのアクティブエリアを反転させ、すべての相互接続、パッケージリード、金属はんだをカバーする半導体パッケージングソリューションです。これは、回路基板にはんだ付けされ、エポキシでアンダーフィルされたバンプまたはボールを使用する、制御崩壊チップ接続（C4）ベースのソリューションです。フリップチップ技術は、半導体デバイス、集積回路チップ、微小電気機械システム（MEMS）を外部回路に相互接続するために使用されます。従来から使用されているワイヤベースのシステムと比較して、フリップチップ技術は、より少ないスペースで、より短い距離でより多くの相互接続を可能にし、超音波およびマイクロ波操作の効率を向上させます。その結果、ノートパソコン、デスクトップパソコン、ゲーム機器、中央演算処理装置（CPU）、チップセットの組み立てに広く利用されています。

フリップチップ技術市場動向：

世界のエレクトロニクス産業の著しい成長は、市場の明るい見通しを生み出す重要な要因のひとつです。フリップチップ技術は、デバイスの小型化、電気効率の向上、消費電力の最小化を目的として、家電製品やロボットソリューションに広く使用されています。さらに、自動車、通信、医療、軍事などさまざまな産業で多機能デバイスへの要求が高まっていることも、市場の成長を後押ししています。例えば、全地球測位システム（GPS）、衛星ベースのナビゲーション、無線探知・測距（RADAR）システムは、この技術をジオセンシングや軍事機器の操作に利用しています。これに伴い、リアルワールド・ゲームの新たな動向も市場の成長に寄与しています。フリップチップ技術は、ゲーム機やグラフィックカードにセンサーやプロセッサーを組み込み、データ・トランスミッションを向上させるために広く利用されています。さらに、コネクテッドデバイスとモノのインターネット（IoT）の統合や、マイクロ波や超音波操作の改善へのフリップチップ技術の活用など、さまざまな技術の進歩が市場の成長を後押ししています。その他の要因としては、マイクロエレクトロニクスデバイスにおける回路の小型化要求の高まりや、広範な研究開発（R&D）活動などが挙げられ、市場の成長に向けた原動力になると予想されます。

本レポートで扱う主な質問

  • 世界のフリップチップ技術市場はこれまでどのように推移してきたか？
  • COVID-19は世界のフリップチップ技術市場にどのような影響を与えたか？
  • 主要地域市場とは？
  • 製品別の市場内訳は？
  • 包装技術別の市場内訳は？
  • バンプ技術別の市場内訳は？
  • 業界別市場内訳は？
  • 業界のバリューチェーンにおける様々な段階とは？
  • 業界の主要な促進要因と課題は何か？
  • 世界のフリップチップ技術市場の構造と主要プレーヤーは？
  • 業界の競合の程度は？

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要業界動向

第5章 世界のフリップチップ技術市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：製品別

  • メモリ
    • 市場動向
    • 市場予測
  • CMOSイメージセンサー
    • 市場動向
    • 市場予測
  • LED
    • 市場動向
    • 市場予測
  • CPU
    • 市場動向
    • 市場予測
  • RF、アナログ、ミックスシグナル、パワーIC
    • 市場動向
    • 市場予測
  • GPU
    • 市場動向
    • 市場予測
  • SOC
    • 市場動向
    • 市場予測

第7章 市場内訳：パッケージング技術別

  • 3D IC
    • 市場動向
    • 市場予測
  • 2.5D IC
    • 市場動向
    • 市場予測
  • 2D IC
    • 市場動向
    • 市場予測

第8章 市場内訳：バンピング技術別

  • 銅柱
    • 市場動向
    • 市場予測
  • はんだバンピング
    • 市場動向
    • 市場予測
  • ゴールドバンピング
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第9章 市場内訳：業界別

  • エレクトロニクス
    • 市場動向
    • 市場予測
  • ヘルスケア
    • 市場動向
    • 市場予測
  • 自動車・輸送
    • 市場動向
    • 市場予測
  • IT・通信
    • 市場動向
    • 市場予測
  • 航空宇宙および防衛
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第10章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋地域
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場動向
    • 市場内訳：国別
    • 市場予測

第11章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第12章 バリューチェーン分析

第13章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第14章 価格分析

第15章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • 3M Company
    • Amkor Technology Inc.
    • ASE Group
    • Fujitsu Limited
    • Intel Corporation
    • Jiangsu Changdian Technology Co. Ltd.
    • Powertech Technology Inc.
    • Samsung Electronics Co.Ltd.
    • Taiwan Semiconductor Manufacturing Company Limited
    • Texas Instruments Incorporated
    • United Microelectronics Corporation
図表

List of Figures

  • Figure 1: Global: Flip Chip Technology Market: Major Drivers and Challenges
  • Figure 2: Global: Flip Chip Technology Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: Flip Chip Technology Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: Flip Chip Technology Market: Breakup by Product (in %), 2023
  • Figure 5: Global: Flip Chip Technology Market: Breakup by Packaging Technology (in %), 2023
  • Figure 6: Global: Flip Chip Technology Market: Breakup by Bumping Technology (in %), 2023
  • Figure 7: Global: Flip Chip Technology Market: Breakup by Industry Vertical (in %), 2023
  • Figure 8: Global: Flip Chip Technology Market: Breakup by Region (in %), 2023
  • Figure 9: Global: Flip Chip Technology (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Flip Chip Technology (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Flip Chip Technology (CMOS Image Sensor) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Flip Chip Technology (CMOS Image Sensor) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Flip Chip Technology (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Flip Chip Technology (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Flip Chip Technology (CPU) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Flip Chip Technology (CPU) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Flip Chip Technology (RF, Analog, Mixed Signal and Power IC) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: Flip Chip Technology (GPU) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: Flip Chip Technology (GPU) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: Flip Chip Technology (SOC) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: Flip Chip Technology (SOC) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: Flip Chip Technology (3D IC) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: Flip Chip Technology (3D IC) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: Flip Chip Technology (2.5D IC) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: Flip Chip Technology (2.5D IC) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: Flip Chip Technology (2D IC) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: Flip Chip Technology (2D IC) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: Flip Chip Technology (Copper Pillar) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: Flip Chip Technology (Copper Pillar) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: Global: Flip Chip Technology (Solder Bumping) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: Global: Flip Chip Technology (Solder Bumping) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: Global: Flip Chip Technology (Gold Bumping) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: Global: Flip Chip Technology (Gold Bumping) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Global: Flip Chip Technology (Other Bumping Technologies) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Global: Flip Chip Technology (Other Bumping Technologies) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Global: Flip Chip Technology (Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Global: Flip Chip Technology (Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Global: Flip Chip Technology (Healthcare) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Global: Flip Chip Technology (Healthcare) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Global: Flip Chip Technology (Automotive and Transport) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Global: Flip Chip Technology (Automotive and Transport) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Global: Flip Chip Technology (IT and Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Global: Flip Chip Technology (IT and Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: Global: Flip Chip Technology (Aerospace and Defense) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: Global: Flip Chip Technology (Aerospace and Defense) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: Global: Flip Chip Technology (Other Industry Verticals) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: Global: Flip Chip Technology (Other Industry Verticals) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: North America: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: North America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: United States: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: United States: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Canada: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Canada: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Asia-Pacific: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Asia-Pacific: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: China: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: China: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Japan: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Japan: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: India: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: India: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: South Korea: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: South Korea: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Australia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Australia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Indonesia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Indonesia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: Europe: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: Europe: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: Germany: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: Germany: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: France: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: France: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: United Kingdom: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: United Kingdom: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 79: Italy: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 80: Italy: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 81: Spain: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 82: Spain: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 83: Russia: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 84: Russia: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 86: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 87: Latin America: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 88: Latin America: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 89: Brazil: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 90: Brazil: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 91: Mexico: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 92: Mexico: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 93: Others: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 94: Others: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 95: Middle East and Africa: Flip Chip Technology Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 96: Middle East and Africa: Flip Chip Technology Market: Breakup by Country (in %), 2023
  • Figure 97: Middle East and Africa: Flip Chip Technology Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 98: Global: Flip Chip Technology Industry: SWOT Analysis
  • Figure 99: Global: Flip Chip Technology Industry: Value Chain Analysis
  • Figure 100: Global: Flip Chip Technology Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Flip Chip Technology Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Flip Chip Technology Market Forecast: Breakup by Product (in Million US$), 2024-2032
  • Table 3: Global: Flip Chip Technology Market Forecast: Breakup by Packaging Technology (in Million US$), 2024-2032
  • Table 4: Global: Flip Chip Technology Market Forecast: Breakup by Bumping Technology (in Million US$), 2024-2032
  • Table 5: Global: Flip Chip Technology Market Forecast: Breakup by Industry Vertical (in Million US$), 2024-2032
  • Table 6: Global: Flip Chip Technology Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 7: Global: Flip Chip Technology Market: Competitive Structure
  • Table 8: Global: Flip Chip Technology Market: Key Players
目次
Product Code: SR112024A4640

The global flip chip technology market size reached US$ 31.1 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 51.4 Billion by 2032, exhibiting a growth rate (CAGR) of 5.5% during 2024-2032.

Flip chip, or direct chip attach, technology is a semiconductor packaging solution that involves flipping the active area of a chip to cover all interconnections, package leads and metallic solders. It is a controlled collapse chip connection (C4)-based solution that uses bumps or balls soldered into the circuit board and underfilled with epoxy. Flip chip technology is used for interconnecting semiconductor devices, integrated circuit chips and micro-electromechanical systems (MEMS) to the external circuitry. In comparison to the traditionally used wire-based systems, flip chip technology consumes lesser space, enables a larger number of interconnects with shorter distances and enhances the efficiency of ultrasonic and microwave operations. As a result, it is widely used in the assembly of laptops, desktops, gaming devices, central processing units (CPUs) and chipsets.

Flip Chip Technology Market Trends:

Significant growth in the electronics industry across the globe is one of the key factors creating a positive outlook for the market. Flip chip technology is widely used in consumer electronics and robotic solutions for device miniaturization, enhanced electrical efficiency and minimal power consumption. Moreover, the increasing requirement for multi-functional devices in various industries, such as automotive, telecommunication, medical and military, is providing a thrust to the market growth. For instance, the global positioning system (GPS), satellite-based navigation and radio detection and ranging (RADAR) systems use the technology for geo-sensing and operating military devices. In line with this, the emerging trend of real-world gaming is also contributing to the growth of the market. Flip chip technology is extensively used for embedding sensors and processors in gaming consoles and graphic cards for improved data transmission. Additionally, various technological advancements, such as the integration of connected devices with the Internet of Things (IoT), and the utilization of flip chip technology for improved microwave and ultrasonic operations, are favoring the growth of the market. Other factors, including the increasing requirement for circuit miniaturization in microelectronic devices, along with extensive research and development (R&D) activities, are anticipated to drive the market toward growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global flip chip technology market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on product, packaging technology, bumping technology and industry vertical.

Breakup by Product:

  • Memory
  • CMOS Image Sensor
  • LED
  • CPU
  • RF, Analog, Mixed Signal and Power IC
  • GPU
  • SOC

Breakup by Packaging Technology:

  • 3D IC
  • 2.5D IC
  • 2D IC

Breakup by Bumping Technology:

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others

Breakup by Industry Vertical:

  • Electronics
  • Healthcare
  • Automotive and Transport
  • IT and Telecommunication
  • Aerospace and Defense
  • Others

Breakup by Region:

  • North America
    • United States
    • Canada
  • Asia-Pacific
    • China
    • Japan
    • India
    • South Korea
    • Australia
    • Indonesia
    • Others
  • Europe
    • Germany
    • France
    • United Kingdom
    • Italy
    • Spain
    • Russia
    • Others
  • Latin America
    • Brazil
    • Mexico
    • Others
  • Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being 3M Company, Amkor Technology Inc., ASE Group, Fujitsu Limited, Intel Corporation, Jiangsu Changdian Technology Co. Ltd., Powertech Technology Inc., Samsung Electronics Co.Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated and United Microelectronics Corporation.

Key Questions Answered in This Report:

  • How has the global flip chip technology market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global flip chip technology market?
  • What are the key regional markets?
  • What is the breakup of the market based on the product?
  • What is the breakup of the market based on the packaging technology?
  • What is the breakup of the market based on the bumping technology?
  • What is the breakup of the market based on the industry vertical?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global flip chip technology market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Flip Chip Technology Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Product

  • 6.1 Memory
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 CMOS Image Sensor
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 LED
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast
  • 6.4 CPU
    • 6.4.1 Market Trends
    • 6.4.2 Market Forecast
  • 6.5 RF, Analog, Mixed Signal and Power IC
    • 6.5.1 Market Trends
    • 6.5.2 Market Forecast
  • 6.6 GPU
    • 6.6.1 Market Trends
    • 6.6.2 Market Forecast
  • 6.7 SOC
    • 6.7.1 Market Trends
    • 6.7.2 Market Forecast

7 Market Breakup by Packaging Technology

  • 7.1 3D IC
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 2.5D IC
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 2D IC
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by Bumping Technology

  • 8.1 Copper Pillar
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Solder Bumping
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Gold Bumping
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 Others
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast

9 Market Breakup by Industry Vertical

  • 9.1 Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Healthcare
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Automotive and Transport
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 IT and Telecommunication
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Aerospace and Defense
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Others
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 SWOT Analysis

  • 11.1 Overview
  • 11.2 Strengths
  • 11.3 Weaknesses
  • 11.4 Opportunities
  • 11.5 Threats

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 3M Company
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 Financials
      • 15.3.1.4 SWOT Analysis
    • 15.3.2 Amkor Technology Inc.
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio
      • 15.3.2.3 Financials
      • 15.3.2.4 SWOT Analysis
    • 15.3.3 ASE Group
      • 15.3.3.1 Company Overview
      • 15.3.3.2 Product Portfolio
      • 15.3.3.3 Financials
    • 15.3.4 Fujitsu Limited
      • 15.3.4.1 Company Overview
      • 15.3.4.2 Product Portfolio
      • 15.3.4.3 Financials
      • 15.3.4.4 SWOT Analysis
    • 15.3.5 Intel Corporation
      • 15.3.5.1 Company Overview
      • 15.3.5.2 Product Portfolio
      • 15.3.5.3 Financials
      • 15.3.5.4 SWOT Analysis
    • 15.3.6 Jiangsu Changdian Technology Co. Ltd.
      • 15.3.6.1 Company Overview
      • 15.3.6.2 Product Portfolio
      • 15.3.6.3 Financials
    • 15.3.7 Powertech Technology Inc.
      • 15.3.7.1 Company Overview
      • 15.3.7.2 Product Portfolio
      • 15.3.7.3 Financials
      • 15.3.7.4 SWOT Analysis
    • 15.3.8 Samsung Electronics Co.Ltd.
      • 15.3.8.1 Company Overview
      • 15.3.8.2 Product Portfolio
      • 15.3.8.3 Financials
      • 15.3.8.4 SWOT Analysis
    • 15.3.9 Taiwan Semiconductor Manufacturing Company Limited
      • 15.3.9.1 Company Overview
      • 15.3.9.2 Product Portfolio
      • 15.3.9.3 Financials
      • 15.3.9.4 SWOT Analysis
    • 15.3.10 Texas Instruments Incorporated
      • 15.3.10.1 Company Overview
      • 15.3.10.2 Product Portfolio
      • 15.3.10.3 Financials
      • 15.3.10.4 SWOT Analysis
    • 15.3.11 United Microelectronics Corporation
      • 15.3.11.1 Company Overview
      • 15.3.11.2 Product Portfolio
      • 15.3.11.3 Financials
      • 15.3.11.4 SWOT Analysis