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3D IC市場：タイプ、コンポーネント、用途、エンドユーザー、地域別、2024～2032年

3D IC Market by Type, Component (Through-Silicon Via, Through Glass Via, Silicon Interposer), Application, End User, and Region 2024-2032
出版日: | 発行: IMARC | ページ情報: 英文 137 Pages | 納期: 2～3営業日

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価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.58円
3D IC市場：タイプ、コンポーネント、用途、エンドユーザー、地域別、2024～2032年
出版日: 2024年04月08日
発行: IMARC
ページ情報: 英文 137 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

世界の3D IC市場規模は2023年に170億米ドルに達しました。今後、IMARC Groupは、2024～2032年にかけて18.96%の成長率（CAGR）を示し、2032年までに847億米ドルに達すると予測しています。ノートパソコン、スマートフォン、タブレット端末など、優れた機能を備えたさまざまな小型で高度な家電製品の購入が増加していることが、市場を牽引する主要要因となっています。

3次元（3D）集積回路（IC）とは、異なるシリコンダイ、チップ、ウエハーを垂直方向に積層または集積する製造技術の総称です。これらの材料はさらに1つのパッケージにまとめられ、デバイスはシリコンビア（TSV）とハイブリッドボンディング手順で接続されます。また、積層プロセスで使用される標準的な技術として、3Dウエハーレベル・チップスケール・パッケージング（WLCSP）、ビーム再結晶、固相結晶化、ウエハーボンディングも含まれます。2次元（2D）ICと比較して、3D ICは、より高速で、フットプリントを最小化し、より優れた機能密度を、同じような小さな面積で、同じように低減された電力で記載しています。これとは別に、より高い帯域幅、柔軟性、異種集積を提供し、より速い信号遷移を保証し、より優れた電気的性能を可能にします。その結果、3D ICはマイクロエレクトロニクス、フォトニクス、ロジックイメージング、オプトエレクトロニクス、センサーの主要コンポーネントとして広範な用途が見つかっています。

3D IC市場の動向：

航空宇宙、自動車、通信・電気通信などの産業で3D ICが広く利用されていることは、市場成長を促進する重要な要因の1つです。これに伴い、ノートパソコン、スマートフォン、タブレット端末など、優れた機能を備えたさまざまな小型で高度な家電製品の購入が増加していることから、エレクトロニクス産業が大幅に拡大していることが、市場成長の原動力となっています。さらに、消費電力を最小限に抑えた先進的なエレクトロニクス・アーキテクチャや集積回路に対するニーズの高まりも、市場成長に寄与しています。さらに、ゲーム機やセンサーなど、小型化された電子機器にICを組み込み、ウエハーレベル・パッケージングを使用するという新たな動向もこれを後押ししています。さらに、セキュリティロック、サーモスタット、ファンコントローラー、スマート煙探知機、窓センサー、エネルギーモニターなどのスマートホームデバイスに3D ICが幅広く組み込まれていることも、市場の成長を後押ししています。さらに、小型補聴器や視覚補助器具、心臓モニターなど、多様な医療機器にも組み込まれています。より優れた速度、メモリー、耐久性、効率、性能、タイミング遅延の低減など、複数の製品の利点に関する消費者の意識の高まりが、市場成長を後押ししています。さらに、モノのインターネット（IoT）や人工知能（AI）ソリューションとワイヤレス技術の統合や、製品生産を改善するためのメーカーによる先進ICパッケージングシステムの登場が、市場成長を後押ししています。その他、高帯域幅メモリ（HBM）に対するニーズの煽りや、進行中の製品の多様化などが、市場の成長を積極的に刺激しています。

本レポートで扱う主要質問

  • 世界の3D IC市場はこれまでどのように推移してきたか？
  • 世界の3D IC市場における促進要因、抑制要因、機会は何か？
  • 主要な地域市場は？
  • 最も魅力的な3D IC市場はどの国ですか？
  • タイプ別の市場内訳は？
  • コンポーネント別の市場内訳は？
  • 用途別の市場内訳は？
  • エンドユーザー別の市場内訳は？
  • 世界の3D IC市場の競争構造は？
  • 3D ICの世界市場における主要参入企業は？

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査目的
  • 利害関係者
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要産業動向

第5章 世界の3D IC市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • 積層3D
  • モノリシック3D

第7章 市場内訳：コンポーネント別

  • 貫通電極（TSV）
    • 市場動向
    • 市場展望
  • ガラス貫通電極（TGV）
  • シリコンインターポーザー
    • 市場動向
    • 市場展望

第8章 市場内訳：用途別

  • ロジック
  • イメージングとオプトエレクトロニクス
    • 市場動向
    • 市場展望
  • メモリ
  • MEMS/センサー
  • LED市場
  • その他

第9章 市場内訳：エンドユーザー別

  • 家電
  • 通信市場
  • 自動車
  • 軍事・航空宇宙
  • 医療機器
  • 産業機器
  • その他

第10章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場動向
    • 市場内訳：国別
    • 市場予測

第11章 促進要因、抑制要因、機会

  • 市場概要
  • 促進要因
  • 抑制要因
  • 機会

第12章 バリューチェーン分析

第13章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第14章 価格分析

第15章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Advanced Micro Devices Inc.
    • MonolithIC 3D Inc.
図表

List of Figures

  • Figure 1: Global: 3D IC Market: Major Drivers and Challenges
  • Figure 2: Global: 3D IC Market: Sales Value (in Billion US$), 2018-2023
  • Figure 3: Global: 3D IC Market Forecast: Sales Value (in Billion US$), 2024-2032
  • Figure 4: Global: 3D IC Market: Breakup by Type (in %), 2023
  • Figure 5: Global: 3D IC Market: Breakup by Component (in %), 2023
  • Figure 6: Global: 3D IC Market: Breakup by Application (in %), 2023
  • Figure 7: Global: 3D IC Market: Breakup by End User (in %), 2023
  • Figure 8: Global: 3D IC Market: Breakup by Region (in %), 2023
  • Figure 9: Global: 3D IC (Stacked 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: 3D IC (Stacked 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: 3D IC (Monolithic 3D) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: 3D IC (Monolithic 3D) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: 3D IC (Through-Silicon Via (TSV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: 3D IC (Through-Silicon Via (TSV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: 3D IC (Through Glass Via (TGV)) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: 3D IC (Through Glass Via (TGV)) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: 3D IC (Silicon Interposer) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: 3D IC (Silicon Interposer) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: Global: 3D IC (Logic) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: Global: 3D IC (Logic) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: Global: 3D IC (Imaging and Optoelectronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: Global: 3D IC (Imaging and Optoelectronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Global: 3D IC (Memory) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Global: 3D IC (Memory) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Global: 3D IC (MEMS/Sensors) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Global: 3D IC (MEMS/Sensors) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: Global: 3D IC (LED) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: Global: 3D IC (LED) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Global: 3D IC (Other Applications) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Global: 3D IC (Other Applications) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: Global: 3D IC (Consumer Electronics) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: Global: 3D IC (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: Global: 3D IC (Telecommunication) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: Global: 3D IC (Telecommunication) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Global: 3D IC (Automotive) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Global: 3D IC (Automotive) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Global: 3D IC (Military and Aerospace) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Global: 3D IC (Military and Aerospace) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Global: 3D IC (Medical Devices) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Global: 3D IC (Medical Devices) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Global: 3D IC (Industrial) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Global: 3D IC (Industrial) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Global: 3D IC (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Global: 3D IC (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: North America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: North America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United States: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United States: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Canada: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Canada: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Asia-Pacific: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Asia-Pacific: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: China: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: China: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Japan: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Japan: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: India: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: India: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: South Korea: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: South Korea: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Australia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Australia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Indonesia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Indonesia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 67: Europe: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 68: Europe: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 69: Germany: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 70: Germany: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 71: France: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 72: France: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 73: United Kingdom: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 74: United Kingdom: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 75: Italy: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 76: Italy: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 77: Spain: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 78: Spain: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 79: Russia: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 80: Russia: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 81: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 82: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 83: Latin America: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 84: Latin America: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 85: Brazil: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 86: Brazil: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 87: Mexico: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 88: Mexico: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 89: Others: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 90: Others: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 91: Middle East and Africa: 3D IC Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 92: Middle East and Africa: 3D IC Market: Breakup by Country (in %), 2023
  • Figure 93: Middle East and Africa: 3D IC Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 94: Global: 3D IC Industry: Drivers, Restraints, and Opportunities
  • Figure 95: Global: 3D IC Industry: Value Chain Analysis
  • Figure 96: Global: 3D IC Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: 3D IC Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: 3D IC Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: 3D IC Market Forecast: Breakup by Component (in Million US$), 2024-2032
  • Table 4: Global: 3D IC Market Forecast: Breakup by Application (in Million US$), 2024-2032
  • Table 5: Global: 3D IC Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 6: Global: 3D IC Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 7: Global: 3D IC Market: Competitive Structure
  • Table 8: Global: 3D IC Market: Key Player
目次
Product Code: SR112024A6723

The global 3D IC market size reached US$ 17.0 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 84.7 Billion by 2032, exhibiting a growth rate (CAGR) of 18.96% during 2024-2032. The increasing purchase of various compact and advanced consumer electronic products with superior functionality, such as laptops, smartphones, and tablets, represents the prime factor driving the market.

Three-dimensional (3D) integrated circuit (IC) refers to an umbrella term representing a manufacturing technology that involves stacking or integrating different silicon die, chips and wafers together vertically. These materials are further combined into a single package wherein the device is connected via silicon vias (TSVs) and hybrid bonding procedures. It also encompasses 3D wafer-level chip-scale packaging (WLCSP), beam re-crystallization, solid phase crystallization, and wafer bonding as standard technologies used in the stacking process. As compared to two-dimensional (2D) IC, 3D IC offers higher speed, minimized footprint, and better functional density at the same reduced power in a similar smaller area. Apart from this, it provides higher bandwidth, flexibility, and heterogeneous integration, ensures faster signal transitions, and enables better electrical performances. As a result, 3D IC finds extensive applications as a key component in microelectronics, photonics, logic imaging, optoelectronics, and sensors.

3D IC Market Trends:

The widespread utilization of 3D IC across industries, such as aerospace, automotive and communications and telecom, represents one of the key factors driving the market growth. In line with this, the considerable expansion in the electronics industry on account of the increasing purchase of various compact and advanced consumer electronics products with superior functionality, such as laptops, smartphones, and tablets, is driving the market growth. Moreover, the rising need for advanced electronics architecture and integrated circuits with minimal power consumption properties, is contributing to the market growth. This is further supported by the emerging trend of incorporating ICs and using wafer-level packaging in miniaturized electronic devices, such as gaming consoles and sensors. Additionally, the extensive incorporation of 3D IC in smart home devices, including security locks, thermostats, fan controllers, smart smoke detectors, window sensors, and energy monitors, is favoring the market growth. They are further embedded in diverse healthcare devices, such as small hearing and visual aids and heart monitors. The escalating consumer awareness regarding the multiple product benefits, including better speed, memory, durability, efficiency, performance, and reduced timing delays, is propelling the market growth. Furthermore, the integration of the Internet of Things (IoT) and artificial intelligence (AI) solutions with wireless technologies and the advent of advanced IC packaging systems by manufacturers to improve product production is impelling the market growth. Other factors, such as the fueling need for high-bandwidth memory (HBM) and ongoing product diversification, are positively stimulating the market growth.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each segment of the global 3D IC market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, component, application and end user.

Type Insights:

Stacked 3D

Monolithic 3D

The report has also provided a detailed breakup and analysis of the 3D IC market based on the type. This includes stacked and monolithic 3D. According to the report, stacked 3D represented the largest segment.

Component Insights:

Through-Silicon Via (TSV)

Through Glass Via (TGV)

Silicon Interposer

A detailed breakup and analysis of the 3D IC market based on the component has also been provided in the report. This includes through-silicon via (TSV), through glass via (TGV) and silicon interposer. According to the report, through-silicon via (TSV) accounted for the largest market share.

Application Insights:

Logic

Imaging and Optoelectronics

Memory

MEMS/Sensors

LED

Others

The report has also provided a detailed breakup and analysis of the 3D IC market based on the application. This includes logic, imaging and optoelectronics, memory, MEMS/sensors, LED, and others. According to the report, MEMS/sensors represented the largest segment.

End User Insights:

Consumer Electronics

Telecommunication

Automotive

Military and Aerospace

Medical Devices

Industrial

Others

A detailed breakup and analysis of the 3D IC market based on the end user has also been provided in the report. This includes consumer electronics, telecommunication, automotive, military and aerospace, medical devices, industrial and others. According to the report, consumer electronics accounted for the largest market share.

Regional Insights:

North America

United States

Canada

Asia Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

The report has also provided a comprehensive analysis of all the major regional markets that include North America (the United States and Canada), Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others), Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others), Latin America (Brazil, Mexico, and others), and the Middle East and Africa. According to the report, Asia Pacific was the largest market for 3D IC. Some of the factors driving the Asia Pacific 3D IC market included its rapid expansion in the electronics sector and the increasing purchase of compact consumer electronic products with superior functionality.

Competitive Landscape:

The report has also provided a comprehensive analysis of the competitive landscape in the global 3D IC market. Detailed profiles of all major companies have also been provided. Some of the companies covered include Advanced Micro Devices Inc., MonolithIC 3D Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.

Key Questions Answered in This Report:

  • How has the global 3D IC market performed so far and how will it perform in the coming years?
  • What are the drivers, restraints, and opportunities in the global 3D IC market?
  • What are the key regional markets?
  • Which countries represent the most attractive 3D IC markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the component?
  • What is the breakup of the market based on the application?
  • What is the breakup of the market based on the end user?
  • What is the competitive structure of the global 3D IC market?
  • Who are the key players/companies in the global 3D IC market?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global 3D IC Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Stacked 3D
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Monolithic 3D
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by Component

  • 7.1 Through-Silicon Via (TSV)
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Through Glass Via (TGV)
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Silicon Interposer
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast

8 Market Breakup by Application

  • 8.1 Logic
    • 8.1.1 Market Trends
    • 8.1.2 Market Forecast
  • 8.2 Imaging and Optoelectronics
    • 8.2.1 Market Trends
    • 8.2.2 Market Forecast
  • 8.3 Memory
    • 8.3.1 Market Trends
    • 8.3.2 Market Forecast
  • 8.4 MEMS/Sensors
    • 8.4.1 Market Trends
    • 8.4.2 Market Forecast
  • 8.5 LED
    • 8.5.1 Market Trends
    • 8.5.2 Market Forecast
  • 8.6 Others
    • 8.6.1 Market Trends
    • 8.6.2 Market Forecast

9 Market Breakup by End User

  • 9.1 Consumer Electronics
    • 9.1.1 Market Trends
    • 9.1.2 Market Forecast
  • 9.2 Telecommunication
    • 9.2.1 Market Trends
    • 9.2.2 Market Forecast
  • 9.3 Automotive
    • 9.3.1 Market Trends
    • 9.3.2 Market Forecast
  • 9.4 Military and Aerospace
    • 9.4.1 Market Trends
    • 9.4.2 Market Forecast
  • 9.5 Medical Devices
    • 9.5.1 Market Trends
    • 9.5.2 Market Forecast
  • 9.6 Industrial
    • 9.6.1 Market Trends
    • 9.6.2 Market Forecast
  • 9.7 Others
    • 9.7.1 Market Trends
    • 9.7.2 Market Forecast

10 Market Breakup by Region

  • 10.1 North America
    • 10.1.1 United States
      • 10.1.1.1 Market Trends
      • 10.1.1.2 Market Forecast
    • 10.1.2 Canada
      • 10.1.2.1 Market Trends
      • 10.1.2.2 Market Forecast
  • 10.2 Asia-Pacific
    • 10.2.1 China
      • 10.2.1.1 Market Trends
      • 10.2.1.2 Market Forecast
    • 10.2.2 Japan
      • 10.2.2.1 Market Trends
      • 10.2.2.2 Market Forecast
    • 10.2.3 India
      • 10.2.3.1 Market Trends
      • 10.2.3.2 Market Forecast
    • 10.2.4 South Korea
      • 10.2.4.1 Market Trends
      • 10.2.4.2 Market Forecast
    • 10.2.5 Australia
      • 10.2.5.1 Market Trends
      • 10.2.5.2 Market Forecast
    • 10.2.6 Indonesia
      • 10.2.6.1 Market Trends
      • 10.2.6.2 Market Forecast
    • 10.2.7 Others
      • 10.2.7.1 Market Trends
      • 10.2.7.2 Market Forecast
  • 10.3 Europe
    • 10.3.1 Germany
      • 10.3.1.1 Market Trends
      • 10.3.1.2 Market Forecast
    • 10.3.2 France
      • 10.3.2.1 Market Trends
      • 10.3.2.2 Market Forecast
    • 10.3.3 United Kingdom
      • 10.3.3.1 Market Trends
      • 10.3.3.2 Market Forecast
    • 10.3.4 Italy
      • 10.3.4.1 Market Trends
      • 10.3.4.2 Market Forecast
    • 10.3.5 Spain
      • 10.3.5.1 Market Trends
      • 10.3.5.2 Market Forecast
    • 10.3.6 Russia
      • 10.3.6.1 Market Trends
      • 10.3.6.2 Market Forecast
    • 10.3.7 Others
      • 10.3.7.1 Market Trends
      • 10.3.7.2 Market Forecast
  • 10.4 Latin America
    • 10.4.1 Brazil
      • 10.4.1.1 Market Trends
      • 10.4.1.2 Market Forecast
    • 10.4.2 Mexico
      • 10.4.2.1 Market Trends
      • 10.4.2.2 Market Forecast
    • 10.4.3 Others
      • 10.4.3.1 Market Trends
      • 10.4.3.2 Market Forecast
  • 10.5 Middle East and Africa
    • 10.5.1 Market Trends
    • 10.5.2 Market Breakup by Country
    • 10.5.3 Market Forecast

11 Drivers, Restraints, and Opportunities

  • 11.1 Overview
  • 11.2 Drivers
  • 11.3 Restraints
  • 11.4 Opportunities

12 Value Chain Analysis

13 Porters Five Forces Analysis

  • 13.1 Overview
  • 13.2 Bargaining Power of Buyers
  • 13.3 Bargaining Power of Suppliers
  • 13.4 Degree of Competition
  • 13.5 Threat of New Entrants
  • 13.6 Threat of Substitutes

14 Price Analysis

15 Competitive Landscape

  • 15.1 Market Structure
  • 15.2 Key Players
  • 15.3 Profiles of Key Players
    • 15.3.1 Advanced Micro Devices Inc.
      • 15.3.1.1 Company Overview
      • 15.3.1.2 Product Portfolio
      • 15.3.1.3 SWOT Analysis
    • 15.3.2 MonolithIC 3D Inc.
      • 15.3.2.1 Company Overview
      • 15.3.2.2 Product Portfolio

Kindly, note that this only represents a partial list of companies, and the complete list has been provided in the report