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アンダーフィル材の世界市場

Underfill Materials

出版日
ページ情報
英文 273 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.47円
アンダーフィル材の世界市場
出版日: 2025年07月09日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 273 Pages
納期: 即日から翌営業日
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概要

アンダーフィル材の世界市場は2030年までに6億4,880万米ドルに達する見込み

2024年に4億3,440万米ドルと推定されるアンダーフィル材の世界市場は、2030年には6億4,880万米ドルに達し、分析期間2024-2030年のCAGRは6.9%で成長すると予測されます。本レポートで分析したセグメントの1つであるキャピラリーアンダーフィル材（CUF）は、CAGR 7.5%を記録し、分析期間終了時には3億8,460万米ドルに達すると予測されます。ノーフローアンダーフィル材（NUF）セグメントの成長率は、分析期間のCAGRで6.4％と推定されます。

米国市場は1億2,080万米ドル、中国はCAGR6.4％で成長予測

米国のアンダーフィル材市場は、2024年に1億2,080万米ドルと推定されます。世界第2位の経済大国である中国は、分析期間2024-2030年のCAGR6.4%を牽引し、2030年には1億米ドルの市場規模に達すると予測されています。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ6.5％と5.5％と予測されています。欧州では、ドイツがCAGR 5.5%で成長すると予測されています。

世界のアンダーフィル材市場- 主要動向と市場促進要因を探る

現代のエレクトロニクス製造において、なぜアンダーフィル材が重要なのか？

アンダーフィル材は、電子デバイスの性能、信頼性、寿命の向上に重要な役割を果たし、エレクトロニクス製造業界において不可欠なものとなっています。しかし、これらの材料とは一体何なのでしょうか？アンダーフィル材は、フリップチップ、ボールグリッドアレイ（BGA）、チップスケールパッケージ（CSP）アセンブリにおいて、マイクロチップとその基板の間の空間を埋めるために使用される特殊なエポキシまたは樹脂化合物です。アンダーフィリングとして知られるこのプロセスは、はんだ接合部の機械的完全性を大幅に強化し、チップと基板間の熱膨張の不一致によって引き起こされる応力や熱による故障から保護します。電子機器の小型化と高性能化が進むにつれ、機械的衝撃や熱サイクル、湿気の侵入に耐える堅牢な相互接続の必要性が飛躍的に高まっています。アンダーフィル材は、マイクロエレクトロニクスパッケージ全体に応力を均等に分散させる機能を持ち、デバイスの信頼性と性能を確保する上で不可欠なソリューションとして浮上してきました。

アンダーフィル材の採用の背景には、高密度電子パッケージの急速な開発と集積回路（IC）の複雑化があります。デバイスの小型化、軽量化、高性能化の要求が高まるにつれ、メーカーはフリップチップや3Dパッケージングのような先進パッケージング技術に依存しており、アンダーフィル材を使用して構造を安定させ、動作中の反りやクラックを防止する必要があります。スマートフォン、タブレット、車載用電子機器、IoT機器など、機械的安定性と熱管理が重要なアプリケーションでは、アンダーフィル材は厳しい条件下でも重要部品の機能維持に役立ちます。市場の成長は、はんだ接合部にさらなるストレスを与え、より高度なアンダーフィルソリューションが必要となる、小型化と高性能化の動向によってさらに促進されます。電子部品が小型化し、その電力密度が高まるにつれて、構造的な支持を提供し、放熱を強化するアンダーフィル材の役割はさらに顕著になっています。

技術の進歩はアンダーフィル材の開発をどのように形成していますか？

アンダーフィル材市場は、現代のエレクトロニクス製造の進化する要求に応えるべく、著しい技術進歩を目の当たりにしてきました。しかし、これらの開発を推進する主なイノベーションとは何でしょうか？一つの大きなブレークスルーは、低温硬化と高流動アンダーフィル材の開発であり、これによりアンダーフィリングプロセスの容易さと効率が向上しました。従来のアンダーフィル材は、高温で長時間の硬化を必要とすることが多く、繊細な部品の熱応力や反りにつながる可能性がありました。対照的に、硬化温度が低く、流動特性が速い新しい配合は、より制御された効率的なアンダーフィリングプロセスを可能にし、デリケートな基板へのダメージのリスクを最小限に抑え、サイクルタイムを短縮します。これらの進歩は、アンダーフィルの正確な塗布と均一な分布が重要な、微細ピッチ部品や高密度相互接続を含むアプリケーションで特に有益です。

さらに、ノーフローアンダーフィルの導入により、従来のアンダーフィルで一般的に必要とされていたディスペンスと硬化の別工程が不要となり、フリップチップパッケージの組み立てに革命をもたらしました。ノーフローアンダーフィルは、チップを配置する前に基板に直接塗布され、リフローはんだ付け工程と同時に硬化します。この技術革新により、製造ワークフローが簡素化され、工程が削減され、生産効率が向上します。リワーク可能なアンダーフィル材の開発により、基板を損傷することなく不良部品を簡単に除去・交換できるようになり、これらの材料の汎用性と適用性がさらに拡大しました。リワーク可能なアンダーフィルは、航空宇宙、防衛、通信などで使用されるような、部品の修理や再利用が生産歩留まりを維持し、全体的なコストを削減するために不可欠な、高コストのアセンブリにおいて特に価値があります。このような技術の進歩により、より高い柔軟性と性能を提供しながら、最新のエレクトロニクスパッケージングの厳しい要件を満たす次世代アンダーフィル材の開発が可能になりました。

エレクトロニクス製造におけるアンダーフィル材の採用を促進する市場動向とは？

エレクトロニクス製造業界におけるアンダーフィル材の採用は、メーカーや消費者の優先事項の変化を反映した、いくつかの新たな市場動向によって形成されています。最も顕著な動向の一つは、電子機器の小型化・高機能化へのシフトが進んでいることです。コンシューマー・エレクトロニクスが進化を続けるなか、処理能力が向上し、エネルギー消費量が削減された小型・軽量のデバイスに対するニーズが高まっています。この動向により、フリップチップや3D集積回路などの先進パッケージング技術が広く採用されるようになり、従来のワイヤーボンディング方式に比べ、スペース効率と性能が向上しています。アンダーフィル材は、これらのパッケージング技術において、機械的補強を提供し、デリケートなはんだ接合部を熱的・機械的ストレスから保護し、デバイス全体の信頼性を高めるという重要な役割を担っています。ウェアラブルデバイス、ポータブル医療機器、IoTデバイスなどのアプリケーションにおいて、小型化されたエレクトロニクスの需要が高まっているため、アンダーフィル材のエレクトロニクスアセンブリへの採用が加速しています。

アンダーフィル材の採用を促進するもう一つの重要な動向は、車載エレクトロニクスの複雑化です。自動車のコネクテッド化、自動化、電動化に伴い、自動車に組み込まれる電子制御ユニット（ECU）やセンサーの数が急増しています。これらのコンポーネントは、大きな温度変化、機械的振動、湿気や化学物質への暴露など、過酷な環境条件下で動作しています。アンダーフィル材は、これらのストレスから重要な部品を保護し、長期的な信頼性と性能を確保するために、自動車用電子機器に広く使用されています。電気自動車（EV）や自律走行システムの台頭により、高電力密度に耐え、効果的な熱管理を実現する高度なアンダーフィル材の需要がさらに高まっています。自動車メーカーが車両技術の限界に課題し続ける中、アンダーフィル材は複雑な電子システムの完全性を守るために不可欠な要素となっています。

アンダーフィル材世界市場の成長を促進する要因は？

世界のアンダーフィル材市場の成長は、電子パッケージング技術の先進化、高信頼性アプリケーションへの採用拡大、電子機器の小型化需要の高まりなど、いくつかの要因によって牽引されています。主な成長要因の1つは、より小型で強力な電子機器へのニーズに対応するため、フリップチップや3Dパッケージング技術の採用が増加していることです。これらの先進パッケージング・ソリューションは、性能と機能を向上させる一方で、構造的完全性と熱安定性を確保するために堅牢なアンダーフィル材を必要とします。電子機器の小型化、複雑化が進むにつれ、機械的な補強と熱管理ができる高性能なアンダーフィル材の必要性はますます重要になってきています。民生用電子機器、通信、車載用電子機器などの産業が拡大したことも、アンダーフィル材市場の成長に寄与しています。これらの分野では、日々の操作や環境暴露の厳しさに耐える信頼性の高い相互接続が必要とされているからです。

アンダーフィル材は、航空宇宙、防衛、医療機器など、製品の故障が許されない高信頼性アプリケーションでの使用が増加していることも、主要な成長要因となっています。これらの産業では、アンダーフィル材は重要なエレクトロニクスアセンブリの機械的堅牢性と信頼性を向上させ、過酷な条件下でも安定した性能を確保するために使用されています。電気自動車や自律走行技術の台頭は、自動車分野でのアンダーフィル材の需要をさらに高めています。これらのシステムの電子部品は、高い電力負荷や課題である熱環境に耐えなければならないからです。さらに、リワーク可能なアンダーフィル材やノーフローアンダーフィル材の開発により、適用範囲が広がり、製造工程のコストと複雑さが軽減されました。これらの材料は、部品の組み立てや修理においてより高い柔軟性を提供し、生産歩留まりの最適化と無駄の削減を目指すメーカーにとって魅力的な選択肢となっています。技術の進歩が電子パッケージングの限界を押し広げ続ける中、世界のアンダーフィル材市場は、技術革新、業界の需要、進化するアプリケーション要件のダイナミックな相互作用によって、持続的な成長を遂げる態勢が整っています。

セグメント

アプリケーション（フリップチップ、ボールグリッドアレイ（BGA）、チップスケールパッケージング（CSP））、製品タイプ（キャピラリーアンダーフィル材（CUF）、ノーフローアンダーフィル材（NUF）、モールドアンダーフィル材（MUF））。

調査対象企業の例

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

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私たちは、検証された専門家のコンテンツとAIツールで市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

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目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP16876

Global Underfill Materials Market to Reach US$648.8 Million by 2030

The global market for Underfill Materials estimated at US$434.4 Million in the year 2024, is expected to reach US$648.8 Million by 2030, growing at a CAGR of 6.9% over the analysis period 2024-2030. Capillary Underfill Material (CUF), one of the segments analyzed in the report, is expected to record a 7.5% CAGR and reach US$384.6 Million by the end of the analysis period. Growth in the No Flow Underfill Material (NUF) segment is estimated at 6.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$120.8 Million While China is Forecast to Grow at 6.4% CAGR

The Underfill Materials market in the U.S. is estimated at US$120.8 Million in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$100.0 Million by the year 2030 trailing a CAGR of 6.4% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 6.5% and 5.5% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 5.5% CAGR.

Global Underfill Materials Market - Key Trends & Growth Drivers Explored

Why Are Underfill Materials Crucial in Modern Electronics Manufacturing?

Underfill materials have become indispensable in the electronics manufacturing industry, serving a critical role in enhancing the performance, reliability, and longevity of electronic devices. But what exactly are these materials, and why are they so essential? Underfill materials are specialized epoxy or resin compounds used to fill the space between a microchip and its substrate in flip-chip, ball grid array (BGA), and chip-scale package (CSP) assemblies. This process, known as underfilling, significantly strengthens the mechanical integrity of solder joints, protecting them from stress and thermal-induced failures caused by mismatched thermal expansion between the chip and substrate. As electronic devices become increasingly miniaturized and powerful, the need for robust interconnects that can withstand mechanical shocks, thermal cycling, and moisture ingress has grown exponentially. Underfill materials, with their ability to distribute stress evenly across the microelectronic package, have emerged as a vital solution in ensuring device reliability and performance.

The adoption of underfill materials is driven by the rapid development of high-density electronic packages and the growing complexity of integrated circuits (ICs). As the demand for smaller, lighter, and more powerful devices increases, manufacturers are relying on advanced packaging technologies like flip-chip and 3D packaging, which necessitate the use of underfill materials to stabilize the structure and prevent warpage or cracking during operation. In applications such as smartphones, tablets, automotive electronics, and IoT devices, where mechanical stability and thermal management are crucial, underfill materials help maintain the functionality of critical components even under challenging conditions. The market’s growth is further propelled by the trend towards increased miniaturization and higher performance requirements, which place additional stress on solder joints and necessitate more advanced underfill solutions. As electronic components become smaller and their power density increases, the role of underfill materials in providing structural support and enhancing heat dissipation is becoming even more prominent.

How Are Technological Advancements Shaping the Development of Underfill Materials?

The underfill materials market has witnessed significant technological advancements aimed at meeting the evolving demands of modern electronics manufacturing. But what are the key innovations driving these developments? One major breakthrough is the development of low-temperature cure and high-flow underfill materials, which have enhanced the ease and efficiency of underfilling processes. Traditional underfill materials often required prolonged curing times at high temperatures, which could lead to thermal stress and warping in sensitive components. In contrast, new formulations with lower curing temperatures and faster flow characteristics enable a more controlled and efficient underfilling process, minimizing the risk of damage to delicate substrates and reducing cycle times. These advancements have been particularly beneficial in applications involving fine-pitch components and high-density interconnects, where precise application and uniform distribution of underfill are critical.

Additionally, the introduction of no-flow underfills has revolutionized the assembly of flip-chip packages by eliminating the separate dispensing and curing steps typically required in traditional underfilling. No-flow underfills are applied directly to the substrate before the placement of the chip, and they cure simultaneously with the reflow soldering process. This innovation simplifies the manufacturing workflow, reduces process steps, and enhances production efficiency. The development of reworkable underfill materials, which allow for the easy removal and replacement of defective components without damaging the substrate, has further expanded the versatility and applicability of these materials. Reworkable underfills are particularly valuable in high-cost assemblies, such as those used in aerospace, defense, and telecommunications, where component repair and reusability are essential for maintaining production yield and reducing overall costs. These technological advancements have enabled the development of next-generation underfill materials that meet the stringent requirements of modern electronic packaging while offering greater flexibility and performance.

What Market Trends Are Driving the Adoption of Underfill Materials in Electronics Manufacturing?

The adoption of underfill materials in the electronics manufacturing industry is being shaped by several emerging market trends that reflect the changing priorities of manufacturers and consumers alike. One of the most prominent trends is the increasing shift towards miniaturization and higher functionality in electronic devices. As consumer electronics continue to evolve, there is a growing need for compact, lightweight devices with enhanced processing power and reduced energy consumption. This trend has led to the widespread adoption of advanced packaging technologies, such as flip-chip and 3D integrated circuits, which provide greater space efficiency and performance compared to traditional wire-bonding methods. Underfill materials play a critical role in these packaging technologies by providing mechanical reinforcement, protecting delicate solder joints from thermal and mechanical stress, and enhancing overall device reliability. The growing demand for miniaturized electronics in applications such as wearable devices, portable medical equipment, and IoT devices has therefore accelerated the use of underfill materials in electronic assemblies.

Another significant trend driving the adoption of underfill materials is the increasing complexity of automotive electronics. As vehicles become more connected, automated, and electrified, the number of electronic control units (ECUs) and sensors integrated into vehicles has surged. These components operate under harsh environmental conditions, including wide temperature variations, mechanical vibrations, and exposure to moisture and chemicals. Underfill materials are being used extensively in automotive electronics to protect critical components from these stresses, ensuring long-term reliability and performance. The rise of electric vehicles (EVs) and autonomous driving systems has further increased the demand for advanced underfill materials that can withstand high power densities and provide effective thermal management. As automotive manufacturers continue to push the boundaries of vehicle technology, underfill materials are becoming an essential element in safeguarding the integrity of complex electronic systems.

What Factors Are Driving the Growth of the Global Underfill Materials Market?

The growth in the global underfill materials market is driven by several factors, including advancements in electronic packaging technologies, increased adoption in high-reliability applications, and the growing demand for miniaturized electronics. One of the primary growth drivers is the rising adoption of flip-chip and 3D packaging technologies in response to the need for more compact and powerful electronic devices. These advanced packaging solutions provide enhanced performance and functionality but also require robust underfill materials to ensure structural integrity and thermal stability. As electronic devices continue to shrink in size and increase in complexity, the need for high-performance underfill materials that can provide mechanical reinforcement and thermal management has become more critical. The expansion of industries such as consumer electronics, telecommunications, and automotive electronics has also contributed to the growth of the underfill materials market, as these sectors require reliable interconnects that can withstand the rigors of daily operation and environmental exposure.

Another key growth driver is the increasing use of underfill materials in high-reliability applications, such as aerospace, defense, and medical devices, where product failure is not an option. In these industries, underfill materials are used to enhance the mechanical robustness and reliability of critical electronic assemblies, ensuring consistent performance under extreme conditions. The rise of electric vehicles and autonomous driving technologies has further boosted the demand for underfill materials in the automotive sector, as electronic components in these systems must withstand high power loads and challenging thermal environments. Moreover, the development of reworkable and no-flow underfill materials has expanded their applicability and reduced the cost and complexity of manufacturing processes. These materials offer greater flexibility in component assembly and repair, making them an attractive choice for manufacturers looking to optimize production yields and reduce waste. As technological advancements continue to push the boundaries of electronic packaging, the global underfill materials market is poised for sustained growth, driven by a dynamic interplay of innovation, industry demand, and evolving application requirements.

SCOPE OF STUDY:

The report analyzes the Underfill Materials market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Application (Flip Chips, Ball Grid Array (BGA), Chip Scale Packaging (CSP)); Product Type (Capillary Underfill Material (CUF), No Flow Underfill Material (NUF), Molded Underfill Material (MUF))

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 42 Featured) -

  • ELANTAS GmbH
  • Epoxy Technology, Inc.
  • H.B. Fuller Company
  • Henkel AG & Co. KGaA
  • Inkron Limited
  • MacDermid Alpha Electronics Solutions
  • NAMICS Corporation
  • NORDSON Corporation
  • Panasonic Industry Co., Ltd.
  • VIETNAM PROS TECHNOLOGY CO., LTD.

AI INTEGRATIONS

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Tariff Impact on Global Supply Chain Patterns
    • Underfill Materials - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Increased Adoption of Underfill Materials in Semiconductor Packaging Expands Addressable Market
    • Surge in Use of Underfill Materials in Flip-Chip and Ball Grid Array (BGA) Applications Fuels Market Growth
    • Rising Adoption of Underfill Materials in Mobile and Consumer Electronics Sets the Stage for Market Growth
    • Surge in Demand for Underfill Materials in Automotive and Advanced Driver Assistance Systems (ADAS) Fuels Market Demand
    • Innovations in Low-Temperature and Fast-Curing Underfill Formulations Propel Market Growth
    • Rising Adoption of Underfill Materials in LED and Display Technologies Expands Market Opportunities
    • Surge in Demand for Underfill Materials in Flexible and Wearable Electronics Fuels Market Growth
    • Growing Use of Underfill Materials in Military and Aerospace Electronics Strengthens Business Case
    • Surge in Demand for Underfill Materials in Data Centers and Networking Equipment Expands Market Opportunities
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Underfill Materials Market Analysis of Annual Sales in US$ Thousand for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Underfill Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Capillary Underfill Material (CUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Capillary Underfill Material (CUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for No Flow Underfill Material (NUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for No Flow Underfill Material (NUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Molded Underfill Material (MUF) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Molded Underfill Material (MUF) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Flip Chips by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Flip Chips by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Ball Grid Array (BGA) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Ball Grid Array (BGA) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Chip Scale Packaging (CSP) by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Chip Scale Packaging (CSP) by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 23: USA Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 24: USA Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 25: USA 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 26: USA Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 27: USA Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 28: USA 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 29: Canada Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 30: Canada Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 31: Canada 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 32: Canada Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Canada Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 34: Canada 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • JAPAN
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 35: Japan Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 36: Japan Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 37: Japan 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 38: Japan Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Japan Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 40: Japan 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • CHINA
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 41: China Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 42: China Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 43: China 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 44: China Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 45: China Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 46: China 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • EUROPE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 47: Europe Recent Past, Current & Future Analysis for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2024 through 2030 and % CAGR
    • TABLE 48: Europe Historic Review for Underfill Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 49: Europe 15-Year Perspective for Underfill Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 50: Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 52: Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 53: Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 55: Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • FRANCE
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 56: France Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 57: France Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 58: France 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 59: France Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 60: France Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 61: France 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • GERMANY
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 62: Germany Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Germany Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 64: Germany 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 65: Germany Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Germany Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 67: Germany 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 68: Italy Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 69: Italy Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 70: Italy 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 71: Italy Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 72: Italy Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 73: Italy 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 74: UK Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 75: UK Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 76: UK 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 77: UK Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 78: UK Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 79: UK 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 80: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Rest of Europe Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 82: Rest of Europe 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 83: Rest of Europe Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Rest of Europe Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 85: Rest of Europe 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Underfill Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 86: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 87: Asia-Pacific Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 88: Asia-Pacific 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 89: Asia-Pacific Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 90: Asia-Pacific Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 91: Asia-Pacific 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 92: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Rest of World Historic Review for Underfill Materials by Product Type - Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 94: Rest of World 15-Year Perspective for Underfill Materials by Product Type - Percentage Breakdown of Value Sales for Capillary Underfill Material (CUF), No Flow Underfill Material (NUF) and Molded Underfill Material (MUF) for the Years 2015, 2025 & 2030
    • TABLE 95: Rest of World Recent Past, Current & Future Analysis for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) - Independent Analysis of Annual Sales in US$ Thousand for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Rest of World Historic Review for Underfill Materials by Application - Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) Markets - Independent Analysis of Annual Sales in US$ Thousand for Years 2015 through 2023 and % CAGR
    • TABLE 97: Rest of World 15-Year Perspective for Underfill Materials by Application - Percentage Breakdown of Value Sales for Flip Chips, Ball Grid Array (BGA) and Chip Scale Packaging (CSP) for the Years 2015, 2025 & 2030

IV. COMPETITION