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5Gプリント基板の世界市場

5G Printed Circuit Boards

出版日
ページ情報
英文 291 Pages
納期
即日から翌営業日
適宜更新あり
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価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.08円
5Gプリント基板の世界市場
出版日: 2025年06月06日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 291 Pages
納期: 即日から翌営業日
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概要

5Gプリント基板の世界市場は2030年までに米国で405億米ドルに達する見込み

2024年に179億米ドルと推定される5Gプリント基板の世界市場は、2024年から2030年にかけてCAGR 14.6%で成長し、2030年には405億米ドルに達すると予測されます。本レポートで分析したセグメントの1つである片面プリント回路基板は、CAGR 13.4%を記録し、分析期間終了時には127億米ドルに達すると予測されます。両面プリント基板セグメントの成長率は、分析期間でCAGR 14.4%と推定されます。

米国市場は推定49億米ドル、中国はCAGR19.1%で成長予測

米国の5Gプリント基板市場は、2024年に49億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに86億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは19.1%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ10.8％と13.0％と予測されています。欧州では、ドイツがCAGR 11.5%で成長すると予測されています。

世界の5Gプリント基板市場- 主要動向と促進要因まとめ

なぜ5Gプリント基板は高周波、高密度エレクトロニクスインフラで重要な部品になりつつあるのか？

5Gアプリケーション用に設計されたプリント基板（PCB）は、次世代ワイヤレスシステムの性能と信頼性の基本です。これらの高度なPCBは、5G基地局、ユーザー機器、ネットワークハードウェア、IoTデバイスに必要な高周波信号伝送、熱管理、コンパクトな統合をサポートします。5Gの展開が世界的に拡大するにつれ、PCBはますます厳しくなる電気的、機械的、環境的性能要件を満たす必要があります。

従来のPCBと比較して、5Gのバリエーションは、高速ラミネート、低損失材料、およびサブ6 GHzからミリ波帯までの周波数に対する正確なシグナルインテグリティを要求しています。また、信号劣化を最小限に抑えながら、高密度の相互接続や多層スタックアップを処理しなければならないです。その結果、PCBメーカーは、超信頼性と低遅延通信の要求をサポートするために、基板アーキテクチャと材料システムを再構築しています。

材料イノベーションと製造技術はどのように5G PCBの性能を進化させていますか？

5G PCBの性能は、低損失正接、高熱安定性、一貫したインピーダンス制御を持つ誘電体材料にかかっています。PTFE、LCP、セラミック充填複合材などの高周波ラミネートは、伝送損失を低減し、mmWaveアプリケーションでの信号の明瞭化を可能にするために採用されています。多層HDI（高密度相互接続）技術、高度なビア構造（マイクロビア、スタックドビア）、ハイブリッドPCB設計は、コンパクトなフットプリントで高い配線密度と熱管理を可能にしています。

製造面では、精密エッチング、レーザードリル、高度なメッキ技術により、寸法精度が向上し、信号の歪みが減少しています。EMI/EMC規格を満たし、高密度に実装された5Gハードウェアの熱を管理するために、組み込み部品、コンフォーマル遮蔽、統合サーマルビアが組み込まれています。これらの進歩により、PCBは5Gトランシーバ、RFモジュール、アンテナアレイの電気的要求をサポートする能力が高まっています。

どのアプリケーションと市場が5G PCBの需要をリードしていますか？

5G PCBは、マクロおよびスモールセル基地局、ネットワークインターフェースデバイス、モバイルハンドセット、RFフロントエンド、CPEユニット、接続された産業システムなど、幅広いアプリケーションで展開されています。通信機器メーカーが主な消費者で、スマートフォン、ウェアラブル、自律走行車、スマート工場自動化プラットフォームのOEMが密接に続いています。

アジア太平洋は、主要なPCBファブリケーターと5Gインフラベンダーの本拠地であり、依然として主要な生産・消費地域です。中国、韓国、台湾、日本は、高周波PCB製造の主要ハブであり、国内および輸出需要を満たすために生産能力を増強しています。北米と欧州がこれに続き、防衛、航空宇宙、電気通信用途のハイエンドPCBに重点を置いています。東南アジア、インド、中東の新興国は5Gインフラ投資を徐々に増やし、PCBサプライヤに新たな機会をもたらしています。

サプライチェーンの圧力、標準化、技術の融合はどのように市場力学を形成していますか？

5G PCBのサプライチェーンは材料依存度が高く、高性能基板、銅箔、特殊樹脂の供給が途絶えるとリードタイムや価格設定に影響を与えます。これを軽減するために、メーカーは調達戦略を多様化し、国内製造ラインに投資し、品質と供給の継続性をコントロールするために垂直統合を追求しています。

IPCやIEEEなどの業界団体を通じた標準化の取り組みは、OEMプラットフォーム間での設計の一貫性と互換性を促進し、設計から生産までのワークフローの効率を向上させています。一方、5GとAI、IoT、エッジコンピューティングの融合は、多機能、高密度統合をサポートできるPCBへの需要を促進しています。これは、信号性能とシステム信頼性の限界を押し広げるために、設計者、材料科学者、ファブリケーター間の緊密な協力を促しています。

5Gプリント基板市場の成長を促進する要因は？

5G PCB市場は、世界の接続インフラが高周波、データ集約型アプリケーションにシフトするにつれて急速に拡大しています。主な成長促進要因には、5G基地局への投資増加、mmWaveユーザーデバイスの展開拡大、各分野における高精度RFハードウェアの需要などがあります。材料の革新、高速基板アーキテクチャ、高度な製造方法によって、PCBは5G時代の通信システム特有の課題に対応できるようになっています。

今後、市場の成功は、PCBサプライヤーがいかに効果的に材料科学、小型化、コスト効率を電気通信、民生、産業機器メーカーの進化する要求に合わせるかにかかっています。エレクトロニクスがますます周波数主導型になり、機能的に収束していく中で、5G PCBは明日のコネクテッドテクノロジーエコシステムの戦略的中核として浮上する可能性はあるのだろうか？

セグメント

タイプ（片面,両面,多層,高密度相互接続,その他のタイプ）;エンドユース（自動車,通信,民生用電子機器,産業,その他のエンドユース）

調査対象企業の例（全42件）

  • Advanced Circuits, Inc.
  • Amphenol Printed Circuits
  • AT&S Austria Technologie & Systemtechnik AG
  • Chin-Poon Industrial Co., Ltd.
  • Compeq Manufacturing Co., Ltd.
  • Daeduck Electronics Co., Ltd.
  • Dynamic Electronics Co., Ltd.
  • Ellington Electronics Technology Co., Ltd.
  • Flex Ltd.
  • Fujikura Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • Isola Group
  • Jabil Inc.
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • Lianchuang Electronic Technology Co., Ltd.
  • Murata Manufacturing Co., Ltd.
  • Nippon Mektron, Ltd.
  • Panasonic Industry Co., Ltd.

関税影響係数

Global Industry Analystsは、本社国、製造拠点、輸出入（完成品およびOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、人為的な売上原価の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

Global Industry Analystsは、世界の主要なチーフ・エコノミスト（1万4,949人）、シンクタンク（62団体）、貿易・産業団体（171団体）の専門家の意見に熱心に従いながら、エコシステムへの影響を評価し、新たな市場の現実に対処しています。あらゆる主要国の専門家やエコノミストが、関税とそれが自国に与える影響についての意見を追跡調査しています。

Global Industry Analystsは、この混乱が今後2-3ヶ月で収束し、新しい世界秩序がより明確に確立されると予想しています。Global Industry Analystsは、これらの開発をリアルタイムで追跡しています。

2025年4月：交渉フェーズ

4月のリリースでは、世界市場全体に対する関税の影響を取り上げ、地域別の市場調整について紹介します。当社の予測は、過去のデータと進化する市場影響要因に基づいています。

2025年7月：最終関税リセット

お客様には、各国間で最終リセットが発表された後、7月に無料アップデート版をお届けします。最終アップデート版には、明確に定義された関税影響分析が組み込まれています。

相互および二国間貿易と関税の影響分析：

アメリカ <>中国<>メキシコ <>カナダ <>EU <>日本<>インド <>その他176カ国

業界をリードするエコノミスト：Global Industry Analystsの知識ベースは、国家、シンクタンク、貿易・業界団体、大企業、そして世界の計量経済状況におけるこの前例のないパラダイムシフトの影響を共有する領域の専門家など、最も影響力のあるチーフエコノミストを含む1万4,949人のエコノミストを追跡しています。当社の16,491を超えるレポートのほとんどは、マイルストーンに基づくこの2段階のリリーススケジュールを取り入れています。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • スペイン
  • ロシア
  • その他欧州
  • アジア太平洋
  • オーストラリア
  • インド
  • 韓国
  • その他アジア太平洋地域
  • ラテンアメリカ
  • アルゼンチン
  • ブラジル
  • メキシコ
  • その他ラテンアメリカ
  • 中東
  • イラン
  • イスラエル
  • サウジアラビア
  • アラブ首長国連邦
  • その他中東
  • アフリカ

第4章 競合

目次
Product Code: MCP34531

Global 5G Printed Circuit Boards Market to Reach US$40.5 Billion by 2030

The global market for 5G Printed Circuit Boards estimated at US$17.9 Billion in the year 2024, is expected to reach US$40.5 Billion by 2030, growing at a CAGR of 14.6% over the analysis period 2024-2030. Single-Sided Printed Circuit Boards, one of the segments analyzed in the report, is expected to record a 13.4% CAGR and reach US$12.7 Billion by the end of the analysis period. Growth in the Double-Sided Printed Circuit Boards segment is estimated at 14.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$4.9 Billion While China is Forecast to Grow at 19.1% CAGR

The 5G Printed Circuit Boards market in the U.S. is estimated at US$4.9 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$8.6 Billion by the year 2030 trailing a CAGR of 19.1% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 10.8% and 13.0% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 11.5% CAGR.

Global 5G Printed Circuit Boards Market - Key Trends & Drivers Summarized

Why Are 5G PCBs Becoming Critical Components in High-Frequency, High-Density Electronics Infrastructure?

Printed circuit boards (PCBs) designed for 5G applications are fundamental to the performance and reliability of next-generation wireless systems. These advanced PCBs support the high-frequency signal transmission, thermal management, and compact integration needed for 5G base stations, user equipment, network hardware, and IoT devices. As 5G rollouts scale globally, PCBs must meet increasingly stringent electrical, mechanical, and environmental performance requirements.

Compared to conventional PCBs, 5G variants demand high-speed laminates, low-loss materials, and precise signal integrity for frequencies ranging from sub-6 GHz to mmWave bands. They must also handle dense interconnects and multi-layer stack-ups while ensuring minimal signal degradation. As a result, PCB manufacturers are reengineering board architecture and material systems to support the demands of ultra-reliable, low-latency communication.

How Are Material Innovation and Fabrication Techniques Advancing 5G PCB Performance?

The performance of 5G PCBs hinges on dielectric materials with low loss tangents, high thermal stability, and consistent impedance control. High-frequency laminates such as PTFE, LCP, and ceramic-filled composites are being adopted to reduce transmission losses and enable signal clarity in mmWave applications. Multilayer HDI (High-Density Interconnect) technologies, advanced via structures (microvias, stacked vias), and hybrid PCB designs are enabling high routing density and thermal management in compact footprints.

On the manufacturing side, precision etching, laser drilling, and advanced plating techniques are improving dimensional accuracy and reducing signal distortion. Embedded components, conformal shielding, and integrated thermal vias are being incorporated to meet EMI/EMC standards and manage heat in densely packed 5G hardware. These advancements are making PCBs more capable of supporting the electrical demands of 5G transceivers, RF modules, and antenna arrays.

Which Applications and Markets Are Leading Demand for 5G PCBs?

5G PCBs are being deployed across a wide range of applications including macro and small cell base stations, network interface devices, mobile handsets, RF front ends, CPE units, and connected industrial systems. Telecom equipment manufacturers are the primary consumers, closely followed by OEMs in smartphones, wearables, autonomous vehicles, and smart factory automation platforms.

Asia-Pacific-home to leading PCB fabricators and 5G infrastructure vendors-remains the dominant production and consumption region. China, South Korea, Taiwan, and Japan are major hubs for high-frequency PCB manufacturing and are ramping capacity to meet domestic and export demand. North America and Europe follow, with emphasis on high-end PCBs for defense, aerospace, and telecom applications. Emerging economies in Southeast Asia, India, and the Middle East are gradually increasing 5G infrastructure investment, driving new opportunities for PCB suppliers.

How Are Supply Chain Pressures, Standardization, and Technological Convergence Shaping Market Dynamics?

The 5G PCB supply chain is highly materials-dependent, and disruptions in the availability of high-performance substrates, copper foils, and specialty resins can impact lead times and pricing. To mitigate this, manufacturers are diversifying sourcing strategies, investing in domestic fabrication lines, and pursuing vertical integration to control quality and supply continuity.

Standardization efforts through industry bodies such as IPC and IEEE are promoting design consistency and compatibility across OEM platforms, improving efficiency in design-to-production workflows. Meanwhile, the convergence of 5G with AI, IoT, and edge computing is driving demand for PCBs that can support multifunctional, high-density integration. This is encouraging closer collaboration between designers, material scientists, and fabricators to push the boundaries of signal performance and system reliability.

What Are the Factors Driving Growth in the 5G Printed Circuit Boards Market?

The 5G PCB market is expanding rapidly as global connectivity infrastructure shifts toward high-frequency, data-intensive applications. Key growth drivers include rising investments in 5G base stations, expanding deployment of mmWave user devices, and demand for precision RF hardware across sectors. Material innovation, high-speed board architecture, and advanced fabrication methods are enabling PCBs to meet the unique challenges of 5G-era communication systems.

Looking ahead, market success will depend on how effectively PCB suppliers align material science, miniaturization, and cost-efficiency with the evolving demands of telecom, consumer, and industrial device manufacturers. As electronics become increasingly frequency-driven and functionally converged, could 5G PCBs emerge as the strategic core of tomorrow’s connected technology ecosystem?

SCOPE OF STUDY:

The report analyzes the 5G Printed Circuit Boards market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Type (Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect, Other Types); End-Use (Automotive, Telecommunication, Consumer Electronics, Industrial, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

  • Advanced Circuits, Inc.
  • Amphenol Printed Circuits
  • AT&S Austria Technologie & Systemtechnik AG
  • Chin-Poon Industrial Co., Ltd.
  • Compeq Manufacturing Co., Ltd.
  • Daeduck Electronics Co., Ltd.
  • Dynamic Electronics Co., Ltd.
  • Ellington Electronics Technology Co., Ltd.
  • Flex Ltd.
  • Fujikura Ltd.
  • HannStar Board Corporation
  • Ibiden Co., Ltd.
  • Isola Group
  • Jabil Inc.
  • Kinsus Interconnect Technology Corp.
  • Kyocera Corporation
  • Lianchuang Electronic Technology Co., Ltd.
  • Murata Manufacturing Co., Ltd.
  • Nippon Mektron, Ltd.
  • Panasonic Industry Co., Ltd.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by artificially increasing the COGS, reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

We are diligently following expert opinions of leading Chief Economists (14,949), Think Tanks (62), Trade & Industry bodies (171) worldwide, as they assess impact and address new market realities for their ecosystems. Experts and economists from every major country are tracked for their opinions on tariffs and how they will impact their countries.

We expect this chaos to play out over the next 2-3 months and a new world order is established with more clarity. We are tracking these developments on a real time basis.

As we release this report, U.S. Trade Representatives are pushing their counterparts in 183 countries for an early closure to bilateral tariff negotiations. Most of the major trading partners also have initiated trade agreements with other key trading nations, outside of those in the works with the United States. We are tracking such secondary fallouts as supply chains shift.

To our valued clients, we say, we have your back. We will present a simplified market reassessment by incorporating these changes!

APRIL 2025: NEGOTIATION PHASE

Our April release addresses the impact of tariffs on the overall global market and presents market adjustments by geography. Our trajectories are based on historic data and evolving market impacting factors.

JULY 2025 FINAL TARIFF RESET

Complimentary Update: Our clients will also receive a complimentary update in July after a final reset is announced between nations. The final updated version incorporates clearly defined Tariff Impact Analyses.

Reciprocal and Bilateral Trade & Tariff Impact Analyses:

USA <> CHINA <> MEXICO <> CANADA <> EU <> JAPAN <> INDIA <> 176 OTHER COUNTRIES.

Leading Economists - Our knowledge base tracks 14,949 economists including a select group of most influential Chief Economists of nations, think tanks, trade and industry bodies, big enterprises, and domain experts who are sharing views on the fallout of this unprecedented paradigm shift in the global econometric landscape. Most of our 16,491+ reports have incorporated this two-stage release schedule based on milestones.

COMPLIMENTARY PREVIEW

Contact your sales agent to request an online 300+ page complimentary preview of this research project. Our preview will present full stack sources, and validated domain expert data transcripts. Deep dive into our interactive data-driven online platform.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • 5G Printed Circuit Boards - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Surge in 5G Base Station Deployments Throws the Spotlight on High-Frequency PCB Requirements
    • Increasing Need for High-Speed Signal Integrity Spurs Demand for Advanced 5G PCB Materials
    • Expansion of mmWave 5G Networks Strengthens Business Case for Low-Loss, High-Thermal PCBs
    • Rising Integration of RF Components in Mobile Devices Drives Development of Multilayer 5G PCBs
    • Advancements in Miniaturization and High-Density Interconnects Expand Application Scope of 5G PCBs
    • Increasing Automation and AI Workloads in 5G Networks Set the Stage for PCB Innovations in Edge Hardware
    • Surge in IoT and Smart Device Connectivity Generates Opportunities for Compact, High-Performance PCBs
    • Growing Role of PCBs in 5G Automotive and Industrial Modules Spurs Market Diversification
    • Material Innovations Like PTFE and LCP Enable Scalability of 5G PCB Manufacturing
    • Increasing Emphasis on Signal Transmission Reliability Bodes Well for Premium PCB Adoption in 5G Devices
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World 5G Printed Circuit Boards Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for 5G Printed Circuit Boards by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for 5G Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Single-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Single-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Double-Sided by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Double-Sided by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Multi-Layered by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Multi-Layered by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Multi-Layered by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for High-Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for High-Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for High-Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Telecommunication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: World 15-Year Perspective for Telecommunication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: World 15-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Industrial by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: World 15-Year Perspective for Industrial by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 35: USA Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: USA 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 38: USA Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: USA 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 41: Canada Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: Canada 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 44: Canada Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: Canada 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • JAPAN
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 47: Japan Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: Japan 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 50: Japan Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Japan 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • CHINA
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 53: China Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: China Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: China 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 56: China Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: China Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: China 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • EUROPE
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 59: Europe Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for 5G Printed Circuit Boards by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: Europe 15-Year Perspective for 5G Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: Europe 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: Europe 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • FRANCE
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 68: France Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: France Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: France 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 71: France Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: France Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: France 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • GERMANY
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 74: Germany Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Germany 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 77: Germany Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: Germany 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 80: Italy Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: Italy 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 83: Italy Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Italy 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 86: UK Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: UK 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 89: UK Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: UK 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • SPAIN
    • TABLE 92: Spain Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: Spain Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: Spain 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 95: Spain Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Spain Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Spain 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • RUSSIA
    • TABLE 98: Russia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Russia Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Russia 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 101: Russia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Russia Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Russia 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 104: Rest of Europe Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Rest of Europe Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Rest of Europe 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 107: Rest of Europe Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Rest of Europe Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Rest of Europe 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 110: Asia-Pacific Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 111: Asia-Pacific Historic Review for 5G Printed Circuit Boards by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Asia-Pacific 15-Year Perspective for 5G Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2015, 2025 & 2030
    • TABLE 113: Asia-Pacific Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: Asia-Pacific Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: Asia-Pacific 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 116: Asia-Pacific Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: Asia-Pacific Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: Asia-Pacific 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • AUSTRALIA
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 119: Australia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: Australia Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: Australia 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 122: Australia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Australia Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: Australia 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • INDIA
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 125: India Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: India Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: India 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 128: India Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: India Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: India 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • SOUTH KOREA
    • TABLE 131: South Korea Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: South Korea Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: South Korea 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 134: South Korea Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: South Korea Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: South Korea 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 137: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Rest of Asia-Pacific Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Rest of Asia-Pacific 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 140: Rest of Asia-Pacific Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of Asia-Pacific Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Rest of Asia-Pacific 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • LATIN AMERICA
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 143: Latin America Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 144: Latin America Historic Review for 5G Printed Circuit Boards by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Latin America 15-Year Perspective for 5G Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2015, 2025 & 2030
    • TABLE 146: Latin America Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Latin America Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Latin America 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 149: Latin America Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 150: Latin America Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 151: Latin America 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • ARGENTINA
    • TABLE 152: Argentina Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 153: Argentina Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 154: Argentina 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 155: Argentina Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 156: Argentina Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 157: Argentina 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • BRAZIL
    • TABLE 158: Brazil Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 159: Brazil Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 160: Brazil 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 161: Brazil Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 162: Brazil Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 163: Brazil 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • MEXICO
    • TABLE 164: Mexico Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 165: Mexico Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 166: Mexico 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 167: Mexico Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 168: Mexico Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 169: Mexico 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 170: Rest of Latin America Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 171: Rest of Latin America Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 172: Rest of Latin America 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 173: Rest of Latin America Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 174: Rest of Latin America Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 175: Rest of Latin America 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • MIDDLE EAST
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 176: Middle East Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 177: Middle East Historic Review for 5G Printed Circuit Boards by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 178: Middle East 15-Year Perspective for 5G Printed Circuit Boards by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2015, 2025 & 2030
    • TABLE 179: Middle East Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 180: Middle East Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 181: Middle East 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 182: Middle East Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 183: Middle East Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 184: Middle East 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • IRAN
    • TABLE 185: Iran Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 186: Iran Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 187: Iran 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 188: Iran Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 189: Iran Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 190: Iran 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • ISRAEL
    • TABLE 191: Israel Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 192: Israel Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 193: Israel 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 194: Israel Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 195: Israel Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 196: Israel 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • SAUDI ARABIA
    • TABLE 197: Saudi Arabia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 198: Saudi Arabia Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 199: Saudi Arabia 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 200: Saudi Arabia Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 201: Saudi Arabia Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 202: Saudi Arabia 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 203: UAE Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 204: UAE Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 205: UAE 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 206: UAE Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 207: UAE Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 208: UAE 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 209: Rest of Middle East Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 210: Rest of Middle East Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 211: Rest of Middle East 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 212: Rest of Middle East Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 213: Rest of Middle East Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 214: Rest of Middle East 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030
  • AFRICA
    • 5G Printed Circuit Boards Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 215: Africa Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 216: Africa Historic Review for 5G Printed Circuit Boards by Type - Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 217: Africa 15-Year Perspective for 5G Printed Circuit Boards by Type - Percentage Breakdown of Value Sales for Single-Sided, Double-Sided, Multi-Layered, High-Density Interconnect and Other Types for the Years 2015, 2025 & 2030
    • TABLE 218: Africa Recent Past, Current & Future Analysis for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 219: Africa Historic Review for 5G Printed Circuit Boards by End-Use - Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 220: Africa 15-Year Perspective for 5G Printed Circuit Boards by End-Use - Percentage Breakdown of Value Sales for Other End-Uses, Automotive, Telecommunication, Consumer Electronics and Industrial for the Years 2015, 2025 & 2030

IV. COMPETITION