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半導体・ICパッケージング材料の世界市場

Semiconductor and IC Packaging Materials
出版日: | 発行: Global Industry Analysts, Inc. | ページ情報: 英文 452 Pages | 納期: 即日から翌営業日

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半導体・ICパッケージング材料の世界市場
出版日: 2024年04月03日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 452 Pages
納期: 即日から翌営業日
● ご注意事項
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
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  • 概要
  • 目次
概要

半導体・ICパッケージング材料の世界市場、2030年には728億米ドルに達する見込み

2023年に334億米ドルと推定された半導体・ICパッケージング材料の世界市場は、2023年から2030年にかけてCAGR 10.2%で成長し、2030年には728億米ドルに達すると予測されます。本レポートで分析したセグメントの1つである有機基板は、CAGR 11.1％を記録し、分析期間終了までに220億米ドルに達すると予想されます。ボンディングワイヤセグメントの成長は、今後8年間のCAGRが12％と推定されます。

米国市場は21億米ドル、中国はCAGR 11.9％で成長予測

米国の半導体・ICパッケージング材料市場は、2023年には21億米ドルになると推定されます。世界第2位の経済大国である中国は、2030年までに176億米ドルの市場規模に達すると予測され、分析期間2023年から2030年までのCAGRは11.9%です。その他の注目すべき地理的市場としては、日本とカナダがあり、それぞれ2023年から2030年にかけて8.9%と5.7%の成長が予測されています。欧州では、ドイツがCAGR約7.7%で成長すると予測されています。

2024年に向けたエキサイティングな新レポート機能のご紹介

インフルエンサーのエンゲージメント統計へのフルアクセス

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リアルタイムのデータシミュレーター・ツールや特注のレポート作成機能を備えたインタラクティブなアンケートにご参加いただけます。

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主要プレーヤーの世界市場シェアを含む競合カバレッジ

複数の地域にまたがるプレーヤーの市場プレゼンス分析（好調/活発/ニッチ/マイナー）

専門家/インフルエンサーのインタビュー、ポッドキャスト、プレス発表、イベント基調講演のYouTubeビデオへのアクセス

2024年の世界経済に期待すること

金融引き締めとそれに伴う金利上昇によって引き起こされる地政学的、経済的不安定性が、2024年の激動の情勢を作り出すと思われます。中東での敵対行為や、ますます頻発する気候災害など、いくつかの要因が回復への道筋に圧力をかけ続けると思われます。リスクの一方で、ディスインフレの兆候が強まり、頑迷なインフレに対する不安が緩和され、サプライチェーンが正常化し、エネルギーコストの変動にもかかわらず物価が緩やかになるなど、いくつかのプラス材料も具体化しつつあります。インドや米国をはじめとするG21諸国の選挙は、資本の流れや投資戦略に影響を与える可能性があります。インドが世界な投資先として注目される一方で、米国を拠点とするハイテク企業は、才能と資本のダイナミックなエコシステムに後押しされ、引き続き優位を保つと思われます。シリコンバレーをはじめとするハイテク機会は、国内経済が減速しているとはいえ底堅く、規制環境も整備されていることから、高成長の可能性を求める投資家にとって引き続き魅力的です。欧州は金融引き締め政策と景気後退リスクとの戦いが続くが、英国は見通しが最も厳しく、2024年の景気後退リスクが最も高いです。中国は、政府支出と個人消費の改善に支えられた成長が期待されるもの、引き続きワイルドカードとなります。不安定な環境は、投資家にも企業にもチャンスと課題の両方をもたらすと思われます。成長への触媒としてボラティリティを受け入れるとともに、投資判断の舵取りにおける敏捷性と戦略的先見性が、生き残りのために重要であることに変わりはないです。

調査対象企業の例

  • BASF SE
  • 3M Company
  • Analog Devices, Inc.
  • Amkor Technology, Inc.
  • ams AG
  • Atotech Deutschland GmbH
  • Canatu Oy
  • Adtech Ceramics
  • Carsem（M）Sdn. Bhd.
  • Ceramtec GmbH
  • Chaozhou Three-Circle（Group）Co., Ltd.
  • AMETEK Electronic Components & Packaging
  • Chipbond Technology Corporation
  • California Fine Wire Co.
  • Amtech Microelectronics, Inc.

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • 韓国
  • 台湾
  • その他アジア太平洋地域
  • 世界のその他の地域

第4章 競合

目次
Product Code: MCP14657

Global Semiconductor and IC Packaging Materials Market to Reach $72.8 Billion by 2030

The global market for Semiconductor and IC Packaging Materials estimated at US$33.4 Billion in the year 2023, is expected to reach US$72.8 Billion by 2030, growing at a CAGR of 10.2% over the period 2023-2030. Organic Substrates, one of the segments analyzed in the report, is expected to record 11.1% CAGR and reach US$22 Billion by the end of the analysis period. Growth in the Bonding Wires segment is estimated at 12% CAGR for the next 8-year period.

The U.S. Market is Estimated at $2.1 Billion, While China is Forecast to Grow at 11.9% CAGR

The Semiconductor and IC Packaging Materials market in the U.S. is estimated at US$2.1 Billion in the year 2023. China, the world`s second largest economy, is forecast to reach a projected market size of US$17.6 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2023 to 2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at 8.9% and 5.7% respectively over the 2023-2030 period. Within Europe, Germany is forecast to grow at approximately 7.7% CAGR.

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What to Expect from the Global Economy in 2024

Edgy geopolitics, and economic instability caused by monetary policy tightening and ensuing higher interest rates will create a tumultuous landscape for 2024. Several factors will continue to exert pressure on the path to recovery including hostilities in the Middle East and increasingly common climate disasters. Among the risks, several positives are also taking shape such as growing signs of disinflation and easing of anxiety over stubborn inflation, supply chain normalization and price moderation despite volatility in energy costs. Elections across several G21 jurisdictions, notably in India and the United States, will have potential ramifications for capital flows and investment strategies. While India emerges as a compelling destination in the global investment landscape, U.S, based tech firms will continue to dominate, fueled by a dynamic ecosystem of talent and capital. Tech opportunities in Silicon Valley and beyond remain attractive for investors seeking high-growth prospects supported largely by a resilient albeit slowing domestic economy and conducive regulatory environment. Europe will continue to battle tight monetary policy and recession risks with U.K. having the most challenging outlook and running the greatest risk of recession in 2024. China remains a wild card with hope for growth in the country underpinned by government spending and improvements in consumer spending. The volatile environment will offer both opportunities and challenges for investors and businesses alike. Embracing volatility as a catalyst for growth together with agility and strategic foresight in navigating investment decisions will remain important for survival.

Select Competitors (Total 106 Featured) -

  • BASF SE
  • 3M Company
  • Analog Devices, Inc.
  • Amkor Technology, Inc.
  • ams AG
  • Atotech Deutschland GmbH
  • Canatu Oy
  • Adtech Ceramics
  • Carsem (M) Sdn. Bhd.
  • Ceramtec GmbH
  • Chaozhou Three-Circle (Group) Co., Ltd.
  • AMETEK Electronic Components & Packaging
  • Chipbond Technology Corporation
  • California Fine Wire Co.
  • Amtech Microelectronics, Inc.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Semiconductor ICs & Packaging Materials, Definition, Scope, Importance & Types
    • As "Digitalization of Everything" Creeps Through Every Facet of Modern Life, Semiconductors the Lifeblood of the Whole Concept Becomes the Most Chased After Commodity
    • The Semiconductor Decade is on its Way Guided by the Digitalization Wave: Digital Transformation (DX) Spending of Business Practices, Products & Organization (In US$ Billion) for Years 2021 Through 2025
    • Digital Transformation Across Networking & Communications, Data Processing, Industrial, Consumer Electronics, Automotive, Aerospace, Healthcare, Retail, Media & Entertainment Shapes a Robust Semiconductor Industry Vital to the Continued Evolution of Human Civilization: Global Semiconductor Industry (In US$ Billion) for Years 2022, 2024, 2026, 2028, and 2030
    • What's Ahead for Businesses & Markets?
    • Competition
    • Semiconductor and IC Packaging Materials - Global Key Competitors Percentage Market Share in 2023 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2023 (E)
    • Semiconductor ICs & Packaging Materials: Introduction, Types, Market Structure
    • World Brands
    • Recent Market Activity
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • As Global Chip Shortage Continues, It is Time to Review the Implications for Semiconductor Materials & Consumables
    • Rising Semiconductor Demand, Favorable Regulations & Robust Demand for Advanced Packaging Drives Growth of Packaging Materials
    • Roust Outlook for Semiconductor Advanced Packaging Technologies to Brighten Opportunities in the Upstream Packaging Materials Market: Global Semiconductor Advanced Packaging Market by Technology (In US$ Million) for Years 2022, 2024, and 2026
    • Emergence of Quantum Computing Drives the Importance of Semiconductors From Design to Materials
    • As Quantum Hardware Emerges Into an Active Area of Research, New Opportunities to Open for All in the Semiconductor Value Chain: Global Market for Quantum Computing (In US$ Million) for Years 2022, 2024, 2026 & 2028
    • Growing Demand for New Generation Smart ICs for Emerging Technologies like AI Bodes Well for Market Growth
    • Growing Focus on AI Chip Development & Production Opens a Parallel Growth Avenue for Chip Packaging Materials: Global Market for AI Chips (In US$ Billion) for Years 2022, 2024, 2026, 2028 and 2030
    • Vehicle Electronification & Autonomous Driving to Bring the Automotive Industry Into the Spotlight as One of the Fastest Growing End-Uses Sector
    • The Exciting Journey Towards Autonomous Driving is Littered with Opportunities for Automotive Semiconductors: Global Autonomous Vehicle Sales (In Units) for Years 2022, 2024 & 2026
    • 3D Packaging Emerges As a Key Driver of Growth & Innovation in the Market
    • Development New Packaging Technologies Bodes Well for Market Growth
    • IoT Ecosystem to Rev Up Opportunities for Semiconductor Advanced Packaging Technologies & Materials
    • Growing Ecosystem of IoT Devices Bodes Well for IoT Hardware Including ICs/Chips & Modules: Global Number of IoT Connected Devices (In Billion) for Years 2015, 2017, 2019, 2021, 2023, and 2025
    • Connected Aircraft to Drive the Aerospace End-Use Industry's Appetite for Semiconductor Chips & Packaging Materials
    • Robust Outlook for the Future of Connected Aviation to Open Up Opportunities to New Generation Semiconductor Solutions: Global Number of Connected Aircraft (In Units) for the Years 2021, 2025 & 2029
    • A Quick Review of Key Market Challenges
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Semiconductor and IC Packaging Materials Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 4: World 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Organic Substrates by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 7: World 16-Year Perspective for Organic Substrates by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Bonding Wires by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 10: World 16-Year Perspective for Bonding Wires by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Lead frames by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 13: World 16-Year Perspective for Lead frames by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Ceramic Packages by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 16: World 16-Year Perspective for Ceramic Packages by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Encapsulation Resins by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 19: World 16-Year Perspective for Encapsulation Resins by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Other Types by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 22: World 16-Year Perspective for Other Types by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 24: World Historic Review for Consumer Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 25: World 16-Year Perspective for Consumer Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 27: World Historic Review for Communications & Telecom by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 28: World 16-Year Perspective for Communications & Telecom by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 30: World Historic Review for Automotive by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 31: World 16-Year Perspective for Automotive by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Aerospace & Defense by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: World 16-Year Perspective for Aerospace & Defense by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 36: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: World 16-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: USA 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: USA 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 44: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Canada 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • JAPAN
    • TABLE 50: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 53: Japan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: Japan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: Japan 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • CHINA
    • TABLE 56: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: China Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: China 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 59: China Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 60: China Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: China 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • EUROPE
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 62: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 68: Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • FRANCE
    • TABLE 71: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: France Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: France 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 74: France Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: France Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: France 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • GERMANY
    • TABLE 77: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 80: Germany Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Germany Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Germany 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 83: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 86: Italy Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: Italy Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: Italy 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • TABLE 89: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: UK 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 92: UK Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: UK Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: UK 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 98: Rest of Europe Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Rest of Europe Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Rest of Europe 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • Semiconductor and IC Packaging Materials Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Geographic Region - South Korea, Taiwan and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Geographic Region - Percentage Breakdown of Value Sales for South Korea, Taiwan and Rest of Asia-Pacific Markets for Years 2014, 2024 & 2030
    • TABLE 104: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 107: Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • SOUTH KOREA
    • TABLE 110: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 111: South Korea Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 112: South Korea 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 113: South Korea Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 114: South Korea Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 115: South Korea 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • TAIWAN
    • TABLE 116: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 117: Taiwan Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 118: Taiwan 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 119: Taiwan Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 120: Taiwan Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 121: Taiwan 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 122: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 123: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 124: Rest of Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 125: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 126: Rest of Asia-Pacific Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 127: Rest of Asia-Pacific 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 128: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 129: Rest of World Historic Review for Semiconductor and IC Packaging Materials by Type - Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 130: Rest of World 16-Year Perspective for Semiconductor and IC Packaging Materials by Type - Percentage Breakdown of Value Sales for Organic Substrates, Bonding Wires, Lead frames, Ceramic Packages, Encapsulation Resins and Other Types for the Years 2014, 2024 & 2030
    • TABLE 131: Rest of World Recent Past, Current & Future Analysis for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 132: Rest of World Historic Review for Semiconductor and IC Packaging Materials by End-Use - Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 133: Rest of World 16-Year Perspective for Semiconductor and IC Packaging Materials by End-Use - Percentage Breakdown of Value Sales for Consumer Electronics, Communications & Telecom, Automotive, Aerospace & Defense and Other End-Uses for the Years 2014, 2024 & 2030

IV. COMPETITION