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表紙：ESDパッケージングの世界市場-2023年～2030年
市場調査レポート
商品コード
1372588

ESDパッケージングの世界市場-2023年～2030年

Global ESD Packaging Market - 2023-2030

出版日
ページ情報
英文 206 Pages
納期
即日から翌営業日
カスタマイズ可能
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.33円
ESDパッケージングの世界市場-2023年～2030年
出版日: 2023年10月18日
発行: DataM Intelligence
ページ情報: 英文 206 Pages
納期: 即日から翌営業日
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概要

概要

ESDパッケージングの世界市場は、2022年に22億米ドルに達し、2023～2030年の予測期間中にCAGR 5.7%で成長し、2030年には34億米ドルに達すると予測されています。

ESD（静電気放電）パッケージング市場は、エレクトロニクス産業における大幅な先進と革新によって牽引されると予想されます。スマートESDソリューションが登場し、静電気のリアルタイム検出と中和を提供し、保護を強化し効率を向上させています。ナノ技術は、薄型を維持しながら優れた保護を提供するナノ材料によってESD保護に革命をもたらしています。

さらに、IoTの統合により、パッケージングソリューションにスマートセンサーが搭載され、部品が常に安全な静電気環境にあることを確認するためのリアルタイムの監視と警告が可能になります。さらに、優れた保護性能と長期的な耐久性の両方を提供する先進的なESD材料が人気を集めています。MalasterのESD Safe Rubber BandsやAdvanced ESD Materialsのような製品に代表されるこの開発は、繊細な電子部品を保護し、エレクトロニクス業界の進化するニーズに適応するために不可欠です。

アジア太平洋のESDパッケージング市場は、エレクトロニクス産業の拡大と開拓によって大きな成長を遂げています。中国政府は2022年、電子部品の国内市場を2023年までに2兆1,000億元（3,270億米ドル）に拡大すると発表しました。この野心的な目標は、ESDパッケージング市場の主要促進要因であるエレクトロニクス分野の大幅な成長の可能性を反映したものです。中国政府は、年間売上高100億元以上の国際競争力のある電子部品メーカーを15社育成することを目指しています。競争力を高めるためには、厳格な品質管理とESD保護が必要であり、ESDパッケージ市場を後押ししています。

力学

半導体産業が先進パッケージング需要を牽引

ESDパッケージング市場は、世界の半導体パッケージング産業の成長によって牽引されると予想されます。半導体産業協会によると、同産業は2024年には11.9%の成長が予測され、回復が見込まれています。電子部品はますます敏感になっており、静電気放電は修復不可能な損傷につながる可能性があります。その結果、半導体メーカーやサプライヤーは、保管中や輸送中に製品を保護するために先進のESDパッケージングソリューションに目を向けています。

さらに、半導体業界の変動と高感度電子部品の需要が、特殊なパッケージングソリューションによる効果的なESD保護の必要性を高めています。半導体市場の回復と拡大に伴い、ESDパッケージング材料とソリューションの需要も連動して伸びることが予想され、ESDパッケージング市場が半導体セクターの進化するニーズに応える機会を提供しています。

持続可能性の推進が電子機器の環境に優しいESDパッケージング需要を後押し

持続可能性が重視されるようになったことで、エレクトロニクス業界では静電気放電パッケージングソリューションの需要が急増しています。環境問題や企業の持続可能性が重視される中、メーカーやサプライヤーは環境に優しいESDパッケージングを模索しています。発泡スチロールやプラスチックのような従来の非生分解性素材に関連する環境への影響を軽減するため、多くの場合生分解性またはリサイクル可能な持続可能なESDパッケージング素材が支持を集めています。

Freudenberg Performance Materialsは、特に自動車や産業分野で静電気放電を防止し、敏感な表面を保護するために設計されたテクニカルパッケージングテキスタイル、エボロンESDを発表しました。エボロンESDは、トリムライン、ダッシュボード、ミラー、ステアリングホイールなどの部品を保護すると同時に、微細な傷や糸くずによる汚染を防ぎます。この持続可能なソリューションは廃棄物削減に貢献し、長持ちし、再生ポリエステルから作られています。

高まる環境への懸念

ESDパッケージング市場は、環境問題への関心の高まりや、環境に優しいパッケージングに対する消費者の嗜好、特にパッケージングに一般的に使用されるPETのような素材が環境に与える影響によって、大きな影響を受ける可能性があります。ESDパッケージングによく使われるプラスチックの一種であるPETは生分解性がなく、プラスチック汚染の一因となっています。PETやその他のプラスチックは分解されるとマイクロプラスチックとなり、海やその他の水域に容易に拡散します。

さらに、これらのマイクロプラスチックは水生生物によって消費され、最終的には食物連鎖に入り、魚介類の消費を通じて人間に到達する可能性があります。このような環境への懸念は、ESDパッケージング材料の持続可能性と長期的影響について疑問を投げかけ、業界はこれらの環境課題を軽減するため、より環境に優しい代替品を模索するよう促しています。

目次

第1章 調査手法と調査範囲

第2章 定義と概要

第3章 エグゼクティブサマリー

第4章 市場力学

  • 影響要因
    • 促進要因
      • 半導体産業が先進パッケージング需要を牽引
      • 持続可能性の推進が電子機器における環境に優しいESDパッケージングの需要を押し上げる
    • 抑制要因
      • 環境に対する懸念の高まり
    • 機会
    • 影響分析

第5章 産業分析

  • ポーターのファイブフォース分析
  • サプライチェーン分析
  • 価格分析
  • 規制分析
  • ロシア・ウクライナ戦争分析
  • DMI意見

第6章 COVID-19分析

第7章 製品別

  • バッグ
  • トレー
  • 箱・容器
  • ESDフォーム
  • ESDフィルム
  • その他

第8章 素材別

  • 導電性プラスチック
  • 金属
  • ポリエチレン（PE）
  • ポリプロピレン（PP）
  • ポリ塩化ビニル
  • その他

第9章 ESD分類別

  • 帯電防止
  • 静電気散逸性
  • 導電性

第10章 用途別

  • 電気・電子部品
  • 機器
  • 爆発性粉末
  • 医薬品

第11章 エンドユーザー別

  • ネットワーク・通信産業
  • 家電・コンピューター周辺機器
  • 自動車産業
  • 軍事・防衛
  • 医療
  • 航空宇宙
  • その他

第12章 地域別

  • 北米
    • 米国
    • カナダ
    • メキシコ
  • 欧州
    • ドイツ
    • 英国
    • フランス
    • イタリア
    • ロシア
    • その他の欧州
  • 南米
    • ブラジル
    • アルゼンチン
    • その他の南米
  • アジア太平洋
    • 中国
    • インド
    • 日本
    • オーストラリア
    • その他のアジア太平洋
  • 中東・アフリカ

第13章 競合情勢

  • 競合シナリオ
  • 市況/シェア分析
  • M&A分析

第14章 企業プロファイル

  • Nefab
  • Desco Industries, Inc.
  • Protektive Pak
  • Conductive Containers, Inc.
  • ACL Staticide
  • Teknis Limited
  • Statclean Technology（S）Pte Ltd
  • GWP Group
  • DS Smith plc
  • Sealed Air Corporation

第15章 付録

目次
Product Code: PAC7150

Overview

Global ESD Packaging Market reached US$ 2.2 billion in 2022 and is expected to reach US$ 3.4 billion by 2030, growing with a CAGR of 5.7% during the forecast period 2023-2030.

The ESD (Electrostatic Discharge) packaging market is expected to be driven with significant advancements and innovations in the electronics industry. Smart ESD solutions have emerged, offering real-time detection and neutralization of static charges, enhancing protection and improving efficiency. Nanotechnology is revolutionizing ESD protection with nanomaterials that provide superior protection while maintaining a slim profile.

Furthermore, IoT integration allows for smart sensors in packaging solutions, enabling real-time monitoring and alerts to ensure components are always in a safe electrostatic environment. Additionally, advanced ESD materials are gaining traction, offering both superior protection and long-term durability. The developments, exemplified by products like Malaster's ESD Safe Rubber Bands and Advanced ESD Materials, are essential for safeguarding sensitive electronic components and adapting to the evolving needs of the electronics industry.

The ESD packaging market in the Asia-Pacific has been experiencing significant growth driven by the expansion and development of the electronics industry. The Chinese government in 2022 announced to expand the domestic market for electronic components to 2.1 trillion yuan (US$ 327 billion) by 2023. Its ambitious goal reflects the substantial growth potential in the electronics sector, which is a major driver of the ESD packaging market. The Chinese government aims to develop 15 globally competitive electronic components makers with annual sales of 10 billion yuan or more. It focusses on competitiveness requires stringent quality control and ESD protection, boosting the ESD packaging market.

Dynamics

Semiconductor Industry Drives Demand for Advanced ESD Packaging

The ESD packaging market is expected to be driven with the growing semiconductor packaging industry globally. According to the Semiconductor Industry Association, the industry is expected to rebound with a projected growth of 11.9% in 2024. Electronic components are becoming increasingly sensitive and any electrostatic discharge can lead to irreparable damage. As a result, semiconductor manufacturers and suppliers are turning to advanced ESD packaging solutions to safeguard their products during storage and transportation.

Furthermore, the semiconductor industry's fluctuations and demand for sensitive electronic components drive the need for effective ESD protection through specialized packaging solutions. As the semiconductor market recovers and expands, the demand for ESD packaging materials and solutions is expected to grow in tandem, providing opportunities for the ESD packaging market to cater to the evolving needs of the semiconductor sector.

Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic

The increasing emphasis on sustainability is driving a surge in demand for electrostatic discharge packaging solutions in the electronics industry. As environmental concerns and corporate sustainability objectives take center stage, manufacturers and suppliers are seeking ESD packaging options that align with eco-friendly practices. Sustainable ESD packaging materials, often biodegradable or recyclable, are gaining traction as they reduce the environmental impact associated with traditional non-biodegradable materials like foam and plastics.

Freudenberg Performance Materials has introduced Evolon ESD, a technical packaging textile designed to prevent electrostatic discharge and safeguard sensitive surfaces, particularly in the automotive and industrial sectors. Evolon ESD offers protection for components like trim lines, dashboards, mirrors and steering wheels, while also preventing micro-scratches and lint contamination. The sustainable solution contributes to waste reduction, is long-lasting and is made from recycled polyester.

Growing Environmental Concerns

The ESD packaging market can be significantly impacted with growing environmental concerns and consumer preferences for eco-friendly packaging, particularly the environmental impact of materials like PET commonly used in packaging. PET which is a type of plastic, commonly used in ESD packaging, is not biodegradable and contributes to plastic pollution. PET and other plastics when break down, they form microplastics, which are easily spreadable in oceans and other water bodies.

Furthermore, these microplastics are consumed by aquatic life, eventually entering the food chain and potentially reaching humans through seafood consumption. It environmental concern raises questions about the sustainability and long-term impact of ESD packaging materials, prompting the industry to explore more eco-friendly alternatives to mitigate these environmental challenges.

Segment Analysis

The global ESD packaging market is segmented based on product, material, ESD classification, application, end-user and region.

ESD Bags Dominate the ESD Packaging Market with Crucial Role in Component Protection

In the ESD packaging market, bags hold the largest product type segment with a significant role in protecting sensitive electronic components and devices from electrostatic discharge. Many industries, including electronics, aerospace and medical devices, have strict ESD control requirements and standards. ESD bags are designed to meet these industry standards, ensuring compliance with regulations.

Furthermore, some ESD bags are designed to be reusable, reducing waste and environmental impact. It sustainability aspect is increasingly important in today's manufacturing and packaging practices. EcoCortec's Eco-Corr Film ESD represents a significant breakthrough in the realm of ESD packaging. It offers an eco-friendly alternative to conventional polyethylene electrostatic dissipating (ESD) films, aligning with the growing global emphasis on sustainability and reducing plastic waste.

Geographical Penetration

Asia-Pacific ESD Packaging Market Surges Alongside Electronics Industry Growth

The ESD packaging market in the Asia-Pacific has been experiencing significant growth, driven by the booming electronics industry. As per International Labour Organization report, China's electronics industry has been on a rapid growth trajectory. In 2020, the industry's value reached nearly US$ 350 billion, constituting about 25% of the global assembly value. It substantial industry size creates a strong demand for ESD packaging to protect sensitive electronic components and devices during manufacturing, storage and transportation.

Further, China consists of a substantial number of industrial enterprises in the electronics manufacturing sector. As of June 2020, there were 43,981 such enterprises in China, employing a total of 13.28 million workers. It extensive manufacturing base generates a continuous demand for ESD packaging materials and solutions to safeguard sensitive electronic products. Further more Make in India policy announced by government of India is also create=ing significant opportunities for the growth of ESD packaging market.

Competitive Landscape

The major global players in the market include: Nefab, Desco Industries, Inc., Protektive Pak, Conductive Containers, Inc., ACL Staticide, Teknis Limited, Statclean Technology (S) Pte Ltd, GWP Group, DS Smith plc and Sealed Air Corporation.

COVID-19 Impact Analysis:

The COVID-19 pandemic had a profound impact on the ESD packaging market, particularly on the electronics industry, bringing about significant changes and trends. As there was a surge in remote work, online education and increased time spent at home, people turned to electronic devices more than ever before which resulted in a booming electronics industry. Consumer habits shifted dramatically, with individuals spending increasingly more time online, which, in turn increases the demand for electronic devices.

However, there were also challenges, such as the rise of counterfeit electronics, disruptions in supply chains due to labor shortages and factory closures and the need for stringent quality control to maintain consumer trust. Despite these challenges, the electronics industry continues to thrive, with smartphones emerging as the dominating product, especially in initiatives related to COVID-19 contact tracing which the growth of ESD packaging demand at the times of pandemic.

Russia-Ukraine War Impact

The Russia-Ukraine war has a major impact on the ESD packaging market, particularly in the semiconductor sector. The immediate risk lies in the supply of specific raw materials used in semiconductor manufacturing, including neon and palladium. The materials are crucial for the production of semiconductor chips, which are integral to various electronic devices. The disruption in the semiconductor industry could significantly impact the ESD packaging market.

Furthermore, to mitigate potential supply chain disruptions, companies in the ESD packaging industry are constantly seeking alternative material sources, understanding their supply chains thoroughly, considering investments in recycling technologies and employing forward pricing strategies. The war's impact on the semiconductor supply chain underscores the importance of supply chain resilience in the industry.

By Product

  • Bags
  • Trays
  • Boxes & Containers
  • ESD Foam
  • ESD Films
  • Others

By Material

  • Conductive Plastics
  • Metal
  • Polyethylene (PE)
  • Polypropylene (PP)
  • Polyvinyl Chloride
  • Others

By ESD Classification

  • Anti-Static
  • Static Dissipative
  • Conductive

By Application

  • Electrical and Electronic Component
  • Equipment
  • Explosive Powder
  • Drugs

By End-User

  • Network and Telecommunication Industry
  • Consumer Electronics & Computer Peripheral
  • Automotive Industry
  • Military and Defense
  • Healthcare
  • Aerospace
  • Others

By Region

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Italy
    • Russia
    • Rest of Europe
  • South America
    • Brazil
    • Argentina
    • Rest of South America
  • Asia-Pacific
    • China
    • India
    • Japan
    • Australia
    • Rest of Asia-Pacific
  • Middle East and Africa

Key Developments

  • In September 2023, Alpha and Omega Semiconductor (AOS) has unveiled its MRigidCSP packaging technology, aimed at enhancing battery management applications. The technology is designed to reduce on-resistance while simultaneously increasing mechanical strength. Initially, AOS is offering MRigidCSP technology on its AOCR33105E, a 12V common-drain dual N-channel MOSFET. The packaging technology is well-suited for battery applications in devices like smartphones, tablets and ultra-thin notebooks.
  • In November 2022, Cortec has introduced a sustainable solution in the form of EcoSonic ESD-safe bags, addressing challenges in electronic product packaging. The bags provide ESD protection to prevent damage from static charges and incorporate bubble wrap for impact protection. What sets them apart is the integration of Nano VpCl lining, which releases corrosion-resistant compounds into the bag's internal atmosphere, forming a protective molecular-scale layer around the product. It protects against moisture and corrosion without affecting solderability.
  • In May 2023, Semtech has introduced its latest Transient Voltage Suppressors (TVS) product, the RClamp0822B, designed to offer high-performance electrostatic discharge (ESD) and surge protection. The versatile circuit protection platform aims to safeguard high-speed data interfaces across various circuit interfaces in industrial, data center and telecommunication applications. The RClamp0822B, with its very-low sub 1 picofarad loading capacitance, is ideal for protecting high-speed data lines from electrical transient threats. It also provides robust surge immunity and is packaged in a user-friendly SC-75 package, making it suitable for a wide range of industrial designs

Why Purchase the Report?

  • To visualize the global ESD packaging market segmentation based on product, material, ESD classification, application, end-user and region, as well as understand key commercial assets and players.
  • Identify commercial opportunities by analyzing trends and co-development.
  • Excel data sheet with numerous data points of microwave packaging market-level with all segments.
  • PDF report consists of a comprehensive analysis after exhaustive qualitative interviews and an in-depth study.
  • Product mapping available as excel consisting of key products of all the major players.

The global ESD packaging market report would provide approximately 60 tables, 65 figures and 206 Pages.

Target Audience 2023

  • Manufacturers/ Buyers
  • Industry Investors/Investment Bankers
  • Research Professionals
  • Emerging Companies

Table of Contents

1. Methodology and Scope

  • 1.1. Research Methodology
  • 1.2. Research Objective and Scope of the Report

2. Definition and Overview

3. Executive Summary

  • 3.1. Snippet By Product
  • 3.2. Snippet By Material
  • 3.3. Snippet By ESD Classification
  • 3.4. Snippet By Application
  • 3.5. Snippet By End-User
  • 3.6. Snippet by Region

4. Dynamics

  • 4.1. Impacting Factors
    • 4.1.1. Drivers
      • 4.1.1.1. Semiconductor Industry Drives Demand for Advanced ESD Packaging
      • 4.1.1.2. Sustainability Drive Boosts Demand for Eco-Friendly ESD Packaging in Electronic
    • 4.1.2. Restraints
      • 4.1.2.1. Growing Environmental Concerns
    • 4.1.3. Opportunity
    • 4.1.4. Impact Analysis

5. Industry Analysis

  • 5.1. Porter's Five Force Analysis
  • 5.2. Supply Chain Analysis
  • 5.3. Pricing Analysis
  • 5.4. Regulatory Analysis
  • 5.5. Russia - Ukraine War Analysis
  • 5.6. DMI Opinion

6. COVID-19 Analysis

  • 6.1. Analysis of COVID-19
    • 6.1.1. Scenario Before COVID
    • 6.1.2. Scenario During COVID
    • 6.1.3. Scenario Post COVID
  • 6.2. Pricing Dynamics Amid COVID-19
  • 6.3. Demand-Supply Spectrum
  • 6.4. Government Initiatives Related to the Market During Pandemic
  • 6.5. Manufacturers Strategic Initiatives
  • 6.6. Conclusion

7. By Product

  • 7.1. Introduction
    • 7.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 7.1.2. Market Attractiveness Index, By Product
  • 7.2. Bags*
    • 7.2.1. Introduction
    • 7.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 7.3. Trays
  • 7.4. Boxes & Containers
  • 7.5. ESD Foam
  • 7.6. ESD Films
  • 7.7. Others

8. By Material

  • 8.1. Introduction
    • 8.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 8.1.2. Market Attractiveness Index, By Material
  • 8.2. Conductive Plastics*
    • 8.2.1. Introduction
    • 8.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 8.3. Metal
  • 8.4. Polyethylene (PE)
  • 8.5. Polypropylene (PP)
  • 8.6. Polyvinyl Chloride
  • 8.7. Others

9. By ESD Classification

  • 9.1. Introduction
    • 9.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 9.1.2. Market Attractiveness Index, By ESD Classification
  • 9.2. Anti-Static*
    • 9.2.1. Introduction
    • 9.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 9.3. Static Dissipative
  • 9.4. Conductive

10. By Application

  • 10.1. Introduction
    • 10.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 10.1.2. Market Attractiveness Index, By Application
  • 10.2. Electrical and Electronic Component*
    • 10.2.1. Introduction
    • 10.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 10.3. Equipment
  • 10.4. Explosive Powder
  • 10.5. Drugs

11. By End-User

  • 11.1. Introduction
    • 11.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 11.1.2. Market Attractiveness Index, By End-User
  • 11.2. Network and Telecommunication Industry*
    • 11.2.1. Introduction
    • 11.2.2. Market Size Analysis and Y-o-Y Growth Analysis (%)
  • 11.3. Consumer Electronics & Computer Peripheral
  • 11.4. Automotive Industry
  • 11.5. Military and Defense
  • 11.6. Healthcare
  • 11.7. Aerospace
  • 11.8. Others

12. By Region

  • 12.1. Introduction
    • 12.1.1. Market Size Analysis and Y-o-Y Growth Analysis (%), By Region
    • 12.1.2. Market Attractiveness Index, By Region
  • 12.2. North America
    • 12.2.1. Introduction
    • 12.2.2. Key Region-Specific Dynamics
    • 12.2.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 12.2.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 12.2.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 12.2.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 12.2.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 12.2.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 12.2.8.1. U.S.
      • 12.2.8.2. Canada
      • 12.2.8.3. Mexico
  • 12.3. Europe
    • 12.3.1. Introduction
    • 12.3.2. Key Region-Specific Dynamics
    • 12.3.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 12.3.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 12.3.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 12.3.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 12.3.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 12.3.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 12.3.8.1. Germany
      • 12.3.8.2. UK
      • 12.3.8.3. France
      • 12.3.8.4. Italy
      • 12.3.8.5. Russia
      • 12.3.8.6. Rest of Europe
  • 12.4. South America
    • 12.4.1. Introduction
    • 12.4.2. Key Region-Specific Dynamics
    • 12.4.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 12.4.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 12.4.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 12.4.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 12.4.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 12.4.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 12.4.8.1. Brazil
      • 12.4.8.2. Argentina
      • 12.4.8.3. Rest of South America
  • 12.5. Asia-Pacific
    • 12.5.1. Introduction
    • 12.5.2. Key Region-Specific Dynamics
    • 12.5.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 12.5.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 12.5.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 12.5.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 12.5.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User
    • 12.5.8. Market Size Analysis and Y-o-Y Growth Analysis (%), By Country
      • 12.5.8.1. China
      • 12.5.8.2. India
      • 12.5.8.3. Japan
      • 12.5.8.4. Australia
      • 12.5.8.5. Rest of Asia-Pacific
  • 12.6. Middle East and Africa
    • 12.6.1. Introduction
    • 12.6.2. Key Region-Specific Dynamics
    • 12.6.3. Market Size Analysis and Y-o-Y Growth Analysis (%), By Product
    • 12.6.4. Market Size Analysis and Y-o-Y Growth Analysis (%), By Material
    • 12.6.5. Market Size Analysis and Y-o-Y Growth Analysis (%), By ESD Classification
    • 12.6.6. Market Size Analysis and Y-o-Y Growth Analysis (%), By Application
    • 12.6.7. Market Size Analysis and Y-o-Y Growth Analysis (%), By End-User

13. Competitive Landscape

  • 13.1. Competitive Scenario
  • 13.2. Market Positioning/Share Analysis
  • 13.3. Mergers and Acquisitions Analysis

14. Company Profiles

  • 14.1. Nefab*
    • 14.1.1. Company Overview
    • 14.1.2. Product Portfolio and Description
    • 14.1.3. Financial Overview
    • 14.1.4. Key Developments
  • 14.2. Desco Industries, Inc.
  • 14.3. Protektive Pak
  • 14.4. Conductive Containers, Inc.
  • 14.5. ACL Staticide
  • 14.6. Teknis Limited
  • 14.7. Statclean Technology (S) Pte Ltd
  • 14.8. GWP Group
  • 14.9. DS Smith plc
  • 14.10. Sealed Air Corporation

LIST NOT EXHAUSTIVE

15. Appendix

  • 15.1. About Us and Services
  • 15.2. Contact Us