静電気放電（ESD）パッケージングの世界市場規模：製品別、用途別、エンドユーザー別、地域範囲別および予測

静電気放電（ESD）パッケージングの市場規模と予測

静電気放電（ESD）パッケージング市場規模は、2024年に22億7,000万米ドルと評価され、2031年には34億5,000万米ドルに達すると予測され、2024年から2031年までのCAGRは5%で成長します。静電気放電（ESD）パッケージングは、静電気の突然の放出による損傷から電子部品やデバイスを保護するために不可欠です。ESDは、電位の異なる2つの物体が接触したときに発生し、その結果、急激な電気の流れが敏感な電子部品に害を及ぼす可能性があります。電子機器の製造、輸送、保管において、この放電は重大なリスクとなり、デバイスの誤動作や完全な故障を引き起こす可能性があります。ESDパッケージは、静電気を安全に放散する制御された環境を作り出すことでこの脅威を最小限に抑え、封入された部品の保護を確実にします。

半導体製造、航空宇宙、自動車、医療機器などの業界では、繊細な電子機器が多いため、ESDパッケージングに大きく依存しています。

電子機器の小型化と複雑化が進むにつれ、小型部品ほど静電気による損傷を受けやすくなるため、堅牢なESD保護の必要性がより重要になっています。さらに、先進的なESDパッケージング・ソリューションに対する需要も増加の一途をたどっています。

ESDパッケージングにおける今後の技術革新は、新素材や製造技術の使用による効率改善、軽量化、環境持続可能性の向上に焦点が当てられると予想されます。

静電気放電（ESD）パッケージングの世界市場力学

世界の静電気放電（ESD）パッケージング市場を形成している主な市場力学

主な市場促進要因

電子機器需要の増加：

電子機器に対する需要の増加：電子機器に対する需要の増加は主要な促進要因の一つです。消費者も産業界も同様に技術の進歩を受け入れているため、製造、輸送、保管中の静電気放電から敏感な電子部品を保護する必要性が高まっています。インターナショナル・データ・コーポレーション（IDC）によると、スマートフォンの世界出荷台数は2022年に12億1,000万台に達し、2026年には13億8,000万台の成長が予測されています。

半導体産業の成長：

半導体産業の急拡大は、特殊なESDパッケージへのニーズを後押ししています。半導体産業協会（SIA）の報告によると、世界の半導体売上高は2022年に50億米ドルに達し、2030年までに1兆米ドルを超えるとの予測もあります。この成長により、サプライチェーン全体で高度なESD保護対策が必要となります。

厳しい規制と規格：

電子部品の取り扱いや保護に関する規制や業界標準の厳格化が進み、ESDパッケージング市場を後押ししています。ESD協会は、ANSI/ESD S20.20などの規格への準拠が多くの電子機器メーカーにとって必須となっていると報告しています。同協会が2021年に実施した調査によると、電子機器メーカーの78%が包括的なESD管理プログラムを実施しており、2018年の65%から増加しており、ESD保護対策が重視されるようになっていることを示しています。

主な課題

高コスト：

サプライチェーン全体でESD対策を実施することに高いコストが伴います。米国エネルギー省の報告書によると、包括的なESD管理プログラムの導入には、製造スペース1平方フィート当たり年間0.10～0.50ドルのコストがかかるといいます。

意識の欠如：

中小企業における認識と適切なトレーニングの欠如。EU-OSHA（European Agency for Safety and Health at Work：欧州労働安全衛生庁）が実施した調査によると、正式なESD対策プログラムを実施している電子機器業界の中小企業は、大企業の76％に対し、わずか38％でした。

ESDパッケージング材の廃棄に関する環境問題：

米国環境保護庁（EPA）の報告によると、ESDパッケージング材に一般的に使用されているプラスチックは、年間発生する都市固形廃棄物全体の18%以上を占めており、リサイクルされているのはわずか約9%です。

主な動向

電子部品の小型化：

電子部品の小型化、高感度化に伴い、静電気による損傷のリスクが高まっています。このため、輸送、保管、取り扱い中にこれらの部品を効果的に保護できるESDパッケージング・ソリューションに対する需要が高まっています。International Technology Roadmap for Semiconductors（ITRS）によると、集積回路の平均トランジスタサイズは1995年の350ナノメートルから2020年にはわずか5ナノメートルに縮小し、2028年には1.5ナノメートルに達すると予測されています。

モノのインターネット（IoT）機器の普及拡大

ヘルスケア、自動車、スマートホームなどの分野でのIoT機器の普及は、高感度部品を保護するESDパッケージングの必要性を高めています。インターナショナル・データ・コーポレーション（IDC）は、2025年までに416億台のIoT機器が接続され、79.4ゼタバイトのデータが生成されると予測しています。これは、2018年から2025年までのCAGRが28.7%であることを示しています。

持続可能でリサイクル可能なESDパッケージング材料への注目の高まり：

環境への関心が高まる中、環境に優しいESDパッケージング資材の開発と使用へのシフトが進んでいます。包装および包装廃棄物に関する欧州委員会の報告書によると、EUにおけるプラスチック包装のリサイクル率は2017年の42.4%から2019年には44.5%に上昇し、持続可能な包装ソリューションへの動向が高まっていることが示されています。

目次

第1章 静電気放電（ESD）パッケージングの世界市場：イントロダクション

• 市場概要
• 調査範囲
• 前提条件

第2章 エグゼクティブサマリー

第3章 VERIFIED MARKET RESEARCHの調査手法

• データマイニング
• バリデーション
• 一次資料
• データソース一覧

第4章 静電気放電（ESD）パッケージングの世界市場展望

• 概要
• 市場力学
• 促進要因
• 抑制要因
• 機会
• ポーターのファイブフォースモデル
• バリューチェーン分析

第5章 静電気放電（ESD）パッケージングの世界市場：製品別

• 袋
• トレイ
• クラムシェル
• シュリンクフィルム
• 箱・容器
• テープとラベル
• フォーム
• トート/IBC
• ラック

第6章 静電気放電（ESD）パッケージングの世界市場：用途別

• 電気・電子
• 自動車
• 防衛・軍事
• 製造
• 航空宇宙
• ヘルスケア

第7章 静電気放電（ESD）パッケージングの世界市場：地域別

• 北米
• 米国
• カナダ
• メキシコ
• 欧州
• ドイツ
• 英国
• フランス
• その他欧州
• アジア太平洋
• 中国
• 日本
• インド
• その他アジア太平洋地域
• 世界のその他の地域
• ラテンアメリカ
• 中東・アフリカ

第8章 世界の静電気放電（ESD）パッケージ市場の競合情勢

• 概要
• 各社の市場ランキング
• 主な開発戦略

第9章 企業プロファイル

• Smurfit Kappa
• DS Smith
• Sealed Air
• Pregis
• Achilles
• Desco
• Storopack
• NEFAB
• Teknis
• Elcom
• Summit Container
• Kiva Container
• Protective Packaging
• GWP
• Pure-Stat
• International Plastics
• AUER Packaging
• Dou Yee Enterprises
• Botron

第10章 付録

• 関連レポート

Electrostatic Discharge ESD Packaging Market Size And Forecast

The Electrostatic Discharge ESD Packaging Market size was valued at USD 2.27 Billion in 2024 and is projected to reach USD 3.45 Billion by 2031 , growing at a CAGR of 5% from 2024 to 2031. Electrostatic discharge (ESD) packaging is essential for protecting electronic components and devices from damage caused by the sudden release of static electricity. ESD occurs when two objects with differing electrical potentials come into contact, resulting in an abrupt flow of electricity that can harm sensitive electronic components. In the manufacturing, transportation, and storage of electronics, this discharge poses a significant risk, potentially causing malfunctions or complete failure of devices. ESD packaging minimizes this threat by creating a controlled environment that safely dissipates static electricity, ensuring the protection of enclosed components.

Industries such as semiconductor manufacturing, aerospace, automotive, and medical devices rely heavily on ESD packaging due to the prevalence of sensitive electronics.

As miniaturization and complexity in electronics increase, the need for robust ESD protection has become more critical, with smaller components being more vulnerable to electrostatic damage. In addition, the demand for advanced ESD packaging solutions continues to grow.

Future innovations in ESD packaging are expected to focus on improving efficiency, reducing weight, and increasing environmental sustainability through the use of new materials and manufacturing techniques.

Global Electrostatic Discharge ESD Packaging Market Dynamics

The key market dynamics that are shaping the global electrostatic discharge ESD packaging market include:

Key Market Drivers

Increasing Demand for Electronic Devices:

The increasing demand for electronic devices is one of the primary drivers. As consumers and industries alike embrace technological advancements, there's a growing need to safeguard sensitive electronic components from electrostatic discharge during manufacturing, transportation, and storage. According to the International Data Corporation (IDC), global shipments of smartphones reached 1.21 billion units in 2022, with a projected growth of 1.38 billion units by 2026.

Growth in the Semiconductor Industry:

The rapid expansion of the semiconductor industry is driving the need for specialized ESD packaging. The Semiconductor Industry Association (SIA) reported that global semiconductor sales reached USD 5 Billion in 2022, with projections suggesting the market could surpass USD 1 Trillion by 2030. This growth necessitates advanced ESD protection measures throughout the supply chain.

Stringent Regulations and Standards:

Increasingly strict regulations and industry standards regarding the handling and protection of electronic components are boosting the ESD packaging market. The ESD Association reported that compliance with standards such as ANSI/ESD S20.20 has become mandatory for many electronics manufacturers. A survey conducted by the association in 2021 found that 78% of electronics manufacturers had implemented comprehensive ESD control programs, up from 65% in 2018, indicating a growing emphasis on ESD protection measures.

Key Challenges

High Cost:

High cost associated with implementing ESD protection measures throughout the supply chain. According to a report by the U.S. Department of Energy, implementing comprehensive ESD control programs can cost companies between $0.10 to $0.50 per square foot of manufacturing space annually.

Lack of Awareness:

Lack of awareness and proper training among small and medium-sized enterprises (SMEs). A survey conducted by the European Agency for Safety and Health at Work (EU-OSHA) found that only 38% of SMEs in the electronics industry had implemented formal ESD control programs, compared to 76% of large enterprises.

Environmental Concerns Related to the Disposal of ESD Packaging Materials:

The U.S. Environmental Protection Agency (EPA) reports that plastics, which are commonly used in ESD packaging, account for more than 18% of total municipal solid waste generated annually, with only about 9% being recycled.

Key Trends

Increasing Miniaturization of Electronic Components:

As electronic components become smaller and more sensitive, the risk of electrostatic damage increases. This has led to a higher demand for ESD packaging solutions that can effectively protect these components during transportation, storage, and handling. According to the International Technology Roadmap for Semiconductors (ITRS), the average transistor size in integrated circuits has shrunk from 350 nanometers in 1995 to just 5 nanometers in 2020, with projections reaching 1.5 nanometers by 2028.

Growing Adoption of Internet of Things (IoT) Devices

: The proliferation of IoT devices in sectors such as healthcare, automotive, and smart homes is driving the need for ESD packaging to protect sensitive components. The International Data Corporation (IDC) forecasts that there will be 41.6 billion connected IoT devices by 2025, generating 79.4 zettabytes of data. This represents a compound annual growth rate (CAGR) of 28.7% from 2018 to 2025.

Increasing Focus on Sustainable and Recyclable ESD Packaging Materials:

With growing environmental concerns, there's a shift towards developing and using eco-friendly ESD packaging materials. A report by the European Commission on Packaging and Packaging Waste found that the recycling rate for plastic packaging in the EU increased from 42.4% in 2017 to 44.5% in 2019, indicating a growing trend towards sustainable packaging solutions.

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Global Electrostatic Discharge ESD Packaging Market Regional Analysis

Here is a more detailed regional analysis of the global electrostatic discharge ESD packaging market:

Asia Pacific

Asia Pacific substantially dominates the global electrostatic discharge ESD Packaging Market driven by the concentration of electronics manufacturing in countries such as China, Japan, South Korea, and Taiwan, producing a significant portion of the world's electronic components and devices.

According to the United Nations Conference on Trade and Development (UNCTAD) Digital Economy Report 2021, East Asian economies accounted for nearly 80% of global exports of ICT goods in 2020, with China alone contributing 44% of the global total.

The semiconductor industry is rapidly growing in the region, particularly in countries like Taiwan and South Korea.

The Semiconductor Industry Association (SIA) reported in 2022 that Taiwan and South Korea accounted for 81% of the global foundry market share in 2021, with Taiwan Semiconductor Manufacturing Company (TSMC) alone holding a 53% market share.

Increasing investments in 5G infrastructure and IoT technologies across Asia Pacific countries.

According to the GSM Association (GSMA) Mobile Economy Asia Pacific 2022 report, 5G connections in the Asia Pacific region are expected to reach 1.2 billion by 2025, accounting for 40% of global 5G connections. The report also projects that operators in the region will invest USD 370 Billion in their networks between 2022 and 2025, with 90% of this dedicated to 5G.

North America

North America is anticipated to witness the fastest growth in the global electrostatic discharge ESD packaging market during the forecast period owing to the presence of major technology companies and a strong focus on innovation and research and development (R&D).

According to the National Science Foundation's National Center for Science and Engineering Statistics, businesses in the United States spent USD 7 Billion on R&D in 2021, with the information and computer/electronic products sectors accounting for 37.3% of this total.

Rapid growth in the aerospace and defense industries, which require high-performance ESD packaging for sensitive electronic components.

The Aerospace Industries Association reported that in 2022, the U.S. aerospace and defense industry generated USD 892 Billion in sales revenue, with a 4.7% year-over-year growth rate, indicating a strong demand for specialized packaging solutions.

Increasing adoption of electric vehicles (EVs) and autonomous driving technologies, driving demand for ESD protection in automotive electronics.

The U.S. Department of Energy reported that electric vehicle sales in the United States grew by 85% from 2020 to 2021, reaching a record high of 608,000 units. This trend continued in 2022, with EV sales surpassing 800,000 units, representing about 5.8% of all new vehicle sales in the U.S.

Global Electrostatic Discharge ESD Packaging Market: Segmentation Analysis

The Global Electrostatic Discharge ESD Packaging Market is segmented based on Product, Application, End-User, And Geography.

Electrostatic Discharge ESD Packaging Market, By Product

• Bags
• Trays
• Clamshell
• Shrink Films
• Boxes and Containers
• Tapes and Labels
• Foams
• Totes/IBC
• Racks

Based on the Product, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Bag, Trays, Clamshell, Shrink Films, Boxes and Containers, Tapes and Labels, Foams, Totes/IBC, and Racks. The bag is a dominant segment within the global electrostatic discharge (ESD) packaging market, favored for their versatility, affordability, and ease of use. ESD bags are commonly employed to shield sensitive electronic components, such as integrated circuits, microchips, and circuit boards, from electrostatic discharge during storage, transportation, and handling. Made from specialized anti-static materials like metalized polyester or polyethylene, these bags provide a reliable barrier that dissipates static electricity, preventing damage to the enclosed electronics.

Electrostatic Discharge ESD Packaging Market, By Application

• Printed Circuit Boards
• Integrated Circuits
• Semiconductors

Based on the Application, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Printed Circuit Boards, Integrated Circuits, and Semiconductors. The printed circuit boards (PCBs) segment dominates the global electrostatic discharge (ESD) packaging market owing to the need to protect sensitive components. PCBs, which contain high-density elements like microprocessors and memory chips, are highly vulnerable to ESD damage. The growing use of electronics in sectors requiring high reliability, such as medical devices, further emphasizes the importance of ESD protection to ensure the safe handling and longevity of PCBs.

Electrostatic Discharge ESD Packaging Market, By End-User

• Electrical and Electronics
• Automobile
• Defense and Military
• Manufacturing
• Aerospace
• Healthcare

Based on the End-User, the Global Electrostatic Discharge (ESD) Packaging Market is bifurcated into Electrical and Electronics, Automobile, Defense and Military, Manufacturing, Aerospace, and Healthcare. The electrical and electronics segment is the leading in the global electrostatic discharge (ESD) packaging market owing to its critical need for ESD protection to safeguard sensitive electronic components. This sector spans various industries, including semiconductor manufacturing, consumer electronics, telecommunications, and industrial automation, all of which depend on ESD packaging solutions to prevent damage from electrostatic discharge during key processes such as manufacturing, assembly, and transportation.

Electrostatic Discharge ESD Packaging Market, By Geography

• North America
• Europe
• Asia Pacific
• Rest of the World

Based on Geography, the Global Electrostatic Discharge ESD Packaging Market is classified into North America, Europe, Asia Pacific, and the Rest of the world. Asia Pacific substantially dominates the global electrostatic discharge ESD packaging market driven by the concentration of electronics manufacturing in countries such as China, Japan, South Korea, and Taiwan, producing a significant portion of the world's electronic components and devices. According to the United Nations Conference on Trade and Development (UNCTAD) Digital Economy Report 2021, East Asian economies accounted for nearly 80% of global exports of ICT goods in 2020, with China alone contributing 44% of the global total. The semiconductor industry is rapidly growing in the region, particularly in countries like Taiwan and South Korea.

Key Players

• The "Global Electrostatic Discharge ESD Packaging Market" study report will provide valuable insight with an emphasis on the global market. The major players in the market are
• Desco Industries, Inc., Sealed Air Corporation, Protektive Pak, Teknis Limited, GWP Group Limited, Elcom, Inc., Summit Packaging Solutions, Statclean Technology (S) Pte Ltd, Conductive Containers, Inc.
• This section offers in-depth analysis through a company overview, position analysis, the regional and industrial footprint of the company, and the ACE matrix for insightful competitive analysis. The section also provides an exhaustive analysis of the financial performances of mentioned players in the given market.

Our market analysis also entails a section solely dedicated to such major players wherein our analysts provide an insight into the financial statements of all the major players, along with product benchmarking and SWOT analysis. The competitive landscape section also includes key development strategies, market share, and market ranking analysis of the above-mentioned players globally.

Global Electrostatic Discharge ESD Packaging Market Key Developments

• In June 2024, Nefab announced the launch of a second factory in Vina del Mar, Chile, expanding its activities in Latin America. The new facility addresses the increased need for contract logistics and sustainable packaging services in the area.
• In July 2023, Smurfit Kappa announced the launch of its new integrated corrugated facility in Rabat, Morocco. This is Smurfit Kappa's first operation in North Africa, with the plant powered by green energy.

TABLE OF CONTENTS

1. Introduction of Global Electrostatic Discharge (ESD) Packaging Market

• Overview of the Market
• Scope of Report
• Assumptions

2. Executive Summary

3. Research Methodology of Verified Market Research

• Data Mining
• Validation
• Primary Interviews
• List of Data Sources

4. Global Electrostatic Discharge (ESD) Packaging Market Outlook

• Overview
• Market Dynamics
• Drivers
• Restraints
• Opportunities
• Porters Five Force Model
• Value Chain Analysis

5. Global Electrostatic Discharge (ESD) Packaging Market, By Product

• Bags
• Trays
• Clamshell
• Shrink Films
• Boxes and Containers
• Tapes and Labels
• Foams
• Totes/IBC
• Racks

6. Global Electrostatic Discharge (ESD) Packaging Market, By Application

• Electrical and Electronics
• Automobile
• Defense and Military
• Manufacturing
• Aerospace
• Healthcare

7. Global Electrostatic Discharge (ESD) Packaging Market, By Geography

• North America
• U.S.
• Canada
• Mexico
• Europe
• Germany
• UK
• France
• Rest of Europe
• Asia Pacific
• China
• Japan
• India
• Rest of Asia Pacific
• Rest of the World
• Latin America
• Middle East & Africa

8. Global Electrostatic Discharge (ESD) Packaging Market Competitive Landscape

• Overview
• Company Market Ranking
• Key Development Strategies

9. Company Profiles

• Smurfit Kappa
• DS Smith
• Sealed Air
• Pregis
• Achilles
• Desco
• Storopack
• NEFAB
• Teknis
• Elcom
• Summit Container
• Kiva Container
• Protective Packaging
• GWP
• Pure-Stat
• International Plastics
• AUER Packaging
• Dou Yee Enterprises
• Botron

10. Appendix

• Related Reports