半導体製造の調査レビュー：2024年

世界のチップレットの市場規模は、2023年の53億米ドルから、予測期間中は41.9%のCAGRで推移し、2029年末には428億米ドルに達すると予測されています。

世界の薄型・超薄型フィルムの市場規模は、2023年の206億米ドルから、13.5%のCAGRで推移し、2028年末には388億米ドルに成長すると予測されています。

世界のIoTチップの市場規模は、2022年の1,861億米ドルから、14.3%のCAGRで推移し、2028年末には3,755億米ドルに達すると予測されています。

当調査レビューは、BCC Researchが2024年に発行したチップレット、薄膜および超薄膜、IoTチップ、高速データコンバータ、プリント基板に関するレポートのハイライトと抜粋を含み、それぞれの市場概要、市場影響因子および市場機会の分析、法規制環境、新興技術および技術開発の動向、市場規模の推移・予測、各種区分・地域別の詳細分析などをまとめています。

目次

第1章 序文

• 調査レビューの範囲

第2章 世界のチップレット市場 (SMC137A)

• チップレット
• 市場見通し
• 調査範囲
• 市場サマリー
• 市場力学
• 新興技術
• セグメント分析
• 地域分析
• 総論
• チップレットの市場概要
• 市場推進要因
• 高性能コンピューティング
• 市場抑制因子/課題
• 熟練労働者の不足
• 市場機会
• 半導体産業への継続的な投資
• 規制状況
• 北米
• 新興技術
• 異種統合
• チップレット市場内訳：プロセッサ別
• CPU
• グラフィックスプロセッシングユニット
• フィールドプログラマブルゲートアレイ
• AI-ASICコプロセッサ
• アプリケーション処理ユニット
• チップレット市場内訳：地域別
• 北米
• 欧州
• アジア太平洋
• 世界のその他の地域

第3章 薄膜および極薄膜の世界市場、技術、材料 (SMC057D)

• 薄膜および超薄膜
• 市場見通し
• 調査範囲
• 市場サマリー
• 技術の進歩と応用
• 市場力学と成長要因
• 今後の動向と展開
• セグメント分析
• 地域別洞察と新興市場
• 総論
• 薄膜および極薄膜の市場概要
• 市場推進要因
• 世界の製造設備投資の増加
• 市場抑制因子
• 薄膜汚染の影響
• 市場機会
• 技術の進歩と新製品の開発
• 主要な新興技術と市場動向
• レーザーベースの指向性エネルギー堆積
• 薄膜および極薄膜の市場内訳：材料別
• 金属
• 誘電
• 化合物
• その他
• 薄膜および極薄膜の市場内訳：地域別
• 北米
• 欧州
• アジア太平洋
• 世界のその他の地域
• 薄膜・超薄膜産業における持続可能性：ESGの観点
• 薄膜および超薄膜市場における主要なESG問題
• ESGパフォーマンス分析
• 薄膜・極薄膜市場におけるESGの現状
• 世界の薄膜・極薄膜市場におけるESG実践
• BCCからの総論

第4章 世界のIoTチップ市場 (SMC135A)

• IoTチップ
• 市場見通し
• 調査範囲
• 市場サマリー
• IoTチップの市場概要
• 市場推進要因
• IoTベースの自動車の需要増加
• 市場抑制因子
• セキュリティとプライバシーに関する懸念
• 市場機会
• 新興技術の導入
• IoTチップ市場の内訳：エンドユーザー産業別
• ヘルスケア
• CE製品
• 自動車
• ビルオートメーション
• 産業
• その他
• IoTチップ市場の内訳：地域別
• 北米
• 欧州
• アジア太平洋
• 世界のその他の地域
• IoTチップ業界の持続可能性：ESGの観点
• IoTチップ市場におけるESG問題
• IoTチップ：ESGパフォーマンス分析
• BCCからの総論

第5章 高速データコンバータ：世界市場と成長予測 (SMC136A)

• 高速データコンバータ
• 市場見通し
• 市場サマリー
• 技術の進歩と応用
• 高速データコンバータの市場力学と成長要因
• セグメント分析
• 地域別洞察と新興市場
• 総論
• 技術概要
• 高速データコンバータの現在および将来の市場概要
• 市場推進要因
• 医療用画像用途の普及
• 市場の課題
• 低消費電力高速データコンバータの開発
• 市場機会
• 自動運転車の台頭
• 新興技術と開発
• 半導体技術の小型化と継続的な改善
• 高速データコンバータ市場の内訳：タイプ別
• A/Dコンバータ (ADC)
• D/Aコンバーター (DAC)
• 高速データコンバータ市場の内訳：地域別
• 北米
• 欧州
• アジア太平洋
• 世界のその他の地域
• 高速データコンバータ業界における持続可能性：ESGの観点
• ESGパフォーマンス分析
• 世界市場におけるESGの現状
• 高速データコンバータ市場におけるESG実践
• BCCによる総論

第6章 プリント基板：各種技術と世界市場 (SMC103D)

• プリント基板
• 市場見通し
• 調査範囲
• 市場サマリー
• 技術の進歩と応用
• プリント基板の市場力学
• セグメント分析
• 地域別洞察と新興市場
• 総論
• 現在の市場と将来の市場
• 市場推進要因
• 自動運転車 (AV) とEVの利用拡大
• 市場の課題
• 技術の複雑化と継続的な革新へのプレッシャーの増大
• 市場機会
• フレキシブルでウェアラブルな電子機器の進歩
• 新興技術と動向
• 3Dプリント
• プリント基板市場の内訳：タイプ別
• 単層
• 二重層
• 多層
• 高密度相互接続 (HDI)
• プリント基板市場の内訳：地域別
• 北米
• 欧州
• アジア太平洋
• 世界のその他の地域
• PCB業界の持続可能性：ESGの観点
• PCB業界におけるESGの現状
• PCB業界におけるESGの実践
• BCCからの総論

第7章 付録

List of Tables

• Table 1 : Global Market for Chiplets, by Region, Through 2029
• Table 2 : Global Market for Chiplets, by Processor, Through 2029
• Table 3 : Global Market for Chiplets, by Region, Through 2029
• Table 4 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 5 : Global Market for Thin and Ultrathin Films, by Material, Through 2028
• Table 6 : Global Market for Thin and Ultrathin Films, by Region, Through 2028
• Table 7 : Environmental Impact
• Table 8 : Social Impact
• Table 9 : Governance Impact
• Table 10 : Global Thin and Ultrathin Films Market, ESG Risk Ratings Metric, 2022
• Table 11 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 12 : Global Market for IoT Chips, by End-use Industry, Through 2028
• Table 13 : Global Market for IoT Chips, by Region, Through 2028
• Table 14 : Environmental Metrics for the IoT Chip Market
• Table 15 : Social Metrics for the IoT Chip Market
• Table 16 : Governance Metrics for the IoT Chip Market
• Table 17 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 18 : Global Market for High-Speed Data Converters, by Type, Through 2029
• Table 19 : Global Market Volume for High-Speed Data Converters, by Type, Through 2029
• Table 20 : Global Market for High-Speed Data Converters, by Region, Through 2029
• Table 21 : Global Market Volume for High-Speed Data Converters, by Region, Through 2029
• Table 22 : Environmental Metrics for the High-Speed Data Converters Market
• Table 23 : Social Metrics for the High-Speed Data Converters Market
• Table 24 : Governance Metrics for the High-Speed Data Converters Market
• Table 25 : ESG Risk Ratings Metric, by Company, 2022
• Table 26 : Global Market for Printed Circuit Boards, by PCB Type, Through 2029
• Table 27 : Global Market for PCBs, by PCB Type, Through 2029
• Table 28 : Global Market for PCBs, by Region, Through 2029
• Table 29 : ESG Risk Ratings, by Company, 2023

List of Figures

• Figure 1 : Global Market Shares of Chiplets, by Region, 2023
• Figure 2 : Emerging Chiplet Technologies
• Figure 3 : Global Market Shares of Chiplets, by Processor, 2023
• Figure 4 : Global Market Shares of Chiplets, by Region, 2023
• Figure 5 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 6 : Front-End Fabrication Equipment Spending, 2020-2024
• Figure 7 : Global Market Shares of Thin and Ultrathin Films, by Material, 2022
• Figure 8 : Global Market Shares of Thin and Ultrathin Films, by Region, 2022
• Figure 9 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 10 : Global Market Shares of IoT Chips, by End-use Industry, 2022
• Figure 11 : Global Market Shares of IoT Chips, by Region, 2022
• Figure 12 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 13 : Global Market Shares of High-Speed Data Converters, by Type, 2023
• Figure 14 : Global Market Volume Shares of High-Speed Data Converters, by Type, 2022
• Figure 15 : Global Market Shares of High-Speed Data Converters, by Region, 2023
• Figure 16 : Global Market Volume Shares of High-Speed Data Converters, by Region, 2023
• Figure 17 : Global Market Shares of Printed Circuit Boards, by PCB Type, 2023
• Figure 18 : Global Market Shares of PCBs, by PCB Type, 2023
• Figure 19 : Global Market Shares of PCBs, by Region, 2023

The global market for chiplets was valued at $5.3 billion in 2023 and is expected to reach $42.8 billion by the end of 2029, at a compound annual growth rate (CAGR) 41.9% from 2024 through 2029.

The global market for thin and ultrathin films is expected to grow from $20.6 billion in 2023 to $38.8 billion by the end of 2028, at a compound annual growth (CAGR) of 13.5% from 2023 to 2028.

The global market for Internet of Things (IoT) chips was valued at $186.1 billion in 2022 and is expected to reach $375.5 billion by the end of 2028, at a compound annual growth (CAGR) of 14.3% from 2023 to 2028.

Research Review Scope

This review report comprehensively analyzes key market trends, technological advancements, and emerging opportunities across various semiconductor segments. It covers the role of chiplets, high-speed data converters, Internet of Things (IoT) chips, printed circuit boards (PCBs), and thin/ultrathin films in next-generation electronics, emphasizing their impact on artificial intelligence (AI), high-performance computing (HPC), 5G technology, automotive applications including electric vehicles (EVs) and autonomous vehicles (AVs), and industrial automation.

Additionally, the review examines market drivers, challenges, growth forecasts, supply chain dynamics, geopolitical influences, and investment trends affecting semiconductor industry. It highlights the increasing demand for modular chiplet integration, IoT connectivity, high-speed data processing, and advanced PCB technologies while addressing regulatory, security, and sustainability challenges. This structured analysis offers valuable insights into the evolving semiconductor landscape and the critical factors driving its transformation .

Research Reviews from BCC Research provide market professionals with concise market coverage within a specific research category. This 2024 Semiconductor Manufacturing Research Review provides a sampling of the type of quantitative market information, analysis, and guidance that BCC Research has been developing since its inception in 1971 to help its customers make informed business decisions. This Research Review includes highlights and excerpts from the following reports published by BCC Research in 2024:

• SMC137A Global Chiplets Market
• SMC057D Global Markets, Technologies and Materials for Thin and Ultrathin Films
• SMC135A Global IoT Chips Market
• SMC136A High-speed Data Converters: Global Markets and Growth Forecast
• SMC103D Printed Circuit Boards: Technologies and Global Markets

After you survey the excerpts in this Research Review, we encourage you to follow up on these topics by checking out the full market research reports associated with each topic. BCC Research looks forward to serving your market intelligence needs in the future.

Table of Contents

Chapter 1 Foreword

• Research Review Scope

Chapter 2 Global Chiplets Market (SMC137A)

• Chiplets
• Market Outlook
• Scope of the Report
• Market Summary
• Market Dynamics
• Emerging Technologies
• Segmental Analysis
• Regional Analysis
• Conclusion
• Market Overview of Chiplets
• Market Driver
• High-Performance Computing
• Market Restraint/Challenge
• Shortage of Skilled Labor
• Market Opportunity
• Continuing Investment in the Semiconductor Industry
• Regulatory Landscape
• North America
• Emerging Technologies
• Heterogeneous Integration
• Market Breakdown of Chiplets by Processor
• CPUs
• Graphics Processing Units
• Field-Programmable Gate Arrays
• AI-ASIC Coprocessors
• Application Processing Units
• Market Breakdown of Chiplets by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World

Chapter 3 Global Markets, Technologies and Materials for Thin and Ultrathin Films (SMC057D)

• Thin and Ultrathin Films
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors
• Future Trends and Developments
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Market Overview of Thin and Ultrathin Films
• Market Driver
• Growing Global Fabrication Equipment Spending
• Market Restraint
• Implications of Thin-Film Contamination
• Market Opportunity
• Technological Advancements and New Product Development
• Key Emerging Technology and Market Trend
• Laser-Based Directed Energy Deposition
• Market Breakdown of Thin and Ultrathin Films by Material
• Metal
• Dielectric
• Compounds
• Others
• Market Breakdown of Thin and Ultrathin Films by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in Thin and Ultrathin Films Industry: An ESG Perspective
• Key ESG Issues in Thin and Ultrathin Films Market
• ESG Performance Analysis
• Current Status of ESG in the Thin and Ultrathin Films Market
• ESG Practices in the Global Thin and Ultrathin Films Market
• Concluding Remarks from BCC Research

Chapter 4 Global IoT Chips Market (SMC135A)

• IoT Chips
• Market Outlook
• Scope of Report
• Market Summary
• Market Overview of IoT Chips
• Market Driver
• Growing Demand for IoT-based Vehicles
• Market Restraint
• Security and Privacy Concerns
• Market Opportunity
• Implementation of Emerging Technologies
• Market Breakdown of IoT Chips by End-use Industry
• Healthcare
• Consumer Electronics
• Automotive
• Building Automation
• Industrial
• Others
• Market Breakdown of IoT Chips by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in IoT Chips Industry: An ESG Perspective
• ESG Issues in the IoT Chip Market
• IoT Chip ESG Performance Analysis
• Concluding Remarks from BCC Research

Chapter 5 High-speed Data Converters: Global Markets and Growth Forecast (SMC136A)

• High-speed Data Converters
• Market Outlook
• Market Summary
• Technological Advancements and Applications
• Market Dynamics and Growth Factors of High-speed Data Converters
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Technology Overview
• Current and Future Market Overview of High-speed Data Converters
• Market Driver
• Widespread Adoption of Medical Imaging Applications
• Market Challenge
• Developing Low-Power High-Speed Data Converters
• Market Opportunity
• Rise of Autonomous Vehicles
• Emerging Technologies and Developments
• Miniaturization and Continuous Improvements in Semiconductor Technologies
• Market Breakdown of High-Speed Data Converters by Type
• A/D Converters (ADC)
• D/A Converters (DAC)
• Market Breakdown of High-Speed Data Converters by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in High-Speed Data Converters Industry: An ESG Perspective
• ESG Performance Analysis
• Current Status of ESG in the Global Market
• ESG Practices in the High-Speed Data Converters Market
• Concluding Remarks from BCC Research

Chapter 6 Printed Circuit Boards: Technologies and Global Markets (SMC103D)

• Printed Circuit Boards
• Market Outlook
• Scope of Report
• Market Summary
• Technological Advances and Applications
• Market Dynamics of Printed Circuit Boards
• Segmental Analysis
• Regional Insights and Emerging Markets
• Conclusion
• Current and Future Market
• Market Driver
• Growing Use of Autonomous Vehicles (AVs) and EVs
• Market Challenge
• Increasing Technological Complexity and Pressure to Continuously Innovate
• Market Opportunity
• Advancements in Flexible and Wearable Electronics
• Emerging Technologies and Trends
• 3D Printing
• Market Breakdown of Printed Circuit Boards by PCB Type
• Single-layer
• Double-layer
• Multilayer
• High-density Interconnect (HDI)
• Market Breakdown of Printed Circuit Boards by Region
• North America
• Europe
• Asia-Pacific
• Rest of the World
• Sustainability in the PCB Industry: An ESG Perspective
• Status of ESG in the PCB Industry
• ESG Practices in the PCB Industry
• Concluding Remarks from BCC Research

Chapter 7 Appendix

• Methodology
• Analyst's Credentials