銅張積層板（CCL）市場- 世界の産業規模、シェア、動向、機会、予測、セグメント：用途別、材料タイプ別、製造プロセス別、地域別、競合、2020年～2030年

銅張積層板（CCL）の世界市場は、2024年に159億7,000万米ドルと評価され、2030年には217億1,000万米ドルに達し、CAGR 5.09%で成長すると予測されています。

銅張積層板（CCL）は、プリント回路基板（PCB）製造の基礎となる材料で、ガラス繊維、紙、複合エポキシなどの絶縁コアの片面または両面に銅箔をコーティングしたものです。これらのラミネートは、さまざまな電子用途の回路経路に不可欠な導電性、構造的支持、熱安定性を提供します。エレクトロニクスがより高性能でコンパクトな設計を求めて進化し続けるにつれ、CCLの関連性と採用は、コンシューマ・デバイス、通信、車載エレクトロニクスなどに大きく広がっています。

市場促進要因

民生用電子機器と小型化デバイスの需要増加

主な市場課題

原材料価格の変動とサプライチェーンの混乱

主要市場動向

高密度相互接続（HDI）技術と電子機器の小型化による需要の急増

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 世界の銅張積層板（CCL）市場展望

• 市場規模・予測
  • 金額別
• 市場シェア・予測
  • 用途別（高速デジタル回路基板、電源回路基板、車載回路基板、民生用電子機器回路基板、医療用回路基板、産業用回路基板）
  • 材料タイプ別（FR-4、CEM-1、CEM-3、FR-2、FR-5、ポリイミド、PTFE）
  • 製造プロセス別（樹脂ラミネートプレス、高圧ラミネートプレス、両面テープラミネート、コールドラミネートプレス、高周波ラミネートプレス）
  • 地域別
• 企業別（2024）
• 市場マップ

第6章 北米の銅張積層板（CCL）市場展望

• 市場規模・予測
• 市場シェア・予測
• 北米：国別分析
  • 米国
  • カナダ
  • メキシコ

第7章 欧州の銅張積層板（CCL）市場展望

• 市場規模・予測
• 市場シェア・予測
• 欧州：国別分析
  • ドイツ
  • 英国
  • イタリア
  • フランス
  • スペイン

第8章 アジア太平洋地域の銅張積層板（CCL）市場展望

• 市場規模・予測
• 市場シェア・予測
• アジア太平洋地域：国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア

第9章 南米の銅張積層板（CCL）市場展望

• 市場規模・予測
• 市場シェア・予測
• 南米：国別分析
  • ブラジル
  • アルゼンチン
  • コロンビア

第10章 中東・アフリカの銅張積層板（CCL）市場展望

• 市場規模・予測
• 市場シェア・予測
• 中東・アフリカ：国別分析
  • 南アフリカ
  • サウジアラビア
  • アラブ首長国連邦
  • クウェート
  • トルコ

第11章 市場力学

• 促進要因
• 課題

第12章 市場動向と発展

• 合併と買収
• 製品上市
• 最近の動向

第13章 企業プロファイル

• Kingboard Laminates Holdings Ltd.
• Nan Ya Plastics Corporation
• Panasonic Corporation
• ITEQ Corporation
• Shengyi Technology Co., Ltd.（SYTECH）
• Isola Group
• Doosan Corporation Electro-Materials
• Nippon Mektron, Ltd.
• Ventec International Group
• Rogers Corporation

第14章 戦略的提言

第15章 調査会社について・免責事項

The Global Copper Clad Laminates Market was valued at USD 15.97 billion in 2024 and is projected to reach USD 21.71 billion by 2030, growing at a CAGR of 5.09%. Copper Clad Laminates (CCLs) serve as foundational materials in the manufacturing of printed circuit boards (PCBs), comprising an insulating core-such as glass fiber, paper, or composite epoxy-coated with copper foil on one or both sides. These laminates provide essential electrical conductivity, structural support, and thermal stability for circuit pathways in a wide array of electronic applications. As electronics continue to evolve with demand for higher performance and compact designs, the relevance and adoption of CCLs have significantly expanded across consumer devices, telecommunications, automotive electronics, and more.

Key Market Drivers

Rising Demand for Consumer Electronics and Miniaturized Devices

The rapid growth of the global consumer electronics sector is significantly propelling the copper clad laminates (CCL) market, with widespread usage in devices such as smartphones, tablets, wearables, laptops, smart home appliances, and gaming consoles. As consumer preferences shift toward faster, slimmer, and multifunctional devices, manufacturers are driven to deliver compact and high-performance products. Copper clad laminates, being a crucial component in printed circuit boards (PCBs), play a pivotal role in achieving these objectives by offering robust electrical conductivity, insulation, and structural integrity needed in compact device architecture.

Key Market Challenges

Volatility in Raw Material Prices and Supply Chain Disruptions

The Copper Clad Laminates (CCL) market faces notable challenges due to fluctuating raw material prices, particularly for copper and epoxy resins, which directly influence production expenses and profitability. Copper's price volatility stems from factors such as global supply-demand imbalances, geopolitical instability, mining limitations, and currency shifts. This unpredictability places cost pressures on manufacturers who may struggle to maintain margins or be forced to pass costs to customers, potentially affecting demand. Additionally, resin and glass fabric costs are impacted by crude oil price movements, adding to the financial uncertainty. The situation is compounded by global supply chain vulnerabilities triggered by events like the COVID-19 pandemic, geopolitical conflicts, and maritime disruptions in regions like the Red Sea and Suez Canal. These issues have led to longer delivery timelines, rising freight costs, and sporadic raw material availability, particularly affecting manufacturers in the Asia Pacific. As a result, securing stable long-term material contracts has become increasingly difficult, making pricing and production planning highly unpredictable.

Key Market Trends

Surge in Demand Driven by High-Density Interconnect (HDI) Technology and Miniaturization in Electronics

The transition toward compact, high-efficiency, and multi-layer printed circuit boards (PCBs) is accelerating demand for copper clad laminates as High-Density Interconnect (HDI) technology becomes standard in modern electronics. With the rise of space-saving consumer products such as smartphones, tablets, and wearables, PCBs must accommodate dense circuitry while ensuring thermal and signal performance. To meet these specifications, CCL manufacturers are developing advanced laminates featuring ultra-thin prepregs, high Tg materials, low-loss substrates, and premium copper foil types like RTF and HTE. These innovations offer superior dielectric characteristics, dimensional reliability, and enhanced adhesion-critical for supporting microvias, blind/buried vias, and fine-line routing. Moreover, the growth of 5G infrastructure, electric vehicle electronics, IoT solutions, and ADAS technologies is fueling further adoption of HDI and multilayer board designs, boosting the overall CCL market.

Key Market Players

• Kingboard Laminates Holdings Ltd.
• Nan Ya Plastics Corporation
• Panasonic Corporation
• ITEQ Corporation
• Shengyi Technology Co., Ltd. (SYTECH)
• Isola Group
• Doosan Corporation Electro-Materials
• Nippon Mektron, Ltd.
• Ventec International Group
• Rogers Corporation

Report Scope:

In this report, the Global Copper Clad Laminates Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Copper Clad Laminates Market, By Application:

• High-Speed Digital Circuit Boards
• Power Circuit Boards
• Automotive Circuit Boards
• Consumer Electronics Circuit Boards
• Medical Circuit Boards
• Industrial Circuit Boards

Copper Clad Laminates Market, By Material Type:

• FR-4
• CEM-1
• CEM-3
• FR-2
• FR-5
• Polyimide
• PTFE

Copper Clad Laminates Market, By Manufacturing Process:

• Laminating Resin Press
• High-Pressure Laminating Press
• Double-Sided Tape Lamination
• Cold Lamination Press
• High-Frequency Lamination Press

Copper Clad Laminates Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • France
  • United Kingdom
  • Italy
  • Germany
  • Spain
• Asia-Pacific
  • China
  • India
  • Japan
  • Australia
  • South Korea
• South America
  • Brazil
  • Argentina
  • Colombia
• Middle East & Africa
  • South Africa
  • Saudi Arabia
  • UAE
  • Kuwait
  • Turkey

Competitive Landscape

Company Profiles: Detailed analysis of the major companies presents in the Global Copper Clad Laminates Market.

Available Customizations:

Global Copper Clad Laminates Market report with the given Market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional Market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
• 1.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Formulation of the Scope
• 2.4. Assumptions and Limitations
• 2.5. Sources of Research
  • 2.5.1. Secondary Research
  • 2.5.2. Primary Research
• 2.6. Approach for the Market Study
  • 2.6.1. The Bottom-Up Approach
  • 2.6.2. The Top-Down Approach
• 2.7. Methodology Followed for Calculation of Market Size & Market Shares
• 2.8. Forecasting Methodology
  • 2.8.1. Data Triangulation & Validation

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Copper Clad Laminates Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Application (High-Speed Digital Circuit Boards, Power Circuit Boards, Automotive Circuit Boards, Consumer Electronics Circuit Boards, Medical Circuit Boards, Industrial Circuit Boards)
  • 5.2.2. By Material Type (FR-4, CEM-1, CEM-3, FR-2, FR-5, Polyimide, PTFE)
  • 5.2.3. By Manufacturing Process (Laminating Resin Press, High-Pressure Laminating Press, Double-Sided Tape Lamination, Cold Lamination Press, High-Frequency Lamination Press)
  • 5.2.4. By Region
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Copper Clad Laminates Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Application
  • 6.2.2. By Material Type
  • 6.2.3. By Manufacturing Process
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Copper Clad Laminates Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Application
      • 6.3.1.2.2. By Material Type
      • 6.3.1.2.3. By Manufacturing Process
  • 6.3.2. Canada Copper Clad Laminates Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Application
      • 6.3.2.2.2. By Material Type
      • 6.3.2.2.3. By Manufacturing Process
  • 6.3.3. Mexico Copper Clad Laminates Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Application
      • 6.3.3.2.2. By Material Type
      • 6.3.3.2.3. By Manufacturing Process

7. Europe Copper Clad Laminates Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Application
  • 7.2.2. By Material Type
  • 7.2.3. By Manufacturing Process
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Copper Clad Laminates Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Application
      • 7.3.1.2.2. By Material Type
      • 7.3.1.2.3. By Manufacturing Process
  • 7.3.2. United Kingdom Copper Clad Laminates Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Application
      • 7.3.2.2.2. By Material Type
      • 7.3.2.2.3. By Manufacturing Process
  • 7.3.3. Italy Copper Clad Laminates Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Application
      • 7.3.3.2.2. By Material Type
      • 7.3.3.2.3. By Manufacturing Process
  • 7.3.4. France Copper Clad Laminates Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Application
      • 7.3.4.2.2. By Material Type
      • 7.3.4.2.3. By Manufacturing Process
  • 7.3.5. Spain Copper Clad Laminates Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Application
      • 7.3.5.2.2. By Material Type
      • 7.3.5.2.3. By Manufacturing Process

8. Asia-Pacific Copper Clad Laminates Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Application
  • 8.2.2. By Material Type
  • 8.2.3. By Manufacturing Process
  • 8.2.4. By Country
• 8.3. Asia-Pacific: Country Analysis
  • 8.3.1. China Copper Clad Laminates Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Application
      • 8.3.1.2.2. By Material Type
      • 8.3.1.2.3. By Manufacturing Process
  • 8.3.2. India Copper Clad Laminates Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Application
      • 8.3.2.2.2. By Material Type
      • 8.3.2.2.3. By Manufacturing Process
  • 8.3.3. Japan Copper Clad Laminates Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Application
      • 8.3.3.2.2. By Material Type
      • 8.3.3.2.3. By Manufacturing Process
  • 8.3.4. South Korea Copper Clad Laminates Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Application
      • 8.3.4.2.2. By Material Type
      • 8.3.4.2.3. By Manufacturing Process
  • 8.3.5. Australia Copper Clad Laminates Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Application
      • 8.3.5.2.2. By Material Type
      • 8.3.5.2.3. By Manufacturing Process

9. South America Copper Clad Laminates Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Application
  • 9.2.2. By Material Type
  • 9.2.3. By Manufacturing Process
  • 9.2.4. By Country
• 9.3. South America: Country Analysis
  • 9.3.1. Brazil Copper Clad Laminates Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Application
      • 9.3.1.2.2. By Material Type
      • 9.3.1.2.3. By Manufacturing Process
  • 9.3.2. Argentina Copper Clad Laminates Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Application
      • 9.3.2.2.2. By Material Type
      • 9.3.2.2.3. By Manufacturing Process
  • 9.3.3. Colombia Copper Clad Laminates Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Application
      • 9.3.3.2.2. By Material Type
      • 9.3.3.2.3. By Manufacturing Process

10. Middle East and Africa Copper Clad Laminates Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Application
  • 10.2.2. By Material Type
  • 10.2.3. By Manufacturing Process
  • 10.2.4. By Country
• 10.3. Middle East and Africa: Country Analysis
  • 10.3.1. South Africa Copper Clad Laminates Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Application
      • 10.3.1.2.2. By Material Type
      • 10.3.1.2.3. By Manufacturing Process
  • 10.3.2. Saudi Arabia Copper Clad Laminates Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Application
      • 10.3.2.2.2. By Material Type
      • 10.3.2.2.3. By Manufacturing Process
  • 10.3.3. UAE Copper Clad Laminates Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Application
      • 10.3.3.2.2. By Material Type
      • 10.3.3.2.3. By Manufacturing Process
  • 10.3.4. Kuwait Copper Clad Laminates Market Outlook
    • 10.3.4.1. Market Size & Forecast
      • 10.3.4.1.1. By Value
    • 10.3.4.2. Market Share & Forecast
      • 10.3.4.2.1. By Application
      • 10.3.4.2.2. By Material Type
      • 10.3.4.2.3. By Manufacturing Process
  • 10.3.5. Turkey Copper Clad Laminates Market Outlook
    • 10.3.5.1. Market Size & Forecast
      • 10.3.5.1.1. By Value
    • 10.3.5.2. Market Share & Forecast
      • 10.3.5.2.1. By Application
      • 10.3.5.2.2. By Material Type
      • 10.3.5.2.3. By Manufacturing Process

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends & Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. Kingboard Laminates Holdings Ltd.
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel/Key Contact Person
  • 13.1.5. Key Product/Services Offered
• 13.2. Nan Ya Plastics Corporation
• 13.3. Panasonic Corporation
• 13.4. ITEQ Corporation
• 13.5. Shengyi Technology Co., Ltd. (SYTECH)
• 13.6. Isola Group
• 13.7. Doosan Corporation Electro-Materials
• 13.8. Nippon Mektron, Ltd.
• 13.9. Ventec International Group
• 13.10. Rogers Corporation

14. Strategic Recommendations

15. About Us & Disclaimer