ダイシング・バックグラインドテープ市場- 世界の産業規模、シェア、動向、機会、予測、タイプ別、材料別、用途別、地域別、競合別、2020-2030F

ダイシング・バックグラインドテープの世界市場規模は2024年に21億2,000万米ドルで、予測期間中のCAGRは6.73%で2030年には31億6,000万米ドルに達すると予測されています。

ダイシング・バックグラインドテープ市場は、半導体製造業界の中でも、ウエハー加工段階、特にダイシング（ウエハーを個々の半導体チップに切断する工程）やバックグラインド（ウエハーを小型電子機器に収まるように薄くする工程）で使用される粘着テープを提供する専門分野を指します。これらのテープは、ウエハー表面や内部回路を汚染や機械的ストレスから保護し、高精度の切断や薄片化作業中に生じるダメージから保護するという重要な役割を担っています。一時的な粘着力を持ち、熱的・機械的ストレスに耐えるように設計されており、後工程でクリーンで残留物のない剥離を保証します。この市場には、材料組成、粘着力、剥離性、シリコン、ガリウムヒ素、シリコンカーバイドなどのウエハタイプとの互換性によって差別化されたさまざまな種類のテープが含まれます。

ダイシング・バックグラインドテープ市場は、半導体製造技術の急速な進歩とチップ設計の複雑化により、今後数年間で大きな成長が見込まれています。スマートフォン、ウェアラブル技術、タブレット端末、車載用電子機器など、小型・薄型・高性能の電子機器に対する需要の高まりは、高度なウエハー加工ソリューションの必要性を加速させています。チップが小型で高密度のフォームファクターに収まるように設計されるため、半導体メーカーはウエハーをより積極的に薄くし、より高い精度で切断する必要があり、高性能保護テープへの依存度が高まっています。

さらに、電気自動車、5Gインフラ、ハイパワーエレクトロニクスへの化合物半導体の採用が拡大しているため、脆性マテリアルを扱える特殊なダイシング・バックグラインドテープの必要性が高まっています。また、世界中の新しい半導体製造施設に対する政府の優遇措置や民間投資も、こうした消耗品の需要を促進しています。さらに、ウエハーレベル・パッケージングや3Dスタッキングといった先進パッケージング技術へのシフトは、バックエンド半導体プロセスにおけるウエハー保護材料の重要性をさらに高めています。

主な市場促進要因

小型化された電子機器への需要の高まり

主な市場課題

多様な基板材料における複雑な接着・剥離要件

主な市場動向

インフラ・建設分野からの需要拡大

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 世界のダイシング・バックグラインドテープ市場展望

• 市場規模・予測
  • 金額別
• 市場シェア・予測
  • タイプ別（ダイシングテープ、バックグラインドテープ）
  • 材質別（ポリオレフィン、ポリ塩化ビニル（PVC）、ポリエチレンテレフタレート（PET）、その他）
  • アプリケーション別（メモリ、ロジック、MEMS、CMOSイメージセンサー、パワーデバイス、その他）
  • 地域別（北米、欧州、南米、中東・アフリカ、アジア太平洋）
• 企業別（2024）
• 市場マップ

第6章 北米のダイシング・バックグラインドテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 北米：国別分析
  • 米国
  • カナダ
  • メキシコ

第7章 欧州のダイシング・バックグラインドテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 欧州：国別分析
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン

第8章 アジア太平洋地域のダイシング・バックグラインドテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• アジア太平洋地域：国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア

第9章 中東・アフリカのダイシング・バックグラインドテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 中東・アフリカ：国別分析
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ

第10章 南米のダイシング・バックグラインドテープ市場展望

• 市場規模・予測
• 市場シェア・予測
• 南米：国別分析
  • ブラジル
  • コロンビア
  • アルゼンチン

第11章 市場力学

• 促進要因
• 課題

第12章 市場動向と発展

• 合併と買収
• 製品上市
• 最近の動向

第13章 企業プロファイル

• 3M Company
• Nitto Denko Corporation
• Tesa SE.
• Lintec Corporation
• Dow Inc.
• Semiconductor Equipment Corporation.
• Kyocera Corporation
• Singamas Container Industry Company Limited
• Mitsui Chemicals, Inc
• Fujifilm Corporation.

第14章 戦略的提言

第15章 調査会社について・免責事項

The Global Dicing & Backgrinding Tapes Market was valued at USD 2.12 Billion in 2024 and is expected to reach USD 3.16 Billion by 2030 with a CAGR of 6.73% during the forecast period.

The Dicing & Backgrinding Tapes Market refers to the specialized segment within the semiconductor manufacturing industry that provides adhesive tapes used during wafer processing stages, specifically during dicing (the process of cutting wafers into individual semiconductor chips) and backgrinding (the process of thinning wafers to fit into compact electronic devices). These tapes play a critical role in protecting wafer surfaces and internal circuitry from contamination, mechanical stress, and damage caused during high-precision cutting and thinning operations. They offer temporary adhesion and are designed to endure thermal and mechanical stress while ensuring clean and residue-free removal post-processing. The market includes various types of tapes differentiated by material composition, adhesive strength, removability, and compatibility with wafer types including silicon, gallium arsenide, and silicon carbide.

The Dicing & Backgrinding Tapes Market is expected to witness significant growth in the coming years due to the rapid advancements in semiconductor manufacturing technologies and the increasing complexity of chip design. The rising demand for smaller, thinner, and more powerful electronic devices such as smartphones, wearable technology, tablets, and automotive electronics is accelerating the need for advanced wafer processing solutions. As chips are designed to fit into compact and high-density form factors, semiconductor manufacturers must thin wafers more aggressively and cut them with greater precision, thus increasing the reliance on high-performance protective tapes.

Additionally, the growing adoption of compound semiconductors in electric vehicles, 5G infrastructure, and high-power electronics is pushing the need for specialized dicing & backgrinding tapes that can handle brittle materials. Government incentives and private investments in new semiconductor fabrication facilities around the globe are also fueling demand for these consumables. Moreover, the shift toward advanced packaging technologies such as wafer-level packaging and 3D stacking further reinforces the importance of wafer protection materials in backend semiconductor processes.

Key Market Drivers

Growing Demand for Miniaturized Electronic Devices

The relentless trend toward the miniaturization of electronic components and devices has created an urgent and sustained demand for precision semiconductor packaging solutions, which directly benefits the Dicing & Backgrinding Tapes Market. In the consumer electronics sector, devices such as smartphones, smartwatches, tablets, and wireless earbuds are being engineered with more compact and lightweight designs while increasing the density and complexity of their internal components.

This transformation necessitates thinner semiconductor wafers and ultra-fine dicing processes, thereby enhancing the requirement for advanced dicing and backgrinding tapes that can protect delicate wafer surfaces from mechanical stress, contamination, and damage during processing. Moreover, as device form factors shrink, the need for wafer-thinning increases, a process where backgrinding tapes play a critical role by providing temporary surface protection. These tapes must adhere uniformly, endure thermal cycling, and peel off cleanly without leaving residues, contributing to high manufacturing yields and reliability. Industries like automotive electronics, which are adopting advanced driver-assistance systems and electric powertrains, are also integrating compact integrated circuits and system-on-chip solutions, all of which require precision wafer handling supported by high-performance tapes. As the average node size decreases across foundries and fabrication plants worldwide, the Dicing & Backgrinding Tapes Market is expected to flourish by catering to the critical needs of wafer integrity and performance assurance throughout the backend manufacturing stages.

Key Market Challenges

Complex Adhesion and Debonding Requirements Across Varied Substrate Materials

One of the most significant challenges facing the Dicing & Backgrinding Tapes Market lies in the complexity of meeting diverse adhesion and debonding requirements for a wide array of substrate materials used in semiconductor fabrication. As the semiconductor industry progresses toward integrating a broader variety of wafer materials-including silicon, gallium nitride, silicon carbide, gallium arsenide, and indium phosphide-the performance expectations from dicing and backgrinding tapes become increasingly intricate.

Each of these materials has unique surface characteristics, mechanical properties, and thermal tolerances that influence how effectively a tape can adhere and subsequently be removed without causing damage or leaving residues. This presents a technological obstacle for tape manufacturers, who must engineer tapes with precise adhesive properties tailored to each substrate while maintaining consistency under high-temperature and high-pressure processing conditions.

The wafer thinning process often reduces wafer thickness to levels below 100 micrometers, increasing their fragility and making the need for effective and non-destructive adhesive solutions even more critical. A tape that adheres too aggressively may cause wafer cracking or damage during debonding, while insufficient adhesion may result in wafer slippage or contamination. Balancing these contradictory demands-strong adhesion during processing and gentle peel-off during removal-requires high-performance materials and precise control of formulation chemistry.

Environmental variables such as humidity, exposure to ultraviolet curing light, and processing equipment configurations further influence tape performance. This variability creates a challenge for standardization across semiconductor manufacturing lines and limits the universal applicability of a single tape solution. As a result, dicing and backgrinding tape manufacturers must continuously invest in research and development to meet application-specific requirements, which elevates production costs and slows down scalability. The inability to deliver universal, cost-effective, and high-performing tape products compatible with all substrate types remains a persistent bottleneck in the Dicing & Backgrinding Tapes Market.

Key Market Trends

Growing Demand from the Infrastructure and Construction Sector

The rising number of large-scale infrastructure projects worldwide is fueling the demand for Dicing & Backgrinding Tapess. Governments are investing heavily in transportation networks, urban development, and renewable energy projects, driving the need for heavy lifting equipment. In countries like China, India, and the United States, massive investments in roads, bridges, and high-rise buildings have led to increased adoption of Dicing & Backgrinding Tapess due to their versatility and mobility. The construction sector prefers these cranes for their ability to handle diverse lifting tasks with minimal setup time. Additionally, the expansion of smart cities and mega projects such as airports, railways, and industrial complexes further contributes to market growth. For example, in 2023, the U.S. government announced significant funding for infrastructure development, increasing demand for advanced lifting solutions. The construction industry's reliance on efficient material handling and lifting equipment continues to boost the adoption of Dicing & Backgrinding Tapess, positioning them as essential assets in infrastructure development.

Key Market Players

• 3M Company
• Nitto Denko Corporation
• Tesa SE.
• Lintec Corporation
• Dow Inc.
• Semiconductor Equipment Corporation.
• Kyocera Corporation
• Singamas Container Industry Company Limited
• Mitsui Chemicals, Inc
• Fujifilm Corporation.

Report Scope:

In this report, the Global Dicing & Backgrinding Tapes Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Dicing & Backgrinding Tapes Market, By Type:

• Dicing Tapes
• Backgrinding Tapes

Dicing & Backgrinding Tapes Market, By Material:

• Polyolefin
• Polyvinyl Chloride (PVC)
• Polyethylene Terephthalate (PET)
• Others

Dicing & Backgrinding Tapes Market, By Application:

• Memory
• Logi
• MEMS
• CMOS Image Sensors
• Power Devices
• Others

Dicing & Backgrinding Tapes Market, By Region:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
• South America
  • Brazil
  • Argentina
  • Colombia
• Asia-Pacific
  • China
  • India
  • Japan
  • South Korea
  • Australia
• Middle East & Africa
  • Saudi Arabia
  • UAE
  • South Africa

Competitive Landscape

Company Profiles: Detailed analysis of the major companies present in the Global Dicing & Backgrinding Tapes Market.

Available Customizations:

Global Dicing & Backgrinding Tapes Market report with the given market data, TechSci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

• 3.1. Overview of the Market
• 3.2. Overview of Key Market Segmentations
• 3.3. Overview of Key Market Players
• 3.4. Overview of Key Regions/Countries
• 3.5. Overview of Market Drivers, Challenges, and Trends

4. Voice of Customer

5. Global Dicing & Backgrinding Tapes Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (Dicing Tapes, Backgrinding Tapes)
  • 5.2.2. By Material (Polyolefin, Polyvinyl Chloride (PVC), Polyethylene Terephthalate (PET), Others)
  • 5.2.3. By Application (Memory, Logic, MEMS, CMOS Image Sensors, Power Devices, Others)
  • 5.2.4. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 5.3. By Company (2024)
• 5.4. Market Map

6. North America Dicing & Backgrinding Tapes Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Material
  • 6.2.3. By Application
  • 6.2.4. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Dicing & Backgrinding Tapes Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Material
      • 6.3.1.2.3. By Application
  • 6.3.2. Canada Dicing & Backgrinding Tapes Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Material
      • 6.3.2.2.3. By Application
  • 6.3.3. Mexico Dicing & Backgrinding Tapes Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Material
      • 6.3.3.2.3. By Application

7. Europe Dicing & Backgrinding Tapes Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Material
  • 7.2.3. By Application
  • 7.2.4. By Country
• 7.3. Europe: Country Analysis
  • 7.3.1. Germany Dicing & Backgrinding Tapes Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Material
      • 7.3.1.2.3. By Application
  • 7.3.2. France Dicing & Backgrinding Tapes Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Material
      • 7.3.2.2.3. By Application
  • 7.3.3. United Kingdom Dicing & Backgrinding Tapes Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Material
      • 7.3.3.2.3. By Application
  • 7.3.4. Italy Dicing & Backgrinding Tapes Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Material
      • 7.3.4.2.3. By Application
  • 7.3.5. Spain Dicing & Backgrinding Tapes Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Material
      • 7.3.5.2.3. By Application

8. Asia Pacific Dicing & Backgrinding Tapes Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Material
  • 8.2.3. By Application
  • 8.2.4. By Country
• 8.3. Asia Pacific: Country Analysis
  • 8.3.1. China Dicing & Backgrinding Tapes Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Material
      • 8.3.1.2.3. By Application
  • 8.3.2. India Dicing & Backgrinding Tapes Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Material
      • 8.3.2.2.3. By Application
  • 8.3.3. Japan Dicing & Backgrinding Tapes Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Material
      • 8.3.3.2.3. By Application
  • 8.3.4. South Korea Dicing & Backgrinding Tapes Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Material
      • 8.3.4.2.3. By Application
  • 8.3.5. Australia Dicing & Backgrinding Tapes Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Material
      • 8.3.5.2.3. By Application

9. Middle East & Africa Dicing & Backgrinding Tapes Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Material
  • 9.2.3. By Application
  • 9.2.4. By Country
• 9.3. Middle East & Africa: Country Analysis
  • 9.3.1. Saudi Arabia Dicing & Backgrinding Tapes Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Material
      • 9.3.1.2.3. By Application
  • 9.3.2. UAE Dicing & Backgrinding Tapes Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Material
      • 9.3.2.2.3. By Application
  • 9.3.3. South Africa Dicing & Backgrinding Tapes Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Material
      • 9.3.3.2.3. By Application

10. South America Dicing & Backgrinding Tapes Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By Material
  • 10.2.3. By Application
  • 10.2.4. By Country
• 10.3. South America: Country Analysis
  • 10.3.1. Brazil Dicing & Backgrinding Tapes Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Material
      • 10.3.1.2.3. By Application
  • 10.3.2. Colombia Dicing & Backgrinding Tapes Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Material
      • 10.3.2.2.3. By Application
  • 10.3.3. Argentina Dicing & Backgrinding Tapes Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Material
      • 10.3.3.2.3. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenges

12. Market Trends and Developments

• 12.1. Merger & Acquisition (If Any)
• 12.2. Product Launches (If Any)
• 12.3. Recent Developments

13. Company Profiles

• 13.1. 3M Company
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services Offered
• 13.2. Nitto Denko Corporation
• 13.3. Tesa SE.
• 13.4. Lintec Corporation
• 13.5. Dow Inc.
• 13.6. Semiconductor Equipment Corporation.
• 13.7. Kyocera Corporation
• 13.8. Singamas Container Industry Company Limited
• 13.9. Mitsui Chemicals, Inc
• 13.10. Fujifilm Corporation.

14. Strategic Recommendations

15. About Us & Disclaimer