フレキシブルプリント基板市場- 世界の産業規模、シェア、動向、機会、予測、タイプ別、エンドユーザー別、地域別、競合別セグメント、2018-2028年

フレキシブルプリント基板の世界市場規模は2022年に278億9,000万米ドルとなり、2028年までのCAGRは10.25%で、予測期間中に力強い成長が予測されています。

世界のフレキシブルプリント基板（FPCB）市場は、産業界と消費者がFPCBをさまざまなアプリケーションやデバイスに統合する方法を再構築する要因の集結によって、現在大きな成長を遂げています。フレキシブルプリント基板は、電子ソリューションやアプリケーションの機能強化、性能の最適化、信頼性の確保において極めて重要な部品となっています。FPCBは、現代の技術情勢の中心に位置し、さまざまな業界においてイノベーション、エネルギー効率、オペレーショナル・エクセレンスを実現する上で極めて重要な役割を果たしています。電子ソリューションが普及し、不可欠な時代において、フレキシブルプリント回路基板は、IoT機器から産業オートメーションに至るまで、幅広いアプリケーションで不可欠な部品へと進化しています。フレキシブルプリント回路基板の採用が急増している主な要因の1つは、小型化と汎用性に対する需要の高まりです。デバイスの小型化と携帯化が進む今日、産業界と消費者は、高性能を維持しながらコンパクトなフォームファクターに適応できるソリューションを求めています。FPCBは、軽量で柔軟性があり、スペース効率の高い電子ソリューションの設計を可能にするため、このニーズに対応するための中心的存在です。その柔軟性と適応性により、従来のリジッドPCBでは不十分なアプリケーションに適しています。

さらに、産業界がモノのインターネット（IoT）を受け入れ、接続されたデバイスの需要が伸び続ける中、FPCBはシームレスな接続を可能にする最前線にあります。これらのボードは、コンパクトでフレキシブルなフォーマットで必要な電気接続を提供するため、IoTデバイス、ウェアラブル、その他のスマート・ソリューションに不可欠です。また、医療機器、航空宇宙、自動車システムなど、厳しい環境下での信頼性が求められるアプリケーションにも最適です。セキュリティとデータインテグリティは、現代の技術状況において最も重要な関心事となっています。FPCBは、暗号化、安全なデータ伝送、データ保護などの高度な機能を提供し、システムのセキュリティと信頼性を高めます。これらの機能は、機密データの保護、サイバー脅威の防止、デジタルソリューションの信頼性確保に不可欠です。

さらに、高度な民生用電子機器、自動車用インフォテインメント・システム、航空宇宙技術への需要が高まる中、FPCBはこれらの技術革新の原動力として不可欠です。民生用電子機器では、FPCBはフレキシブル・ディスプレイ、ウェアラブル技術、小型高性能デバイスの開発を可能にします。車載アプリケーションでは、車載エンターテインメント・システム、GPSナビゲーション、ADAS（先進運転支援システム）の操作の中核を担っています。航空宇宙分野では、FPCBは通信、ナビゲーション、制御システムをサポートし、空の旅の安全と効率化に貢献しています。

結論として、世界のフレキシブルプリント基板市場は、多様なアプリケーションに小型化、汎用性、安全性を提供するFPCBの極めて重要な役割が産業界に認識され、大幅な成長を遂げています。技術が進歩し続け、世界がますますデジタル化する中、FPCBはさまざまな分野で革新と信頼性の最前線にあり続けると思われます。この変革は、電子システムとアプリケーションの未来を形成するFPCBの重要性を強調し、世界中の産業の効率性と卓越性に貢献します。

主な市場促進要因

小型化とフォームファクターの柔軟性

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 フレキシブルプリント基板の世界市場概要

第6章 フレキシブルプリント基板の世界市場展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • タイプ別（片面FPCB、両面FPCB、多層FPCB、リジッドフレックスPCB）
  • エンドユーザー別（民生用電子機器、車載用電子機器、産業用電子機器）、
  • 地域別（北米,欧州,南米,中東&アフリカ,アジア太平洋）
• 企業別（2022年）
• 市場マップ

第7章 北米のフレキシブルプリント基板市場展望

• 市場規模・予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • エンドユーザー別
  • 国別
• 北米国別分析
  • 米国
  • カナダ
  • メキシコ

第8章 欧州のフレキシブルプリント基板市場展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • エンドユーザー別
  • 国別
• 欧州国別分析
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン
  • ベルギー

第9章 南米のフレキシブルプリント基板市場展望

• 市場規模・予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • エンドユーザー別
  • 国別
• 南米：国別分析
  • ブラジル
  • コロンビア
  • アルゼンチン
  • チリ
  • ペルー

第10章 中東・アフリカのフレキシブルプリント基板市場展望

• 市場規模・予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • エンドユーザー別
  • 国別
• 中東・アフリカ：国別分析
  • サウジアラビア
  • アラブ首長国連邦
  • 南アフリカ
  • トルコ
  • イスラエル

第11章 アジア太平洋フレキシブルプリント基板市場展望

• 市場規模・予測
  • タイプ別
  • エンドユーザー別
  • 国別
• アジア太平洋地域国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア
  • インドネシア
  • ベトナム

第12章 市場力学

• 促進要因
• 課題

第13章 市場動向と発展

第14章 企業プロファイル

• Nippon Mektron, Ltd.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Multi-Fineline Electronix, Inc.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Flexible Circuit Technologies, Inc.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Fujikura Ltd.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Sumitomo Electric Industries, Ltd.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Zhen Ding Technology Holding Limited
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Unimicron Technology Corporation
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Career Technology（MFG.）Co., Ltd.：
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Flexium Interconnect, Inc.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered
• Kingboard Holdings Limited
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel/Key Contact Person
  • Key Product/Services Offered

第15章 戦略的提言

第16章 調査会社について・免責事項

Global Flexible Printed Circuit Board Market was valued at USD 27.89 Billion in 2022 and is anticipated to project robust growth in the forecast period with a CAGR of 10.25% through 2028. The Global Flexible Printed Circuit Board (FPCB) Market is currently experiencing significant growth, driven by a convergence of factors that are reshaping how industries and consumers integrate FPCBs into a wide array of applications and devices. Flexible printed circuit boards have become pivotal components in enhancing functionality, optimizing performance, and ensuring the reliability of electronic solutions and applications. FPCBs are at the heart of the contemporary technological landscape, playing a pivotal role in delivering innovation, energy efficiency, and operational excellence across various industries. In an era where electronic solutions are pervasive and indispensable, flexible printed circuit boards have evolved into essential components across applications ranging from IoT devices to industrial automation. One of the primary drivers for the burgeoning adoption of flexible printed circuit boards is the increasing demand for miniaturization and versatility. In today's world, where devices are becoming smaller and more portable, industries and consumers seek solutions that can adapt to compact form factors while maintaining high performance. FPCBs are central to addressing this need, as they enable the design of lightweight, flexible, and space-efficient electronic solutions. Their flexibility and adaptability make them suitable for applications where traditional rigid PCBs fall short.

Additionally, as industries embrace the Internet of Things (IoT) and the demand for connected devices continues to grow, FPCBs are at the forefront of enabling seamless connectivity. These boards are crucial for IoT devices, wearables, and other smart solutions, as they provide the necessary electrical connections in a compact and flexible format. They are also ideal for applications that require reliability in challenging environments, such as medical devices, aerospace, and automotive systems. Security and data integrity have become paramount concerns in the modern technological landscape. FPCBs offer advanced features such as encryption, secure data transmission, and data protection, which enhance system security and reliability. These features are critical in safeguarding sensitive data, preventing cyber threats, and ensuring the trustworthiness of digital solutions.

Furthermore, as the demand for advanced consumer electronics, automotive infotainment systems, and aerospace technologies increases, FPCBs are indispensable for powering these innovations. In consumer electronics, FPCBs enable the development of flexible displays, wearable technology, and compact, high-performance devices. In automotive applications, they are central to the operation of in-car entertainment systems, GPS navigation, and advanced driver-assistance systems. In aerospace, FPCBs support communication, navigation, and control systems, contributing to the safety and efficiency of air travel.

In conclusion, the Global Flexible Printed Circuit Board Market is witnessing substantial growth as industries recognize the pivotal role of FPCBs in delivering miniaturization, versatility, and security across a diverse range of applications. As technology continues to advance and our world becomes increasingly digital, FPCBs will remain at the forefront of innovation and reliability in various sectors. This transformation underscores the significance of FPCBs in shaping the future of electronic systems and applications, contributing to efficiency and excellence across industries worldwide.

Key Market Drivers:

Miniaturization and Form Factor Flexibility

The relentless drive toward smaller, lighter, and more portable electronic devices is a pivotal factor propelling the growth of the Global Flexible Printed Circuit Board (FPCB) Market. As technology evolves, so do the expectations of consumers and industries. Smaller, more compact electronic devices are not only desirable but often essential for applications ranging from wearables and consumer electronics to medical devices and automotive systems.

FPCBs play a central role in addressing this need for miniaturization and form factor flexibility. Unlike traditional rigid printed circuit boards (PCBs), FPCBs are designed to be flexible, lightweight, and capable of bending and conforming to various shapes. This flexibility enables designers to create electronic solutions that fit into compact and irregular spaces while maintaining high performance and reliability. Whether it's a flexible display for a smartphone, a wearable health tracker, or a medical device that conforms to the body, FPCBs are the enablers of these innovations.

The importance of miniaturization extends beyond consumer electronics. Industries like aerospace and automotive also benefit from FPCBs' ability to save space and reduce weight. In aerospace, FPCBs are used in communication, navigation, and control systems, where every ounce and inch saved can contribute to fuel efficiency and cost reduction. In the automotive sector, FPCBs support infotainment systems, advanced driver-assistance systems (ADAS), and in-car electronics. Their flexibility allows for creative and space-efficient designs that enhance the overall driving experience.

Connectivity and the Internet of Things (IoT)

The era of the Internet of Things (IoT) is upon us, and it's driving the demand for seamless connectivity across an ever-expanding range of devices and applications. This surge in interconnected devices, from smart home appliances to industrial sensors, necessitates robust and reliable electronic interconnections. FPCBs are at the forefront of enabling this connectivity.

FPCBs are crucial for IoT devices due to their versatility and adaptability. They can be integrated into various form factors, including flexible and curved designs, which is essential for many IoT applications. Whether it's a smart sensor in a factory, a wearable health monitor, or a home automation system, FPCBs provide the electrical connections needed for data transfer, power distribution, and sensor interfaces.

The ability of FPCBs to withstand bending and flexing without compromising their performance is particularly valuable for IoT applications. For instance, sensors placed in industrial environments may be subject to vibrations or mechanical stress, and FPCBs ensure reliable connectivity under such conditions. This reliability is also important in wearables, where FPCBs support the continuous monitoring of vital signs and activities. As the IoT ecosystem continues to expand, FPCBs will remain integral to creating interconnected, data-driven solutions that enhance productivity, efficiency, and convenience across various industries.

Enhanced Data Security and Data Integrity

In an era of increasing cybersecurity threats and data privacy concerns, ensuring the security and integrity of electronic systems is paramount. FPCBs contribute to this imperative by offering advanced features and capabilities that enhance data security and data integrity.

One of the key security features provided by FPCBs is hardware-based encryption. This encryption is embedded within the board's design, ensuring that sensitive data transmitted across the FPCB remains secure. Whether it's financial transactions, medical data, or confidential industrial information, the encryption capabilities of FPCBs protect against unauthorized access and data breaches.

Secure boot processes are another critical element in enhancing security. FPCBs can be designed to incorporate secure boot mechanisms that verify the integrity of the system software during startup. This prevents malicious code from compromising the system's functionality, ensuring that only trusted software is executed.

Data protection mechanisms embedded in FPCBs also guard against data corruption or loss. For applications where data integrity is crucial, such as critical infrastructure and healthcare, FPCBs ensure that data remains accurate and reliable even in challenging conditions.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market is being driven by the compelling need for miniaturization and form factor flexibility, the demand for connectivity in the IoT era, and the growing emphasis on data security and integrity. These factors converge to position FPCBs as essential components in the development of innovative electronic solutions across various industries, contributing to enhanced efficiency, connectivity, and security. As technology continues to evolve, FPCBs will remain integral to the advancement of electronic systems and applications worldwide.

Key Market Challenges

Design and Manufacturing Complexity

One of the primary challenges in the Global Flexible Printed Circuit Board (FPCB) Market is the inherent complexity in designing and manufacturing flexible circuits. Unlike traditional rigid printed circuit boards (PCBs), FPCBs require a different approach in terms of materials, processes, and design considerations. This complexity stems from various factors, including the need to accommodate bending, flexibility, and durability while maintaining high-performance standards.

Designing FPCBs necessitates a deep understanding of flexible materials, their mechanical properties, and their electrical characteristics. Engineers and designers must consider factors like bend radius, material selection, and component placement, all of which are unique to flexible circuits. This complexity is compounded when dealing with intricate and densely populated designs.

Moreover, manufacturing flexible circuits presents challenges in terms of precision and quality control. The flexible materials used in FPCBs can be more sensitive to variations in the manufacturing process compared to rigid boards. Ensuring that the circuits meet the required electrical specifications while maintaining their flexibility and reliability is a demanding task.

The challenge of design and manufacturing complexity is particularly relevant when dealing with high-density interconnects and miniaturized components. Meeting the stringent requirements of advanced applications, such as aerospace and medical devices, adds an extra layer of complexity to FPCB design and production.

Addressing this challenge requires ongoing research and development to advance materials, design tools, and manufacturing techniques. Additionally, it necessitates collaboration among stakeholders in the supply chain, from material suppliers to fabricators, to ensure that FPCBs meet the exacting standards of modern electronics.

Durability and Reliability

Another significant challenge in the FPCB market is ensuring the long-term durability and reliability of flexible circuits. FPCBs are often deployed in applications where they may undergo bending, flexing, and exposure to various environmental factors. These conditions can subject the circuits to mechanical stress, thermal cycling, and moisture, which can impact their performance and longevity.To ensure the durability of FPCBs, manufacturers need to develop materials and construction techniques that can withstand these challenges. This includes selecting flexible substrates with high resistance to fatigue, designing circuits that distribute stress evenly, and implementing protective coatings that guard against environmental factors.

However, ensuring reliability in FPCBs is not only about material selection and design; it also involves rigorous testing and quality control. Testing methods must be adapted to evaluate the performance of flexible circuits under dynamic conditions, simulating the bending and flexing that they will experience during their operational life. This is particularly crucial in applications where FPCBs are subjected to repeated mechanical stress, such as in wearable technology and aerospace systems.

Reliability concerns are especially critical in industries where FPCBs are deployed in mission-critical applications, like medical devices and automotive safety systems. Any failure or degradation in performance can have serious consequences, making it essential to address this challenge through rigorous testing, quality assurance, and ongoing monitoring of FPCB performance in the field.

Material Advancements and Cost-Effective Production

The choice of materials is a critical factor in the performance and cost-effectiveness of FPCBs. While flexible substrates like polyimide and polyester are commonly used, their performance characteristics, cost, and availability can pose challenges.

The challenge of material advancements is twofold. First, there is a need for continuous research and development to improve the properties of existing materials and to explore new materials that offer superior electrical and mechanical properties. This includes materials that can withstand extreme temperature variations, resist environmental factors, and exhibit long-term reliability in demanding applications.

Second, the cost-effectiveness of producing FPCBs is a significant challenge. High-quality flexible materials can be more expensive than traditional rigid substrates like FR-4. Additionally, the complexity of FPCB manufacturing processes, which may include intricate layering and additive processes, can contribute to higher production costs.

Balancing the need for advanced materials with cost-effectiveness is a challenge that the FPCB industry must address. This requires ongoing collaboration between material suppliers, manufacturers, and end-users to optimize material selection and production processes.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market faces challenges related to design and manufacturing complexity, the durability and reliability of flexible circuits, and the need for material advancements and cost-effective production. Addressing these challenges requires a combination of research and development efforts, quality control measures, and industry collaboration to ensure that FPCBs meet the demands of diverse applications and maintain their position as crucial components in the electronics industry.

Key Market Trends

Proliferation of Wearable Technology and IoT Devices

One of the most prominent trends in the Global Flexible Printed Circuit Board (FPCB) Market is the proliferation of wearable technology and Internet of Things (IoT) devices. This trend is driven by the increasing demand for compact, lightweight, and flexible electronic solutions that can seamlessly integrate into our daily lives.

Wearable technology, including smartwatches, fitness trackers, and augmented reality glasses, relies heavily on FPCBs to provide the necessary flexibility and miniaturization. FPCBs allow these devices to conform to the contours of the human body, ensuring comfort and wearability while maintaining high-performance standards.

In the IoT landscape, FPCBs are essential components for connecting a wide array of devices and sensors. Whether it's a smart home system, industrial sensor networks, or medical devices, FPCBs enable the efficient transfer of data and power within compact and often unconventional form factors. The ability to bend and flex is a core feature of FPCBs, making them ideal for applications where rigid circuit boards fall short.

This trend is poised to grow as the adoption of wearable technology and IoT devices continues to surge. Consumers and industries alike are seeking innovative ways to collect and process data, and FPCBs are central to enabling these devices to function optimally.

Advanced Materials and Manufacturing Techniques

Another notable trend in the FPCB market is the continuous advancement of materials and manufacturing techniques. As the demand for more complex and high-performance flexible circuits increases, material suppliers and manufacturers are innovating to meet these needs.

One area of advancement is in materials. Polyimide and polyester have been traditional choices for FPCB substrates, but new materials are emerging with enhanced properties. For instance, liquid crystal polymer (LCP) substrates offer improved thermal stability, high-frequency performance, and moisture resistance. These materials are particularly beneficial for applications where reliability in harsh environments is essential, such as aerospace and automotive systems.

Manufacturing techniques are also evolving to meet the demand for smaller, denser, and more complex FPCBs. Additive manufacturing, such as 3D printing, is gaining traction as a way to produce flexible circuits with intricate patterns and features. This approach enables rapid prototyping and customization while reducing waste and lead times.

Advancements in materials and manufacturing techniques not only improve the performance of FPCBs but also contribute to cost-efficiency. By optimizing production processes and materials, the industry can strike a balance between high-performance capabilities and affordability.

Green and Sustainable FPCBs

Environmental consciousness and sustainability have become significant drivers in the electronics industry, and this trend is extending to the FPCB market. As consumers and industries prioritize eco-friendly products and manufacturing processes, the demand for green and sustainable FPCBs is on the rise. One aspect of sustainability is the use of recyclable and biodegradable materials in FPCBs. Manufacturers are exploring alternatives to traditional materials that reduce the environmental impact of circuit boards. These materials are designed to be less harmful to the environment during production and disposal.

In addition to materials, there is a growing emphasis on sustainable manufacturing practices. Companies are adopting eco-friendly processes, reducing waste, and implementing energy-efficient production techniques. This not only aligns with sustainability goals but also appeals to environmentally conscious consumers.

The drive for sustainable FPCBs is also pushing the development of eco-friendly disposal and recycling methods. As electronic waste (e-waste) continues to be a global concern, finding ways to recycle and recover materials from old and discarded FPCBs is becoming increasingly important. Recycling initiatives and the responsible disposal of electronic components are gaining traction to minimize the environmental impact of electronic devices.

In conclusion, the Global Flexible Printed Circuit Board (FPCB) Market is witnessing several notable trends, including the proliferation of wearable technology and IoT devices, advancements in materials and manufacturing techniques, and the growing focus on green and sustainable FPCBs. These trends are shaping the industry by fostering innovation, improving performance, and aligning with the values of eco-conscious consumers and industries. As technology continues to advance, FPCBs will remain at the forefront of enabling flexibility, miniaturization, and environmental responsibility in various applications and devices.

Segmental Insights

Type Insights

Double-sided FPCBs are the dominating segment in the global flexible printed circuit board (FPCB) market by type.The dominance of the double-sided FPCBs segment is due to a number of factors, including: Cost-effectiveness: Double-sided FPCBs are the most cost-effective type of FPCB, making them ideal for a wide range of applications.

Flexibility: Double-sided FPCBs are highly flexible, allowing them to be used in applications where space is limited or where components need to be mounted on curved surfaces.

Versatility: Double-sided FPCBs can be used in a wide range of applications, including consumer electronics, automotive, medical devices, and industrial automation. Other type segments in the global FPCB market include single-sided FPCBs, multilayer FPCBs, and rigid-flex PCBs. However, the double-sided FPCBs segment is expected to remain the dominating segment in the market in the coming years.

Regional Insights

Asia Pacific is the dominating region in the global flexible printed circuit board (FPCB) market. The dominance of the Asia Pacific region is due to a number of factors, including:

The presence of major FPCB manufacturers in the region: Asia Pacific is home to some of the world's largest FPCB manufacturers, such as Nippon Mektron, Sumitomo Electric Industries, and Fujikura. These companies have a strong presence in the region and are well-positioned to meet the growing demand for FPCBs.

The growing demand for FPCBs in consumer electronics, automotive, and industrial applications in the region: Asia Pacific is a major market for consumer electronics, automotive, and industrial products. These products all rely heavily on FPCBs for their operation. The growing demand for these products is driving the growth of the FPCB market in the region.

The government support for the development of the FPCB industry in several countries in the region: Governments in several Asia Pacific countries, such as China and Japan, are providing support for the development of the FPCB industry. This support is in the form of financial incentives, tax breaks, and research and development funding. This support is helping to accelerate the growth of the FPCB market in the region.

Key Market Players

Nippon Mektron, Ltd.

Multi-Fineline Electronix, Inc.

Flexible Circuit Technologies, Inc.

Fujikura Ltd.

Sumitomo Electric Industries, Ltd.

Zhen Ding Technology Holding Limited

Career Technology (MFG.) Co., Ltd.

Unimicron Technology Corporation

Flexium Interconnect, Inc.

Kingboard Holdings Limited

Report Scope:

In this report, the Global Flexible Printed Circuit Board Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Flexible Printed Circuit Board Market, By Type:

• Single-Sided FPCBs
• Double-Sided FPCBs
• Multilayer FPCBs
• Rigid-Flex PCBs

Flexible Printed Circuit Board Market, By End User:

• Consumer Electronics
• Automotive Electronics
• Industrial Electronics

Flexible Printed Circuit Board Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Belgium
• Asia-Pacific
• China
• India
• Japan
• Australia
• South Korea
• Indonesia
• Vietnam
• South America
• Brazil
• Argentina
• Colombia
• Chile
• Peru
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE
• Turkey
• Israel

Competitive Landscape

• Company Profiles: Detailed analysis of the major companies present in the Global Flexible Printed Circuit Board Market.

Available Customizations:

• Global Flexible Printed Circuit Board market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Formulation of the Scope
• 2.4. Assumptions and Limitations
• 2.5. Sources of Research
  • 2.5.1. Secondary Research
  • 2.5.2. Primary Research
• 2.6. Approach for the Market Study
  • 2.6.1. The Bottom-Up Approach
  • 2.6.2. The Top-Down Approach
• 2.7. Methodology Followed for Calculation of Market Size & Market Shares
• 2.8. Forecasting Methodology
  • 2.8.1. Data Triangulation & Validation

3. Executive Summary

4. Voice of Customer

5. Global Flexible Printed Circuit Board Market Overview

6. Global Flexible Printed Circuit Board Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type (Single-Sided FPCBs, Double-Sided FPCBs, Multilayer FPCBs, Rigid-Flex PCBs)
  • 6.2.2. By End User (Consumer Electronics, Automotive Electronics, Industrial Electronics),
  • 6.2.3. By Region (North America, Europe, South America, Middle East & Africa, Asia Pacific)
• 6.3. By Company (2022)
• 6.4. Market Map

7. North America Flexible Printed Circuit Board Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By End User
  • 7.2.3. By Country
• 7.3. North America: Country Analysis
  • 7.3.1. United States Flexible Printed Circuit Board Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By End User
  • 7.3.2. Canada Flexible Printed Circuit Board Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By End User
  • 7.3.3. Mexico Flexible Printed Circuit Board Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By End User

8. Europe Flexible Printed Circuit Board Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By End User
  • 8.2.3. By Country
• 8.3. Europe: Country Analysis
  • 8.3.1. Germany Flexible Printed Circuit Board Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By End User
  • 8.3.2. France Flexible Printed Circuit Board Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By End User
  • 8.3.3. United Kingdom Flexible Printed Circuit Board Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By End User
  • 8.3.4. Italy Flexible Printed Circuit Board Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By End User
  • 8.3.5. Spain Flexible Printed Circuit Board Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By End User
  • 8.3.6. Belgium Flexible Printed Circuit Board Market Outlook
    • 8.3.6.1. Market Size & Forecast
      • 8.3.6.1.1. By Value
    • 8.3.6.2. Market Share & Forecast
      • 8.3.6.2.1. By Type
      • 8.3.6.2.2. By End User

9. South America Flexible Printed Circuit Board Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By End User
  • 9.2.3. By Country
• 9.3. South America: Country Analysis
  • 9.3.1. Brazil Flexible Printed Circuit Board Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By End User
  • 9.3.2. Colombia Flexible Printed Circuit Board Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By End User
  • 9.3.3. Argentina Flexible Printed Circuit Board Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By End User
  • 9.3.4. Chile Flexible Printed Circuit Board Market Outlook
    • 9.3.4.1. Market Size & Forecast
      • 9.3.4.1.1. By Value
    • 9.3.4.2. Market Share & Forecast
      • 9.3.4.2.1. By Type
      • 9.3.4.2.2. By End User
  • 9.3.5. Peru Flexible Printed Circuit Board Market Outlook
    • 9.3.5.1. Market Size & Forecast
      • 9.3.5.1.1. By Value
    • 9.3.5.2. Market Share & Forecast
      • 9.3.5.2.1. By Type
      • 9.3.5.2.2. By End User

10. Middle East & Africa Flexible Printed Circuit Board Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Type
  • 10.2.2. By End User
  • 10.2.3. By Country
• 10.3. Middle East & Africa: Country Analysis
  • 10.3.1. Saudi Arabia Flexible Printed Circuit Board Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By End User
  • 10.3.2. UAE Flexible Printed Circuit Board Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By End User
  • 10.3.3. South Africa Flexible Printed Circuit Board Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By End User
  • 10.3.4. Turkey Flexible Printed Circuit Board Market Outlook
    • 10.3.4.1. Market Size & Forecast
      • 10.3.4.1.1. By Value
    • 10.3.4.2. Market Share & Forecast
      • 10.3.4.2.1. By Type
      • 10.3.4.2.2. By End User
  • 10.3.5. Israel Flexible Printed Circuit Board Market Outlook
    • 10.3.5.1. Market Size & Forecast
      • 10.3.5.1.1. By Value
    • 10.3.5.2. Market Share & Forecast
      • 10.3.5.2.1. By Type
      • 10.3.5.2.2. By End User

11. Asia Pacific Flexible Printed Circuit Board Market Outlook

• 11.1. Market Size & Forecast
  • 11.1.1. By Type
  • 11.1.2. By End User
  • 11.1.3. By Country
• 11.2. Asia-Pacific: Country Analysis
  • 11.2.1. China Flexible Printed Circuit Board Market Outlook
    • 11.2.1.1. Market Size & Forecast
      • 11.2.1.1.1. By Value
    • 11.2.1.2. Market Share & Forecast
      • 11.2.1.2.1. By Type
      • 11.2.1.2.2. By End User
  • 11.2.2. India Flexible Printed Circuit Board Market Outlook
    • 11.2.2.1. Market Size & Forecast
      • 11.2.2.1.1. By Value
    • 11.2.2.2. Market Share & Forecast
      • 11.2.2.2.1. By Type
      • 11.2.2.2.2. By End User
  • 11.2.3. Japan Flexible Printed Circuit Board Market Outlook
    • 11.2.3.1. Market Size & Forecast
      • 11.2.3.1.1. By Value
    • 11.2.3.2. Market Share & Forecast
      • 11.2.3.2.1. By Type
      • 11.2.3.2.2. By End User
  • 11.2.4. South Korea Flexible Printed Circuit Board Market Outlook
    • 11.2.4.1. Market Size & Forecast
      • 11.2.4.1.1. By Value
    • 11.2.4.2. Market Share & Forecast
      • 11.2.4.2.1. By Type
      • 11.2.4.2.2. By End User
  • 11.2.5. Australia Flexible Printed Circuit Board Market Outlook
    • 11.2.5.1. Market Size & Forecast
      • 11.2.5.1.1. By Value
    • 11.2.5.2. Market Share & Forecast
      • 11.2.5.2.1. By Type
      • 11.2.5.2.2. By End User
  • 11.2.6. Indonesia Flexible Printed Circuit Board Market Outlook
    • 11.2.6.1. Market Size & Forecast
      • 11.2.6.1.1. By Value
    • 11.2.6.2. Market Share & Forecast
      • 11.2.6.2.1. By Type
      • 11.2.6.2.2. By End User
  • 11.2.7. Vietnam Flexible Printed Circuit Board Market Outlook
    • 11.2.7.1. Market Size & Forecast
      • 11.2.7.1.1. By Value
    • 11.2.7.2. Market Share & Forecast
      • 11.2.7.2.1. By Type
      • 11.2.7.2.2. By End User

12. Market Dynamics

• 12.1. Drivers
• 12.2. Challenges

13. Market Trends and Developments

14. Company Profiles

• 14.1. Nippon Mektron, Ltd.
  • 14.1.1. Business Overview
  • 14.1.2. Key Revenue and Financials
  • 14.1.3. Recent Developments
  • 14.1.4. Key Personnel/Key Contact Person
  • 14.1.5. Key Product/Services Offered
• 14.2. Multi-Fineline Electronix, Inc.
  • 14.2.1. Business Overview
  • 14.2.2. Key Revenue and Financials
  • 14.2.3. Recent Developments
  • 14.2.4. Key Personnel/Key Contact Person
  • 14.2.5. Key Product/Services Offered
• 14.3. Flexible Circuit Technologies, Inc.
  • 14.3.1. Business Overview
  • 14.3.2. Key Revenue and Financials
  • 14.3.3. Recent Developments
  • 14.3.4. Key Personnel/Key Contact Person
  • 14.3.5. Key Product/Services Offered
• 14.4. Fujikura Ltd.
  • 14.4.1. Business Overview
  • 14.4.2. Key Revenue and Financials
  • 14.4.3. Recent Developments
  • 14.4.4. Key Personnel/Key Contact Person
  • 14.4.5. Key Product/Services Offered
• 14.5. Sumitomo Electric Industries, Ltd.
  • 14.5.1. Business Overview
  • 14.5.2. Key Revenue and Financials
  • 14.5.3. Recent Developments
  • 14.5.4. Key Personnel/Key Contact Person
  • 14.5.5. Key Product/Services Offered
• 14.6. Zhen Ding Technology Holding Limited
  • 14.6.1. Business Overview
  • 14.6.2. Key Revenue and Financials
  • 14.6.3. Recent Developments
  • 14.6.4. Key Personnel/Key Contact Person
  • 14.6.5. Key Product/Services Offered
• 14.7. Unimicron Technology Corporation
  • 14.7.1. Business Overview
  • 14.7.2. Key Revenue and Financials
  • 14.7.3. Recent Developments
  • 14.7.4. Key Personnel/Key Contact Person
  • 14.7.5. Key Product/Services Offered
• 14.8. Career Technology (MFG.) Co., Ltd.:
  • 14.8.1. Business Overview
  • 14.8.2. Key Revenue and Financials
  • 14.8.3. Recent Developments
  • 14.8.4. Key Personnel/Key Contact Person
  • 14.8.5. Key Product/Services Offered
• 14.9. Flexium Interconnect, Inc.
  • 14.9.1. Business Overview
  • 14.9.2. Key Revenue and Financials
  • 14.9.3. Recent Developments
  • 14.9.4. Key Personnel/Key Contact Person
  • 14.9.5. Key Product/Services Offered
• 14.10. Kingboard Holdings Limited
  • 14.10.1. Business Overview
  • 14.10.2. Key Revenue and Financials
  • 14.10.3. Recent Developments
  • 14.10.4. Key Personnel/Key Contact Person
  • 14.10.5. Key Product/Services Offered

15. Strategic Recommendations

16. About Us & Disclaimer