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市場調査レポート
商品コード
1397907
フレキシブルプリント基板(FPCB)の世界市場の評価:タイプ別、材料別、産業別、地域別、機会、予測(2016年~2030年)Flexible Printed Circuit Board Market Assessment, By Type, By Material, By Industry, By Region, Opportunities and Forecast, 2016-2030F |
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カスタマイズ可能
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フレキシブルプリント基板(FPCB)の世界市場の評価:タイプ別、材料別、産業別、地域別、機会、予測(2016年~2030年) |
出版日: 2023年12月21日
発行: Market Xcel - Markets and Data
ページ情報: 英文 245 Pages
納期: 3~5営業日
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世界のフレキシブルプリント基板(FPCB)の市場規模は、2022年の155億8,000万米ドルから2030年に355億9,000万米ドルに達し、2023年~2030年の予測期間にCAGRで10.8%の成長が見込まれています。市場は急速に拡大しています。この拡大の主因は、重要なコンシューマーエレクトロニクス、自動車、医療部門における需要の増加です。機器の小型化、軽量化、技術の先進化の動向は、その柔軟性、省スペース設計、電気性能の向上により、FPCBに対する需要を高めています。さらに、フレキシブルディスプレイ、IoT機器、電気自動車などの開発途上にある技術が、市場を後押ししています。FPCB市場は、フレキシブル回路の継続的な進歩と受容の拡大により、今後数年間も上昇動向を維持する可能性が高いです。
2023年の電子製造の見通しでは、その本質的な利点により、フレキシブルPCBの採用が顕著に急増しています。インフレ、人件費、コンポーネント不足に対する懸念が高まる中、PCBの柔軟性は戦略的資産となっています。業界の調査によると、世界の不確実性により多品種少量生産の動向が強まっており、フレキシブルプリント基板(FPCB)の汎用性と一致しています。企業がリショアリングの選択肢を模索する中、フレキシブルプリント回路基板の適応性とスペース効率は、弾力的で効率的なサプライチェーンの確立に寄与しています。さらに、持続可能な電子に対する需要の高まりは、フレキシブルプリント基板の環境にやさしい特性と一致し、環境フットプリントの削減に寄与します。
ウェアラブルの動向は市場の成長に大きく寄与し、今後一定期間、メーカーに有利な機会をもたらします。健康とフィットネス、スマートウォッチ、医療機器など、さまざまな産業でウェアラブルの人気が高まり続けているため、柔軟性のある軽量な電子コンポーネントの需要が高まっています。フレキシブルハイブリッドエレクトロニクス(FHE)の主要技術であるFPCBは、ウェアラブル機器に求められる折り曲げ可能でコンパクトな設計を可能にします。
FPCB市場のメーカーは、生産能力をウェアラブル技術特有のニーズに合わせることで、この動向を活用することができます。ウェアラブル向けFPCBには、カスタマイズ、小型化、耐久性の向上が不可欠です。ウェアラブル市場の拡大に伴い、FPCBメーカーは革新的な設計要件に対応し、幅広いウェアラブル用途へのシームレスな統合を実現する機会を得ています。Tapeconのような経験豊富なFHE製造パートナーと早期に協力することで、FPCBの開発と拡張性を強化することができ、メーカーはこのダイナミックな成長市場の最前線にとどまることができます。
環境にやさしく持続可能な電子が重視されるようになったことが、フレキシブルプリント基板の需要増加の主因となっています。FPCBは、材料の無駄を省き、エネルギー消費を削減することで、この環境志向の動向を支えています。その柔軟で軽量な設計は、材料の正確な利用を可能にし、製造工程における無駄を省きます。さらに、FPCB製造はエネルギー効率の高い方法を採用することが多く、持続可能性目標に合致しています。環境規制や消費者の選好がグリーン技術を優先させる中、FPCBは、より環境に配慮した持続可能な電子製品に寄与できることから、従来のリジッドPCBよりも好まれるようになってきています。このことは、電子産業における環境にやさしい慣行を推進する上で、FPCBが極めて重要な役割を担っていることを明確に示しています。
高密度相互接続技術は、市場を形成する上で極めて重要であり、今後一定期間、メーカーに大きな機会を提供します。HDI PCBは、配線密度の向上を特徴とし、レーザードリルマイクロビア、スタックドビア、スタッガードビア、ビアインパッド配列などの先進の機能を使用します。高密度配線技術により、回路基板をより小型化できるため、スペースに制約のある用途、特に急成長しているウェアラブル機器やポータブル電子機器に最適です。
HDI FPCBは、片面に多くの部品を配置しやすく、信号伝送を改善し、RF回路のような高周波用途に適しています。消費者の選好がより小型で高性能な機器にシフトする中、HDI技術を活用するメーカーはこうした需要に対応し、コスト効率と性能の向上、そしてダイナミックなフレキシブルプリント基板(FPCB)市場での競争力を確保することができます。
当レポートでは、世界のフレキシブルプリント基板(FPCB)市場について調査分析し、市場規模と予測、市場力学、主要企業の情勢と見通しなどを提供しています。
Global flexible printed circuit board market size was valued at USD 15.58 billion in 2022, expected to reach USD 35.59 billion in 2030, with a CAGR of 10.8% for the forecast period between 2023 and 2030. The flexible printed circuit board market is expanding rapidly. This expansion is driven mostly by rising demand in important consumer electronics, automotive, and healthcare sectors. The trend toward smaller, lighter, and more technologically advanced devices has raised the demand for FPCBs due to their flexibility, space-saving design, and enhanced electrical performance. Furthermore, developing technologies like flexible displays, IoT devices, and electric cars propel the market forward. The FPCB market will likely maintain its rising trend in the coming years, owing to continued advancements and increased acceptance of flexible circuitry.
The electronics manufacturing landscape 2023 sees a notable surge in adopting flexible PCBs, driven by their intrinsic advantages. Amid rising concerns over inflation, labor costs, and component shortages, the flexibility of PCBs has become a strategic asset. According to industry studies, the trend towards high-mix, low-volume production, amplified by global uncertainties, aligns with the versatility of flexible printed circuit boards. As companies explore reshoring options, flexible printed circuit boards' adaptability and space efficiency contribute to establishing resilient and efficient supply chains. Moreover, the growing demand for sustainable electronics aligns with the eco-friendly attributes of flexible printed circuit boards, contributing to a reduced environmental footprint.
For instance, in April 2021, Siemens introduced PCBflow, a revolutionary cloud-based solution fostering secure collaboration between PCB designers and manufacturers. The pioneering software, driven by Valor NPI, accelerates the design-to-manufacturing transition, providing swift design for manufacturability analysis and handling over 1000 DFM checks. It enhances communication and optimizes designs for seamless integration.
The trend in wearables significantly contributes to the growth of the flexible printed circuit board market, presenting lucrative opportunities for manufacturers in the upcoming period. As wearables continue to gain popularity in various industries, including health and fitness, smartwatches, and medical devices, the demand for flexible and lightweight electronic components rises. FPCBs, a key technology in flexible hybrid electronics (FHE), enable the bendable and compact designs required for wearable devices.
Manufacturers in the FPCB market can capitalize on this trend by aligning their production capabilities with the specific needs of wearable technology. Customization, miniaturization, and increased durability are essential for FPCBs catering to wearables. As the wearables market expands, FPCB manufacturers have the opportunity to innovate and address evolving design requirements, ensuring seamless integration into a wide range of wearable applications. Early collaboration with experienced FHE manufacturing partners, like Tapecon, can enhance the development and scalability of FPCBs, allowing manufacturers to stay at the forefront of this dynamic and growing market.
The growing emphasis on eco-friendly and sustainable electronics is a key driver behind the increasing demand for flexible printed circuit boards. FPCBs support this environmentally conscious trend by mitigating material waste and reducing energy consumption. Their flexible, lightweight design allows for precise material utilization, eliminating unnecessary waste in the production process. Furthermore, FPCB manufacturing often employs energy-efficient methods, aligning with sustainability objectives. As environmental regulations and consumer preferences prioritize green technologies, FPCBs are becoming preferred over traditional rigid PCBs for their ability to contribute to more environmentally responsible and sustainable electronic products. It underscores their crucial role in advancing eco-friendly practices in the electronics industry.
For example, in November 2023, Elephantech secured USD 26.23 million in Series D financing, totaling USD 67.26 billion since inception. The funds will amplify mass production of P-Flex, an eco-friendly PCB, bolster global sales, and advance metal inkjet printing tech.
High-density interconnect technology is pivotal in shaping the landscape of the flexible printed circuit board market, offering manufacturers significant opportunities in the upcoming period. HDI PCBs, characterized by enhanced wiring density, use advanced features such as laser drilled microvias, stacked vias, staggered vias, and via-in-pad arrangements. High-density interconnect technology allows for more compact and smaller circuit boards, making it an ideal choice for applications with space constraints, particularly in the rapidly growing market of wearables and portable electronic devices.
HDI FPCBs facilitate the placement of more components on a single side, improving signal transmission and making them suitable for high-frequency applications like RF circuits. As consumer preferences shift towards smaller and more powerful devices, manufacturers leveraging HDI technology can meet these demands, ensuring cost-effectiveness, improved performance, and a competitive edge in dynamic flexible printed circuit board market.
Study reveals that Asia-Pacific commands a substantial portion of the global flexible printed circuit board market, propelled by robust electronics manufacturing ecosystems in countries like China, Japan, and South Korea. The region benefits from extensive technological infrastructure, skilled workforce, and significant investments in research and development. Furthermore, the substantial presence of major electronic device manufacturers amplifies the demand for FPCBs. This dominance is emphasized by the region's efficient large-scale production of FPCBs, establishing it as a pivotal player in global market.
For instance, in June 2023, Japan accelerated semiconductor industry efforts with a potential JSR Corp buyout, TSMC's USD 7 billion chip plant, Micron's USD 3.5 billion investment, and Samsung's chip line. The state-backed fund supports growth plans.
Globally, governments are actively supporting the growth of the flexible printed circuit board market. Their policies encourage innovation, expand manufacturing capabilities, and provide incentives for research and development, all of which contribute to building a strong, flexible printed circuit board ecosystem. Particularly in Asia, governments are offering tax benefits and infrastructure support to attract global electronics assembly leaders. Efforts are underway to stabilize tariffs and create an investor-friendly climate, ultimately boosting the competitiveness of flexible printed circuit board manufacturers globally. These initiatives are part of a broader strategy to establish countries as key players in the global electronics supply chain, emphasizing adaptability and innovation.
For instance, in December 2022, The Ministry of Environment, Forest, and Climate Change in India emphasized the formalization and regulation of the e-waste recycling sector. The E-Waste (Management) Rules, 2016, and the newly notified E-Waste (Management) Rules, 2022, introduce Extended Producer Responsibility (EPR) and set recycling targets, including the inclusion of 106 Electronic and Electrical Equipment (EEE) items. The rules aim to enhance environmental sustainability and safety in the dismantling and recycling e-waste, providing a comprehensive framework for flexible printed circuit board disposal and management.
The flexible printed circuit board market experienced a dual impact from COVID-19. Initially, the pandemic fueled demand for flexible printed circuit boards in the medical electronics sector owing to the increased need for medical devices. However, disruptions in global supply chain and trade tensions between the United States and China reduced demand for flexible PCBs, notably in Apple's supply chain. As the world transitions to the post-pandemic landscape, the FPCB market is anticipated to rebound, with an ongoing focus on medical applications and the rising demand for IoT devices and HDI technology.
The Russia-Ukraine war has impacted the flexible printed circuit board market, revealing challenges in controlling technology diversion. As sanctions aim to restrict semiconductor exports to Russia, reports indicate Western semiconductors still appear in Russian weapons, raising concerns about illicit purchases and counterfeiting. The complexity of global supply chains, dual-use issues, and the longevity of chip use pose significant challenges. Efforts to control technology flow face hurdles, emphasizing the need for collaborative action. The war underscores the importance of addressing the broad range of challenges to prevent unintended applications of FPCBs in military systems, highlighting the industry's commitment to compliance.
Industry leaders like Siemens Aktiengesellschaft, Fujikura Printed Circuits Ltd., Sumitomo Electric Group, Nitto Denko Corporation, and Flexible Circuit Technologies, Inc., play a crucial role. These companies shape the market with their advanced technologies and wide market presence. The demand for FPCBs is rising, especially in consumer electronics and automotive areas. The market looks promising, with expectations of continued growth. Collaboration, technology advancements, and strategic partnerships among these key players are anticipated to drive innovation and meet the changing needs of the flexible printed circuit boards market.
In October 2023, Cicor's acquisition of STS Defence enhanced its position in high-reliability electronics for aerospace and defense. The integration of STS Defence's capabilities strengthens Cicor's ability to provide innovative solutions, contributing to its competitiveness in flexible printed circuit board market.
All segments will be provided for all regions and countries covered:
Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.