フレキシブルプリント基板（FPC）市場：動向、機会、競合分析【2024-2030年】

フレキシブルプリント基板市場の動向と予測

世界のフレキシブルプリント基板（FPC）市場は、2024年から2030年までのCAGRが3.2%で、2030年には推定227億米ドルに達すると予測されています。この市場の主な促進要因は、通信業界におけるFPC需要の増加、コネクテッドデバイスの成長、カーエレクトロニクスの進歩です。世界のフレキシブルプリント基板（FPC）市場の将来は、コンピュータ/周辺機器、通信、家電、医療、自動車、航空宇宙・防衛産業における機会で有望視されています。

フレキシブルプリント基板市場の新たな動向

業界のダイナミクスに直接的な影響を与える新たな動向には、電子機器の小型化や低損失/高速プリント基板に対する需要の高まりなどがあります。

フレキシブルプリント基板市場の洞察

• Lucintelの予測では、自動車業界と通信業界における需要の増加により、多層が最大の技術タイプであり続けると思われます。リジッドフレックス基板セグメントは、スマートフォンやディスプレイ用途の需要増加により、予測期間中に最も高い成長が見込まれます。
• 通信は、スマートフォン、データストレージ、5G技術、ネットワークソリューション分野の需要増に支えられ、最大の最終用途産業であり続けると思われます。医療用エンドユース市場は、ポータブル、ワイヤレス、より複雑なエレクトロニクスアセンブリの需要が増加するため、予測期間中に最も高い成長が見込まれます。
• アジア太平洋地域は、自動車におけるADASと車両安全機能の増加、民生用電子機器と通信製品の成長により、最大市場であり続け、予測期間中最も高い成長が見込まれます。また、環境問題への関心と規制の高まりによる電気自動車の使用の増加も、この地域におけるFPCの需要を促進すると予想されます。

よくある質問

Q1.市場規模は：

A1.世界のフレキシブルプリント基板市場は、2030年までに推定227億米ドルに達すると予想されています。

Q2.市場の成長予測は：

A2.フレキシブルプリント基板市場は、2024年から2030年にかけてCAGR 3.2%で成長すると予想されます。

Q3.市場の成長に影響を与える主な促進要因は：

A3.この市場の主な促進要因は、通信業界におけるFPC需要の増加、コネクテッドデバイスの成長、カーエレクトロニクスの進歩です。

Q4.フレキシブルプリント基板の主な用途や最終産業は？

A4.フレキシブルプリント基板市場の主な最終用途産業は、通信とコンピュータ周辺機器です。

Q5.フレキシブルプリント基板市場の新たな動向は？

A5.業界のダイナミクスに直接的な影響を与える新たな動向としては、電子機器の小型化、低損失/高速プリント基板に対する需要の高まりなどが挙げられます。

Q6.フレキシブルプリント基板の主要企業は？

A6.フレキシブルプリント基板の主要企業は以下の通りです：

• Zhen Ding Technology Holding Limited（ZDT）
• NOK Corporation
• Sumitomo Electric
• Flexium Interconnect Inc.
• Fujikura Ltd.
• Nitto Denko Corporation
• Interflex
• Samsung Electro-Mechanics
• Daeduck GDS
• Compeq Samtec Inc.

Q7.フレキシブルプリント基板の技術セグメントで今後最も大きくなるのは？

A7.Lucintelの予測では、自動車や通信業界における需要の増加により、多層が最大の技術タイプであり続けると思われます。リジッド-フレックス基板セグメントは、スマートフォンやディスプレイ用途の需要増加により、予測期間中に最も高い成長が見込まれます。

Q8.：フレキシブルプリント基板市場において、今後5年間で最大の成長が見込まれる地域はどこか。

A8.アジア太平洋地域が引き続き最大で、今後5年間で最も高い成長が見込まれます。

Q9.レポートのカスタマイズは可能か：

A9.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 市場の背景と分類

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• 世界のFPC市場動向（2018-2023）と予測（2024-2030）
• 最終用途産業別世界FPC市場
  • コンピュータ/周辺機器
  • 自動車
  • 通信
    • 携帯電話
    • その他
  • 家電
  • 医療
  • 軍事/航空宇宙
  • その他
• 技術別世界FPC市場
  • 片面FPC
  • 両面FPC
  • 多層FPC
  • リジッドフレックスFPC
• 材料タイプ別FPC市場
  • ポリイミド
  • ポリエステルその他
• 原材料用途別FPC市場
  • ポリイミドフィルム
  • ポリエステルおよびその他のフィルム

第4章 2018年から2030年までの地域別市場動向と予測分析

• 地域別世界FPC市場
• 北米のFPC市場
• 欧州のFPC市場
• アジア太平洋のFPC市場
• その他地域のFPC市場

第5章 競合分析

• 製品ポートフォリオ分析
• 市場シェア分析
• 業務統合
• 地理的範囲
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 最終用途産業別世界FPC市場の成長機会
  • 技術別世界FPC市場の成長機会
  • 地域別の世界FPC市場の成長機会
• 世界のFPC市場の新たな動向
• 戦略分析
  • 新製品の開発
  • 世界のFPC市場の生産能力拡大
  • 世界のFPC業界における合併と買収

第7章 主要企業の企業プロファイル

• Zhen Ding Technology Holding Limited（ZDT）
• NOK Corporation
• Sumitomo Electric
• Flexium Interconnect Inc.
• Fujikura Ltd.
• Nitto Denko Corporation
• Interflex
• Samsung Electro-Mechanics
• Daeduck GDS
• Compeq Samtec Inc .

Flexible Printed Circuit Board Market Trends and Forecast

The future of the global flexible printed circuit board (FPC) market looks promising with opportunities in the computer/peripheral, telecommunication, consumer electronics, medical, automotive, and aerospace and defense industries.The global flexible printed circuit board (FPC) market is expected to reach an estimated $22.7 billion by 2030 with a CAGR of 3.2% from 2024 to 2030. The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Emerging Trends in the Flexible Printed Circuit Board Market

Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

A total of 122 figures / charts and 134 tables are provided in this 197-page report to help in your business decisions. Sample figures with insights are shown below.

Flexible Printed Circuit Board Market by Segment

The study includes trends and forecast for the global flexible printed circuit board (FPC) market by technology, end use industry, laminate material type, raw material usage, and region as follows:

By End Use Industry [$M and M Sqm shipment analysis for 2018 - 2030]:

• Computers/Peripherals
• Telecommunications
• Consumer Electronics
• Medical
• Automotive
• Aerospace and Defense
• Others

By Technology [$M and M Sqm shipment analysis for 2018 - 2030]:

• Single Layer
• Double Layer
• Multi- Layer
• Rigid-Flex

By Laminate Material Type [$M and M Sqm shipment analysis for 2018 - 2030]:

• Polyimide
• Polyester and Others

By Raw Material Usage [$M and kilotons shipment analysis for 2018 - 2030]:

• Polyimide Films
• Polyester and Other Films

By Region [$M and M Sqm shipment analysis for 2018 - 2030]:

• North America
  • United States
  • Canada
  • Mexico
• Europe
  • Germany
  • France
  • UK
• Asia Pacific
  • China
  • Japan
  • South Korea
  • India
  • Taiwan
• Rest of the World

List of Flexible Printed Circuit Board Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies flexible PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the flexible PCB companies profiled in this report includes.

• Zhen Ding Technology Holding Limited (ZDT)
• NOK Corporation
• Sumitomo Electric
• Flexium Interconnect Inc.
• Fujikura Ltd.
• Nitto Denko Corporation
• Interflex
• Samsung Electro-Mechanics
• Daeduck GDS
• Compeq Samtec Inc

Flexible Printed Circuit Board Market Insight

• Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.
• Telecommunication will remain the largest end use industry, supported by increasing demand for smartphones, data storage, 5G technology, and network solution sectors. The medical end use market is expected to witness the highest growth during the forecast period because it will witness increasing demand for portable, wireless, and more complex electronic assemblies.
• Asia Pacific is expected to remain the largest market and witness the highest growth over the forecast period due to increasing ADAS and vehicle safety features in automotive and growth in consumer electronic devices and telecommunication products. Increasing usage of electric vehicles due to growing environmental concerns and regulations is also expected to drive the demand for FPC in this region.

Features of Flexible Printed Circuit Board Market

• Market Size Estimates: Flexible printed circuit board market size estimation in terms of value ($M) and volume (million square meter)
• Trend and Forecast Analysis: Market trends (2018-2023) and forecast (2024-2030) by various segments and regions.
• Segmentation Analysis: Flexible printed circuit board market size by various segments, such as end use industry, technology, laminate material type, and raw material usage, in terms of value and volume.
• Regional Analysis: Flexible printed circuit board market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
• Growth Opportunities: Analysis on growth opportunities in various end use industries, technologies, laminate material types, and raw material usages, and regions, for the flexible printed circuit board market.
• Strategic Analysis: This includes M&A, new product development, and competitive landscape for the flexible printed circuit board market.
• Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the flexible printed circuit board market size?

Answer: The global flexible printed circuit board market is expected to reach an estimated $22.7 billion by 2030.

Q2. What is the growth forecast for flexible printed circuit board market?

Answer: The flexible printed circuit board market is expected to grow at a CAGR of 3.2% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the flexible printed circuit board market?

Answer: The major drivers for this market are increasing demand for FPC in the telecommunication industry, growth in connected devices, and advancement in automotive electronics.

Q4. What are the major applications or end use industries for flexible printed circuit board?

Answer: Telecommunication and computer ad peripherals are the major end use industries for flexible printed circuit board market.

Q5. What are the emerging trends in flexible printed circuit board market?

Answer: Emerging trends, which have a direct impact on the dynamics of the industry, include miniaturization of electronic devices and growing demand for low loss/high speed PCBs.

Q6. Who are the key flexible printed circuit board companies?

Answer: Some of the key flexible printed circuit board companies are as follows:

• Zhen Ding Technology Holding Limited (ZDT)
• NOK Corporation
• Sumitomo Electric
• Flexium Interconnect Inc.
• Fujikura Ltd.
• Nitto Denko Corporation
• Interflex
• Samsung Electro-Mechanics
• Daeduck GDS
• Compeq Samtec Inc.

Q7.Which flexible printed circuit board technology segment will be the largest in future?

Answer: Lucintel forecasts that multi-layer will remain the largest technology type due to increasing demand in the automotive and telecommunication industries. The rigid-flex substrate segment is expected to witness the highest growth during the forecast period due to growing demand for smartphone and display applications.

Q8: In flexible printed circuit board market, which region is expected to be the largest in next 5 years?

Answer: Asia Pacific is expected to remain the largest region and witness the highest growth over next 5 years.

Q9. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% Customization Without any Additional Cost.

This report answers following 11 key questions

• Q.1 What are some of the most promising potential, high-growth opportunities for the global FPC market by end use industry (computers/peripherals, telecommunication, consumer electronics, medical, automotive, aerospace and defense, and others), technology (single layer, double layer, multi-layer and rigid flex), laminate material type (polyimide and polyester & others), laminate raw material usage (polyimide films and polyester & other films), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q. 2 Which segments will grow at a faster pace and why?
• Q.3 Which regions will grow at a faster pace and why?
• Q.4 What are the key factors affecting market dynamics? What are the drivers and challenges of the market?
• Q.5 What are the business risks and threats to the market?
• Q.6 What are the emerging trends in this market and the reasons behind them?
• Q.7 What are some changing demands of customers in the market?
• Q.8 What are the new developments in the market? Which companies are leading these developments?
• Q.9 Who are the major players in this market? What strategic initiatives are being implemented by key players for business growth?
• Q.10 What are some of the competitive products and processes in this area and how big of a threat do they pose for loss of market share via material or product substitution?
• Q.11 What M & A activities did take place in the last five years in this market?

Table of Contents

1. Executive Summary

2. Market Background and Classifications

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1: Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2: Global FPC Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global FPC Market by End Use Industry
  • 3.3.1: Computers/Peripherals
  • 3.3.2: Automotive
  • 3.3.3: Telecommunications
    • 3.3.3.1: Mobile Phones
    • 3.3.3.2: Others
  • 3.3.4: Consumer Electronics
  • 3.3.5: Medical
  • 3.3.6: Military/Aerospace
  • 3.3.7: Others
• 3.4: Global FPC Market by Technology
  • 3.4.1: Single-Sided FPC
  • 3.4.2: Double-Sided FPC
  • 3.4.3: Multi-Layer FPC
  • 3.4.4: Rigid-Flex FPC
• 3.5: FPC Market by Material Type
  • 3.5.1: Polyimide
  • 3.5.2: Polyester and Others
• 3.6: FPC Market by Raw Material Usage
  • 3.6.1: Polyimide Films
  • 3.6.2: Polyester and Other Films

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global FPC Market by Region
• 4.2: North American FPC Market
  • 4.2.1: Market by End Use Industry
  • 4.2.2: Market by Technology
  • 4.2.3: The US FPC Market
  • 4.2.4: The Canadian FPC Market
  • 4.2.5: The Mexican FPC Market
• 4.3: European FPC Market
  • 4.3.1: Market by End Use Industry
  • 4.3.2: Market by Technology
  • 4.3.3: German FPC Market
  • 4.3.4: United Kingdom FPC Market
  • 4.3.5: French FPC Market
• 4.4: APAC FPC Market
  • 4.4.1: Market by End Use Industry
  • 4.4.2: Market by Technology
  • 4.4.3: Chinese FPC Market
  • 4.4.4: Japanese FPC Market
  • 4.4.5: Taiwanese FPC Market
  • 4.4.6: South Korean FPC Market
• 4.5: ROW FPC Market
  • 4.5.1: Market by End Use Industry
  • 4.5.2: Market by Technology

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Market Share Analysis
• 5.3: Operational Integration
• 5.4: Geographical Reach
• 5.5: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global FPC Market by End Use Industry
  • 6.1.2: Growth Opportunities for the Global FPC Market by Technology
  • 6.1.3: Growth Opportunities for the Global FPC Market by Region
• 6.2: Emerging Trends in the Global FPC Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global FPC Market
  • 6.3.3: Mergers and Acquisitions in the Global FPC Industry

7. Company Profiles of Leading Players

• 7.1: Zhen Ding Technology Holding Limited (ZDT)
• 7.2: NOK Corporation
• 7.3: Sumitomo Electric
• 7.4: Flexium Interconnect Inc.
• 7.5: Fujikura Ltd.
• 7.6: Nitto Denko Corporation
• 7.7: Interflex
• 7.8: Samsung Electro-Mechanics
• 7.9: Daeduck GDS
• 7.10: Compeq Samtec Inc .