基板対基板コネクタ市場- 世界の産業規模、シェア、動向、機会、予測タイプ別、ピンヘッダ別、ピッチ別、用途別、地域別、競合予測・市場競合、2018年～2028年

世界の基板対基板コネクタ市場は、2022年に122億米ドルとなり、予測期間中にCAGR 5.45％で成長しています。

電子機器の需要拡大がプリント回路コネクタ市場を牽引しています。スマートフォン、タブレット、ノートパソコン、モノのインターネットの普及に伴い、デバイスやその他の電子システムは効率的な接続ソリューションを必要としています。通信、自動車、産業オートメーション、ヘルスケア、コンシューマーエレクトロニクスなどの分野における技術の進歩は、カード間の高度なコネクタを必要とします。

世界化の進展により、新興国ではスマート・デバイスの普及が進んでいます。スマートフォン、パソコン、ビデオカメラの普及により、BTBコネクターの需要が増加しています。あらゆる産業でデジタル化が進み、医療機器、データセンター、携帯機器、セキュリティ・ソリューション・システムでBTBコネクタの使用と需要が増加しています。BTBコネクタの生産量の増加は、BTBコネクタ市場の需要仕様比率を高めています。BTBコネクタの世界生産量は2016年に38億7,057万個で、2024年には51億83万個に達すると予測されています。モノのインターネット（IoT）の普及がBTBコネクタ市場の成長を牽引しています。自動化ニーズの高まりは、効率的な動作のためにBTBコネクタを必要とする先端技術の出現につながっています。進化する自動車産業は、将来の電気自動車のイントロダクション伴い、BTBコネクタに機会を提供しています。家電市場では、BTBコネクタの消費量が最も高かったです。異なるブランドや市場プレイヤー間の価格差の縮小が、BTBコネクタの市場に影響を与えています。製品性能の向上もBTBコネクターのニーズを高めています。製品タイプの進化と模範的なアフターサービスがBTBコネクター市場の成長に寄与しています。BTBコネクタ市場では、プレミアムまたはプレミアム市場が最大のシェアを占めていることが判明しました。

市場促進要因

電子機器と消費者機器の急速な進歩：

目次

第1章 概要

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 顧客の声

第5章 基板対基板コネクタの世界市場展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • タイプ別（ピンヘッダー、ソケット）
  • ピンヘッダー別（スタック型、シュラウド型）
  • ピッチ別（1mm未満、1mm以上2mm未満、2mm以上）
  • アプリケーション別（コンシューマー・エレクトロニクス、産業用オートメーション）
  • 地域別
• 企業別（2022年）
• 市場マップ

第6章 北米基板対基板コネクタ市場展望

• 市場規模・予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • ピンヘッダー別
  • ピッチ別
  • 用途別
  • 国別
• 北米国別分析
  • 米国
  • カナダ
  • メキシコ

第7章 アジア太平洋地域の基板対基板コネクタ市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • ピンヘッダー別
  • ピッチ別
  • 用途別
  • 国別
• アジア太平洋地域国別分析
  • 中国
  • インド
  • 日本
  • 韓国
  • オーストラリア

第8章 欧州基板対基板コネクタ市場展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • ピンヘッダー別
  • ピッチ別
  • 用途別
  • 国別
• 欧州国別分析
  • ドイツ
  • 英国
  • フランス
  • イタリア
  • スペイン

第9章 南米基板対基板コネクタ市場の展望

• 市場規模・予測
  • 金額別
• 市場シェアと予測
  • タイプ別
  • ピンヘッダー別
  • ピッチ別
  • 用途別
  • 国別
• 南米：国別分析
  • ブラジル
  • アルゼンチン
  • コロンビア

第10章 中東・アフリカ基板対基板コネクタ市場の展望

• 市場規模と予測
  • 金額別
• 市場シェアと予測
  • コンポーネント別
  • 用途別
  • エンドユーザー別
  • 国別
• 中東・アフリカ：国別分析
  • サウジアラビア
  • 南アフリカ
  • アラブ首長国連邦

第11章 市場力学

• 促進要因
• 課題

第12章 市場動向と発展

第13章 企業プロファイル

• ANSYS, Inc
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• AMPHENOL
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• Molex
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• Foxconn
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• JAE
• DELPHI
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• Samtec
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• JST
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• Hirose.
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services
• HARTING
  • Business Overview
  • Key Revenue and Financials
  • Recent Developments
  • Key Personnel
  • Key Product/Services

第14章 戦略的提言

第15章 調査会社について・免責事項

The Global Board-to-Board Connectors Market was valued at USD 12.2 billion in 2022 and is growing at a CAGR of 5.45% during the forecast period. Growing demand for electronic devices is driving the market for printed circuit connectors. With the proliferation of smartphones, tablets, laptops and the Internet of Things devices and other electronic systems require efficient connectivity solutions. Technological advances in areas such as telecommunications, automobiles and industry automation, healthcare and consumer electronics require advanced connectors between cards.

Increasing globalization has led to emerging economies that have increased the penetration of smart devices. The increased use of smartphones, personal computers and video cameras has increased the demand for BTB connectors. Growing digitization in all industries has increased the use and demand for BTB connectors in medical devices, data centers, portable and security solutions systems. The growing production volume of BTB connectors has increased the demand-specification ratio of the BTB connectors market. The global production volume of BTB connectors was 3,870.57 million units in 2016 and is projected to reach 5,100.83 million units by 2024. The growing adoption of the Internet of Things (IoT) has driven the growth of the BTB connector market. The growing need for automation has led to the emergence of advanced technology that requires BTB connectors for efficient operation. The evolving automotive industry has provided opportunities for BTB connectors with the introduction of electric vehicles of the future. In the consumer electronics market, the consumption of BTB connectors was the highest. The reduction of the price difference between different brands and market players has affected the market for BTB connectors. The increase in product performance also increases the need for BTB connectors. Evolving product types and exemplary after-sales services have contributed to the growth of the BTB connector market. The premium or premium market was found to have the largest share of the BTB connector market.

Key Market Drivers

Rapid Advancements in Electronics and Consumer Devices:

Rapid advancements in electronics and the continuous evolution of consumer devices are among the primary drivers propelling the Global Board-to-Board Connectors Market. This driver is rooted in the dynamic and ever-changing landscape of technology, where innovations and upgrades in electronic devices are constant. Let's delve deeper into how these advancements are driving the demand for board-to-board connectors.

Consumer electronics, such as smartphones, tablets, laptops, wearables, and smart home devices, are at the forefront of technological innovation. These devices have become an integral part of modern life, and consumers expect them to be increasingly powerful, compact, and feature-rich. To meet these expectations, manufacturers must continuously advance the internal components, which necessitates smaller and more sophisticated board-to-board connectors. Consumers and industries alike demand smaller and more lightweight electronic devices. Whether it's a thinner smartphone, a sleeker laptop, or a compact wearable, miniaturization is a dominant trend. Board-to-board connectors are crucial in achieving miniaturization goals. These connectors allow for the stacking of printed circuit boards (PCBs) in tight spaces within a device, conserving precious real estate and enabling a sleek, compact design. Advancements in electronics often involve increasing the density of components on PCBs. As more functionality is packed into smaller areas, the interconnection between PCBs becomes more challenging. Board-to-board connectors play a pivotal role in ensuring reliable connections between densely populated PCBs, facilitating data transmission, power delivery, and signal integrity. Electronics manufacturers require board-to-board connectors that offer flexibility in design and customization. Different devices may have unique requirements for the positioning and orientation of PCBs. Connectors that can be tailored to specific design needs, such as right-angle connectors or mezzanine connectors, are essential in accommodating diverse electronic designs. Many consumer devices demand high-speed data transfer capabilities to handle large files, high-definition media streaming, and seamless connectivity. Board-to-board connectors designed for high-speed data transmission enable devices to meet these demands. They ensure minimal signal loss and maintain data integrity even at high data rates. Consumers expect their electronic devices to be reliable and durable. Board-to-board connectors must withstand the rigors of everyday use, including plugging and unplugging, temperature variations, and physical stress. Robust connectors contribute to the overall reliability and longevity of electronic products. Wearable devices and the Internet of Things (IoT) are driving a new wave of consumer electronics. These devices often have unique form factors and connectivity requirements. Board-to-board connectors are adapted to meet the specific needs of wearables and IoT devices, ensuring seamless integration and reliable performance.

In summary, the rapid advancements in electronics and consumer devices are driving the demand for board-to-board connectors that can keep pace with evolving technologies. These connectors are vital components that enable the miniaturization of devices, accommodate high-speed data transmission, offer flexibility in design, and ensure reliability and durability. As consumer expectations for smaller, more powerful, and feature-rich electronics continue to grow, board-to-board connectors play a critical role in making these innovations a reality..

Growing Demand for High-Speed Data Transmission:

The growing demand for high-speed data transmission is a significant driver fueling the Global Board-to-Board Connectors Market. This driver is closely linked to the increasing reliance on fast and efficient data exchange in various industries and applications. Let's explore how the demand for high-speed data transmission is shaping the board-to-board connectors market: In today's digital era, data-intensive applications have become ubiquitous across multiple sectors. Whether it's streaming high-definition videos, real-time gaming, cloud computing, or big data analytics, these applications require rapid data transmission to deliver a seamless user experience. Board-to-board connectors play a critical role in ensuring that data flows smoothly between interconnected components within electronic devices. The global rollout of 5G technology is a significant catalyst for the demand for high-speed data transmission. 5G networks offer dramatically increased data transfer rates, reduced latency, and enhanced network reliability. As 5G infrastructure expands, electronic devices need to be equipped with connectors capable of handling the higher data speeds. Board-to-board connectors designed for high-speed data transmission are essential components in 5G-enabled devices, including smartphones, IoT devices, and networking equipment. The automotive industry is undergoing a transformation with the development of autonomous vehicles. These vehicles require real-time data communication not only within the vehicle itself but also with other vehicles and infrastructure (V2X communication). High-speed board-to-board connectors facilitate the exchange of data between the various sensors, processors, and communication modules in autonomous vehicles, ensuring safe and efficient operation. The Internet of Things (IoT) ecosystem relies on seamless connectivity and rapid data transmission. IoT devices collect and transmit data from various sensors and sensors to central processing units or cloud servers. Edge computing, which processes data closer to the source rather than relying solely on centralized cloud servers, also demands fast data transmission. Board-to-board connectors enable these devices and systems to transmit data swiftly and efficiently, supporting real-time decision-making and data analysis. Data centers are the backbone of the digital world, hosting vast amounts of data and providing cloud services. Within data centers, board-to-board connectors facilitate high-speed data transmission between servers, storage devices, and networking equipment. The need for rapid data transfer within data centers is essential for delivering services with low latency and high availability. Industrial automation and robotics applications require real-time communication and precise synchronization. Board-to-board connectors used in these applications enable high-speed data transmission between control units, sensors, actuators, and robotic arms. Fast and reliable data exchange is crucial for achieving efficiency and precision in manufacturing and automation processes. In the aerospace and defense sectors, high-speed data transmission is essential for communication, surveillance, and mission-critical applications. Board-to-board connectors used in avionics, radar systems, and communication equipment must meet stringent requirements for data integrity and speed to ensure the success and safety of missions.

In summary, the growing demand for high-speed data transmission is a fundamental driver of the board-to-board connectors market. As technology continues to advance and data-intensive applications become more prevalent, the need for connectors capable of handling rapid data exchange is paramount. Board-to-board connectors play a pivotal role in supporting the development of cutting-edge technologies, from 5G networks and autonomous vehicles to IoT.

Key Market Challenges

The Global Board-to-Board Connectors Market is undoubtedly thriving due to the increasing demand for high-speed data transmission and the proliferation of electronic devices. However, like any other industry, it faces several challenges that must be addressed to sustain growth and innovation. Here are three significant challenges facing the Global Board-to-Board Connectors Market:

Miniaturization and High-Density Packaging:

Miniaturization and high-density packaging represent a significant challenge in the global Board-to-Board Connectors Market. As electronic devices continue to evolve towards smaller and more compact form factors while packing in greater functionality, the demand for connectors that can meet these requirements has surged. This challenge revolves around the need to create connectors that are not only smaller in size but also capable of handling high-speed data transmission, power delivery, and signal integrity without compromising performance or reliability.

Electronic devices, ranging from smartphones and tablets to wearables and IoT sensors, are becoming increasingly compact. As a result, the space available for components such as connectors is shrinking. In some cases, connectors need to fit into confined spaces within the device's casing, leaving minimal room for traditional connectors. This demands the development of miniature connectors that can function effectively within these tight constraints.

While devices are getting smaller, they are also becoming more feature-rich. This means that connectors need to accommodate a growing number of pins or contacts to support various functions, including data transmission, power supply, and sensor interfaces. These connectors must deliver high performance despite their reduced size, which adds to the complexity of design. The demand for high-speed data transmission is relentless, driven by the need for faster data processing and seamless connectivity. Board-to-board connectors must facilitate rapid data exchange, especially in applications involving video streaming, gaming, 5G connectivity, and high-performance computing. Achieving this in miniature connectors requires addressing signal integrity challenges, including impedance mismatches and signal loss. Miniaturization can exacerbate signal integrity issues, including crosstalk, electromagnetic interference (EMI), and attenuation. As connectors are placed closer together in high-density packaging, the risk of signal interference rises. Maintaining signal integrity is crucial to ensure reliable data transmission and prevent data corruption or loss. Manufacturing and assembling miniature connectors can be intricate and require advanced techniques. Handling tiny components with precision is a delicate process that demands specialized equipment and skilled labor. The assembly process needs to be efficient to keep production costs in check, but it must also ensure that connectors are correctly aligned and securely connected. Miniature connectors need to be constructed from materials that can withstand environmental factors, such as temperature fluctuations, moisture, and physical stress. Ensuring that these connectors are durable while remaining small and lightweight is a materials engineering challenge. Different applications require specific connector configurations, pin counts, orientations, and contact styles. This level of customization can be challenging to achieve while maintaining standardized and interoperable connectors. Balancing customization with the ability to plug and play connectors across various devices and systems is an ongoing challenge. Addressing the challenge of miniaturization and high-density packaging in the board-to-board connectors market requires a multi-faceted approach. Manufacturers need to invest in research and development to create innovative connector designs that optimize space, performance, and signal integrity. Advanced materials with low dielectric constants and controlled impedance characteristics play a crucial role in minimizing signal degradation. Additionally, the use of surface-mount technology (SMT) and precision molding can enhance the manufacturing process of miniature connectors. Collaboration between connector manufacturers and industries that rely on these components is essential. Manufacturers must work closely with electronics companies to understand their specific requirements and develop customized solutions that meet their needs. Standardization efforts within the industry can also help strike a balance between customization and interoperability.

In conclusion, the challenge of miniaturization and high-density packaging in the global Board-to-Board Connectors Market underscores the need for continuous innovation, advanced materials, and collaborative partnerships to meet the demands of modern electronic devices and applications..

Signal Integrity and Data Speeds:

With the increasing demand for high-speed data transmission, maintaining signal integrity has become a paramount challenge in the board-to-board connectors market. Signal integrity issues, such as impedance mismatches, crosstalk, and signal loss, can degrade data transmission quality and reliability. The connectors must be designed to minimize these issues, especially when dealing with data rates in the gigabit per second (Gbps) range or higher. Overcoming this challenge necessitates rigorous testing, simulation, and modeling of connector designs to ensure that they meet signal integrity requirements. Advanced materials with low dielectric constant and controlled impedance characteristics are used to minimize signal degradation. Additionally, connectors with improved shielding and grounding mechanisms can help mitigate signal integrity issues. As data speeds continue to increase, ongoing research and development efforts are essential to stay ahead of the curve.

Customization and Interoperability:

The demand for customization in board-to-board connectors has surged as various industries require connectors tailored to their specific applications and design requirements. However, customization can pose a challenge in terms of cost, lead times, and interoperability. Creating custom connectors can be time-consuming and expensive, and it may lead to difficulties in integrating these connectors into standardized systems or devices. To address this challenge, manufacturers are increasingly offering configurable connectors that strike a balance between customization and interoperability. These connectors allow customers to choose from a range of options, such as pin counts, orientations, and contact styles, to match their unique needs without the complexity of full customization. Standardization efforts and the adoption of industry standards for connectors also play a role in ensuring interoperability across different devices and systems. In conclusion, while the Global Board-to-Board Connectors Market is thriving due to the demand for high-speed data transmission and miniaturization, it faces challenges related to miniaturization and high-density packaging, signal integrity and data speeds, and customization and interoperability. Overcoming these challenges requires ongoing research, innovation in connector design and materials, and collaboration between manufacturers and industries to develop solutions that meet the evolving needs of electronic devices and applications.

Key Market Trends

High-Speed Data Transmission Requirements:

One of the prominent trends in the Global Board-to-Board Connectors Market is the increasing demand for high-speed data transmission capabilities. As electronic devices continue to incorporate features like 5G connectivity, high-definition video streaming, and real-time data processing, the need for connectors that can support rapid data exchange has surged.Applications such as data centers, telecommunications infrastructure, gaming consoles, and automotive electronics require connectors that can handle data rates in the gigabit and terabit per second range. This trend is pushing connector manufacturers to develop high-speed solutions with enhanced signal integrity and reduced latency.

Impedance Matching: To ensure minimal signal loss and avoid electromagnetic interference (EMI), connectors must offer precise impedance matching. Connectors designed for high-speed data transmission often incorporate controlled impedance features and low-loss materials to maintain signal integrity, making them suitable for emerging technologies like PCIe (Peripheral Component Interconnect Express) and Thunderbolt.

Parallel and Serial Interfaces: Connectors supporting high-speed data transmission are available in both parallel and serial configurations. While parallel interfaces allow for data transmission across multiple lanes simultaneously, serial interfaces offer more straightforward routing and lower latency, making them suitable for compact devices and high-speed backplanes...

Miniaturization and High-Density Packaging:

The relentless drive toward smaller and more compact electronic devices is another prevailing trend in the Board-to-Board Connectors Market. This trend aligns with the broader industry goal of achieving higher functionality within smaller form factors, whether in consumer electronics, medical devices, or industrial equipment. Miniaturization efforts have led to the development of miniature board-to-board connectors that occupy minimal space on PCBs. These connectors are essential for applications like smartphones, wearables, and IoT devices, where every millimeter of space is valuable.High-density packaging involves placing connectors closer together on PCBs, optimizing space utilization. This trend is particularly relevant in industries like aerospace, where weight and size constraints are critical, as well as data center equipment where space efficiency is paramount. To support miniaturization and high-density packaging, connector manufacturers are investing in advanced materials and manufacturing techniques. Materials with low dielectric constants and controlled impedance characteristics help mitigate signal integrity challenges associated with compact connectors. The demand for application-specific connectors and customized solutions is on the rise in the Board-to-Board Connectors Market. As industries diversify and develop specialized applications, connectors need to adapt to unique requirements. Various industries, including automotive, medical, aerospace, and industrial automation, require connectors tailored to their specific needs. For example, automotive connectors may need to withstand extreme temperature ranges and vibrations, while medical connectors must adhere to strict sterilization standards. Connector customization extends to factors such as pin counts, orientations (right-angle or vertical), and contact styles (surface-mount, through-hole, or press-fit). Custom connectors are designed to fit seamlessly into a particular device or system. While customization is essential, maintaining interoperability between different components and systems remains a challenge. Connector manufacturers must strike a balance between providing tailored solutions and ensuring compatibility with standardized interfaces. These trends in the Global Board-to-Board Connectors Market reflect the ongoing evolution of electronic devices and their connectivity needs. To remain competitive, connector manufacturers are investing in research and development to meet the demands of high-speed data transmission, miniaturization, and customization while upholding performance and reliability standards. Collaboration with industry stakeholders and adherence to global standards are vital for driving innovation in this dynamic market.

Segmental Insights

Type Insights

On the basis of type, the socket segment is expected to have the highest CAGR during the forecast period time period The socket segment is growing at the highest CAGR in the PCB connector market. The sockets offer great flexibility and interchangeability, which allows easy replacement and component reconfiguration. This feature is valuable for fields that change frequently or upgrading of electronic equipment is common, for example in consumer electronics or telecommunications. Card-to-board connectors are compatible with many card-to-board connectors, which makes them suitable for a wide range of applications and industries. Hence, growth in industries such as because consumer electronics have a positive impact on the demand for sockets.

Regional Insights

In 2022, the Asia-Pacific region emerged as the largest market for board-to-board connectors, accounting for the majority of the global market share. This dominance is anticipated to persist and even strengthen over the forecast period for several key reasons: Manufacturing Hub: APAC, particularly countries like China, Taiwan, South Korea, and Japan, serves as a global manufacturing hub for electronics and consumer devices. The region's robust electronics industry, which includes the production of smartphones, tablets, laptops, and other electronic gadgets, drives substantial demand for board-to-board connectors. APAC is at the forefront of technological innovation and adoption. The region continuously witnesses the introduction of cutting-edge electronic products that require advanced board-to-board connectors to enable seamless data transmission and power distribution. As consumer preferences shift toward high-performance, feature-rich devices, the demand for sophisticated connectors in APAC remains high. The automotive and industrial sectors in APAC are experiencing significant growth. These sectors increasingly rely on board-to-board connectors for applications like vehicle electronics, factory automation, robotics, and industrial control systems. The expansion of these industries further fuels the demand for connectors in the region. The rapid expansion of telecommunications networks, including the deployment of 5G infrastructure, drives demand for high-speed, reliable connectors. APAC countries are investing heavily in upgrading their telecommunications infrastructure, creating substantial opportunities for board-to-board connector manufacturers. APAC has a large and growing consumer electronics market. With a rising middle-class population and increased disposable income, consumers in the region are adopting a wide range of electronic gadgets. This surge in consumer electronics, including smartphones, smart TVs, and wearable devices, contributes significantly to the demand for connectors. APAC boasts a well-established manufacturing ecosystem that includes semiconductor fabrication, PCB manufacturing, and assembly. The proximity of these manufacturing facilities to connector suppliers fosters collaboration and cost-effective production, further driving the dominance of APAC in the board-to-board connectors market.

Given these factors, the Asia-Pacific region is expected to maintain its leading position in the Global Board-to-Board Connectors Market in the coming years. The region's vibrant electronics industry, technological advancements, and expanding application areas will continue to propel the demand for board-to-board connectors, making APAC a focal point for market growth and innovation..

Key Market Players

ANSYS, Inc

AMPHENOL

Molex

Foxconn

JAE

DELPHI

Samtec

JST

Hirose.

HARTING

Report Scope:

In this report, the Global Board-to-Board Connectors Market has been segmented into the following categories, in addition to the industry trends which have also been detailed below:

Global Board-to-Board Connectors Market, By Type:

• Pin Headers
• Sockets

Global Board-to-Board Connectors Market, By Pin Headers:

• Stacked
• Shrouded

Global Board-to-Board Connectors Market, By End User:

• Less Than 1 mm
• 1 mm to 2mm
• Greater Than 2 mm

Global Board-to-Board Connectors Market, By Application:

• Consumer Electronics
• Industrial Automation

Global Hazard Control Market, By Region:

• North America
• United States
• Canada
• Mexico
• Europe
• France
• United Kingdom
• Italy
• Germany
• Spain
• Asia-Pacific
• China
• India
• Japan
• Australia
• South Korea
• South America
• Brazil
• Argentina
• Colombia
• Middle East & Africa
• South Africa
• Saudi Arabia
• UAE

Competitive Landscape

• Company Profiles: Detailed analysis of the major companies present in the Global Board-to-Board Connectors Market.

Available Customizations:

• Global Board-to-Board Connectors Market report with the given market data, Tech Sci Research offers customizations according to a company's specific needs. The following customization options are available for the report:

Company Information

• Detailed analysis and profiling of additional market players (up to five).

Table of Contents

1. Product Overview

• 1.1. Market Definition
• 1.2. Scope of the Market
  • 1.2.1. Markets Covered
  • 1.2.2. Years Considered for Study
  • 1.2.3. Key Market Segmentations

2. Research Methodology

• 2.1. Objective of the Study
• 2.2. Baseline Methodology
• 2.3. Key Industry Partners
• 2.4. Major Association and Secondary Sources
• 2.5. Forecasting Methodology
• 2.6. Data Triangulation & Validation
• 2.7. Assumptions and Limitations

3. Executive Summary

4. Voice of Customers

5. Global Board-to-Board Connectors Market Outlook

• 5.1. Market Size & Forecast
  • 5.1.1. By Value
• 5.2. Market Share & Forecast
  • 5.2.1. By Type (Pin Headers, and Sockets)
  • 5.2.2. By Pin Headers (Stacked & Shrouded)
  • 5.2.3. By Pitch (Less Than 1 mm, 1 mm to 2mm, Greater Than 2 mm)
  • 5.2.4. By Application (Consumer Electronics, Industrial Automation)
  • 5.2.5. By Region
• 5.3. By Company (2022)
• 5.4. Market Map

6. North America Board-to-Board Connectors Market Outlook

• 6.1. Market Size & Forecast
  • 6.1.1. By Value
• 6.2. Market Share & Forecast
  • 6.2.1. By Type
  • 6.2.2. By Pin Headers
  • 6.2.3. By Pitch
  • 6.2.4. By Application
  • 6.2.5. By Country
• 6.3. North America: Country Analysis
  • 6.3.1. United States Board-to-Board Connectors Market Outlook
    • 6.3.1.1. Market Size & Forecast
      • 6.3.1.1.1. By Value
    • 6.3.1.2. Market Share & Forecast
      • 6.3.1.2.1. By Type
      • 6.3.1.2.2. By Pin Headers
      • 6.3.1.2.3. By Pitch
      • 6.3.1.2.4. By Application
  • 6.3.2. Canada Board-to-Board Connectors Market Outlook
    • 6.3.2.1. Market Size & Forecast
      • 6.3.2.1.1. By Value
    • 6.3.2.2. Market Share & Forecast
      • 6.3.2.2.1. By Type
      • 6.3.2.2.2. By Pin Headers
      • 6.3.2.2.3. By Pitch
      • 6.3.2.2.4. By Application
  • 6.3.3. Mexico Board-to-Board Connectors Market Outlook
    • 6.3.3.1. Market Size & Forecast
      • 6.3.3.1.1. By Value
    • 6.3.3.2. Market Share & Forecast
      • 6.3.3.2.1. By Type
      • 6.3.3.2.2. By Pin Headers
      • 6.3.3.2.3. By Pitch
      • 6.3.3.2.4. By Application

7. Asia-Pacific Board-to-Board Connectors Market Outlook

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
• 7.2. Market Share & Forecast
  • 7.2.1. By Type
  • 7.2.2. By Pin Headers
  • 7.2.3. By Pitch
  • 7.2.4. By Application
  • 7.2.5. By Country
• 7.3. Asia-Pacific: Country Analysis
  • 7.3.1. China Board-to-Board Connectors Market Outlook
    • 7.3.1.1. Market Size & Forecast
      • 7.3.1.1.1. By Value
    • 7.3.1.2. Market Share & Forecast
      • 7.3.1.2.1. By Type
      • 7.3.1.2.2. By Pin Headers
      • 7.3.1.2.3. By Pitch
      • 7.3.1.2.4. By Application
  • 7.3.2. India Board-to-Board Connectors Market Outlook
    • 7.3.2.1. Market Size & Forecast
      • 7.3.2.1.1. By Value
    • 7.3.2.2. Market Share & Forecast
      • 7.3.2.2.1. By Type
      • 7.3.2.2.2. By Pin Headers
      • 7.3.2.2.3. By Pitch
      • 7.3.2.2.4. By Application
  • 7.3.3. Japan Board-to-Board Connectors Market Outlook
    • 7.3.3.1. Market Size & Forecast
      • 7.3.3.1.1. By Value
    • 7.3.3.2. Market Share & Forecast
      • 7.3.3.2.1. By Type
      • 7.3.3.2.2. By Pin Headers
      • 7.3.3.2.3. By Pitch
      • 7.3.3.2.4. By Application
  • 7.3.4. South Korea Board-to-Board Connectors Market Outlook
    • 7.3.4.1. Market Size & Forecast
      • 7.3.4.1.1. By Value
    • 7.3.4.2. Market Share & Forecast
      • 7.3.4.2.1. By Type
      • 7.3.4.2.2. By Pin Headers
      • 7.3.4.2.3. By Pitch
      • 7.3.4.2.4. By Application
  • 7.3.5. Australia Board-to-Board Connectors Market Outlook
    • 7.3.5.1. Market Size & Forecast
      • 7.3.5.1.1. By Value
    • 7.3.5.2. Market Share & Forecast
      • 7.3.5.2.1. By Type
      • 7.3.5.2.2. By Pin Headers
      • 7.3.5.2.3. By Pitch
      • 7.3.5.2.4. By Application

8. Europe Board-to-Board Connectors Market Outlook

• 8.1. Market Size & Forecast
  • 8.1.1. By Value
• 8.2. Market Share & Forecast
  • 8.2.1. By Type
  • 8.2.2. By Pin Headers
  • 8.2.3. By Pitch
  • 8.2.4. By Application
  • 8.2.5. By Country
• 8.3. Europe: Country Analysis
  • 8.3.1. Germany Board-to-Board Connectors Market Outlook
    • 8.3.1.1. Market Size & Forecast
      • 8.3.1.1.1. By Value
    • 8.3.1.2. Market Share & Forecast
      • 8.3.1.2.1. By Type
      • 8.3.1.2.2. By Pin Headers
      • 8.3.1.2.3. By Pitch
      • 8.3.1.2.4. By Application
  • 8.3.2. United Kingdom Board-to-Board Connectors Market Outlook
    • 8.3.2.1. Market Size & Forecast
      • 8.3.2.1.1. By Value
    • 8.3.2.2. Market Share & Forecast
      • 8.3.2.2.1. By Type
      • 8.3.2.2.2. By Pin Headers
      • 8.3.2.2.3. By Pitch
      • 8.3.2.2.4. By Application
  • 8.3.3. France Board-to-Board Connectors Market Outlook
    • 8.3.3.1. Market Size & Forecast
      • 8.3.3.1.1. By Value
    • 8.3.3.2. Market Share & Forecast
      • 8.3.3.2.1. By Type
      • 8.3.3.2.2. By Pin Headers
      • 8.3.3.2.3. By Pitch
      • 8.3.3.2.4. By Application
  • 8.3.4. Italy Board-to-Board Connectors Market Outlook
    • 8.3.4.1. Market Size & Forecast
      • 8.3.4.1.1. By Value
    • 8.3.4.2. Market Share & Forecast
      • 8.3.4.2.1. By Type
      • 8.3.4.2.2. By Pin Headers
      • 8.3.4.2.3. By Pitch
      • 8.3.4.2.4. By Application
  • 8.3.5. Spain Board-to-Board Connectors Market Outlook
    • 8.3.5.1. Market Size & Forecast
      • 8.3.5.1.1. By Value
    • 8.3.5.2. Market Share & Forecast
      • 8.3.5.2.1. By Type
      • 8.3.5.2.2. By Pin Headers
      • 8.3.5.2.3. By Pitch
      • 8.3.5.2.4. By Application

9. South America Board-to-Board Connectors Market Outlook

• 9.1. Market Size & Forecast
  • 9.1.1. By Value
• 9.2. Market Share & Forecast
  • 9.2.1. By Type
  • 9.2.2. By Pin Headers
  • 9.2.3. By Pitch
  • 9.2.4. By Application
  • 9.2.5. By Country
• 9.3. South America: Country Analysis
  • 9.3.1. Brazil Board-to-Board Connectors Market Outlook
    • 9.3.1.1. Market Size & Forecast
      • 9.3.1.1.1. By Value
    • 9.3.1.2. Market Share & Forecast
      • 9.3.1.2.1. By Type
      • 9.3.1.2.2. By Pin Headers
      • 9.3.1.2.3. By Pitch
      • 9.3.1.2.4. By Application
  • 9.3.2. Argentina Board-to-Board Connectors Market Outlook
    • 9.3.2.1. Market Size & Forecast
      • 9.3.2.1.1. By Value
    • 9.3.2.2. Market Share & Forecast
      • 9.3.2.2.1. By Type
      • 9.3.2.2.2. By Pin Headers
      • 9.3.2.2.3. By Pitch
      • 9.3.2.2.4. By Application
  • 9.3.3. Colombia Board-to-Board Connectors Market Outlook
    • 9.3.3.1. Market Size & Forecast
      • 9.3.3.1.1. By Value
    • 9.3.3.2. Market Share & Forecast
      • 9.3.3.2.1. By Type
      • 9.3.3.2.2. By Pin Headers
      • 9.3.3.2.3. By Pitch
      • 9.3.3.2.4. By Application

10. Middle East & Africa Board-to-Board Connectors Market Outlook

• 10.1. Market Size & Forecast
  • 10.1.1. By Value
• 10.2. Market Share & Forecast
  • 10.2.1. By Component
  • 10.2.2. By Application
  • 10.2.3. By End User
  • 10.2.4. By Country
• 10.3. Middle East & Africa: Country Analysis
  • 10.3.1. Saudi Arabia Board-to-Board Connectors Market Outlook
    • 10.3.1.1. Market Size & Forecast
      • 10.3.1.1.1. By Value
    • 10.3.1.2. Market Share & Forecast
      • 10.3.1.2.1. By Type
      • 10.3.1.2.2. By Pin Headers
      • 10.3.1.2.3. By Pitch
      • 10.3.1.2.4. By Application
  • 10.3.2. South Africa Board-to-Board Connectors Market Outlook
    • 10.3.2.1. Market Size & Forecast
      • 10.3.2.1.1. By Value
    • 10.3.2.2. Market Share & Forecast
      • 10.3.2.2.1. By Type
      • 10.3.2.2.2. By Pin Headers
      • 10.3.2.2.3. By Pitch
      • 10.3.2.2.4. By Application
  • 10.3.3. UAE Board-to-Board Connectors Market Outlook
    • 10.3.3.1. Market Size & Forecast
      • 10.3.3.1.1. By Value
    • 10.3.3.2. Market Share & Forecast
      • 10.3.3.2.1. By Type
      • 10.3.3.2.2. By Pin Headers
      • 10.3.3.2.3. By Pitch
      • 10.3.3.2.4. By Application

11. Market Dynamics

• 11.1. Drivers
• 11.2. Challenge

12. Market Trends & Developments

13. Company Profiles

• 13.1. ANSYS, Inc
  • 13.1.1. Business Overview
  • 13.1.2. Key Revenue and Financials
  • 13.1.3. Recent Developments
  • 13.1.4. Key Personnel
  • 13.1.5. Key Product/Services
• 13.2. AMPHENOL
  • 13.2.1. Business Overview
  • 13.2.2. Key Revenue and Financials
  • 13.2.3. Recent Developments
  • 13.2.4. Key Personnel
  • 13.2.5. Key Product/Services
• 13.3. Molex
  • 13.3.1. Business Overview
  • 13.3.2. Key Revenue and Financials
  • 13.3.3. Recent Developments
  • 13.3.4. Key Personnel
  • 13.3.5. Key Product/Services
• 13.4. Foxconn
  • 13.4.1. Business Overview
  • 13.4.2. Key Revenue and Financials
  • 13.4.3. Recent Developments
  • 13.4.4. Key Personnel
  • 13.4.5. Key Product/Services
• 13.5. JAE
• 13.6. DELPHI
  • 13.6.1. Business Overview
  • 13.6.2. Key Revenue and Financials
  • 13.6.3. Recent Developments
  • 13.6.4. Key Personnel
  • 13.6.5. Key Product/Services
• 13.7. Samtec
  • 13.7.1. Business Overview
  • 13.7.2. Key Revenue and Financials
  • 13.7.3. Recent Developments
  • 13.7.4. Key Personnel
  • 13.7.5. Key Product/Services
• 13.8. JST
  • 13.8.1. Business Overview
  • 13.8.2. Key Revenue and Financials
  • 13.8.3. Recent Developments
  • 13.8.4. Key Personnel
  • 13.8.5. Key Product/Services
• 13.9. Hirose.
  • 13.9.1. Business Overview
  • 13.9.2. Key Revenue and Financials
  • 13.9.3. Recent Developments
  • 13.9.4. Key Personnel
  • 13.9.5. Key Product/Services
• 13.10. HARTING
  • 13.10.1. Business Overview
  • 13.10.2. Key Revenue and Financials
  • 13.10.3. Recent Developments
  • 13.10.4. Key Personnel
  • 13.10.5. Key Product/Services

14. Strategic Recommendations

15. About Us & Disclaimer