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表紙：ALD/High-K金属前駆体の世界市場の分析 (2023～2024年)
市場調査レポート
商品コード
1413683

ALD/High-K金属前駆体の世界市場の分析 (2023～2024年)

ALD / High K Metal Precursors Market Report (a Critical Materials Report) 2023-2024
出版日: | 発行: TECHCET | ページ情報: 英文 276 Pages | 納期: 即日から翌営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.65円
ALD/High-K金属前駆体の世界市場の分析 (2023～2024年)
出版日: 2023年11月17日
発行: TECHCET
ページ情報: 英文 276 Pages
納期: 即日から翌営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

当レポートでは、世界の無機ガスと液体CVD/ALD前駆体 (金属、金属酸化物、high-k、誘電体、SOD材料) に関する市場・技術動向について分析しております。過去20年間、半導体産業に特化したALDとCVD前駆体に関する多くの調査論文と特許が発表されてきました。当レポートでは、新しい前駆体の開発経路とロードマップ、そしてこれらの材料が大量生産 (HVM) に投入される際の現在のEHS (環境・健康・安全) および規制上の障壁についても考察しております。あらゆる種類の前駆体に関する予測が提供され、特にhigi-K、金属電極、相互接続メタライゼーション、犠牲層、low-k誘電体、ハードマスク、マンドレル、エッチストップ層を含む最先端の前工程絶縁・導電材料に焦点が当てられています。これらのプロセス分野は、最先端ロジック (45nm以下、28nm～10/7nmノード、将来の5nm・3nmノード)、先進DRAMおよび3DNAND揮発性・不揮発性メモリに関連する高い成長の可能性があるため、注目されています。

ALD/High-K市場の最新情報と分析：概要 - 注目のプレスリリース：

目次

第1章 エグゼクティブサマリー

第2章 調査範囲・目的・手法

第3章 半導体産業市場の現状と展望

  • 世界経済
    • 半導体産業と世界経済の連動
    • 半導体の販売増加率
    • 台湾の月次販売動向
    • 2023年の不確実性の高さ - 半導体の収益成長は、鈍化からマイナスになる見通し
  • チップの販売動向：電子機器セグメント別
    • スマートフォン
    • PCユニットの出荷台数
    • サーバー/IT市場
  • 半導体製造の成長と拡大
    • ファウンドリの拡張発表：概要
    • 世界各国でのファウンドリ拡張による成長促進
    • 設備支出の動向
    • 技術ロードマップ
    • ファウンドリ投資の評価
  • 政策と貿易の動向と影響
  • 半導体材料の概要
    • 材料の生産能力によってチップの生産スケジュールが制限される可能性
    • 物流問題の軽減
    • ウエハー市場の動向予測 (2027年まで)
    • 材料市場の予測

第4章 前駆体市場の動向

  • 市場動向
    • 市場動向：ウエハー投入枚数
    • 市場動向：ウエハー投入枚数 (ロジック)
    • 市場動向：ウエハー投入枚数 (DRAM)
    • 市場動向：ウエハー投入枚数 (NAND)
  • 供給能力と需要・投資
    • WF6の需要促進要因
    • WF6の市場需要
    • WF6の市場需要：MO ALD IP申請
    • WF6の市場需要
  • 供給能力と需要、投資
    • 供給能力と需要・投資：ハフニウム・ジルコニウム
  • 金属前駆体：地域別の傾向
    • 地域別の傾向：金属前駆体
    • 市場の動向と促進要因：地域別
  • CVD・ALD装置市場
    • WFE予測：すべての種類
    • WFE予測：積層、エッチング・クリーン、リソグラフィー、計測など
  • 技術促進要因／材料の変更と移行：デバイスの種類別
    • 過去10年間の一般的傾向：PVD・LPCVDからPECVD・ALDへ
    • 高度ロジックノードHVMの推定
    • DRAMノードHVMの推定
    • 3D NANDノードHVMの推定
    • デバイスセグメント別の機会：概要
  • 半導体プロセスと材料の動向
    • デバイスの種類別のエッチングプロセス：原子層エッチングエール
    • 領域選択的蒸着
    • 誘導自己組織化 (DSA) とEUV
    • 直接自己組織化 (DSA) とEUV
    • 2D TDM (遷移金属ジカルコゲニド)
    • EUV用ドライレジスト
    • EUVレジスト用下層
    • その他の用途：光学
  • EHSと物流の問題：ジルコニウム・ハフニウム
    • EHSと物流の問題：ジルコニウム・ハフニウム
    • EHSと物流の問題：チタン
    • EHSと物流の問題：タングステン
    • EHSと物流の問題：タングステン
    • EHSと物流の問題：コバルト
    • EHSと物流の問題：ルテニウム
    • 半導体製造からの温室効果ガス
    • EUVとエネルギー
    • 原子層堆積 (ALD) プロセスの環境への影響と、それを低減するための経路の評価
  • 標準パッケージ/バルブタイプの変更
  • 市場評価

第5章 市場の統計と予測：セグメント別

  • 前駆体市場の実績と予測 (5年間分)
    • CVD/ALD金属およびhigh-K前駆体の収益 (2021～2027年)
    • 需給予測：WF6 (2023年まで)
    • 市場評価：金属とhigh-k
  • 企業合併・買収 (M&A) 活動
    • M&A活動 - MERCK & MECARO
  • 新規工場
  • サプライヤーの工場閉鎖 - 報告なし
  • 新規参入企業 - DRY RESIST CONSORTIUM
  • 価格動向
    • 価格傾向：ハフニウム

第6章 下層の材料サプライチェーン

  • 下層のサプライチェーン：概要
    • 下層サプライチェーン：混乱と中国
  • ロジスティクス
  • 下層のサプライチェーンの新規参入企業 - 報告なし
  • 下層のサプライチェーン工場の最新情報 (新規) - 報告なし
  • 下層のサプライチェーン：TechCETのアナリストの評価

第7章 サプライヤーのプロファイル

  • ADEKA CORPORATION
  • AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
  • AZMAX CO., LTD.
  • CITY CHEMICAL LLC
  • DNF CO., LTD.
  • その他20社以上
図表

LIST OF FIGURES

  • FIGURE 1: METAL PRECURSORS MARKET SHARES 2022
  • FIGURE 2: TOTAL PRECURSOR MARKETS REGIONAL 2022
  • FIGURE 3: TOTAL PRECURSOR MARKET, M USD
  • FIGURE 4: CVD/ALD METAL & HIGH-K PRECURSORS 2021 TO 2027
  • FIGURE 5: WF6 SUPPLY VS. DEMAND THROUGH 2027
  • FIGURE 6: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
  • FIGURE 7: GLOBAL ECONOMY AND THE ELECTRONICS SUPPLY CHAIN (2022)
  • FIGURE 8: WORLDWIDE SEMICONDUCTOR SALES
  • FIGURE 9: TECHCET'S TAIWAN SEMICONDUCTOR INDUSTRY I NDEX (TTSI)*
  • FIGURE 10: 2023 SEMICONDUCTOR INDUSTRY REVENUE GROWTH FORECASTS
  • FIGURE 11: 2022 SEMICONDUCTOR CHIP APPLICATIONS
  • FIGURE 12: MOBILE PHONE SHIPMENTS WW ESTIMATES
  • FIGURE 13: WORLDWIDE PC AND TABLET FORECAST
  • FIGURE 14: ELECTRIFICATION TREND BY WORLD REGION
  • FIGURE 15: SEMICONDUCTOR AUTOMOTIVE PRODUCTION
  • FIGURE 16: TSMC PHOENIX INVESTMENT ESTIMATED WILL BE US $40 B
  • FIGURE 17: CHIP EXPANSIONS 2022-2027 US$366 B
  • FIGURE 18: SEMICONDUCTOR CHIP MANUFACTURING REGIONS OF THE WORLD
  • FIGURE 19: GLOBAL TOTAL EQUIPMENT SPENDING BY SEGMENT (US$ B)
  • FIGURE 20: OVERVIEW OF ADVANCED LOGIC DEVICE TECHNOLOGY ROADMAP
  • FIGURE 21: INTEL OHIO PLANT SITE FEB. 2023 AND ARTIST RENDERING (ON BOTTOM)
  • FIGURE 22: EUROPE CHIP EXPANSION UPSIDE
  • FIGURE 23: PORT OF LA
  • FIGURE 24: TECHCET WAFER START FORECAST BY NODE SEGMENTS**
  • FIGURE 25: GLOBAL SEMICONDUCTOR MATERIALS OUTLOOK
  • FIGURE 26: FORECASTS--WAFER STARTS 2021 TO 2027
  • FIGURE 27: FORECASTS--WAFER STARTS LOGIC 300 MM
  • FIGURE 28: FORECASTS--WAFER STARTS DRAM 300 MM
  • FIGURE 29: FORECASTS--WAFER STARTS NAND 300 MM
  • FIGURE 30: 3DNAND MARKET SHARE 2022
  • FIGURE 31: 3DNAND STRUCTURE
  • FIGURE 32: MO PRECURSORS
  • FIGURE 33: PATENT FAMILIES FILED FOR MOLYBDENUM ALD IN THE MEMORY SPACE
  • FIGURE 34: WAFER START FORECAST SHOWING TWO TIMING SCENARIOS WHERE MO COULD BE INTRODUCED
  • FIGURE 35: ZIRCONIUM METAL DEMAND 2021 1.6 MILLION TONNES
  • FIGURE 36: HAFNIUM METAL DEMAND 2021 78 TONNES
  • FIGURE 37: METAL PRECURSORS MARKET SHARES 2022
  • FIGURE 38: CVD AND ALD TOTAL EQUIPMENT MARKET 2022 USD 17-18 BILLION
  • FIGURE 39: SEMI 2022 SEMICONDUCTOR EQUIPMENT FORECAST
  • FIGURE 40: 2022 TECHINSIGHTS WFE SPENDING (TOP) AND 2022 GARTNER WFE SPENDING PER NODE (BOTTOM)
  • FIGURE 41: 3D DEVICE ARCHITECTURES
  • FIGURE 42: LOGIC TECHNOLOGY NODE ROADMAP FOR LEADING IDMS
  • FIGURE 43: SAMSUNG START 3 NM PILOT RAMP USING GAA-FET TECHNOLOGY JUNE 2022
  • FIGURE 44: IMEC 2022 LOGIC ROADMAP
  • FIGURE 45: SCALING AND LITHOGRAPHY TRENDS--A HIGH COST IN CAPITAL EXPENDITURE, ENERGY AND EMISSIONS
  • FIGURE 46: APPLIED MATERIALS CENTURA PATTERN SHAPING CLUSTER
  • FIGURE 47: DRAM TECHNOLOGY ROADMAP FOR LEADING IDMS
  • FIGURE 48: IP FILING IN THE FIELD OF 3DRAM IS ACCELERATING
  • FIGURE 49: NAND TECHNOLOGY ROADMAP FOR LEADING IDMS
  • FIGURE 50: PATHWAYS FOR CONTINUED 3D NAND SCALING
  • FIGURE 51: 3DNAND STACK TRENDS FROM <100L TO 4 STACKS
  • FIGURE 52: MEMORY STACK CHALLENGES FOR V-NAND
  • FIGURE 53A: FINFET TO GAA TRANSISTOR DIAGRAMS SHOWING SELECTIVE ETCHING IS NEEDED TO ADDRESS DEVICE COMPLEXITY
  • FIGURE 53B: ALE PROCESS CYCLE
  • FIGURE 54: PERIOD TABLE INDICATING CANDIDATES FOR ALE (ISOTROPIC ETCHING)
  • FIGURE 55: APPLICATION OF ALE (ISOTROPIC ETCH)
  • FIGURE 56: ALD AND ALE COMBO PROCESS
  • FIGURE 57: PLASMA AND THERMAL ALE PROCESSES
  • FIGURE 58: LAM ALE PROCESS
  • FIGURE 59: ALD / ALE PROCESS ROADMAP
  • FIGURE 60: ALE PATENT ACTIVITY BY COMPANY THROUGH 2022
  • FIGURE 61: AREA SELECTIVE SIN DEPOSITION BY ALD (AVS ASD2022)
  • FIGURE 62: DSA AND EUS PROCESSES
  • FIGURE 63: RESIST RECTIFICATION WITH DSA
  • FIGURE 64: TEM AND ARTIST RENDERING OF MONOLAYER CHANNEL FORMATION
  • FIGURE 65: EUV LITHOGRAPHY ENABLING GATE STRUCTURES AND PITCH SCALING
  • FIGURE 66: DRY RESIST FOR EUV SEM IMAGE
  • FIGURE 67: SPIN ON CARBON (SOC) DIELECTRIC FOR EUV METAL OXIDE RESISTS PATTERNS AFTER LITHO
  • FIGURE 68: UNDERLAYER (DIELECTRIC) HARDMASKS TRENDS FOR NIGH NA EUV
  • FIGURE 69: SPIN ON PRIMER (SOC) VS. HMDS PRIMER
  • FIGURE 70: Y2O3 ALD VS. SPRAY COATINGS
  • FIGURE 71: GREENHOUSE GAS CONTRIBUTIONS OF CHIP FAB MATERIALS AND EQUIPMENT
  • FIGURE 72: ENVIRONMENTAL IMPACT (GWP) OF VARIOUS PROCESSES AND GASES
  • FIGURE 73: CO2EQ OUTPUT FROM ETCH GASES (SOURCE: IMEC)
  • FIGURE 74: TOTAL EMISSIONS AND ENERGY USE PROJECTION PER LOGIC NODE
  • FIGURE 75: ENVIRONMENTAL IMPACT OF ALD
  • FIGURE 76: SEGMENTATION OF THE AMPOULE FLEET 2020
  • FIGURE 77: TOTAL PRECURSOR MARKET, M USD
  • FIGURE 78: CVD/ALD METAL & HIGH-K PRECURSORS 2021 TO 2027
  • FIGURE 79: WF6 SUPPLY VS. DEMAND THROUGH 2027
  • FIGURE 80: WHAT IS EUV DRY RESIST?
  • FIGURE 81: HAFNIUM METAL SPOT PRICING
  • FIGURE 82: TYPICAL NON-HALIDE LIGANDS USED FOR ALD PRECURSORS
  • FIGURE 83: EXAMPLES OF PRECURSORS SUPPLIED BY SHIP
  • FIGURE 84: OCEAN CONTAINER PRICE INDEX-JULY '20 TO MARCH '23

LIST OF TABLES

  • TABLE 1: DIELECTRIC PRECURSOR REVENUES BY REGION (US$ M)
  • TABLE 2: TOTAL PRECURSOR MARKETS BY REGION (US$ M)
  • TABLE 3: 2017 TO 2027 5-YEAR CAGRS
  • TABLE 4: GLOBAL GDP AND SEMICONDUCTOR REVENUES*
  • TABLE 5: IMF ECONOMIC OUTLOOK*
  • TABLE 6: DATA CENTER SYSTEMS AND COMMUNICATION SERVICES MARKET SPENDING 2022
  • TABLE 7: PRECURSOR USAGE OF LEADING IDMS
  • TABLE 8: DIELECTRIC PRECURSOR MARKET SIZE BY REGION
  • TABLE 9: TOTAL PRECURSOR MARKET SIZE BY REGION
  • TABLE 10: REGIONAL PRECURSOR MARKETS
  • TABLE 12: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR LOGIC DEVICES
  • TABLE 13: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR DRAM
  • TABLE 14: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL FOR 3DNAND
  • TABLE 15: GAS TRENDS AND OPPORTUNITIES BY DEVICE TYPE
  • TABLE 16: OVERVIEW OF DEPOSITION PROCESSES BY DEVICE TYPE AND MATERIAL
  • TABLE 17: PRECURSOR 5-YEAR CAGR COMPARISON
  • TABLE 18: ZIRCONIUM MINING PRODUCTION AND RESERVES
  • TABLE 19: WORLDWIDE TUNGSTEN PRODUCTION AND RESERVES
  • TABLE 20: ZIRCONIUM MINING
目次

This report provides market and technical trend information on inorganic gases and liquid CVD/ALD precursors (metal, metal oxide, high K, dielectric and SOD materials). For the last 20 years, there have been many research papers and patents published regarding ALD and CVD precursors specifically for the semiconductor industry. This report includes detail on the development path and roadmaps for new precursors and any current EHS and regulatory hurdles for these materials to enter into high volume manufacturing (HVM). Forecasts are provided on precursors of all types, with a focus is on the leading-edge front end of the line insulating and conductive materials, including high K, metal electrode, interconnect metallization, sacrificial layers, low-k dielectrics, hard masks, mandrel, and etch stop layers. These process areas are of interest because of the high growth potential associated with leading-edge logic <45 nm, 28 nm to 10/7 nm nodes, and the future 5 & 3 nm nodes, as well as advanced DRAM and 3DNAND volatile and non-volatile memories.

This report comes with 3 Quarterly Updates featuring updated market information and forecasting from the report analyst.

Table of Contents

1. Executive Summary

  • 1.1. REGIONAL TRENDS-METAL PRECURSORS
  • 1.2. REGIONAL TRENDS-TOTAL PRECURSOR MARKET
  • 1.3. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
  • 1.4. CVD/ALD METAL & HIGH-K PRECURSOR REVENUE 2021 TO 2027
  • 1.5. ASSESSMENT-METAL & HIGH-K
  • 1.6. SUPPLY-DEMAND FORECAST-WF6 (UNTIL 2023)
  • 1.7. CVD AND ALD EQUIPMENT MARKET
  • 1.8. ANALYST ASSESSMENT-HI K & METAL PRECURSORS
    • 1.8.2. ANALYST ASSESSMENT

2. Scope, Purpose, and Methodology

  • 2.1. SCOPE
  • 2.2. PURPOSE
  • 2.3. METHODOLOGY
  • 2.4. OVERVIEW OF OTHER TECHCET CMR™ REPORTS

3. Semiconductor Industry Market Status & Outlook

  • 3.1. WORLDWIDE ECONOMY
    • 3.1.1. SEMICONDUCTOR INDUSTRIES TIES TO THE GLOBAL ECONOMY
    • 3.1.2. SEMICONDUCTOR SALES GROWTH
    • 3.1.3. TAIWAN MONTHLY SALES TRENDS
    • 3.1.4. UNCERTAINTY ABOUNDS ESPECIALLY FOR 2023 -SLOWER TO NEGATIVE SEMICONDUCTOR REVENUE GROWTH EXPECTED
  • 3.2. CHIPS SALES BY ELECTRONIC GOODS SEGMENT
    • 3.2.1. SMARTPHONES
    • 3.2.2. PC UNIT SHIPMENTS
    • 3.2.3. SERVERS / IT MARKET
  • 3.3. SEMICONDUCTOR FABRICATION GROWTH & EXPANSION
    • 3.3.1. FAB EXPANSION ANNOUNCEMENT SUMMARY
    • 3.3.2. WW FAB EXPANSION DRIVING GROWTH
    • 3.3.3. EQUIPMENT SPENDING TRENDS
    • 3.3.4. TECHNOLOGY ROADMAPS
    • 3.3.5. FAB INVESTMENT ASSESSMENT
  • 3.4. POLICY & TRADE TRENDS AND IMPACT
  • 3.5. SEMICONDUCTOR MATERIALS OVERVIEW
    • 3.5.1. COULD MATERIALS CAPACITY LIMIT CHIP PRODUCTION SCHEDULES?
    • 3.5.2. LOGISTICS ISSUES EASED DOWN
    • 3.5.3. TECHCET WAFER STARTS FORECAST THROUGH 2027
    • 3.5.4. TECHCET'S MATERIAL FORECAST

4. Precursor Market Trends

  • 4.1. MARKET TRENDS
    • 4.1.1. MARKET TRENDS-WAFER STARTS
    • 4.1.2. MARKET TRENDS-WAFER STARTS LOGIC
    • 4.1.3. MARKET TRENDS-WAFER STARTS DRAM
    • 4.1.4. MARKET TRENDS-WAFER STARTS NAND
  • 4.2. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
    • 4.2.1. WF6 DEMAND DRIVERS
    • 4.2.2. WF6 MARKET DEMAND
    • 4.2.4. WF6 MARKET DEMAND-MO ALD IP FILING
    • 4.2.5. WF6 MARKET DEMAND
  • 4.3. SUPPLY CAPACITY AND DEMAND, INVESTMENTS
    • 4.3.1. SUPPLY CAPACITY AND DEMAND, INVESTMENTS: HAFNIUM
  • & ZIRCONIUM
  • 4.4. REGIONAL TRENDS-METAL PRECURSORS
    • 4.4.1. REGIONAL TRENDS-METAL PRECURSORS
    • 4.4.2. REGIONAL TRENDS AND DRIVERS
  • 4.5. CVD AND ALD EQUIPMENT MARKET
    • 4.5.1. WFE FORECAST: ALL TYPES
    • 4.5.2. WFE FORECAST: DEPOSITION, ETCH & CLEAN, LITHOGRAPHY, METROLOGY ETC.
  • 4.6. TECHNICAL DRIVERS /MATERIAL CHANGES AND TRANSITIONS BY DEVICE TYPE
    • 4.6.1. GENERAL TREND LAST DECADE GOING FROM PVD & LPCVD TO PECVD & ALD
    • 4.6.2. ADVANCED LOGIC NODE HVM ESTIMATE
    • 4.6.3. DRAM NODE HVM ESTIMATE
    • 4.6.4. 3D NAND NODE HVM ESTIMATE
    • 4.6.5. SUMMARY OF OPPORTUNITIES BY DEVICE SEGMENT
  • 4.7. SEMICONDUCTOR PROCESS & MATERIALS TRENDS
    • 4.7.1. ETCH PROCESS BY DEVICE TYPE-ATOMIC LAYER ETCHING ALE
    • 4.7.2. AREA SELECTIVE DEPOSITION
    • 4.7.3. DIRECTED SELF ASSEMBLY (DSA) AND EUV
    • 4.7.4. DIRECT SELF ASSEMBLY (DSA) AND EUV
    • 4.7.5. 2D TRANSITION METAL DICHALCOGENIDES (TMD)
    • 4.7.6. DRY RESIST FOR EUV
    • 4.7.7. UNDERLAYERS FOR EUV RESIST
    • 4.7.8. OTHER APPLICATIONS-CHAMBER COATINGS BY ALD (Y2O3)
    • 4.7.9. OTHER APPLICATIONS-OPTICS
  • 4.8. EHS AND LOGISTIC ISSUES-ZIRCONIUM AND HAFNIUM
    • 4.8.1. EHS AND LOGISTIC ISSUES-ZIRCONIUM AND HAFNIUM
    • 4.8.2. EHS AND LOGISTIC ISSUES-TITANIUM
    • 4.8.3. EHS AND LOGISTIC ISSUES-TUNGSTEN
    • 4.8.4. EHS AND LOGISTIC ISSUES-TUNGSTEN
    • 4.8.5. EHS AND LOGISTIC ISSUES-COBALT
    • 4.8.6. EHS AND LOGISTIC ISSUES-RUTHENIUM
    • 4.8.7. GREEN HOUSE GASES FROM SEMICONDUCTOR PRODUCTION
    • 4.8.8. EUV AND ENERGY
    • 4.8.9. ASSESSING THE ENVIRONMENTAL IMPACT OF ATOMIC LAYER DEPOSITION (ALD) PROCESSES AND PATHWAYS TO LOWER IT
  • 4.9. CHANGES IN STANDARD PACKAGING/VALVE TYPES
  • 4.10. MARKET ASSESSMENT

5. Segment Market Statistics & Forecasts

  • 5.1. PRECURSOR MARKET-HISTORICAL AND 5-YEAR FORECAST
    • 5.1.1. CVD/ALD METAL & HIGH-K PRECURSOR REVENUE 2021 TO 2027
    • 5.1.2. SUPPLY-DEMAND FORECAST-WF6 (UNTIL 2023)
    • 5.1.3. ASSESSMENT-METAL & HIGH-K
  • 5.2. M&A ACTIVITIES
    • 5.2.1. M&A ACTIVITIES-MERCK & MECARO
  • 5.3. NEW PLANTS
    • 5.3.1. NEW PLANTS
    • 5.3.2. NEW PLANTS
    • 5.3.3. NEW PLANTS
    • 5.3.4. NEW PLANTS
  • 5.4. SUPPLIER PLANT CLOSURES-NONE REPORTED
  • 5.5. NEW ENTRANTS-DRY RESIST CONSORTIUM
  • 5.6. PRICING TRENDS
    • 5.6.1. PRICING TRENDS-HAFNIUM

6. Sub Tier Material Supply Chain

  • 6.1. SUB-TIER SUPPLY-CHAIN: INTRODUCTION
    • 6.1.1. SUB-TIER SUPPLY-CHAIN: DISRUPTIONS & CHINA
  • 6.2. LOGISTICS
  • 6.3. SUB-TIER SUPPLY-CHAIN "NEW" ENTRANTS-NONE REPORTED
  • 6.4. SUB-TIER SUPPLY-CHAIN PLANTS UPDATES-NEW-NONE REPORTED
  • 6.5. SUB-TIER SUPPLY-CHAIN TECHCET ANALYST ASSESSMENT

7. Supplier profiles

  • ADEKA CORPORATION
  • AIR LIQUIDE (MAKER, PURIFIER, SUPPLIER)
  • AZMAX CO., LTD.
  • CITY CHEMICAL LLC
  • DNF CO., LTD.
  • ...and 20+ more