有機基板パッケージ材料の世界市場レポート 2025年

有機基板パッケージ材料の市場規模は、今後数年間で力強い成長が見込まれます。2029年にはCAGR（複合年間成長率）6.2％で199億米ドルに成長します。予測期間の成長は、電気自動車市場の成長、循環型経済への取り組み、厳しい環境規制、家電動向の高まり、サプライチェーンの回復力に起因しています。予測期間の主な動向には、パッケージングにおけるナノテクノロジーの統合、ヘルスケアにおけるアプリケーションの拡大、材料組成の革新、高性能でコスト効率の高いソリューションの需要、次世代技術が含まれます。

自動運転車の普及が今後の有機基板パッケージ材料市場の成長を牽引すると予想されます。自律走行車としても知られる自動運転車は、環境を感知し、人間の介入なしに運転することができます。これらの自動車は、取得したデータの処理とセンシングに半導体を利用しています。半導体の需要が高まるにつれて、半導体のパッケージングに対するニーズも高まり、ひいては有機基板のパッケージング材料に対する需要も高まると思われます。例えば、2022年12月、米国の非営利団体である全米保険委員会は、2025年までに350万台、2030年までに450万台の自律走行車が米国の道路を走ると予測しました。このように、自動運転車の普及が有機基板パッケージ材料市場の成長を後押ししています。

半導体の使用増加が、今後数年間の有機基板パッケージ材料市場の成長を促進すると予想されます。半導体は、導体（金属など）と絶縁体（非金属など）の中間に位置する導電性を持つ材料です。電子機器に不可欠な部品であり、さまざまな電子機器の製造に重要な役割を果たしています。有機基板パッケージ材料は、半導体産業、特に集積回路（IC）のパッケージングとアセンブリにおいて不可欠です。これらの材料は、電気絶縁と機械的支持を提供しながら、半導体デバイスを取り付け、接続するための構造基盤を提供します。有機基板パッケージ材料は、半導体の信頼性、熱性能、全体的な機能性を向上させる。小型で高性能な電子機器への需要が高まるにつれ、半導体業界では、半導体部品の小型化と効率的な統合を促進するために、先進の有機基板パッケージ材料への依存度が高まっています。例えば2022年2月、米国の業界団体である半導体産業協会（SIA）は、2022年の半導体売上高が5,741億米ドルに達し、2021年の5,559億米ドルから3.3%増加したと報告しました。したがって、半導体の用途の増加が有機基板パッケージ材料市場を牽引しています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場：金利、インフレ、地政学、コロナ禍、回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

• 世界の有機基板パッケージ材料PESTEL分析（政治、社会、技術、環境、法的要因、促進要因、抑制要因）
• 最終用途産業の分析
• 世界の有機基板パッケージ材料市場：成長率分析
• 世界の有機基板パッケージ材料市場の実績：規模と成長, 2019-2024
• 世界の有機基板パッケージ材料市場の予測：規模と成長, 2024-2029, 2034F
• 世界の有機基板パッケージ材料総アドレス可能市場（TAM）

第6章 市場セグメンテーション

• 世界の有機基板パッケージ材料市場：技術別、実績と予測, 2019-2024, 2024-2029F, 2034F
• スモールアウトライン（SO）パッケージ
• グリッドアレイ（GA）パッケージ
• フラットノーリードパッケージ
• クアッドフラットパッケージ（QFP）
• デュアルインラインパッケージ（DIP）
• その他の技術
• 世界の有機基板パッケージ材料市場：用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
• コンシューマーエレクトロニクス
• 自動車
• 製造業
• ヘルスケア
• その他の用途
• 世界の有機基板パッケージ材料市場：最終用途別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 携帯電話
• FPD（フラットパネルディスプレイ）
• その他の用途
• 世界の有機基板パッケージ材料市場：スモールアウトライン（SO）パッケージのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 小型アウトライン集積回路（SOIC）
• スモールアウトライントランジスタ（SOT）
• 世界の有機基板パッケージ材料市場：グリッドアレイ（GA）パッケージのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• ボールグリッドアレイ（BGA）
• 列グリッド配列（CGA）
• 世界の有機基板パッケージ材料市場：フラットノーリードパッケージのサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 薄型鉛フリー（TPNL）パッケージ
• クアッドノーリード（QNL）パッケージ
• 世界の有機基板パッケージ材料市場：クアッドフラットパッケージ（QFP）のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 薄型クワッドフラットパッケージ（TQFP）
• ロープロファイルクアッドフラットパッケージ（LQFP）
• 世界の有機基板パッケージ材料市場：デュアルインラインパッケージ（DIP）のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 標準DIP
• デュアルインラインメモリモジュール（DIMM）
• 世界の有機基板パッケージ材料市場：その他の技術のサブセグメンテーション、タイプ別、実績と予測, 2019-2024, 2024-2029F, 2034F
• チップオンボード（COB）
• 組み込みウェハレベルボールグリッドアレイ（eWLB）

第7章 地域別・国別分析

• 世界の有機基板パッケージ材料市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 世界の有機基板パッケージ材料市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

• 有機基板パッケージ材料市場：競合情勢
• 有機基板パッケージ材料市場：企業プロファイル
  • Amkor Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
  • Advanced Semiconductor Engineering Inc. Overview, Products and Services, Strategy and Financial Analysis
  • Compass Technology Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Hitachi Chemical Company Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Mitsubishi Corporation Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

• STATS ChipPAC Pte Ltd.
• Shinko Electric Industries Co. Ltd.
• Showa Denko KK
• Kyocera Corporation
• WUS Printed Circuit Co. Ltd.
• Microchip Technology Inc.
• Texas Instruments Incorporated
• Unimicron Technology Corporation
• Ibiden Co. Ltd.
• AT&S Austria Technologie & Systemtechnik AG
• Samsung Electro-Mechanics Co. Ltd.
• Amcor PLC
• Fujikura Ltd.
• Nippon Mektron Ltd.
• Tripod Technology Corporation

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

• 有機基板パッケージ材料市場2029：新たな機会を提供する国
• 有機基板パッケージ材料市場2029：新たな機会を提供するセグメント
• 有機基板パッケージ材料市場2029：成長戦略
  • 市場動向に基づく戦略
  • 競合の戦略

第36章 付録

Organic substrate packaging material stands as a highly dependable and intricately designed element within semiconductor packaging, serving as a foundational layer in semiconductor construction.

The technology associated with organic substrate packaging material encompasses various package types like small outline (SO), grid array (GA), flat no-leads packages, quad flat packages (QFP), dual in-line packages (DIP), and others. For instance, a small outline package constitutes a surface-mounted component with pins positioned on both sides of its body. These technologies find applications across diverse sectors including consumer electronics, automotive, manufacturing, healthcare, and more, catering to end-uses such as mobile phones, flat panel displays (FPD), and various other applications.

The organic substrate packaging material market research report is one of a series of new reports from The Business Research Company that provides organic substrate packaging material market statistics, including organic substrate packaging material industry global market size, regional shares, competitors with organic substrate packaging material market share, detailed organic substrate packaging material market segments, market trends, and opportunities, and any further data you may need to thrive in the organic substrate packaging material industry. This organic substrate packaging material market research report delivers a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The organic substrate packaging material market size has grown strongly in recent years. It will grow from $14.9 billion in 2024 to $15.65 billion in 2025 at a compound annual growth rate (CAGR) of 5.0%. The growth in the historic period can be attributed to consumer electronics boom, environmental concerns, regulatory standards, market competition, global economic trends.

The organic substrate packaging material market size is expected to see strong growth in the next few years. It will grow to $19.9 billion in 2029 at a compound annual growth rate (CAGR) of 6.2%. The growth in the forecast period can be attributed to electric vehicle market growth, circular economy initiatives, stringent environmental regulations, rising consumer electronics trends, supply chain resilience. Major trends in the forecast period include integration of nanotechnology in packaging, expansion of applications in healthcare, innovation in material compositions, demand for high-performance and cost-effective solutions, next-gen technologies.

The growing adoption of self-driving vehicles is anticipated to drive the growth of the organic substrate packaging material market in the future. Self-driving vehicles, also known as autonomous cars, are capable of sensing their environment and operating without human intervention. These vehicles rely on semiconductors for processing and sensing the data they capture. As the demand for semiconductors rises, so will the need for their packaging, which in turn will boost the demand for organic substrate packaging materials. For example, in December 2022, the National Association of Insurance Commissioners, a US-based non-profit organization, projected that there would be 3.5 million autonomous vehicles on American roads by 2025 and 4.5 million by 2030. Thus, the increasing adoption of self-driving vehicles is fueling growth in the organic substrate packaging material market.

An increase in the use of semiconductors is expected to drive the growth of the organic substrate packaging material market in the coming years. Semiconductors are materials with electrical conductivity that falls between that of conductors (such as metals) and insulators (like non-metals). They are essential components in electronics and play a crucial role in the creation of various electronic devices. Organic substrate packaging materials are vital in the semiconductor industry, especially in the packaging and assembly of integrated circuits (ICs). These materials provide the structural foundation for mounting and connecting semiconductor devices while offering electrical insulation and mechanical support. Organic substrate packaging materials enhance the reliability, thermal performance, and overall functionality of semiconductors. As demand for compact and high-performance electronic devices rises, the semiconductor industry increasingly relies on advanced organic substrate packaging materials to facilitate the miniaturization and efficient integration of semiconductor components. For instance, in February 2022, the Semiconductor Industry Association (SIA), a US-based trade association, reported that semiconductor sales reached $574.1 billion in 2022, marking a 3.3% increase from $555.9 billion in 2021. Therefore, the rising use of semiconductors is driving the organic substrate packaging material market.

Major companies in the organic substrate packaging material sector are concentrating on developing innovative products, such as high-reliability coreless organic interposers, to enhance performance in advanced semiconductor applications, improve thermal and electrical conductivity, and support miniaturization trends in electronic devices while addressing the growing demand for sustainable packaging solutions. A high-reliability coreless organic interposer serves as a substrate in advanced electronic packaging, particularly for semiconductor devices. It is designed to facilitate connections between different components of an integrated circuit (IC) while providing enhanced performance and reliability. For example, in June 2024, TOPPAN Group, a Japan-based printing company, introduced a high-reliability coreless organic interposer. This innovation tackles the challenges related to the heterogeneous integration of semiconductors, which is essential for advancing next-generation semiconductor technologies. This development is particularly significant as industries increasingly seek more compact and efficient semiconductor solutions to power advanced technologies such as AI, IoT, and automotive applications.

Major companies in the organic substrate packaging material market are focusing on innovative solutions, such as biodegradable materials and eco-friendly laminations, to address the increasing demand for sustainable packaging options that improve product safety and promote environmental responsibility. The Ultra C vac-p flux cleaning tool is a vacuum-based technology designed to effectively eliminate flux residues from chip structures in fan-out panel-level packaging (FOPLP), ensuring optimal cleanliness for advanced semiconductor packaging processes. For example, in July 2024, ACM Research, Inc., a US-based semiconductor company, launched the Ultra C vac-p flux cleaning tool for FOPLP. By utilizing vacuum technology, this new tool efficiently removes flux residues from chiplet structures. ACM also announced that it received a purchase order from a leading semiconductor manufacturer in China. The Ultra C vac-p signifies a significant advancement in overcoming the cleaning challenges associated with next-generation advanced packaging technologies.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed sum. Through this acquisition, Lam Research intends to enhance its advanced packaging capabilities, especially in chiplet-based solutions, and to expand its research and development initiatives to better meet the changing needs of the semiconductor industry. SEMSYSCO Semiconductor Systems Corporation GmbH is an Austria-based company that designs, develops, and manufactures machines and systems for the semiconductor sector, focusing on advanced packaging solutions, including fan-out panel-level packaging (FOPLP).

Major companies operating in the organic substrate packaging material market are Amkor Technology Inc., Advanced Semiconductor Engineering Inc., Compass Technology Co. Ltd., Hitachi Chemical Company Ltd., Mitsubishi Corporation, STATS ChipPAC Pte Ltd., Shinko Electric Industries Co. Ltd., Showa Denko KK, Kyocera Corporation, WUS Printed Circuit Co. Ltd., Microchip Technology Inc., Texas Instruments Incorporated, Unimicron Technology Corporation, Ibiden Co. Ltd., AT&S Austria Technologie & Systemtechnik AG, Samsung Electro-Mechanics Co. Ltd., Amcor PLC, Fujikura Ltd., Nippon Mektron Ltd., Tripod Technology Corporation, Compeq Manufacturing Co. Ltd., HannStar Board Corporation, Kingboard Chemical Holdings Ltd., Sumitomo Bakelite Co. Ltd., Panasonic Corporation, Nitto Denko Corporation, Rogers Corporation, Shenzhen Kinwong Electronic Co. Ltd., Unitech Printed Circuit Board Corporation, Young Poong Electronics Co. Ltd., CMK Corporation, Daeduck GDS Co. Ltd., Dynamic Electronics Co. Ltd., Flexium Interconnect Inc., Fujitsu Interconnect Technologies Ltd., Interflex Co. Ltd., LG Innotek Co. Ltd., Multek Corporation

Asia-Pacific was the largest region in the organic substrate packaging material market share in 2024. North America was the second-largest region in the organic substrate packaging material market. The regions covered in the organic substrate packaging material market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the organic substrate packaging material market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The organic substrate packaging material market consists of sales of integrated circuit packaging, flip-chip scale packaging, and high-density multilayers. Values in this market are 'factory gate' values, that is the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Organic Substrate Packaging Material Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on organic substrate packaging material market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for organic substrate packaging material ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward? The organic substrate packaging material market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the Russia-Ukraine war, rising inflation, higher interest rates, and the legacy of the COVID-19 pandemic.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth. It covers the growth trajectory of COVID-19 for all regions, key developed countries and major emerging markets.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Technology: Small Outline (SO) Packages; Grid Array (GA) Packages; Flat No-Leads Packages; Quad Flat Package (QFP); Dual In-Line Package (DIP); Other Technologies
• 2) By Application: Consumer Electronics; Automotive; Manufacturing; Healthcare; Other Applications
• 3) By End-Use: Mobile Phones; FPD (Flat Panel Display); Other End-Uses
• Subsegments:
• 1) By Small Outline (SO) Packages: Small Outline Integrated Circuit (SOIC); Small Outline Transistor (SOT)
• 2) By Grid Array (GA) Packages: Ball Grid Array (BGA); Column Grid Array (CGA)
• 3) By Flat No-Leads Packages: Thin Profile No-Lead (TPNL) Packages; Quad No-Lead (QNL) Packages
• 4) By Quad Flat Package (QFP): Thin Quad Flat Package (TQFP); Low-Profile Quad Flat Package (LQFP)
• 5) By Dual In-Line Package (DIP): Standard DIP; Dual In-Line Memory Module (DIMM)
• 6) By Other Technologies: Chip-On-Board (COB); Embedded Wafer-Level Ball Grid Array (eWLB)
• Companies Mentioned: Amkor Technology Inc.; Advanced Semiconductor Engineering Inc.; Compass Technology Co. Ltd.; Hitachi Chemical Company Ltd.; Mitsubishi Corporation
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Organic Substrate Packaging Material Market Characteristics

3. Organic Substrate Packaging Material Market Trends And Strategies

4. Organic Substrate Packaging Material Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics And Covid And Recovery On The Market

5. Global Organic Substrate Packaging Material Growth Analysis And Strategic Analysis Framework

• 5.1. Global Organic Substrate Packaging Material PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Organic Substrate Packaging Material Market Growth Rate Analysis
• 5.4. Global Organic Substrate Packaging Material Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Organic Substrate Packaging Material Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Organic Substrate Packaging Material Total Addressable Market (TAM)

6. Organic Substrate Packaging Material Market Segmentation

• 6.1. Global Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Small Outline (SO) Packages
• Grid Array (GA) Packages
• Flat No-Leads Packages
• Quad Flat Package (QFP)
• Dual In-Line Package (DIP)
• Other Technologies
• 6.2. Global Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Consumer Electronics
• Automotive
• Manufacturing
• Healthcare
• Other Applications
• 6.3. Global Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Mobile Phones
• FPD (Flat Panel Display)
• Other End-Uses
• 6.4. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Small Outline (SO) Packages, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Small Outline Integrated Circuit (SOIC)
• Small Outline Transistor (SOT)
• 6.5. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Grid Array (GA) Packages, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Ball Grid Array (BGA)
• Column Grid Array (CGA)
• 6.6. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Flat No-Leads Packages, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Thin Profile No-Lead (TPNL) Packages
• Quad No-Lead (QNL) Packages
• 6.7. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Quad Flat Package (QFP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Thin Quad Flat Package (TQFP)
• Low-Profile Quad Flat Package (LQFP)
• 6.8. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Dual In-Line Package (DIP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Standard DIP
• Dual In-Line Memory Module (DIMM)
• 6.9. Global Organic Substrate Packaging Material Market, Sub-Segmentation Of Other Technologies, By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Chip-On-Board (COB)
• Embedded Wafer-Level Ball Grid Array (eWLB)

7. Organic Substrate Packaging Material Market Regional And Country Analysis

• 7.1. Global Organic Substrate Packaging Material Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Organic Substrate Packaging Material Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Organic Substrate Packaging Material Market

• 8.1. Asia-Pacific Organic Substrate Packaging Material Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Organic Substrate Packaging Material Market

• 9.1. China Organic Substrate Packaging Material Market Overview
• 9.2. China Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Organic Substrate Packaging Material Market

• 10.1. India Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Organic Substrate Packaging Material Market

• 11.1. Japan Organic Substrate Packaging Material Market Overview
• 11.2. Japan Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Organic Substrate Packaging Material Market

• 12.1. Australia Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Organic Substrate Packaging Material Market

• 13.1. Indonesia Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Organic Substrate Packaging Material Market

• 14.1. South Korea Organic Substrate Packaging Material Market Overview
• 14.2. South Korea Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Organic Substrate Packaging Material Market

• 15.1. Western Europe Organic Substrate Packaging Material Market Overview
• 15.2. Western Europe Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Organic Substrate Packaging Material Market

• 16.1. UK Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Organic Substrate Packaging Material Market

• 17.1. Germany Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Organic Substrate Packaging Material Market

• 18.1. France Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Organic Substrate Packaging Material Market

• 19.1. Italy Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Organic Substrate Packaging Material Market

• 20.1. Spain Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Organic Substrate Packaging Material Market

• 21.1. Eastern Europe Organic Substrate Packaging Material Market Overview
• 21.2. Eastern Europe Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Organic Substrate Packaging Material Market

• 22.1. Russia Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Organic Substrate Packaging Material Market

• 23.1. North America Organic Substrate Packaging Material Market Overview
• 23.2. North America Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Organic Substrate Packaging Material Market

• 24.1. USA Organic Substrate Packaging Material Market Overview
• 24.2. USA Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Organic Substrate Packaging Material Market

• 25.1. Canada Organic Substrate Packaging Material Market Overview
• 25.2. Canada Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Organic Substrate Packaging Material Market

• 26.1. South America Organic Substrate Packaging Material Market Overview
• 26.2. South America Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Organic Substrate Packaging Material Market

• 27.1. Brazil Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Organic Substrate Packaging Material Market

• 28.1. Middle East Organic Substrate Packaging Material Market Overview
• 28.2. Middle East Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Organic Substrate Packaging Material Market

• 29.1. Africa Organic Substrate Packaging Material Market Overview
• 29.2. Africa Organic Substrate Packaging Material Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Organic Substrate Packaging Material Market, Segmentation By Application, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Organic Substrate Packaging Material Market, Segmentation By End Use, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Organic Substrate Packaging Material Market Competitive Landscape And Company Profiles

• 30.1. Organic Substrate Packaging Material Market Competitive Landscape
• 30.2. Organic Substrate Packaging Material Market Company Profiles
  • 30.2.1. Amkor Technology Inc. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Advanced Semiconductor Engineering Inc. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Compass Technology Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. Hitachi Chemical Company Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. Mitsubishi Corporation Overview, Products and Services, Strategy and Financial Analysis

31. Organic Substrate Packaging Material Market Other Major And Innovative Companies

• 31.1. STATS ChipPAC Pte Ltd.
• 31.2. Shinko Electric Industries Co. Ltd.
• 31.3. Showa Denko KK
• 31.4. Kyocera Corporation
• 31.5. WUS Printed Circuit Co. Ltd.
• 31.6. Microchip Technology Inc.
• 31.7. Texas Instruments Incorporated
• 31.8. Unimicron Technology Corporation
• 31.9. Ibiden Co. Ltd.
• 31.10. AT&S Austria Technologie & Systemtechnik AG
• 31.11. Samsung Electro-Mechanics Co. Ltd.
• 31.12. Amcor PLC
• 31.13. Fujikura Ltd.
• 31.14. Nippon Mektron Ltd.
• 31.15. Tripod Technology Corporation

32. Global Organic Substrate Packaging Material Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Organic Substrate Packaging Material Market

34. Recent Developments In The Organic Substrate Packaging Material Market

35. Organic Substrate Packaging Material Market High Potential Countries, Segments and Strategies

• 35.1 Organic Substrate Packaging Material Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Organic Substrate Packaging Material Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Organic Substrate Packaging Material Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer