市場調査レポート
商品コード
1159509
半導体組立および試験サービスの世界市場:2028年までの予測 - サービス別、プロセス別、パッケージングタイプ別、用途別Semiconductor Assembly and Test Services Market Forecasts to 2028 - Global Analysis By Service, Process, Packaging Type and Application(Industrial, Automotive Electronics, Communications, Consumer Electronics |
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半導体組立および試験サービスの世界市場:2028年までの予測 - サービス別、プロセス別、パッケージングタイプ別、用途別 |
出版日: 2022年11月01日
発行: Stratistics Market Research Consulting
ページ情報: 英文 175+ Pages
納期: 2~3営業日
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世界の半導体組立および試験サービスの市場規模は、2022年に342億4,000万米ドルとなりました。
同市場は、予測期間中にCAGR7.5%で拡大し、2028年には528億5,000万米ドルに達すると予測されています。
当レポートでは、世界の半導体組立および試験サービス市場について調査し、市場の概要とともに、サービス別、プロセス別、パッケージングタイプ別、用途別、地域別の動向、および市場に参入する企業のプロファイルなどを提供しています。
According to Stratistics MRC, the Global Semiconductor Assembly and Test Services Market is accounted for $34.24 billion in 2022 and is expected to reach $52.85 billion by 2028 growing at a CAGR of 7.5% during the forecast period. Semiconductor assembly and test services are part of semi conductor manufacturing process. Semiconductors are used by many modern consumer goods in daily uses, such as in cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. Testing services includes functional, physical, and electrical testing of the product that verifies the quality of the product. In this process, all the parts of the product are assembled together and will be tested to know its functioning and efficiency.
According to the Semiconductor Industry Association (SIA), China is producing the devices like computers, cloud services and recognised as the second largest final producers.
Market Dynamics:
Driver:
Increase in demand for consumer electronics
Increase in disposable revenue of people across the globe drastically fuels sales of consumer electronics devices such as TV, mobile phones, and tablets which boosts requirement for outsourced semiconductor assembly and test services. In addition, increase in implementation of smart phones considerably propels the market growth.
Restraint:
Supply Chain Management
The semiconductor supply chain starts with System Companies, travels through EMS, IC Design, IC Manufacturing, IC Assembly & Test, End Consumers and circles back to System Companies. In supply chain management, the four principles are code compliance, risk assessment, audit participation, and continuous improvement. Every segment must be properly carried out to avoid losses.
Opportunity:
Innovations
Increasing demand and innovation in connected technologies will encourage growth in the global sector. The long-term outlook for growth is promising in this sector. The most demanded are automotive, computation and data storage, and wireless. The new innovations in semi conductor designs are driving the market. Chip applications are tripling the demand of the market.
Threat:
Huge capital investment
Semiconductor foundries need a massive capital investment of billions of dollars and a significant period of time to set up. Moreover, these foundries cannot manufacture chips at a very quick speed because the manufacturing process also takes time and requires high-priced equipment.
COVID-19 Impact
The COVID-19 pandemic drastically impacted the semiconductor industry by dropping end-user and industrial demand for electronic components. Microelectronics' revenue model has transformed because no mass production was done during the shutdown. This troubled the development of semiconductor assembly & testing services market. The chip shortages shown more impact during pandemic.
The consumer electronics segment is expected to be the largest during the forecast period
The consumer electronics segment is estimated to have a lucrative growth, due to their daily usage activities. Mobile phones, laptops, games consoles, microwaves and refrigerators all operate with the use of semiconductor components such as integrated chips, diodes and transistors. Semi conductors help the electronics by controlling and managing the flow of electric current in devices.
The packaging segment is expected to have the highest CAGR during the forecast period
The packaging segment is anticipated to witness the fastest CAGR growth during the forecast period, due to development of 3D packages. It prevents from physical damage and corrosion to silicon wafers, logic units, and memory during the final stage of semiconductor manufacturing process. It allows the chip to be connected to a circuit board and helps in delivering all over the globe.
Region with highest share:
North America is projected to hold the largest market share during the forecast period owing to development of advance chip applications. This region has the most key companies which is the prime factor of demand. It is witnessing several initiatives and investments relating to the market. Emergence of electronic products is complimenting the growth in this region.
Region with highest CAGR:
Asia Pacific is projected to have the highest CAGR over the forecast period, owing to the presence of number of outsourcing facilities in the region. The growing automotive industry is driving the market growth across the region. Most of the assembly and test operations are done in industries of this region.
Key players in the market
Some of the key players profiled in the Semiconductor Assembly and Test Services Market include Taiwan Semiconductor Manufacturing Company Limited, ASE Group, Chipbond Technology Corporation, JCET Group Co., Ltd, Belden Inc, ChipMOS Technologies, Powertech Technology Inc, United Test and Assembly Center Ltd, Unisem, CORWIL Technology Corporation, Powertech Technology, Inc, Siliconware Precision Industries Co., Ltd, Tripp Lite, Teledyne Technologies, Amkor Technology, Integra Technologies, Jiangsu Changjiang Electronics Technology Co., Ltd, STATS chip PAC Ltd, Global Foundaries Inc, Integrated Microelectronics Inc
Key Developments:
In July 2021, Jiangsu Changjiang Electronics Technology Co., Ltd. unveiled XDFOI - a new line of high-density fanout packaging solutions. These products are reliable, cost-effective, and offer high-integration interconnection of chips to enable cutting-edge semiconductor manufacturing.
In March 2021, Deca technologies, a technology provider for advanced semiconductor packaging in collaboration with ASE group introduced APDK to cater to customer's demand in achieving innovative electrical performance.
Services Covered:
Packaging Types Covered:
Applications Covered:
Regions Covered:
What our report offers:
Free Customization Offerings:
All the customers of this report will be entitled to receive one of the following free customization options: