表紙:電子機器受託組立市場の市場規模、シェア、成長分析:製品別、用途別、組織規模別、エンドユーザー別、地域別 - 産業予測、2025~2032年
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1796108

電子機器受託組立市場の市場規模、シェア、成長分析:製品別、用途別、組織規模別、エンドユーザー別、地域別 - 産業予測、2025~2032年

Electronic Contract Assembly Market Size, Share, and Growth Analysis, By Product (Printed Circuit Board Assembly, Cable Assemblies), By Application, By Organization Size, By End User, By Region - Industry Forecast 2025-2032


出版日
発行
SkyQuest
ページ情報
英文 196 Pages
納期
3~5営業日
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=148.16円
電子機器受託組立市場の市場規模、シェア、成長分析:製品別、用途別、組織規模別、エンドユーザー別、地域別 - 産業予測、2025~2032年
出版日: 2025年08月13日
発行: SkyQuest
ページ情報: 英文 196 Pages
納期: 3~5営業日
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概要

世界の電子機器受託組立の市場規模は、2023年に1,574億米ドルとなり、2024年の1,736億1,000万米ドルから2032年には3,803億5,000万米ドルに成長し、予測期間(2025~2032年)のCAGRは10.3%で成長する見通しです。

世界の電子機器受託組立市場は、電子機器に対する需要の高まり、国内製造を促進する政府の支援策、急速な技術進歩によって力強い成長を遂げています。政府は、製造インフラの強化や、重要なインフラプロジェクトや産業計画への電子機器受託組立技術の採用を優先するようになってきています。機械学習と人工知能の技術革新は、厳格な品質管理を確保しながらも、部品の入手可能性と需要の変動に合わせて、オペレーションを最適化し、超効率的でリアルタイムの組み立てを促進することで、生産プロセスを変革しています。このようなダイナミックな業界情勢は、これらの技術が電子機器受託組立の実践を再構築し続け、最終的にメーカーと消費者双方の進化するニーズに応えることで、業界がさらに拡大する可能性があることを示しています。

目次

イントロダクション

  • 調査の目的
  • 調査範囲
  • 定義

調査手法

  • 情報調達
  • 二次と一次データの方法
  • 市場規模予測
  • 市場の前提条件と制限

エグゼクティブサマリー

  • 世界市場の展望
  • 供給と需要の動向分析
  • セグメント別機会分析

市場力学と展望

  • 市場概要
  • 市場規模
  • 市場力学
    • 促進要因と機会
    • 抑制要因と課題
  • ポーターの分析

主な市場の考察

  • 重要成功要因
  • 競合の程度
  • 主な投資機会
  • 市場エコシステム
  • 市場の魅力指数(2024年)
  • PESTEL分析
  • マクロ経済指標
  • バリューチェーン分析
  • 価格分析
  • 技術分析
  • ケーススタディ

電子機器受託組立の市場規模:製品別、CAGR(2025~2032年)

  • 市場概要
  • プリント回路基板アセンブリ(PCBA)
  • ケーブルアセンブリ
  • 電気機械アセンブリ
  • その他

電子機器受託組立の市場規模:用途別、CAGR(2025~2032年)

  • 市場概要
  • 家電
  • 産業
  • 自動車
  • 通信

電子機器受託組立の市場規模:組織規模別、CAGR(2025~2032年)

  • 市場概要
  • 大企業および中規模企業
  • 小規模企業

電子機器受託組立の市場規模:エンドユーザー別、CAGR(2025~2032年)

  • 市場概要
  • OEM(オリジナル機器メーカー)
  • ODM(オリジナルデザインメーカー)
  • EMSプロバイダー(電子機器製造サービス)

電子機器受託組立の市場規模:地域別、CAGR(2025~2032年)

  • 北米
    • 米国
    • カナダ
  • 欧州
    • ドイツ
    • スペイン
    • フランス
    • 英国
    • イタリア
    • その他欧州地域
  • アジア太平洋地域
    • 中国
    • インド
    • 日本
    • 韓国
    • その他アジア太平洋地域
  • ラテンアメリカ
    • ブラジル
    • その他ラテンアメリカ地域
  • 中東・アフリカ
    • GCC諸国
    • 南アフリカ
    • その他中東・アフリカ

競合情報

  • 上位5社の比較
  • 主要企業の市場ポジショニング(2024年)
  • 主な市場企業が採用した戦略
  • 最近の市場動向
  • 企業の市場シェア分析(2024年)
  • 主要企業の企業プロファイル
    • 企業の詳細
    • 製品ポートフォリオ分析
    • 企業のセグメント別シェア分析
    • 収益の前年比比較(2022~2024年)

主要企業プロファイル

  • TPV Technology
  • Foxconn Technology Group
  • Kinpo Electronics
  • Jabil Inc.
  • Kimball Electronics
  • Sanmina
  • Flex
  • Wistron
  • Benchmark Electronics
  • Plexus

結論と提言

目次
Product Code: SQMIG45L2020

Global Electronic Contract Assembly Market size was valued at USD 157.4 billion in 2023 and is poised to grow from USD 173.61 billion in 2024 to USD 380.35 billion by 2032, growing at a CAGR of 10.3% during the forecast period (2025-2032).

The global electronic contract assembly market is experiencing robust growth driven by heightened demand for electronic devices, supportive government initiatives promoting domestic manufacturing, and rapid technological advancements. Governments are increasingly prioritizing the enhancement of manufacturing infrastructure and the adoption of electronic contract assembly technologies for critical infrastructure projects and industrial planning. Innovations in machine learning and artificial intelligence are transforming production processes by optimizing operations and facilitating hyper-efficient, real-time assembly, tailored to component availability and demand variability while ensuring stringent quality control. This dynamic landscape underscores the industry's potential for further expansion as these technologies continue to reshape practices in electronic contract assembly, ultimately meeting the evolving needs of manufacturers and consumers alike.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Electronic Contract Assembly market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Electronic Contract Assembly Market Segments Analysis

Global Electronic Contract Assembly Market is segmented by Product, Application, Organization Size, End User and region. Based on Product, the market is segmented into Printed Circuit Board Assembly (PCBA), Cable Assemblies, Electromechanical Assemblies and Others. Based on Application, the market is segmented into Consumer Electronics, Industrial, Automotive and Telecommunications. Based on Organization Size, the market is segmented into Large & Medium Enterprises and Small Enterprises. Based on End User, the market is segmented into OEM (Original Equipment Manufacturers), ODMs (Original Design Manufacturers) and EMS Providers (Electronics Manufacturing Services). Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Electronic Contract Assembly Market

The Global Electronic Contract Assembly market is being propelled by the rising global demand for wearables, laptops, smartphones, and smart home devices. Manufacturers are increasingly seeking efficient and scalable production solutions to reduce time-to-market while maintaining high-quality standards. As a result, original equipment manufacturers (OEMs) are turning to electronic manufacturing services (EMS) providers for their assembly needs. This trend is particularly pronounced in emerging economies, where the ability to quickly customize products and offer competitive pricing is essential for market success. Consequently, this escalating demand is significantly boosting the penetration of electronic contract assembly services.

Restraints in the Global Electronic Contract Assembly Market

The Global Electronic Contract Assembly market faces significant challenges due to geopolitical uncertainties, logistical bottlenecks, and ongoing semiconductor shortages. These factors create persistent strain on manufacturers, reducing their operational flexibility, increasing costs, and hindering timely production. In sectors with heightened demand, such as consumer electronics and automotive, this instability adversely impacts the reliability of market predictions. Consequently, businesses struggle to maintain consistent delivery schedules and effectively plan for long-term investments. Such unpredictability can disrupt supply chains and complicate strategic decision-making, ultimately affecting the competitive position and growth potential of companies within the industry.

Market Trends of the Global Electronic Contract Assembly Market

A prominent market trend in the Global Electronic Contract Assembly sector is the transition towards intelligent and automated production, driven by advancements in Industry 4.0 technologies. The integration of robotics, AI-driven inspection systems, and IoT-enabled monitoring is revolutionizing contract assembly operations. This shift enhances production capabilities by significantly improving precision, reducing error rates, and increasing scalability. As companies prioritize efficiency and competitiveness, the demand for innovative solutions continues to grow, enabling faster turnaround times and greater flexibility in manufacturing processes. Consequently, the electronic contract assembly market is experiencing a transformation that emphasizes smart production environments and sophisticated technology adoption.

Table of Contents

Introduction

  • Objectives of the Study
  • Scope of the Report
  • Definitions

Research Methodology

  • Information Procurement
  • Secondary & Primary Data Methods
  • Market Size Estimation
  • Market Assumptions & Limitations

Executive Summary

  • Global Market Outlook
  • Supply & Demand Trend Analysis
  • Segmental Opportunity Analysis

Market Dynamics & Outlook

  • Market Overview
  • Market Size
  • Market Dynamics
    • Drivers & Opportunities
    • Restraints & Challenges
  • Porters Analysis
    • Competitive rivalry
    • Threat of substitute
    • Bargaining power of buyers
    • Threat of new entrants
    • Bargaining power of suppliers

Key Market Insights

  • Key Success Factors
  • Degree of Competition
  • Top Investment Pockets
  • Market Ecosystem
  • Market Attractiveness Index, 2024
  • PESTEL Analysis
  • Macro-Economic Indicators
  • Value Chain Analysis
  • Pricing Analysis
  • Technology Analysis
  • Case Studies

Global Electronic Contract Assembly Market Size by Product & CAGR (2025-2032)

  • Market Overview
  • Printed Circuit Board Assembly (PCBA)
  • Cable Assemblies
  • Electromechanical Assemblies
  • Others)

Global Electronic Contract Assembly Market Size by Application & CAGR (2025-2032)

  • Market Overview
  • Consumer Electronics
  • Industrial
  • Automotive
  • Telecommunications

Global Electronic Contract Assembly Market Size by Organization Size & CAGR (2025-2032)

  • Market Overview
  • Large & Medium Enterprises
  • Small Enterprises

Global Electronic Contract Assembly Market Size by End User & CAGR (2025-2032)

  • Market Overview
  • OEM (Original Equipment Manufacturers)
  • ODMs (Original Design Manufacturers)
  • EMS Providers (Electronics Manufacturing Services)

Global Electronic Contract Assembly Market Size & CAGR (2025-2032)

  • North America (Product, Application, Organization Size, End User)
    • US
    • Canada
  • Europe (Product, Application, Organization Size, End User)
    • Germany
    • Spain
    • France
    • UK
    • Italy
    • Rest of Europe
  • Asia Pacific (Product, Application, Organization Size, End User)
    • China
    • India
    • Japan
    • South Korea
    • Rest of Asia-Pacific
  • Latin America (Product, Application, Organization Size, End User)
    • Brazil
    • Rest of Latin America
  • Middle East & Africa (Product, Application, Organization Size, End User)
    • GCC Countries
    • South Africa
    • Rest of Middle East & Africa

Competitive Intelligence

  • Top 5 Player Comparison
  • Market Positioning of Key Players, 2024
  • Strategies Adopted by Key Market Players
  • Recent Developments in the Market
  • Company Market Share Analysis, 2024
  • Company Profiles of All Key Players
    • Company Details
    • Product Portfolio Analysis
    • Company's Segmental Share Analysis
    • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

  • TPV Technology
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Foxconn Technology Group
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kinpo Electronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Jabil Inc.
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Kimball Electronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Sanmina
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Flex
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Wistron
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Benchmark Electronics
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments
  • Plexus
    • Company Overview
    • Business Segment Overview
    • Financial Updates
    • Key Developments

Conclusion & Recommendations