有機基板包装材料の市場規模、シェア、成長分析、技術別、用途別、地域別 - 産業予測 2025～2032年

有機基板包装材料の世界市場規模は2023年に138億米ドルと評価され、2024年の143億7,000万米ドルから2032年には198億1,000万米ドルに成長し、予測期間（2025-2032年）のCAGRは4.1％で成長する見通しです。

基板パッケージング業界は、先進家庭用電子機器に対する需要の高まりと、小型で高機能なデバイスの普及によって大きな成長を遂げています。スマートフォンからIoTデバイスまで、多様なアプリケーションをサポートするため、機能性を強化した小型コンポーネントが業界で採用されるにつれ、堅牢な高密度相互接続ソリューションの必要性が高まっています。クラウドコンピューティング、AI技術、5Gインフラの台頭は、ハイエンド基板材料の需要をさらに押し上げます。同時に、自動車分野では先進安全システム、インフォテインメント、電動パワートレインにエレクトロニクスが採用され、信頼性の高いパッケージング技術の必要性が高まっています。しかし、高い初期設備投資、変動する原材料価格、サプライチェーンの問題、規制上のハードルといった課題が業界のダイナミクスを複雑にしており、メーカーには性能、コスト、持続可能性のバランスを効果的にとることが求められています。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次と一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の見通し
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と見通し

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析
• 規制情勢
• ケーススタディ
• 技術分析

有機基板包装材料市場規模：技術別& CAGR（2025-2032）

• 市場概要
• 小型薄型アウトラインパッケージ
• ピングリッドアレイ（PGA）パッケージ
• フラットノーリードパッケージ
• クアッドフラットパッケージ（QFP）
• デュアルインラインパッケージ（GIP）
• その他

有機基板包装材料市場規模：用途別& CAGR（2025-2032）

• 市場概要
• 家電
• 自動車
• 産業
• 製造業
• ヘルスケア
• その他

有機基板包装材料市場規模：地域別& CAGR（2025-2032）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 最近の市場動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 企業の詳細
  • 製品ポートフォリオ分析
  • 企業のセグメント別シェア分析
  • 収益の前年比比較（2022-2024年）

主要企業プロファイル

• Amkor Technology Inc.（USA）
• Kyocera Corporation（Japan）
• Microchip Technology Inc.（USA）
• Texas Instruments Incorporated（USA）
• ASE Kaohsiung（Advanced Semiconductor Engineering Inc.）（Taiwan）
• Simmtech Co., Ltd.（South Korea）
• Shinko Electric Industries Co., Ltd.（Japan）
• LG Innotek Co., Ltd.（South Korea）
• AT&S（Austria Technologie & Systemtechnik AG）（Austria）
• Daeduck Electronics Co., Ltd.（South Korea）
• WUS Printed Circuit Co., Ltd.（Taiwan）
• STATS ChipPAC Pte. Ltd.（Singapore）
• Compass Technology Co., Ltd.（Hong Kong）
• Hitachi Chemical Company Ltd.（Japan）
• NGK Spark Plug Co., Ltd.（Japan）
• Mitsubishi Corporation（Japan）
• Samsung Electro-Mechanics Co., Ltd.（South Korea）
• Sumitomo Bakelite Co., Ltd.（Japan）
• TTM Technologies, Inc.（USA）
• DuPont de Nemours, Inc.（USA）

結論と提言

Global Organic Substrate Packaging Material Market size was valued at USD 13.8 billion in 2023 and is poised to grow from USD 14.37 billion in 2024 to USD 19.81 billion by 2032, growing at a CAGR of 4.1% during the forecast period (2025-2032).

The substrate packaging industry is experiencing significant growth driven by the increasing demand for advanced consumer electronics and the proliferation of compact, high-functioning devices. As industries embrace smaller components with enhanced functionality to support a diverse range of applications-from smartphones to IoT devices-the need for robust high-density interconnect solutions escalates. The rise of cloud computing, AI technologies, and 5G infrastructures further propels the demand for high-end substrate materials. Concurrently, the automotive sector's adoption of electronics for advanced safety systems, infotainment, and electric powertrains enhances the necessity for reliable packaging technologies. However, challenges such as high initial capital investments, fluctuating raw material prices, supply chain issues, and regulatory hurdles complicate industry dynamics, urging manufacturers to balance performance, cost, and sustainability effectively.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Organic Substrate Packaging Material market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Organic Substrate Packaging Material Market Segments Analysis

Global Organic Substrate Packaging Material Market is segmented by Technology, Application and region. Based on Technology, the market is segmented into Small Thin Outline Packages, Pin Grid Array (PGA) Packages, Flat no-leads Packages, Quad Flat Package (QFP), Dual in-line Package (GIP) and Others. Based on Application, the market is segmented into Consumer Electronics, Automotive, Industrial, Manufacturing, Healthcare and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Organic Substrate Packaging Material Market

One of the key drivers behind the Global Organic Substrate Packaging Material market is the rapid expansion of the consumer electronics and automotive sectors. The increasing demand for smartphones, wearables, electric vehicles, and infotainment systems necessitates the use of efficient and high-performance packaging solutions. Prominent companies such as Apple, Samsung, and Tesla are at the forefront of this trend, actively promoting the adoption of organic substrates to facilitate lightweight, stable, and reliable chip stacking. This pivotal movement is significantly contributing to the heightened demand for organic substrate packaging materials, underscoring their essential role in modern technology applications.

Restraints in the Global Organic Substrate Packaging Material Market

One major challenge facing the Global Organic Substrate Packaging Material market is the inherent sensitivity of organic substrates to high temperatures and moisture. These vulnerabilities can lead to issues such as delamination or reduced electrical performance, particularly in high-power applications. With the rising use of more advanced chips, the packaging materials experience greater thermal loads that must be managed effectively, making thermal management a persistent concern. As a result, some users may be compelled to shift towards ceramics or inorganic materials to address these limitations, thereby hindering the growth and adoption of organic substrate solutions in various applications.

Market Trends of the Global Organic Substrate Packaging Material Market

In the Global Organic Substrate Packaging Material market, a notable short-term trend is the rapid adoption of advanced semiconductor packaging technologies fueled by the rise of AI, 5G, and IoT applications. Manufacturers are increasingly focusing on the development of ultra-thin and high-layer count organic substrates to accommodate rising frequency and velocity requirements. Moreover, the integration of passive components and the implementation of tightly patterned circuits are addressing the miniaturization challenges posed by contemporary electronic devices, such as wearables and smartphones. This shift emphasizes innovation in packaging solutions, positioning organic substrates at the forefront of the evolving electronics landscape.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Regulatory Landscape
• Case Studies
• Technology Analysis

Global Organic Substrate Packaging Material Market Size by Technology & CAGR (2025-2032)

• Market Overview
• Small Thin Outline Packages
• Pin Grid Array (PGA) Packages
• Flat no-leads Packages
• Quad Flat Package (QFP)
• Dual in-line Package (GIP)
• Others

Global Organic Substrate Packaging Material Market Size by Application & CAGR (2025-2032)

• Market Overview
• Consumer Electronics
• Automotive
• Industrial
• Manufacturing
• Healthcare
• Others

Global Organic Substrate Packaging Material Market Size & CAGR (2025-2032)

• North America (Technology, Application)
  • US
  • Canada
• Europe (Technology, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Technology, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Technology, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Technology, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Amkor Technology Inc. (USA)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Kyocera Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Microchip Technology Inc. (USA)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Texas Instruments Incorporated (USA)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Kaohsiung (Advanced Semiconductor Engineering Inc.) (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Simmtech Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shinko Electric Industries Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• LG Innotek Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• AT&S (Austria Technologie & Systemtechnik AG) (Austria)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Daeduck Electronics Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• WUS Printed Circuit Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• STATS ChipPAC Pte. Ltd. (Singapore)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Compass Technology Co., Ltd. (Hong Kong)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Hitachi Chemical Company Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• NGK Spark Plug Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Mitsubishi Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electro-Mechanics Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sumitomo Bakelite Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• TTM Technologies, Inc. (USA)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• DuPont de Nemours, Inc. (USA)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations