システムインパッケージ技術の市場規模、シェア、成長分析：相互接続技術別、パッケージ技術別、パッケージ別、デバイス別、用途別、地域別 - 産業予測 2025～2032年

システムインパッケージ（SiP）技術市場規模は、2023年に192億3,000万米ドルと評価され、2024年の210億6,000万米ドルから2032年には435億2,000万米ドルに成長し、予測期間（2025-2032年）のCAGRは9.5％で成長する見通しです。

システムインパッケージ（SiP）技術市場は、5G対応デバイスの普及に加え、スマートフォンやスマートウェアラブルの採用が増加していることから、力強い成長が見込まれています。高性能電子機器や洗練されたコンパクトなコンシューマーガジェットへの需要の高まりと、特に多様なサイズのICパッケージングの進化が相まって、この拡大をさらに後押ししています。しかし、リソースや熟練労働者の不足、SiP技術や集積に関連する熱問題に伴う高コストにより、成長に課題が生じる可能性があります。とはいえ、インターネットに接続された小型電子機器の普及は、多数のコンポーネントを単一パッケージに組み込むことを容易にするSiP技術に大きな機会をもたらすと予想されます。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次データと一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の見通し
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と見通し

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析
• 技術分析

世界システムインパッケージ（SiP）技術市場規模：相互接続技術別& CAGR（2025-2032）

• 市場概要
• ワイヤーボンド
• フリップチップ
• ファンアウトウエハーレベル

世界システムインパッケージ（SiP）技術市場規模：パッケージ技術別& CAGR（2025-2032）

• 市場概要
• 2D ICパッケージング
• 2.5-D ICパッケージング
• 3D ICパッケージング

世界のシステムインパッケージ（SiP）技術市場規模：パッケージ別 & CAGR（2025-2032）

• 市場概要
• フラットパッケージ
• ピングリッドアレイ
• 表面実装
• 小さなアウトライン

世界システムインパッケージ（SiP）技術市場規模：デバイス別& CAGR（2025-2032）

• 市場概要
• 電源管理集積回路（PMIC）
• マイクロエレクトロメカニカルシステム（MEMS）
• RFフロントエンド
• RFパワーアンプ
• アプリケーションプロセッサ
• ベースバンドプロセッサ
• その他

世界システムインパッケージ（SiP）技術市場規模：用途別& CAGR（2025-2032）

• 市場概要
• 家電
• 自動車
• 通信
• 産業システム
• 航空宇宙および防衛
• その他

世界のシステムインパッケージ（SiP）技術市場規模：地域別& CAGR（2025-2032）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 市場の最近の動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 会社概要
  • 製品ポートフォリオ分析
  • セグメント別シェア分析
  • 収益の前年比比較（2022-2024）

主要企業プロファイル

• ASE Technology Holding Co., Ltd.（Taiwan）
• Amkor Technology, Inc.（United States）
• Taiwan Semiconductor Manufacturing Company Limited（TSMC）（Taiwan）
• Intel Corporation（United States）
• Texas Instruments Incorporated（United States）
• Samsung Electronics Co., Ltd.（South Korea）
• Qualcomm Technologies, Inc.（United States）
• Broadcom Inc.（United States）
• STMicroelectronics N.V.（Switzerland）
• NXP Semiconductors N.V.（Netherlands）
• Infineon Technologies AG（Germany）
• Micron Technology, Inc.（United States）
• SK Hynix Inc.（South Korea）
• Toshiba Corporation（Japan）
• Sony Corporation（Japan）
• MediaTek Inc.（Taiwan）
• Marvell Technology Group Ltd.（United States）
• ON Semiconductor Corporation（United States）
• Renesas Electronics Corporation（Japan）
• Advanced Micro Devices, Inc.（AMD）（United States）

結論と推奨事項

System In Package (SiP) Technology Market size was valued at USD 19.23 billion in 2023 and is poised to grow from USD 21.06 billion in 2024 to USD 43.52 billion by 2032, growing at a CAGR of 9.5% during the forecast period (2025-2032).

The market for System In Package (SiP) Technology is set for robust growth, driven by the rising adoption of smartphones and smart wearables, alongside the proliferation of 5G-enabled devices. Increasing demand for high-performance electronics and sophisticated, compact consumer gadgets, coupled with the evolving landscape of IC packaging, particularly in diverse sizes, further fuels this expansion. However, growth may face challenges due to resource and skilled labor shortages, as well as the high costs associated with SiP technology and integration-related thermal issues. Nevertheless, the widespread use of internet-connected, small-sized electronic devices is expected to present significant opportunities for SiP technology, which facilitates the incorporation of numerous components into a single package.

Top-down and bottom-up approaches were used to estimate and validate the size of the System In Package (SiP) Technology market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

System In Package (SiP) Technology Market Segments Analysis

Global System In Package (SiP) Technology Market is segmented by Interconnection Technology, Packaging Technology, Package, Device, Application and region. Based on Interconnection Technology, the market is segmented into Wire Bond, Flip Chip and Fan-Out Wafer level. Based on Packaging Technology, the market is segmented into 2-D IC Packaging, 2.5-D IC Packaging and 3-D IC Packaging. Based on Package, the market is segmented into Flat Packages, Pin Grid Arrays, Surface Mount and Small Outline. Based on Device, the market is segmented into Power Management Integrated Circuit (PMIC), Microelectromechanical Systems (MEMS), RF Front-End, RF Power Amplifier, Application Processor, Baseband Processor and Others. Based on Application, the market is segmented into Consumer Electronics, Automotive, Telecommunication, Industrial System, Aerospace & Defense and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the System In Package (SiP) Technology Market

The System In Package (SiP) Technology market is being driven by the rising demand for miniaturized electronic devices. As consumers increasingly favor compact and multifunctional handheld gadgets, manufacturers are focused on developing smaller electronic components that optimize space and enhance overall product design. This trend has led companies to innovate by integrating numerous components, such as sensors and processors, into a single package. By consolidating these elements into one compact solution, manufacturers can deliver a superior user experience, providing customers with enhanced functionality while meeting the growing preference for sleek and space-efficient devices.

Restraints in the System In Package (SiP) Technology Market

The System In Package (SiP) Technology market faces several significant restraints, primarily due to the substantial initial investment required to establish manufacturing and printing facilities. Building factories and procuring essential printing machinery entails a considerable financial commitment. For instance, a rotogravure press, which is more advanced, can cost approximately USD 1 million more than a lithographic press, with a single rotogravure cylinder priced around USD 5,000 compared to the lower cost of lithographic plates. Additionally, the transition from traditional lithographic printing to more advanced technologies, needed for competitiveness, poses further challenges, while setup and equipment costs for offset printing remain quite high.

Market Trends of the System In Package (SiP) Technology Market

The System In Package (SiP) Technology market is witnessing a significant upward trend, primarily driven by advancements in the electric vehicle (EV) sector and the increasing demand for compact, efficient integrated circuits (ICs). With the industry's shift toward sustainable practices and stringent safety standards, manufacturers are compelled to innovate, focusing on smart automotive applications that require integrated sensors, RF components, and high-performance modules. The impending transition to 5G technology further amplifies this need, as it necessitates the development of intricate SiP solutions capable of handling high-bandwidth demands amidst wireless network congestion. Consequently, SiP technology is becoming integral in supporting cutting-edge automotive and telecommunications infrastructures, representing a pivotal growth opportunity within the semiconductor landscape.

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis
• Technology Analysis

Global System In Package (SiP) Technology Market Size by Interconnection Technology & CAGR (2025-2032)

• Market Overview
• Wire Bond
• Flip Chip
• Fan-Out Wafer level

Global System In Package (SiP) Technology Market Size by Packaging Technology & CAGR (2025-2032)

• Market Overview
• 2-D IC Packaging
• 2.5-D IC Packaging
• 3-D IC Packaging

Global System In Package (SiP) Technology Market Size by Package & CAGR (2025-2032)

• Market Overview
• Flat Packages
• Pin Grid Arrays
• Surface Mount
• Small Outline

Global System In Package (SiP) Technology Market Size by Device & CAGR (2025-2032)

• Market Overview
• Power Management Integrated Circuit (PMIC)
• Microelectromechanical Systems (MEMS)
• RF Front-End
• RF Power Amplifier
• Application Processor
• Baseband Processor
• Others

Global System In Package (SiP) Technology Market Size by Application & CAGR (2025-2032)

• Market Overview
• Consumer Electronics
• Automotive
• Telecommunication
• Industrial System
• Aerospace & Defense
• Others

Global System In Package (SiP) Technology Market Size & CAGR (2025-2032)

• North America (Interconnection Technology, Packaging Technology, Package, Device, Application)
  • US
  • Canada
• Europe (Interconnection Technology, Packaging Technology, Package, Device, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Interconnection Technology, Packaging Technology, Package, Device, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Interconnection Technology, Packaging Technology, Package, Device, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Interconnection Technology, Packaging Technology, Package, Device, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Amkor Technology, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Taiwan Semiconductor Manufacturing Company Limited (TSMC) (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Intel Corporation (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Texas Instruments Incorporated (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electronics Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Qualcomm Technologies, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Broadcom Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• STMicroelectronics N.V. (Switzerland)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• NXP Semiconductors N.V. (Netherlands)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Infineon Technologies AG (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Micron Technology, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• SK Hynix Inc. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Toshiba Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Sony Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• MediaTek Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Marvell Technology Group Ltd. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ON Semiconductor Corporation (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Renesas Electronics Corporation (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Advanced Micro Devices, Inc. (AMD) (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations