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車載用システムインパッケージ（SiP）市場：パッケージング技術別、パッケージング方式別、最終用途別、国別、地域別-2024-2032年の産業分析、市場規模、市場シェア、予測

Automotive System in Package (SiP) Market, By Packaging Technology, By Packaging Method, By End Use, By Country, and By Region - Industry Analysis, Market Size, Market Share & Forecast from 2024-2032

出版日
ページ情報
英文 284 Pages
納期
2～3営業日
カスタマイズ可能
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=144.76円
車載用システムインパッケージ（SiP）市場：パッケージング技術別、パッケージング方式別、最終用途別、国別、地域別-2024-2032年の産業分析、市場規模、市場シェア、予測
出版日: 2025年04月04日
発行: AnalystView Market Insights
ページ情報: 英文 284 Pages
納期: 2～3営業日
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概要

レポートハイライト

車載用システムインパッケージ（SiP）市場規模は2023年に21億342万米ドルとなり、2024年から2032年にかけてCAGR 10.20%で拡大

車載用システムインパッケージ（SiP）市場-市場力学

EVとADASの需要増とコネクテッドカー動向の高まりが市場需要を促進する見込み

車載用システムインパッケージ（SiP）市場は、技術革新の収束、EVの普及、消費者の期待の変化により、力強い成長を遂げています。SiP技術は、複数のチップやコンポーネントを1つのパッケージに統合する技術です。世界の電気自動車（EV）へのシフトに伴い、バッテリー管理、モーター制御、充電システムなど、小型で効率的な電子システムへのニーズが高まっています。車載用SiPは、高い熱性能と電気性能を確保しながら、省スペース化に貢献します。例えば、バッテリ・マネジメント・システム（BMS）は、複数のバッテリ・セルの電圧、電流、温度をリアルタイムで監視する必要があるため、SiPの恩恵を大きく受けます。SiPはまた、信頼性を高め、組み立ての複雑さを軽減します。これは、スペースと重量が重視されるEVでは極めて重要です。

ADAS（先進運転支援システム）は、カーエレクトロニクスで最も急成長している分野のひとつです。アダプティブ・クルーズ・コントロール、車線維持支援、自動緊急ブレーキ、360度カメラ・システムなどの機能には、強力かつコンパクトな電子制御ユニット（ECU）が必要です。車載SiPは、センサー、プロセッシング・ユニット、メモリー、パワー・マネージメント・コンポーネントを小さなフットプリントで統合できるため、このようなシステムに最適です。これにより、ADASにおけるリアルタイムの意思決定に不可欠な高速データ処理と信号干渉の最小化が可能になります。最近の自動車はますます接続が進んでおり、無線（OTA）アップデート、リアルタイムの交通情報、車車間（V2V）通信、リッチなインフォテインメント体験などの機能を提供しています。これらの機能には、無線通信モジュール（Wi-Fi、Bluetooth、5G）、マイクロコントローラー、マルチメディア・プロセッサーの統合が必要です。没入感のある車内体験と継続的な接続性に対する消費者の需要の高まりが、SiP採用の強力な推進力となっています。車載SiPは、シームレスなデータ通信とマルチメディア処理をサポートし、コスト効率に優れたコンパクトな形態でこの統合を可能にし、市場の成長を後押ししています。

車載用システムインパッケージ（SiP）市場-主な洞察

当社リサーチアナリストの分析によると、世界市場は予測期間（2024-2032年）に約10.20%のCAGRで年間成長すると予測されています。

パッケージング技術のセグメンテーションに基づくと、2.5D ICパッケージングセグメントは、パッケージングにおけるその生産能力により、2023年に最大の市場シェアを示すと予測されました。

パッケージング方式別では、フリップチップセグメントが、その小型化と多機能性により、2023年のパッケージング方式をリードしました。

最終用途セグメンテーションに基づくと、ADASシステムにおける半導体チップ＆ICの需要増加により、2023年の最終用途はADASセグメントがトップでした。

地域別では、クアルコム、インテル、パワーテックなどの主要企業の存在により、北米が2023年の主要収益源でした。

車載用システムインパッケージ（SiP）市場-セグメンテーション分析：

車載用システムインパッケージ（SiP）の世界市場は、パッケージング技術、パッケージング方法、最終用途、地域に基づいてセグメント化されます。

パッケージング技術によって、2D ICパッケージング、2.5D ICパッケージング、3D ICパッケージングの3つに分類されます。2.5D ICパッケージングセグメントが市場を独占しています。高い生産需要と容易なパッケージングが同分野の成長を促進すると予想されます。

市場はパッケージング方式によって、ワイヤーボンド、フリップチップ、ファンアウトウエハーレベルパッケージングの3つに分類されます。フリップチップセグメントが市場を独占しています。ファンアウトウエハーレベルパッケージングが予測期間中に最も速い速度で拡大する見込みです。小型パッケージング、特にスモールファクターソリューションの需要が高いことが、このセグメントの需要を補完しています。

市場は、最終用途に基づき、インフォテインメント＆テレマティクスモジュール、ADAS、その他の3つのカテゴリーに分類されます。ADAS分野が市場を独占しており、予測期間中も高い優位性を維持するとみられます。EV需要の動向と、安全性を意識したADASシステムの動向が市場成長を促進すると予測されます。

車載用システムインパッケージ（SiP）市場-地域別インサイト

車載SiP市場は、北米、ラテンアメリカ、欧州、アジア太平洋、中東アフリカの各地域に広がっています。アジア太平洋は車載SiPの最大かつ最速成長市場です。中国は世界のEV生産と普及をリードしており、世界のEVの50％以上が中国で販売されています。日本と韓国には、ルネサス、東芝、サムスン、SKハイニックスのような大手半導体メーカーや、ASEグループのようなパッケージ大手メーカーがあります。米国の自動車関連データによると、米国は世界のADAS展開の約25～30%を占めており、小型SiPソリューションに大きく依存しています。さらに、電気自動車（EV）は2030年までに世界の自動車販売台数の約40％を占めると予想されており、先進SiPの需要を大きく押し上げています。

車載用システムインパッケージ（SiP）市場-競合情勢：

車載SiP市場は競争が激しく、急速に進化しています。半導体と車載エレクトロニクスの大手企業は、製品ポートフォリオを強化するために多額の投資を行い、3Dパッケージング技術を革新しています。例えば、Amkor Technology Inc.は、ポルトガルとベトナムに車載用半導体パッケージ専用の新工場を開発し、異種混載SiP開発のためにトップOEM半導体サプライヤーと提携しています。市場参入企業は、タイヤ空気圧監視システム（TPMS）やADAS向けにMEMSセンサとコントローラを統合したSiPソリューションを開発しています。各社はまた、特に放熱性に優れた高信頼性車載パッケージをターゲットとしたSiP機能の拡大にも注力しています。

目次

第1章 車載用システムインパッケージ（SiP）市場概要

  • 調査範囲
  • 市場推定年数

第2章 エグゼクティブサマリー

  • 市場内訳
  • 競合考察

第3章 車載用システムインパッケージ（SiP）の主要市場動向

  • 市場促進要因
  • 市場抑制要因
  • 市場機会
  • 市場の将来動向

第4章 車載用システムインパッケージ（SiP）産業の調査

  • PEST分析
  • ポーターのファイブフォース分析
  • 成長見通しマッピング
  • 規制枠組み分析

第5章 車載用システムインパッケージ（SiP）市場： COVID-19の影響分析

  • COVID-19以前の影響分析
  • COVID-19後の影響分析

第6章 車載用システムインパッケージ（SiP）市場情勢

  • 車載用システムインパッケージ（SiP）市場シェア分析、2024年
  • 主要メーカー別内訳データ
    • ベテラン選手の分析
    • 新興企業の分析

第7章 車載用システムインパッケージ（SiP）市場- パッケージング技術別

  • 概要
    • 包装技術別セグメントシェア分析
    • 2D ICパッケージング
    • 2.5D ICパッケージング
    • 3D ICパッケージング

第8章 車載用システムインパッケージ（SiP）市場- パッケージング方法別

  • 概要
    • 包装方法別セグメントシェア分析
    • ワイヤーボンド
    • フリップチップ
    • ファンアウト型ウエハーレベルパッケージング

第9章 車載用システムインパッケージ（SiP）市場- 最終用途別

  • 概要
    • 用途別セグメントシェア分析
    • インフォテインメントおよびテレマティクスモジュール
    • ADAS
    • その他

第10章 車載用システムインパッケージ（SiP）市場-地域

  • イントロダクション
  • 北米
    • 概要
    • 北米の主要メーカー
    • 米国
    • カナダ
  • 欧州
    • 概要
    • 欧州の主要メーカー
    • ドイツ
    • イタリア
    • 英国
    • フランス
    • ロシア
    • オランダ
    • スウェーデン
    • ポーランド
    • その他
  • アジア太平洋（APAC）
    • 概要
    • アジア太平洋地域の主要メーカー
    • インド
    • 中国
    • 日本
    • 韓国
    • オーストラリア
    • タイ
    • インドネシア
    • フィリピン
    • その他
  • ラテンアメリカ
    • 概要
    • ラテンアメリカの主要メーカー
    • ブラジル
    • メキシコ
    • アルゼンチン
    • コロンビア
    • その他
  • 中東およびアフリカ
    • 概要
    • 中東およびアフリカの主要メーカー
    • サウジアラビア
    • アラブ首長国連邦
    • イスラエル
    • トルコ
    • アルジェリア
    • エジプト
    • その他

第11章 主要ベンダー分析- 車載用システムインパッケージ（SiP）業界

  • 競合ダッシュボード
  • 企業プロファイル
    • NXP Semiconductors
    • Infineon Technologies
    • STMicroelectronics
    • Texas Instruments
    • Qualcomm Technologies, Inc.
    • Amkor Technology
    • ASE Group
    • Renesas Electronics Corporation
    • Samsung Electronics
    • TSMC（Taiwan Semiconductor Manufacturing Company）
    • Intel Corporation
    • ROHM Semiconductor
    • Murata Manufacturing Co., Ltd.
    • Skyworks Solutions, Inc.
    • Analog Devices, Inc.
    • Others

第12章 アナリストの全方位展望

目次
Product Code: ANV5076

REPORT HIGHLIGHT

Automotive System in Package (SiP) Market size was valued at USD 2,103.42 Million in 2023, expanding at a CAGR of 10.20% from 2024 to 2032.

Automotive System-in-Package (SiP) is an advanced packaging method where multiple integrated circuits (ICs) and passive components like resistors, capacitors, and inductors are combined into a single compact package to perform a specific function, optimized for automotive applications.

Automotive System in Package (SiP) Market- Market Dynamics

Increasing demand for EVs & ADAS and the rising trend of connected cars are expected to propel market demand

The Automotive System in Package (SiP) market is witnessing robust growth due to a convergence of technological innovations, adoption EVs, and shifting consumer expectations. SiP technology, which integrates multiple chips and components into a single package. With the global shift toward electric vehicles (EVs), there is a growing need for compact and efficient electronic systems for battery management, motor control, and charging systems. Automotive SiPs help reduce space while ensuring high thermal and electrical performance. Battery Management Systems (BMS), for example, benefit greatly from SiPs because they require real-time monitoring of voltage, current, and temperature across multiple battery cells. SiPs also enhance reliability and reduce assembly complexity, which is crucial in EVs where space and weight are at a premium.

Advanced Driver Assistance System (ADAS) is one of the fastest-growing sectors in automotive electronics. Features such as adaptive cruise control, lane-keeping assistance, automatic emergency braking, and 360-degree camera systems require powerful yet compact electronic control units (ECUs). Automotive SiPs are ideal for such systems as they can integrate sensors, processing units, memory, and power management components in a small footprint. This enables high-speed data processing and minimal signal interference, which are critical for real-time decision-making in ADAS. Modern vehicles are increasingly connected, offering features like over-the-air (OTA) updates, real-time traffic information, vehicle-to-vehicle (V2V) communication, and rich infotainment experiences. These functions require integration of wireless communication modules (Wi-Fi, Bluetooth, 5G), microcontrollers, and multimedia processors. The growing consumer demand for immersive in-car experiences and continuous connectivity is a strong driver for SiP adoption. Automotive SiPs enable this integration in a cost-effective and compact form, supporting seamless data communication and multimedia processing, fueling market growth.

Automotive System in Package (SiP) Market- Key Insights

As per the analysis shared by our research analyst, the global market is estimated to grow annually at a CAGR of around 10.20% over the forecast period (2024-2032)

Based on Packaging Technology segmentation, 2.5D IC packaging segment was predicted to show maximum market share in the year 2023, owing to its production capacity in packaging.

Based on Packaging Method segmentation, flip chip segment was the leading Packaging Method in 2023, due to its reduced size and more functionalities.

Based on End Use segmentation, ADAS segment was the leading End Use in 2023, due to increased demand for semiconductor chips & ICs in ADAS system.

On the basis of the region, North America was the leading revenue generator in 2023, owing to the presence of top companies like Qualcomm, Intel, Powertech, etc.

Automotive System in Package (SiP) Market- Segmentation Analysis:

The Global Automotive System in Package (SiP) Market is segmented on the basis of Packaging Technology, Packaging Method, End Use, and Region.

The market is divided into three categories based on Packaging Technology: 2D IC packaging, 2.5D IC packaging, and 3D IC packaging. The 2.5D IC packaging segment dominates the market. High production demand and easy packaging is expected to fuel segment growth.

The market is divided into three categories based on the Packaging Method: wire bond, flip chip, and fan-out wafer level packaging. The flip-chip segment dominates the market. The fan-out wafer-level packaging is expected to expand at the fastest rate over the forecast period. The high demand from compact packaging, especially small factor solutions, is supplementing segment demand.

The market is divided into three categories based on End Use: infotainment & telematics modules, ADAS, and others. The ADAS segment dominates the market and is expected to maintain its high dominance during the forecast period. Growing demand for EVs and trend of ADAS system with safety awareness is anticipated to foster market growth.

Automotive System in Package (SiP) Market- Geographical Insights

Worldwide, the Automotive System in Package (SiP) market is widespread in the regions of North America, Latin America, Europe, Asia Pacific, and the Middle East and Africa. Asia-Pacific is the largest and fastest-growing market for automotive SiPs. China leads global EV production and adoption with over 50% of the world's EVs being sold in China. Japan and South Korea house major semiconductor giants like Renesas, Toshiba, Samsung, SK Hynix, and packaging leaders like ASE Group. According to the U.S. automotive data, the U.S. accounts for around 25-30% of global ADAS deployments, heavily reliant on miniaturized SiP solutions. In addition, Electric vehicles (EVs) are expected to represent about 40% of global car sales by 2030, heavily pushing demand for advanced SiPs.

Automotive System in Package (SiP) Market- Competitive Landscape:

The Automotive SiP market is highly competitive and rapidly evolving. Major players in semiconductors and automotive electronics are investing heavily to strengthen their product portfolios, innovating 3D packaging technologies. For example, Amkor Technology Inc. Opened new factories dedicated to automotive semiconductor packaging in Portugal and Vietnam and partnering with top OEM semiconductor suppliers for heterogeneous SiP development. Market participants are developing SiP solutions integrating MEMS sensors and controllers for tire pressure monitoring systems (TPMS) and ADAS. Companies also focus on expansion of SiP capabilities specifically targeted at high-reliability automotive packages with better thermal dissipation.

Recent Developments:

In 2024, Infineon Technologies introduced AURIX SiP microcontrollers targeting safety-critical applications like autonomous driving.

In 2024, NXP Semiconductors announced heavy investment in S32 Automotive Platform combining SiP concepts for scalability across vehicle domains as a part of their key strategy.

SCOPE OF THE REPORT

The scope of this report covers the market by its major segments, which include as follows:

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET KEY PLAYERS

  • NXP Semiconductors
  • Infineon Technologies
  • STMicroelectronics
  • Texas Instruments
  • Qualcomm Technologies, Inc.
  • Amkor Technology
  • ASE Group
  • Renesas Electronics Corporation
  • Samsung Electronics
  • TSMC (Taiwan Semiconductor Manufacturing Company)
  • Intel Corporation
  • ROHM Semiconductor
  • Murata Manufacturing Co., Ltd.
  • Skyworks Solutions, Inc.
  • Analog Devices, Inc.
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING TECHNOLOGY- MARKET ANALYSIS, 2019-2032

  • 2D IC packaging
  • 2.5D IC packaging
  • 3D IC packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY PACKAGING METHOD- MARKET ANALYSIS, 2019-2032

  • Wire bond
  • Flip chip
  • Fan-out wafer level packaging

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY END USE- MARKET ANALYSIS, 2019-2032

  • Infotainment & Telematics Modules
  • ADAS
  • Others

GLOBAL AUTOMOTIVE SYSTEM IN PACKAGE (SIP) MARKET, BY REGION- MARKET ANALYSIS, 2019-2032

  • North America
  • The U.S.
  • Canada
  • Europe
  • Germany
  • France
  • Italy
  • Spain
  • United Kingdom
  • Russia
  • Netherlands
  • Sweden
  • Poland
  • Rest of Europe
  • Asia Pacific
  • India
  • China
  • South Korea
  • Japan
  • Australia
  • Thailand
  • Indonesia
  • Philippines
  • Rest of APAC
  • Latin America
  • Brazil
  • Mexico
  • Argentina
  • Colombia
  • Rest of LATAM
  • The Middle East and Africa
  • Saudi Arabia
  • United Arab Emirates
  • Israel
  • Turkey
  • Algeria
  • Egypt
  • Rest of MEA

Table of Contents

1. Automotive System in Package (SiP) Market Overview

  • 1.1. Study Scope
  • 1.2. Market Estimation Years

2. Executive Summary

  • 2.1. Market Snippet
    • 2.1.1. Automotive System in Package (SiP) Market Snippet by Packaging Technology
    • 2.1.2. Automotive System in Package (SiP) Market Snippet by Packaging Method
    • 2.1.3. Automotive System in Package (SiP) Market Snippet by End Use
    • 2.1.4. Automotive System in Package (SiP) Market Snippet by Country
    • 2.1.5. Automotive System in Package (SiP) Market Snippet by Region
  • 2.2. Competitive Insights

3. Automotive System in Package (SiP) Key Market Trends

  • 3.1. Automotive System in Package (SiP) Market Drivers
    • 3.1.1. Impact Analysis of Market Drivers
  • 3.2. Automotive System in Package (SiP) Market Restraints
    • 3.2.1. Impact Analysis of Market Restraints
  • 3.3. Automotive System in Package (SiP) Market Opportunities
  • 3.4. Automotive System in Package (SiP) Market Future Trends

4. Automotive System in Package (SiP) Industry Study

  • 4.1. PEST Analysis
  • 4.2. Porter's Five Forces Analysis
  • 4.3. Growth Prospect Mapping
  • 4.4. Regulatory Framework Analysis

5. Automotive System in Package (SiP) Market: COVID-19 Impact Analysis

  • 5.1. Pre-COVID-19 Impact Analysis
  • 5.2. Post-COVID-19 Impact Analysis
    • 5.2.1. Top Performing Segments
    • 5.2.2. Marginal Growth Segments
    • 5.2.3. Top Looser Segments
    • 5.2.4. Marginal Loss Segments

6. Automotive System in Package (SiP) Market Landscape

  • 6.1. Automotive System in Package (SiP) Market Share Analysis, 2024
  • 6.2. Breakdown Data, by Key Manufacturer
    • 6.2.1. Established Players' Analysis
    • 6.2.2. Emerging Players' Analysis

7. Automotive System in Package (SiP) Market - By Packaging Technology

  • 7.1. Overview
    • 7.1.1. Segment Share Analysis, By Packaging Technology, 2024 & 2032 (%)
    • 7.1.2. 2D IC packaging
    • 7.1.3. 2.5D IC packaging
    • 7.1.4. 3D IC packaging

8. Automotive System in Package (SiP) Market - By Packaging Method

  • 8.1. Overview
    • 8.1.1. Segment Share Analysis, By Packaging Method, 2024 & 2032 (%)
    • 8.1.2. Wire bond
    • 8.1.3. Flip chip
    • 8.1.4. Fan-out wafer level packaging

9. Automotive System in Package (SiP) Market - By End Use

  • 9.1. Overview
    • 9.1.1. Segment Share Analysis, By End Use, 2024 & 2032 (%)
    • 9.1.2. Infotainment & Telematics Modules
    • 9.1.3. ADAS
    • 9.1.4. Others

10. Automotive System in Package (SiP) Market- By Geography

  • 10.1. Introduction
    • 10.1.1. Segment Share Analysis, By Geography, 2024 & 2032 (%)
  • 10.2. North America
    • 10.2.1. Overview
    • 10.2.2. Automotive System in Package (SiP) Key Manufacturers in North America
    • 10.2.3. North America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.2.4. North America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.2.5. North America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.2.6. North America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.7. U.S.
      • 10.2.7.1. Overview
      • 10.2.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.7.3. U.S. Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.7.4. U.S. Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.7.5. U.S. Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.2.8. Canada
      • 10.2.8.1. Overview
      • 10.2.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.2.8.3. Canada Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.2.8.4. Canada Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.2.8.5. Canada Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.3. Europe
    • 10.3.1. Overview
    • 10.3.2. Automotive System in Package (SiP) Key Manufacturers in Europe
    • 10.3.3. Europe Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.3.4. Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.3.5. Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.3.6. Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.7. Germany
      • 10.3.7.1. Overview
      • 10.3.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.7.3. Germany Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.7.4. Germany Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.7.5. Germany Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.8. Italy
      • 10.3.8.1. Overview
      • 10.3.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.8.3. Italy Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.8.4. Italy Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.8.5. Italy Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.9. United Kingdom
      • 10.3.9.1. Overview
      • 10.3.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.9.3. United Kingdom Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.9.4. United Kingdom Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.9.5. United Kingdom Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.10. France
      • 10.3.10.1. Overview
      • 10.3.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.10.3. France Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.10.4. France Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.10.5. France Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.11. Russia
      • 10.3.11.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.11.2. Russia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.11.3. Russia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.11.4. Russia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.12. Netherlands
      • 10.3.12.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.12.2. Netherlands Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.12.3. Netherlands Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.12.4. Netherlands Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.13. Sweden
      • 10.3.13.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.13.2. Sweden Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.13.3. Sweden Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.13.4. Sweden Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.14. Poland
      • 10.3.14.1. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.14.2. Poland Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.14.3. Poland Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.14.4. Poland Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.3.15. Rest of Europe
      • 10.3.15.1. Overview
      • 10.3.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.3.15.3. Rest of the Europe Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.3.15.4. Rest of the Europe Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.3.15.5. Rest of the Europe Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.4. Asia Pacific (APAC)
    • 10.4.1. Overview
    • 10.4.2. Automotive System in Package (SiP) Key Manufacturers in Asia Pacific
    • 10.4.3. Asia Pacific Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.4.4. Asia Pacific Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.4.5. Asia Pacific Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.4.6. Asia Pacific Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.7. India
      • 10.4.7.1. Overview
      • 10.4.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.7.3. India Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.7.4. India Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.7.5. India Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.8. China
      • 10.4.8.1. Overview
      • 10.4.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.8.3. China Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.8.4. China Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.8.5. China Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.9. Japan
      • 10.4.9.1. Overview
      • 10.4.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.9.3. Japan Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.9.4. Japan Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.9.5. Japan Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.10. South Korea
      • 10.4.10.1. Overview
      • 10.4.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.10.3. South Korea Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.10.4. South Korea Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.10.5. South Korea Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.11. Australia
      • 10.4.11.1. Overview
      • 10.4.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.11.3. Australia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.11.4. Australia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.11.5. Australia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.12. Thailand
      • 10.4.12.1. Overview
      • 10.4.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.12.3. Thailand Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.12.4. Thailand Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.12.5. Thailand Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.13. Indonesia
      • 10.4.13.1. Overview
      • 10.4.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.13.3. Indonesia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.13.4. Indonesia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.13.5. Indonesia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.14. Philippines
      • 10.4.14.1. Overview
      • 10.4.14.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.14.3. Philippines Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.14.4. Philippines Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.14.5. Philippines Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.4.15. Rest of APAC
      • 10.4.15.1. Overview
      • 10.4.15.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.4.15.3. Rest of APAC Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.4.15.4. Rest of APAC Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.4.15.5. Rest of APAC Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.5. Latin America
    • 10.5.1. Overview
    • 10.5.2. Automotive System in Package (SiP) Key Manufacturers in Latin America
    • 10.5.3. Latin America Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.5.4. Latin America Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.5.5. Latin America Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.5.6. Latin America Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.7. Brazil
      • 10.5.7.1. Overview
      • 10.5.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.7.3. Brazil Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.7.4. Brazil Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.7.5. Brazil Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.8. Mexico
      • 10.5.8.1. Overview
      • 10.5.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.8.3. Mexico Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.8.4. Mexico Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.8.5. Mexico Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.9. Argentina
      • 10.5.9.1. Overview
      • 10.5.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.9.3. Argentina Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.9.4. Argentina Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.9.5. Argentina Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.10. Colombia
      • 10.5.10.1. Overview
      • 10.5.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.10.3. Colombia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.10.4. Colombia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.10.5. Colombia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.5.11. Rest of LATAM
      • 10.5.11.1. Overview
      • 10.5.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.5.11.3. Rest of LATAM Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.5.11.4. Rest of LATAM Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.5.11.5. Rest of LATAM Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
  • 10.6. Middle East and Africa
    • 10.6.1. Overview
    • 10.6.2. Automotive System in Package (SiP) Key Manufacturers in Middle East and Africa
    • 10.6.3. Middle East and Africa Market Size and Forecast, By Country, 2019 - 2032 (US$ Million)
    • 10.6.4. Middle East and Africa Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
    • 10.6.5. Middle East and Africa Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
    • 10.6.6. Middle East and Africa Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.7. Saudi Arabia
      • 10.6.7.1. Overview
      • 10.6.7.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.7.3. Saudi Arabia Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.7.4. Saudi Arabia Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.7.5. Saudi Arabia Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.8. United Arab Emirates
      • 10.6.8.1. Overview
      • 10.6.8.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.8.3. United Arab Emirates Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.8.4. United Arab Emirates Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.8.5. United Arab Emirates Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.9. Israel
      • 10.6.9.1. Overview
      • 10.6.9.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.9.3. Israel Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.9.4. Israel Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.9.5. Israel Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.10. Turkey
      • 10.6.10.1. Overview
      • 10.6.10.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.10.3. Turkey Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.10.4. Turkey Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.10.5. Turkey Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.11. Algeria
      • 10.6.11.1. Overview
      • 10.6.11.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.11.3. Algeria Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.11.4. Algeria Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.11.5. Algeria Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.12. Egypt
      • 10.6.12.1. Overview
      • 10.6.12.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.12.3. Egypt Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.12.4. Egypt Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.12.5. Egypt Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)
    • 10.6.13. Rest of MEA
      • 10.6.13.1. Overview
      • 10.6.13.2. Market Analysis, Forecast, and Y-O-Y Growth Rate, 2019 - 2032, (US$ Million)
      • 10.6.13.3. Rest of MEA Market Size and Forecast, By Packaging Technology, 2019 - 2032 (US$ Million)
      • 10.6.13.4. Rest of MEA Market Size and Forecast, By Packaging Method, 2019 - 2032 (US$ Million)
      • 10.6.13.5. Rest of MEA Market Size and Forecast, By End Use, 2019 - 2032 (US$ Million)

11. Key Vendor Analysis- Automotive System in Package (SiP) Industry

  • 11.1. Competitive Dashboard
  • 11.2. Company Profiles
    • 11.2.1. NXP Semiconductors
    • 11.2.2. Infineon Technologies
    • 11.2.3. STMicroelectronics
    • 11.2.4. Texas Instruments
    • 11.2.5. Qualcomm Technologies, Inc.
    • 11.2.6. Amkor Technology
    • 11.2.7. ASE Group
    • 11.2.8. Renesas Electronics Corporation
    • 11.2.9. Samsung Electronics
    • 11.2.10. TSMC (Taiwan Semiconductor Manufacturing Company)
    • 11.2.11. Intel Corporation
    • 11.2.12. ROHM Semiconductor
    • 11.2.13. Murata Manufacturing Co., Ltd.
    • 11.2.14. Skyworks Solutions, Inc.
    • 11.2.15. Analog Devices, Inc.
    • 11.2.16. Others

12. 360 Degree Analyst View

13. Appendix

  • 13.1. Research Methodology
  • 13.2. References
  • 13.3. Abbreviations
  • 13.4. Disclaimer
  • 13.5. Contact Us