電子包装の市場規模、シェア、成長分析：タイプ別、包装材料別、包装技術別、用途別、地域別 - 産業予測 2025～2032年

電子包装の世界市場規模は2023年に348億2,000万米ドルとなり、予測期間（2025-2032年）のCAGRは4.2％で成長し、2024年の362億8,000万米ドルから2032年には504億2,000万米ドルに拡大する見通しです。

IoT、AI、先端エレクトロニクスの融合が、家電や自動車分野での洗練された電子包装の需要を促進しています。最近、アムコアテクノロジーはサムスン電子と共同で革新的なH-Cubeソリューションを開発し、高性能半導体アプリケーション向けのハイブリッド基板キューブ技術の機能を強化しました。5Gへの移行、特にMIMOを備えた802.11acは、最大1.3GHzの速度を約束し、市場の需要をさらに促進しています。また、Smurfit Kappaがブラジルで3,300万米ドルを投じてパッケージング・ソリューション用の施設を拡張したように、ミニマリズムを取り入れた革新的なデザインも成長に影響を与えています。電気自動車（EV）の普及に後押しされた自動車部門は、最大の市場セグメントを占めており、インドのEV市場は2025年までに70億9,000万米ドルに達し、2030年までに2,060億米ドル相当のさらなるビジネスチャンスに牽引されると予測され、電子包装の進歩を促しています。

目次

イントロダクション

• 調査の目的
• 調査範囲
• 定義

調査手法

• 情報調達
• 二次データと一次データの方法
• 市場規模予測
• 市場の前提条件と制限

エグゼクティブサマリー

• 世界市場の見通し
• 供給と需要の動向分析
• セグメント別機会分析

市場力学と見通し

• 市場概要
• 市場規模
• 市場力学
  • 促進要因と機会
  • 抑制要因と課題
• ポーターの分析

主な市場の考察

• 重要成功要因
• 競合の程度
• 主な投資機会
• 市場エコシステム
• 市場の魅力指数（2024年）
• PESTEL分析
• マクロ経済指標
• バリューチェーン分析
• 価格分析

電子包装市場規模：タイプ別& CAGR（2025-2032）

• 市場概要
• 段ボール箱
• 段ボール箱
• 熱成形トレイ
• バッグとポーチ
• ブリスターパックとクラムシェル
• 保護
• フレキシブル包装
• 硬質包装

電子包装市場規模：包装材料別& CAGR（2025-2032）

• 市場概要
• プラスチック
• 金属
• ガラス
• 板紙

電子包装市場規模：包装技術別& CAGR（2025-2032）

• 市場概要
• サーマル包装
• 保護包装
• ガス置換包装

電子包装市場規模：用途別& CAGR（2025-2032）

• 市場概要
• 家電
• 産業用電子機器
• 通信
• 自動車エレクトロニクス

電子包装市場規模：地域別& CAGR（2025-2032）

• 北米
  • 米国
  • カナダ
• 欧州
  • ドイツ
  • スペイン
  • フランス
  • 英国
  • イタリア
  • その他欧州地域
• アジア太平洋地域
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• ラテンアメリカ
  • ブラジル
  • その他ラテンアメリカ地域
• 中東・アフリカ
  • GCC諸国
  • 南アフリカ
  • その他中東・アフリカ

競合情報

• 上位5社の比較
• 主要企業の市場ポジショニング（2024年）
• 主な市場企業が採用した戦略
• 市場の最近の動向
• 企業の市場シェア分析（2024年）
• 主要企業の企業プロファイル
  • 会社概要
  • 製品ポートフォリオ分析
  • セグメント別シェア分析
  • 収益の前年比比較（2022-2024）

主要企業プロファイル

• Amkor Technology, Inc.（United States）
• ASE Technology Holding Co., Ltd.（Taiwan）
• Jabil Inc.（United States）
• BE Semiconductor Industries N.V.（Besi）（Netherlands）
• Kulicke & Soffa Industries, Inc.（Singapore）
• Tokyo Electron Limited（Japan）
• Toppan Inc.（Japan）
• Shinko Electric Industries Co., Ltd.（Japan）
• Unimicron Technology Corporation（Taiwan）
• Samsung Electro-Mechanics Co., Ltd.（South Korea）
• LG Innotek Co., Ltd.（South Korea）
• ASE Group（Taiwan）
• SPIL（Siliconware Precision Industries Co., Ltd.）（Taiwan）
• Powertech Technology Inc.（Taiwan）
• JCET Group Co., Ltd.（China）
• Tongfu Microelectronics Co., Ltd.（China）
• Hana Micron Inc.（South Korea）
• ASE Technology Holding Co., Ltd.（Taiwan）
• Nepes Corporation（South Korea）

結論と推奨事項

Global Electronic Packaging Market size was valued at USD 34.82 billion in 2023 and is poised to grow from USD 36.28 billion in 2024 to USD 50.42 billion by 2032, growing at a CAGR of 4.2% during the forecast period (2025-2032).

The convergence of IoT, AI, and advanced electronics is propelling the demand for sophisticated electronic packaging in consumer electronics and automotive sectors. Recently, Amcor Technology collaborated with Samsung Electronics to develop the innovative H-Cube solution, enhancing the capabilities of Hybrid-Substrate Cube technology for high-performance semiconductor applications. The transition to 5G, specifically 802.11ac with MIMO, promises speeds up to 1.3 GHz, further driving market demand. Innovative designs with minimalism are also influencing growth, as seen in Smurfit Kappa's $33 million facility expansion in Brazil for packaging solutions. The automotive sector, fueled by electric vehicle (EV) adoption, represents the largest market segment, with projections indicating the Indian EV market could reach $7.09 billion by 2025, driven by further opportunities worth $206 billion by 2030, thus stimulating electronic packaging advancements.

Top-down and bottom-up approaches were used to estimate and validate the size of the Global Electronic Packaging market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Global Electronic Packaging Market Segmental Analysis

Global Electronic Packaging Market is segmented by Type, Packaging Material, Packaging Technology, Application and region. Based on Type, the market is segmented into Corrugated Boxes, Paperboard Boxes, Thermoformed Trays, Bags and Pouches, Blister packs and Clamshell, Protective, Flexible Packaging and Rigid Packaging. Based on Packaging Material, the market is segmented into Plastic, Metal, Glass and Paperboard. Based on Packaging Technology, the market is segmented into Thermal Packaging, Protective Packaging and Modified Atmosphere Packaging. Based on Application, the market is segmented into Consumer Electronics, Industrial Electronics, Telecommunications and Automotive Electronics. Based on region, the market is segmented into North America, Europe, Asia Pacific, Latin America and Middle East & Africa.

Driver of the Global Electronic Packaging Market

The Global Electronic Packaging market is significantly propelled by the ongoing advancements in miniaturization. As the demand for compact electronics like smartphones and wearable IoT devices continues to grow, there is an increasing need for improved semiconductor packaging techniques. Miniaturization not only helps reduce the size and weight of electronic devices, enhancing their performance, but it also facilitates the integration of multiple functions and features within a single compact unit. This evolution in packaging technology enables manufacturers to create more efficient and powerful devices, ultimately driving innovation and expanding the capabilities of electronic products in the market.

Restraints in the Global Electronic Packaging Market

The Global Electronic Packaging market faces several constraints, with financial limitations being a significant factor. The use of advanced packaging technologies necessitates intricate components, specialized machinery, and high-quality materials, all contributing to elevated production costs. Additionally, manufacturers often encounter challenges related to ongoing investments in innovative packaging technologies and equipment. The competitive landscape, along with pricing pressures from customers, further complicates profitability, potentially hindering the willingness of manufacturers to adopt enhanced packaging solutions. As a result, the financial strain experienced by companies in this sector can significantly impact their ability to innovate and improve their product offerings.

Market Trends of the Global Electronic Packaging Market

The Global Electronic Packaging market is experiencing a notable upward trend, driven by the surging demand for electronic products, particularly in regions like India and China. As the electronics sector in India is projected to reach USD 220 billion by 2025, bolstered by robust regulatory frameworks and increased capital investment, the need for efficient packaging solutions is escalating. Additionally, China's industrial growth, fueled by advancements in technology and

Table of Contents

Introduction

• Objectives of the Study
• Scope of the Report
• Definitions

Research Methodology

• Information Procurement
• Secondary & Primary Data Methods
• Market Size Estimation
• Market Assumptions & Limitations

Executive Summary

• Global Market Outlook
• Supply & Demand Trend Analysis
• Segmental Opportunity Analysis

Market Dynamics & Outlook

• Market Overview
• Market Size
• Market Dynamics
  • Drivers & Opportunities
  • Restraints & Challenges
• Porters Analysis
  • Competitive rivalry
  • Threat of substitute
  • Bargaining power of buyers
  • Threat of new entrants
  • Bargaining power of suppliers

Key Market Insights

• Key Success Factors
• Degree of Competition
• Top Investment Pockets
• Market Ecosystem
• Market Attractiveness Index, 2024
• PESTEL Analysis
• Macro-Economic Indicators
• Value Chain Analysis
• Pricing Analysis

Global Electronic Packaging Market Size by Type & CAGR (2025-2032)

• Market Overview
• Corrugated Boxes
• Paperboard Boxes
• Thermoformed Trays
• Bags and Pouches
• Blister packs and Clamshell
• Protective
• Flexible Packaging
• Rigid Packaging

Global Electronic Packaging Market Size by Packaging Material & CAGR (2025-2032)

• Market Overview
• Plastic
• Metal
• Glass
• Paperboard

Global Electronic Packaging Market Size by Packaging Technology & CAGR (2025-2032)

• Market Overview
• Thermal Packaging
• Protective Packaging
• Modified Atmosphere Packaging

Global Electronic Packaging Market Size by Application & CAGR (2025-2032)

• Market Overview
• Consumer Electronics
• Industrial Electronics
• Telecommunications
• Automotive Electronics

Global Electronic Packaging Market Size & CAGR (2025-2032)

• North America (Type, Packaging Material, Packaging Technology, Application)
  • US
  • Canada
• Europe (Type, Packaging Material, Packaging Technology, Application)
  • Germany
  • Spain
  • France
  • UK
  • Italy
  • Rest of Europe
• Asia Pacific (Type, Packaging Material, Packaging Technology, Application)
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
• Latin America (Type, Packaging Material, Packaging Technology, Application)
  • Brazil
  • Rest of Latin America
• Middle East & Africa (Type, Packaging Material, Packaging Technology, Application)
  • GCC Countries
  • South Africa
  • Rest of Middle East & Africa

Competitive Intelligence

• Top 5 Player Comparison
• Market Positioning of Key Players, 2024
• Strategies Adopted by Key Market Players
• Recent Developments in the Market
• Company Market Share Analysis, 2024
• Company Profiles of All Key Players
  • Company Details
  • Product Portfolio Analysis
  • Company's Segmental Share Analysis
  • Revenue Y-O-Y Comparison (2022-2024)

Key Company Profiles

• Amkor Technology, Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Jabil Inc. (United States)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• BE Semiconductor Industries N.V. (Besi) (Netherlands)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Kulicke & Soffa Industries, Inc. (Singapore)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tokyo Electron Limited (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Toppan Inc. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Shinko Electric Industries Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Unimicron Technology Corporation (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Samsung Electro-Mechanics Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• LG Innotek Co., Ltd. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Group (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• SPIL (Siliconware Precision Industries Co., Ltd.) (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Powertech Technology Inc. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• JCET Group Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Tongfu Microelectronics Co., Ltd. (China)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Hana Micron Inc. (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• ASE Technology Holding Co., Ltd. (Taiwan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
• Nepes Corporation (South Korea)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments

Conclusion & Recommendations