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市場調査レポート
商品コード
1373824

電子接着剤の世界市場 (2023-2030年):タイプ (導電性接着剤・熱伝導性接着剤)・用途 (プリント基板・半導体・ICパッケージング) 別の規模・シェア・成長分析・予測

Global Electronic Adhesives Market Size, Share, Growth Analysis, By Type(Electrically Conductive Adhesives, Thermally Conductive Adhesives), By Application(Printed Circuit Boards, Semiconductor and IC Packaging) - Industry Forecast 2023-2030

出版日: | 発行: SkyQuest | ページ情報: 英文 157 Pages | 納期: 3~5営業日

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=158.54円
電子接着剤の世界市場 (2023-2030年):タイプ (導電性接着剤・熱伝導性接着剤)・用途 (プリント基板・半導体・ICパッケージング) 別の規模・シェア・成長分析・予測
出版日: 2023年10月12日
発行: SkyQuest
ページ情報: 英文 157 Pages
納期: 3~5営業日
  • 全表示
  • 概要
  • 目次
概要

世界の電子接着剤の市場規模は、2021年の77億米ドル、2022年の82億9,000万米ドルから、予測期間中は7.7%のCAGRで推移し、2030年には150億9,000万米ドルの規模に成長すると予測されています。

世界の電子接着剤の市場は、主に電子機器への需要の急増と技術進歩により、近年大幅な拡大を遂げています。この成長は主に、CE製品、自動車、航空宇宙、ヘルスケアなど、さまざまな産業における電子デバイスの消費の拡大に起因しています。スマートフォン、タブレット、ウェアラブルデバイス、スマート家電の普及により、電子接着剤のニーズが大幅に高まっています。また、電子部品の小型化やフレキシブルエレクトロニクスやウェアラブルエレクトロニクスの人気の高まりも、市場成長をさらに加速させています。世界市場における重要な動向としては、環境に優しく持続可能な接着剤ソリューションへの移行があります。環境規制の高まりと消費者意識の高まりを受け、メーカーは揮発性有機化合物 (VOC) レベルが低く、環境への影響が少ない接着剤の開発に重点を置いています。このシフトは、安全性と持続可能性を高めるだけでなく、性能基準も維持する水性接着剤や無溶剤接着剤の採用につながっています。

当レポートでは、世界の電子接着剤の市場を調査し、市場概要、市場への各種影響因子の分析、技術・イノベーションの動向、法規制環境、市場規模の推移・予測、各種区分・地域別の内訳、競合情勢、主要企業のプロファイルなどをまとめています。

目次

  • エグゼクティブサマリー
  • 調査手法
  • 親市場の分析
    • 市場概要
    • 市場規模
    • 市場力学
      • 促進要因
      • 機会
      • 抑制要因
      • 課題
  • 主要な市場洞察
    • 技術分析
    • 価格分析
    • サプライチェーン分析
    • バリューチェーン分析
    • 市場のエコシステム
    • IP分析
    • 貿易分析
    • スタートアップ分析
    • 原材料分析
    • イノベーションマトリックス
    • パイプライン製品の分析
    • マクロ経済指標
    • 主要投資分析
    • 主要な成功要因
    • 競合の程度
    • 市場力学と見通し
      • 市場力学
        • 促進要因
        • 機会
        • 抑制要因
        • 課題
    • 規制状況
    • ポーターの分析
    • 将来のディスラプションに関するSkyquestの特別な洞察
  • 世界の電子接着剤市場:タイプ別
    • 市場概要
    • 導電性接着剤
    • 熱伝導性接着剤
    • UV硬化型接着剤・シリコーン系接着剤
  • 世界の電子接着剤市場:用途別
    • 市場概要
    • プリント基板
    • 半導体・ICパッケージング
    • ディスプレイ・タッチパネル
    • ポッティング・封止・その他
  • 世界の電子接着剤市場:地域別
    • 市場概要
    • 北米
    • 欧州
    • アジア太平洋
    • ラテンアメリカ
    • 中東・アフリカ
  • 競合情勢
    • トップ5社の比較
    • 主要企業の市場での位置付け
    • 主要企業の採用戦略
    • 主要成功戦略
    • 市場における最近の活動
    • 主要企業の市場シェア
  • 主要企業プロファイル
    • Henkel AG & Co. KGaA
    • 3M Company
    • H.B. Fuller Company
    • Dow Inc.
    • Dymax Corporation
    • Shin-Etsu Chemical Co., Ltd.
    • Hitachi Chemical Co., Ltd.
    • LORD Corporation
    • Huntsman Corporation
目次
Product Code: SQMIG45K2057

Global Electronic Adhesives Market size was valued at USD 7.7 billion in 2021 and is poised to grow from USD 8.29 billion in 2022 to USD 15.09 billion by 2030, growing at a CAGR of 7.7% during the forecast period (2023-2030).

The global electronic adhesives market has experienced substantial expansion in recent years, primarily due to the surging demand for electronic devices and technological advancements. This growth is primarily attributed to the increased consumption of electronic devices in various industries such as consumer electronics, automotive, aerospace, and healthcare. The widespread adoption of smartphones, tablets, wearable devices, and smart home appliances has created a significant upswing in the need for electronic adhesives. Furthermore, the development of smaller electronic components and the growing popularity of flexible and wearable electronics have further accelerated the market's progress. An important trend in the worldwide market is the transition towards eco-friendly and sustainable adhesive solutions. Given the escalating environmental regulations and heightened consumer consciousness, manufacturers are placing a strong emphasis on creating adhesives with lower levels of volatile organic compounds (VOCs) and reduced environmental impact. This shift has led to the adoption of water-based and solvent-free adhesives, which not only enhance safety and sustainability but also maintain performance standards.

Top-down and bottom-up approaches were used to estimate and validate the size of the global electronic adhesives market and to estimate the size of various other dependent submarkets. The research methodology used to estimate the market size includes the following details: The key players in the market were identified through secondary research, and their market shares in the respective regions were determined through primary and secondary research. This entire procedure includes the study of the annual and financial reports of the top market players and extensive interviews for key insights from industry leaders such as CEOs, VPs, directors, and marketing executives. All percentage shares split, and breakdowns were determined by using secondary sources and verified through Primary sources. All possible parameters that affect the markets covered in this research study have been accounted for, viewed in extensive detail, verified through primary research, and analyzed to get the final quantitative and qualitative data.

Segments covered in this report

Global Electronic Adhesives Market is segmented by type, application, and region. Based on type, the market can be segmented into Electrically Conductive Adhesives, Thermally Conductive Adhesives, UV Curing Adhesives and Silicone Adhesives. Based on application, the market is segmented into Printed Circuit Boards, Semiconductor and IC Packaging, Display and Touch Panels, Potting and Encapsulation and Others. Based on region, the market is segmented into North America, Europe, Asia Pacific, Middle East and Africa, and Latin America.

Drivers:

Technological Advancements and Miniaturization

The ongoing progress in technology has led to the shrinking of electronic components and devices. This development underscores the importance of employing electronic adhesives that exhibit outstanding adhesive qualities, excellent thermal conductivity, and low viscosity. These attributes are essential for optimizing assembly procedures and upholding the dependability of small-scale electronic products. As technology continues its advancement, electronic adhesives become increasingly crucial in facilitating the growth and operation of compact electronic devices.

Restraints:

Limitations in High-Temperature Applications

It's crucial to take into account the constraints associated with electronic adhesives in high-temperature scenarios. Some adhesives have particular temperature limits beyond which they encounter difficulties. Elevated operational temperatures can result in problems such as deterioration, diminished adhesion strength, or disparities in thermal expansion. Consequently, the utilization of specific adhesives in situations involving high temperatures is restricted. To overcome this limitation in the market, manufacturers and researchers are continuously striving to create electronic adhesives capable of enduring higher temperatures, thus broadening their scope of applications.

Market Trends:

A notable development observed in the worldwide electronic adhesives market involves the increasing desire for miniaturization and cutting-edge packaging technologies within the electronics industry. As consumer electronics, automotive electronics, and various electronic devices progressively reduce in size, weight, and overall dimensions, the demand for effective and trustworthy bonding solutions has grown substantially. Electronic adhesives are essential in ensuring robust and enduring connections among diverse electronic components, guaranteeing their optimal performance and extended dependability.

Table of Contents

  • Executive Summary
    • Market Overview
    • Wheel of Fortune
  • Research Methodology
    • Information Procurement
    • Secondary & Primary Data Sources
    • Market Size Estimation
    • Market Assumptions & Limitations
  • Parent Market Analysis
    • Market Overview
    • Market Size
    • Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges
  • Key Market Insights
    • Technology Analysis
    • Pricing Analysis
    • Supply Chain Analysis
    • Value Chain Analysis
    • Ecosystem of the Market
    • IP Analysis
    • Trade Analysis
    • Startup Analysis
    • Raw Material Analysis
    • Innovation Matrix
    • Pipeline Product Analysis
    • Macroeconomic Indicators
    • Top Investment Analysis
    • Key Success Factor
    • Degree of Competition
  • Market Dynamics & Outlook
    • Market Dynamics
  • Drivers
  • Opportunities
  • Restraints
  • Challenges
    • Regulatory Landscape
    • Porters Analysis
  • Competitive rivalry
  • Threat of Substitute Products
  • Bargaining Power of Buyers
  • Threat of New Entrants
  • Bargaining Power of Suppliers
    • Skyquest Special Insights on Future Disruptions
  • Political Impact
  • Economic Impact
  • Social Impact
  • Technical Impact
  • Environmental Impact
  • Legal Impact
  • Global Electronic Adhesives Market by Type
    • Market Overview
    • Electrically Conductive Adhesives
    • Thermally Conductive Adhesives
    • UV Curing Adhesives and Silicone Adhesives
  • Global Electronic Adhesives Market by Application
    • Market Overview
    • Printed Circuit Boards
    • Semiconductor and IC Packaging
    • Display and Touch Panels
    • Potting and Encapsulation and Others
  • Global Electronic Adhesives Market Size by Region
    • Market Overview
    • North America
  • USA
  • Canada
    • Europe
  • Germany
  • Spain
  • France
  • UK
  • Rest of Europe
    • Asia Pacific
  • China
  • India
  • Japan
  • South Korea
  • Rest of Asia-Pacific
    • Latin America
  • Brazil
  • Rest of Latin America
    • Middle East & Africa (MEA)
  • GCC Countries
  • South Africa
  • Rest of MEA
  • Competitive Landscape
    • Top 5 Player Comparison
    • Market Positioning of Key Players, 2021
    • Strategies Adopted by Key Market Players
    • Top Winning Strategies
  • By Development
  • By Company
  • By Year
    • Recent Activities in the Market
    • Key Companies Market Share (%), 2021
  • Key Company Profiles
    • Henkel AG & Co. KGaA (Germany)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • 3M Company (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • H.B. Fuller Company (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • Dow Inc. (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • Dymax Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • Shin-Etsu Chemical Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • Hitachi Chemical Co., Ltd. (Japan)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • LORD Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments
    • Huntsman Corporation (US)
  • Company Overview
  • Business Segment Overview
  • Financial Updates
  • Key Developments