自動運転SoC（2025年）

先進のインテリジェントドライビングの普及が続き、2025年までにインテリジェントドライビングSoCの大規模なアップグレードが進む

2024年、中国の国内の乗用車の総売上台数は約2,284万台、前年比8.6%増となり、2023年の伸び率5.8%を約3ポイント上回っています。このうち、L2以上のインテリジェントドライビングSoCを搭載した乗用車は1,456万台を超え、搭載率は63.8%で、2023年の搭載率を約6ポイント上回っています。

中国の国内の乗用車の売上台数は年々増加していますが、成長率は鈍化しています。同時に、自動車へのインテリジェントドライビングSoCの搭載が加速しています。インテリジェントドライビングレベルの点では、

L2.9：25～30万元の価格帯でもっとも多くのモデルが搭載しています。2024年と2025年第1四半期の普及率は50%を超えました。50万元超の価格帯では、2024年と2025年第1四半期の普及率は30%を超えました。現在、NVIDIA Orin-X、Huawei Ascend 610、Tesla FSDなどが市場を席巻しています。新製品としては、NVIDIA Thor-X、Thor-U、Orin-Y、Qualcomm 8797/8,397、Horizon J6P/J6M、Black Sesame Technologies A2000/C1236、RHINO Guangzhi R1、XPeng「Turing」、NIO Shenji NX9031などがあり、2025年に車両に次々と量産されます。

L2.5：20万元超のモデルの普及率が上昇傾向を示します。その中で、インテリジェントドライビングSoCの主流は、Horizon J5/J6E、NVIDIA Orin-X/Orin-N、Black Sesame Technologies A1000、TI TDA4VH/VM、Mobileye EyeQ5Hなどのチップです。

L2：10万元以内のモデルに低下しており、Horizon、Axera、Mobileyeなどのメーカーの低レベルインテリジェントドライビングSoCチップ製品を搭載したものが多いです。

2025年に入り、インテリジェントドライビングSoCは交換サイクルに入っています。一部の自動車メーカーはNIOやXPengなどの自社開発インテリジェントドライビングSoCを搭載し始めましたが、多くの自動車メーカーはLi Autoのように従来通り製品をアップグレードしています。

2024年8月23日、世界初のAIチップであるXPengの「Turing」チップがテープアウトに成功し、2025年6月に正式に量産・発売され、まずXPeng G7 Ultraに搭載され、3チップが搭載されました。このうち、2つのTuringチップはVLAモデル（自律強化学習機能を持つVLA-OL、モーション制御とリアルタイム判断を担当、フレームレート要件は20fps超）を実行し、残りの1つのTuringチップはVLM（道路標識認識や命令解析などの環境認識と意味理解を担当、フレームレート要件は1～2fps）を実行します。TuringチップはPCIeを介して通信し、「ヒューマンブレインパーティションコラボレーション」モードをシミュレートします（VLAは運動脳ドメイン、VLMは認知脳ドメイン）。

当レポートでは、中国の自動車産業について調査分析し、各自動運転SoCの比較、搭載数と市場シェア、国内外のインテリジェントドライビングSoC企業などの情報を提供しています。

目次

第1章 中国の乗用車インテリジェントドライビングシステムとSoC構成戦略

• インテリジェントドライビングSoCの定義
• 中国の乗用車向けインテリジェントドライビングシステムの搭載率と市場シェア
• 乗用車のインテリジェントドライビングSoC構成戦略：価格帯別

第2章 インテリジェントドライビングSoC市場の調査とデータ分析

• 代表的な超高演算能力（500TOPS超）インテリジェントドライビングSoCの比較
• 代表的な高計算能力（150～500TOPS）インテリジェントドライビングSoCの比較
• 代表的な中演算能力（30～150TOPS）インテリジェントドライビングSoCの比較
• 代表的な低演算能力（30TOPS未満）インテリジェントドライビングSoCの比較
• 量産段階にあるインテリジェントドライビングSoCの搭載数と市場シェア（2022年～2024年）
• インテリジェントドライビングSoCのコストの分析
• インテリジェントドライビングSoCのプロセスの分析
• インテリジェントドライビングSoCの市場規模と主要ベンダーの収益
• OEM各社のインテリジェントドライビングSoC構成の現状と将来計画

第3章 OEM各社のインテリジェントドライビングSoCの展開と自社研究戦略

• NIO
• Xpeng
• Li Auto
• Leapmotor
• FAW Hongqi
• GAC Group
• SAIC
• BAIC Group
• Changan Automobile
• Great Wall Motor
• Dongfeng Motor
• Geely Auto
• Chery
• BYD
• Xiaomi Automobile
• Tesla
• BMW
• Volkswagen
• Audi
• Daimler Benz
• Toyota
• Honda

第4章 国外のインテリジェントドライビングSoC企業とSoCチップ設計

• Nvidia
• Qualcomm
• Mobileye
• TI
• Renesas Electronics
• Ambarella
• Intel

第5章 中国のインテリジェントドライビングSoC企業とSoCチップ設計

• Horizon

High-level intelligent driving penetration continues to increase, with large-scale upgrading of intelligent driving SoC in 2025

In 2024, the total sales volume of domestic passenger cars in China was approximately 22.84 million, a year-on-year increase of 8.6%, which was about 3 percentage points higher than the 5.8% growth rate in 2023. Among them, the number of passenger cars equipped with L2 and above intelligent driving SoC exceeded 14.56 million, with installation rate of 63.8%, which was about 6 percentage points higher than that of in 2023.

The sales volume of China's domestic passenger cars has increased year by year, but the growth rate has slowed down. At the same time, intelligent driving SoC has been accelerating its installation in vehicles. From the perspective of intelligent driving levels:

L2.9: The most models in the 250,000-300,000 yuan price range are equipped with it. In 2024 and Q1 2025, the penetration rate has exceeded 50%; for the price range above 500,000 yuan, the penetration rate in 2024 and Q1 2025 exceeded 30%; currently, NVIDIA Orin-X, Huawei Ascend 610, Tesla FSD, etc. dominate the market. New products include NVIDIA Thor-X, Thor-U, Orin-Y, Qualcomm 8797/8397, Horizon J6P/J6M, Black Sesame Technologies A2000/C1236, RHINO Guangzhi R1, XPeng "Turing", NIO Shenji NX9031, etc., which will be put into mass production in vehicles one after another in 2025.

L2.5: The penetration rate of models above 200,000 yuan shows an upward trend. Among them, mainstream intelligent driving SoCs include Horizon J5/J6E, NVIDIA Orin-X/Orin-N, Black Sesame Technologies A1000, TI TDA4VH/VM, Mobileye EyeQ5H and other chips.

L2: It has been dropped to models within 100,000 yuan, most of which are equipped with low-level intelligent driving SoC chip products from manufacturers such as Horizon, Axera, and Mobileye.

Entering 2025, intelligent driving SoC has entered a replacement cycle. Some automakers have begun to introduce self-developed intelligent driving SoC, such as NIO and XPeng; most automakers have upgraded their products as in the past, such as Li Auto.

On August 23, 2024, the world's first AI chip, XPeng's "Turing" chip, successfully taped out; it was officially mass-produced and launched in June 2025, and was first equipped on the XPeng G7 Ultra, with 3 chips installed. Among them, 2 Turing chips run the VLA model (VLA-OL with autonomous reinforcement learning capability, responsible for motion control and real-time decision, with a frame rate requirement of >=20fps), and the other 1 Turing chip (runs VLM, handles environmental perception and semantic understanding, such as road sign recognition and instruction parsing, with a frame rate requirement of 1-2fps). The Turing chips communicate through PCIe, simulating the "human brain partition collaboration" mode (VLA is the motor brain region, VLM is the cognitive brain region).

Typical performance of "Turing" AI chip:

Single chip computing power 750TOPS, equivalent to three NVIDIA Orin-X;

AI large model customization, integrating 2 self-developed neural network processing brains (NPU), 2 independent image signal processors (ISP), and adopting DSA (Domain-Specific Architecture) for neural networks;

Equipped with 40-core processor, providing strong computing support for large models and supporting the operation of large models with high parameters on the local end;

An independent safety island is set up to carry out real-time full-vehicle blind-spot-free safety detection.

In 2025, the intelligent driving SoC of the Max and Ultra versions of Li Auto's L-series models will be upgraded to NVIDIA Thor-U chip, with a single-chip computing power of 730 TOPS, supporting VLA large models. The core capabilities of VLA include:

Language interactive driving: Support voice commands to perform complex operations (such as "avoid congestion" and "find a parking space to park"), realizing anthropomorphic decision.

Scene generalization: Optimize driving trajectories through diffusion models to solve long-tail scenes (such as unmarked roads and special-shaped intersections)

The Li Auto L6 Pro will add a lidar, and the intelligent driving chip will be upgraded from Horizon J5 (1 chip) to J6M (2 chips), with computing power upgraded from 128TOPS to 256TOPS, supporting up to 12 cameras, 6 radars and lidar. According to the official statement, after upgrading the hardware, the AD Pro intelligent driving system models will be comparable to AD Max in terms of active safety capabilities.

Intelligent driving SoC chip vendors move towards high computing power chips and accelerate the deployment of full-stack self-developed algorithm IP to reduce the technical application threshold for OEMs

Chip vendors continue to introduce new products to seize the high-level intelligent driving market. NVIDIA's latest Thor chip has multiple versions, with a maximum computing power of up to 2000TOPS, and will be mass-produced one after another starting from 2025. As of June 2025, models such as Li Auto MEGA, the intelligent driving upgraded version of L-series, Lynk & Co 900, Zeekr 9X, and Xiaomi YU7 have officially announced their installation. Potential partners also include BYD, GAC, Mercedes-Benz, Hyundai, Jaguar Land Rover and other automakers.

NVIDIA Thor has four main versions: X, U, S, and Z. Among them, the Thor U with 730T computing power has attracted the most attention from passenger car manufacturers; the Thor X with 1000T computing power is mainly used in Robotaxi scenarios, and some manufacturers are considering using a single Thor X or a combination of dual Thor U to build an L3 autonomous driving system. The estimated price of Thor-X is between 600-800 US dollars.

In addition, there are two other versions. One is Thor-X-Super, which is the combination of two Thor-X chips, possibly using MCM, a process similar to Chiplet, with an estimated price between 1000-1300 US dollars. The other is Thor-Jetson, used in robotics and industrial fields, with 1000TOPS computing power, Ethernet interface bandwidth of 100GB, and an estimated price between 400-500 US dollars.

At the same time, chip vendors are accelerating the deployment of full-stack self-developed algorithm IP, and everything is ready for OEMs to use directly.

NVIDIA launched the L3 autonomous driving system NDAS (NVIDIA DRIVE AV Solution) at the GTC 2025 conference, codenamed Alpamayo. It is actually an end-to-end system. NVIDIA covers from model training, sensor simulation, traffic flow simulation, synthetic data, world model to model deployment, from VLM to VLA. The first version of NDAS was launched in April 2025, the dual Thor highway version L3 will be launched in the first quarter of 2027, and the dual Thor Urban version L3 will be launched at the end of 2027.

Qualcomm mainly promotes two product lines: Snapdragon Ride and Snapdragon Ride Flex. According to data released by Qualcomm, 2025-2026 will be a large-scale mass production window for its assisted driving projects: more than 20 ADAS/AD projects worldwide are planned to be launched within these two years, with cooperating automakers covering Chinese and foreign brands such as Leapmotor, FAW, Geely, BAIC, Chery, Volkswagen, GM, Honda, Mercedes-Benz, and BMW.

According to Qualcomm's official data, more than 10 Chinese automakers and Tier-1 partners are using the Snapdragon Automotive Platform Ultimate Edition (including Snapdragon 8797 and Snapdragon 8397) to build driving assistance and intelligent cockpit solutions:

On June 27, 2025, Leapmotor and Qualcomm Technologies announced that Leapmotor's flagship D series will be equipped with the Snapdragon Automotive Platform Ultimate Edition (QAM8797P), with a single-chip equivalent computing power of 640TOPS and dual-chip is up to 1280TOPS. One chip specializes in intelligent cockpit, realizing immersive voice interaction and high-definition audio-visual entertainment; the other focuses on assisted driving, supporting L3+ level intelligent driving functions, realizing in-depth integration of cockpit and driving;

BAIC confirmed that it will cooperate with Autolink and Zhuoyu Technology to promote intelligent landing based on Qualcomm's solutions.

Based on the Snapdragon Automotive Platform Ultimate Edition, Qualcomm has, through model lightweight and scheduling optimization, collaborated with Tier-1 manufacturers to achieve smooth operation of 14 billion parameter (14B) large models on the local end. Autolink, Bosch, and Visteon have demonstrated solutions integrating 7 billion parameter (7B) end-side models. From the perspective of performance indicators:

SAIC-GM plans to equip the Snapdragon 8775 chip to realize the "8-screen linkage" experience in Buick models.

14B model inference can achieve a frame rate of more than 40 FPS, which can be increased to 50-60 FPS after optimization;

The 7B model has a frame rate of 60-72 FPS, meeting real-time interaction needs, such as understanding user's voice and semantics, and building user portraits.

Domestically, Black Sesame Technologies has launched its high computing power chip platform designed for next-generation AI models - Huashan A2000 family.

Manufactured using 7nm process, integrating multi-functional units such as CPU, DSP, GPU, NPU, MCU, ISP and CV, with a built-in self-developed "Jiushao" NPU, featuring single-chip multi-task processing capability. When the intelligent driving function is operating normally, it can desensitize, compress, encode and store the entire vehicle's data;

Including three products: A2000 Lite (urban intelligent driving), A2000 (full-scenario general intelligent driving) and A2000 Pro (high-level full-scenario general intelligent driving), which are respectively aimed at different levels of autonomous driving needs, with computing power ranging from 256TOPS to 1000TOPS.

At the same time, Horizon officially launched Journey 6P (J6P). Compared with the previous generation Journey 5 (about 20 billion transistors), the transistor scale has increased by nearly 85%. Based on the newly developed BPU "Nash" architecture, it adopts a super-heterogeneous computing core, integrating five computing modules: CPU, GPU, NPU, MCU and VPU. Cooperating with a three-level storage architecture and data transformation engine, it significantly improves the chip's processing capability for complex intelligent driving algorithms.

Table of Contents

1 China Passenger Car Intelligent Driving System and SoC Configuration Strategy

• 1.1 Definition of Intelligent Driving SoC
• Definition of Intelligent Driving SoC
• Detailed Performance Indicators of Intelligent Driving SoC Chips (1)
• Detailed Performance Indicators of Intelligent Driving SoC Chips (2)
• Detailed Performance Indicators of Intelligent Driving SoC Chips (3)
• 1.2 Installation Rate and Market Share of Intelligent Driving System for Passenger Cars in China
  • 1.2.1 Installation Rate of L1-L4 Intelligent Driving System for Passenger Cars in China
• China's Taxonomy of Driving Automation for Vehicles
• Installation Rate of L1-L4 Autonomous Driving System (Including Hardware Embedded) for Passenger Cars in China, 2022-2030E
• 1.2.2 Installation Rate and Chip Share of L2.9 Intelligent Driving for Passenger Cars in China (by Price Range)
• China Passenger Car L2.9 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (Jan.-Mar.2025)
• China Passenger Car L2.9 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (2024)
• China Passenger Car L2.9 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (2023)
• L2.9 Intelligent Driving SoC Market Share of Passenger Cars in China (2024 & Jan.-Mar. 2025)
• 1.2.3 Installation Rate and Chip Share of L2.5 Intelligent Driving for Passenger Cars in China (by Price Range)
• China Passenger Car L2.5 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (Jan.-Mar.2025)
• China Passenger Car L2.5 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (2024)
• China Passenger Car L2.5 Intelligent Driving (Including Hardware Embedded) Distribution by Price Range (2023)
• L2.5 Intelligent Driving SoC Market Share of Passenger Cars in China (2024 & Jan.-Mar. 2025)
• 1.2.4 Installation Rate and Chip Share of L2 Intelligent Driving for Passenger Cars in China (by Price Range)
• China Passenger Car L2 Intelligent Driving Distribution by Price Range(2025.1-2025.3)
• China Passenger Car L2 Intelligent Driving Distribution by Price Range (2024)
• China Passenger Car L2 Intelligent Driving Distribution by Price Range (2023)
• L2 Intelligent Driving SoC Market Share of Passenger Cars in China (2024 & Jan.-Mar. 2025)
• 1.3 Intelligent Driving SoC Configuration Strategy of Passenger Cars by Price Range
• Sales of Passenger Cars in China (by Price Range), 2023-2024
• 1.3.1 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB500,000 and Above)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB500,000 and Above, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB500,000 and Above, 2023-2025
• 1.3.2 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB400,000-500,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB400,000-500,000, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB400,000-500,000, 2023-2025
• 1.3.3 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB350,000-400,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB350,000-400,000, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB350,000-400,000, 2023-2025
• 1.3.4 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB300,000-350,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB300,000-350,000, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB300,000-350,000, 2023-2025
• 1.3.5 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB250,000-300,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB250,000-300,000, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB250,000-300,000, 2023-2025
• 1.3.6 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB200,000-250,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB200,000-250,000, 2023-2024
• 1.3.7 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB150,000-200,000)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB150,000-200,000, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB150,000-200,000, 2023-2025
• 1.3.8 Configuration Strategy and Chip Share of Intelligent Driving SoC for Passenger Cars in China (RMB150,000 and Below)
• Intelligent Driving SoC Share of Passenger Cars Priced RMB150,000 and Below, 2023-2024
• Configuration Strategy for Intelligent Driving SoCs in Mainstream Models Priced RMB150,000 and Below, 2023-2025

2 Intelligent Driving SoC Market Research and Data Analysis

• Classification Logic of Intelligent Driving SoC by Level
• Intelligent Driving SoC Classification: By Intelligent Driving Level (1)
• Intelligent Driving SoC Classification: By Intelligent Driving Level (2)
• 2.1 Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs
• Summary of Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs and Cooperation with OEMs (1)
• Summary of Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs and Cooperation with OEMs (2)
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Nvidia Thor-X
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Nvidia Thor-U
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Qualcomm 8797
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Horizon J6P
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Xpeng "Turing" AI Chip
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: NIO Shenji NX9031
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Huixi Guangzhi R1
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: SiEngine "Xingchen No.1" (AD1000)
• Comparison of Typical Ultra-high Computing Power (More Than 500TOPS) Intelligent Driving SoCs: Ambarella CV3-AD685
• 2.2 Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs
• Summary of High Computing Power (150-500TOPS) Intelligent Driving SoCs and Cooperation with OEMs
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Nvidia Orin-Y
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Nvidia Orin-X
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Tesla HW 4.0 or FSD Computer 2
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Renesas R-Car X5H
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Huawei Ascend 610
• Comparison of Typical High Computing Power (150-500TOPS) Intelligent Driving SoCs: Black Sesame A2000
• 2.3 Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs
• Summary of Medium Computing Power (30-150TOPS) Intelligent Driving SoCs and Cooperation with OEMs
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Nvidia Orin N
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Nvidia Xavier
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: TI TDA4VH
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Renesas R-Car V4H
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Ambarella CV72AQ
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Black Sesame A1000
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Horizon J5
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Horizon J6M
• Comparison of Typical Medium Computing Power (30-150TOPS) Intelligent Driving SoCs: Horizon J6E
• 2.4 Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: Mobileye EyeQ6L
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: TI TDA4VM
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: Horizon J2
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: Horizon J3
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: Horizon J6B
• Comparison of Typical Low Computing Power (Less Than 30TOPS) Intelligent Driving SoCs: Black Sesame A1000L
• 2.5 Installations and Market Share of Intelligent Driving SoCs in Mass Production, 2022-2024
• Installations of Intelligent Driving SoCs in Mass Production (by Intelligent Driving System Level), 2022-2024 (1)
• Installations of Intelligent Driving SoCs in Mass Production (by Intelligent Driving System Level), 2022-2024 (2)
• Shipments and Market Share of Intelligent Driving SoCs in Mass Production, 2022-2024
• Installations and Market Share of Intelligent Driving SoCs in Mass Production by Vendor, 2022-2024
• 2.6 Intelligent Driving SoC Cost Analysis
• Intelligent Driving SoC Cost Composition (1)
• Intelligent Driving SoC Cost Composition (2)
• Intelligent Driving SoC Cost Composition (3): Tape-out Cost
• Intelligent Driving SoC Shipping Price, 2022-2025 (1)
• Intelligent Driving SoC Shipping Price, 2022-2025 (2)
• Intelligent Driving SoC Shipping Price, 2022-2025 (3)
• 2.7 Intelligent Driving SoC Process Analysis
• Breakdown of China's Intelligent Driving SoC Shipments by Nanometer Process, 2022-2024
• Breakdown of China's Intelligent Driving SoC Shipments by Nanometer Process, 2022-2024; Share Forecast for 2030
• 2.8 Intelligent Driving SoC Market Size and Revenue of Major Vendors
• China's Intelligent Driving SoC Market Size, 2022-2030E
• Global Intelligent Driving SoC Market Size, 2022-2030E
• Revenue and Shipments of Global and Chinese Intelligent Driving SoC Vendors, 2022-2024 (1)
• Revenue and Shipments of Global and Chinese Intelligent Driving SoC Vendors, 2022-2024 (5)
• Revenue and Shipments of Global and Chinese Intelligent Driving SoC Vendors, 2022-2024 (6)
• 2.9 Status Quo of OEMs' Intelligent Driving SoC Configurations and Their Future Planning
• OEMs' Intelligent Driving SoC Solutions and Planning (1)
• OEMs' Intelligent Driving SoC Solutions and Planning (2)
• OEMs' Intelligent Driving SoC Solutions and Planning (3)
• OEMs' Intelligent Driving SoC Solutions and Planning (4)
• OEMs' Intelligent Driving SoC Solutions and Planning (5)
• OEMs' Intelligent Driving SoC Solutions and Planning (6)
• OEMs' Intelligent Driving SoC Solutions and Planning (7)
• OEMs' Intelligent Driving SoC Solutions and Planning (8)
• OEMs' Intelligent Driving SoC Solutions and Planning (9)

3 Intelligent Driving SoC Deployment and Self-research Strategy of OEMs

• 3.1 NIO
• Intelligent Driving SoC: Performance Parameters of Shenji NX9031
• Intelligent Driving SoC: Shenji NX9031
• Intelligent Driving SoC Platform: Central Computing Platform (ADAM)
• Software and Toolchain: SkyOS
• Software and Toolchain: World Model (1)
• Software and Toolchain: World Model (2)
• Software and Toolchain: World Model (3)
• Intelligent Driving System Development and Iteration
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• The Latest Cooperation on Intelligent Driving Chips and Installation
• 3.2 Xpeng
• Intelligent Driving AI SoC: Performance Parameters of Turing Chip
• Intelligent Driving AI SoC: Turing Chip
• Intelligent Driving AI SoC: Successful Tape-out of Turing Chip
• Intelligent Driving AI SoC: Application Scenarios of Turing Chip
• Intelligent Driving AI SoC: Turing Chip First Installed in Xpeng G7
• Software and Toolchain: End-to-End Intelligent Driving Large Model (1), "Cloud Model Factory"
• Software and Toolchain: End-to-End Intelligent Driving Large Model (2), "World Foundation Model"
• Software and Toolchain: End-to-End Intelligent Driving Large Model (3), "World Foundation Model"
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• The Latest Cooperation on Intelligent Driving Chips and Installation
• 3.3 Li Auto
• Intelligent Driving SoC: Mach 100
• Software and Toolchain: End-to-End Model + VLM (Vision-Language Model) (1)
• Software and Toolchain: End-to-End Model + VLM (Vision-Language Model) (2)
• Software and Toolchain: End-to-End Model + VLM (Vision-Language Model) (3), Upgraded MindVLA Multimodal Large Model
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• The Latest Cooperation on Intelligent Driving Chips and Installation
• 3.4 Leapmotor
• EEA Iteration
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• The Latest Cooperation on Intelligent Driving Chips and Installation
• 3.5 FAW Hongqi
• FAW Group's Five-domain Fusion SoC: Hongqi No.1
• FAW Group's Intelligent Driving System: Sinan Intelligent Driving System
• FAW Group's Planning and Model Orientation (By Vehicle Platform)
• FAW Group's Installation of Intelligent Driving SoCs (by Vehicle Platform)
• FAW Hongqi: Application of Intelligent Driving SoCs (2023-2024)
• FAW Hongqi's Latest Cooperation and Deployment in Intelligent Driving Chips
• 3.6 GAC Group
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• AION Brand: Application of Intelligent Driving SoC (2023-2024)
• Hyptec Brand: Application of Intelligent Driving SoC (2023-2024)
• Trumpchi Brand: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.7 SAIC
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (3)
• IM Brand: Application of Intelligent Driving SoC (2023-2024)
• Rising Auto Brand: Application of Intelligent Driving SoC (2023-2024)
• MG Brand: Application of Intelligent Driving SoC (2023-2024)
• Maxus Brand: Application of Intelligent Driving SoC (2023-2024)
• Roewe Brand: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.8 BAIC Group
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• ARCFOX Brand: Application of Intelligent Driving SoC (2023-2024)
• BEIJING Brand: Application of Intelligent Driving SoC (2023-2024)
• BAIC's Brands: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.9 Changan Automobile
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• Avatr Brand: Application of Intelligent Driving SoC (2023-2024)
• Deepal Brand: Application of Intelligent Driving SoC (2023-2024)
• NEVO Brand: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.10 Great Wall Motor
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• ORA Brand: Application of Intelligent Driving SoC (2023-2024)
• Tank Brand: Application of Intelligent Driving SoC (2023-2024)
• WEY and Haval Brands: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.11 Dongfeng Motor
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• Voyah Brand: Application of Intelligent Driving SoC (2023-2024)
• FORTHING Brand: Application of Intelligent Driving SoC (2023-2024)
• Aeolus Brand: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.12 Geely Auto
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (3)
• Zeekr Brand: Application of Intelligent Driving SoC (2023-2024)
• Smart Brand: Application of Intelligent Driving SoC (2023-2024)
• GEOME Brand: Application of Intelligent Driving SoC (2023-2024)
• Galaxy Brand: Application of Intelligent Driving SoC (2023-2024)
• Lynk & Co Brand: Application of Intelligent Driving SoC (2023-2024)
• Livan Brand: Application of Intelligent Driving SoC (2023-2024)
• Latest Cooperation and Installation Status of Intelligent Driving Chips
• 3.13 Chery
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• LUXEED and iCAR: Intelligent Driving SoC Application (2023-2024)
• EXEED: Intelligent Driving SoC Application (2023-2024)
• New Energy Brand: Intelligent Driving SoC Application (2023-2024)
• Cowin: Intelligent Driving SoC Application (2023-2024)
• Jetour: Intelligent Driving SoC Application (2023-2024)
• Chery: Intelligent Driving SoC Application (2023-2024)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.14 BYD
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (1)
• Intelligent Driving SoC Installation (by Vehicle Model Platform) (2)
• Denza: Intelligent Driving SoC Application (2023-2024)
• Yangwang: Intelligent Driving SoC Application (2023-2024)
• Fangchengbao: Intelligent Driving SoC Application (2023-2024)
• Ocean and Dynasty: Intelligent Driving SoC Application (2023-2024)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.15 Xiaomi Automobile
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.16 Tesla
• Intelligent Driving Hardware System Roadmap
• Intelligent Driving Hardware System: Parameter Evolution of Tesla FSD HW1.0 - HW4.0 System
• SoC Performance Parameters of HW 4.0 or FSD Computer 2
• SoC Performance Parameters of HW 3.0 or FSD Computer 1
• Intelligent Driving SoC: Speculation on Third Generation FSD SoC for FSD HW5.0 (1)
• Intelligent Driving SoC: Speculation on Third Generation FSD SoC for FSD HW5.0 (2)
• Intelligent Driving SoC: Typical Features of Second Generation FSD SoC for HW 4.0
• Intelligent Driving SoC: The Second Generation FSD SoC for HW 4.0 Can Support GDDR6
• Intelligent Driving SoC: The Second Generation FSD SoC for HW 4.0 Upgrades MAC and SRAM Capacity to Improve Computing Capabilities of Convolutional Neural Network
• Intelligent Driving SoC: Key Parameters of The First Generation FSD SoC for HW3.0
• Intelligent Driving SoC: Internal Structure of The First Generation FSD SoC for HW3.0
• Software and Toolchain: Development of Intelligent Driving Software Systems and Algorithms
• Software and Toolchain: End-to-end Foundation Models
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• Tesla: Intelligent Driving SoC Application (2023-2024)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.17 BMW
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• Intelligent Driving SoC Application (2023-2024)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.18 Volkswagen
• Planning and Model Orientation (By Vehicle Platform)
• Intelligent Driving SoC Installation (by Vehicle Model Platform)
• Intelligent Driving SoC Application (2023-2024)
• Latest Cooperation in and Installation of Intelligent Driving Chips
• 3.19 Audi
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• The Latest Cooperation on Intelligent Driving Chips and Installation
• 3.20 Daimler Benz
• Planning and Model Orientation (By Vehicle Platform)
• Daimler Benz's Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Beijing Benz: Application of Intelligent Driving SoCs (2023-2024)
• Daimler Benz's Latest Cooperation on Intelligent Driving Chips and Installation
• 3.21 Toyota
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)
• 3.22 Honda
• Planning and Model Orientation (By Vehicle Platform)
• Installation of Intelligent Driving SoCs (by Vehicle Platform)
• Application of Intelligent Driving SoCs (2023-2024)

4 Foreign Intelligent Driving SoC Players and SoC Chip Design

• 4.1 Nvidia
• Intelligent Driving SoC Roadmap
• Intelligent Driving Solution: L3 Intelligent Driving Full-Stack System Alpamayo (1)
• Intelligent Driving Solution: L3 Intelligent Driving Full-Stack System Alpamayo (2)
• Intelligent Driving SoC Partners/Mass Production and Installation
• Intelligent Driving SoC Market: Installation Structure by Auto Brand, 2023-2024
• NVIDIA DRIVE Thor: Performance Parameters of Thor-X
• NVIDIA DRIVE Thor: Performance Parameters of Thor-U
• NVIDIA DRIVE Thor: Centralized Vehicle Computing Platform
• NVIDIA DRIVE Thor: Key Parameters
• NVIDIA DRIVE Thor: Product Model
• NVIDIA DRIVE Thor: Support NVLink Multi-Chip Cascading
• NVIDIA DRIVE Thor: GPU Adopts Blackwell Architecture (1)
• NVIDIA DRIVE Thor: GPU Adopts Blackwell Architecture (2), Supporting 7 Billion-Parameter Large Model
• NVIDIA DRIVE Thor: Adopting Grace CPU, Based on ARM Neoverse V3 Core (1)
• NVIDIA DRIVE Thor: Adopting Grace CPU, Based on ARM Neoverse V3 Core (2)
• NVIDIA DRIVE Thor Hardware Solution: Intelligent Driving Domain Controller Based on Thor Series
• NVIDIA DRIVE Orin: Performance Parameters of Orin-Y
• NVIDIA DRIVE Orin: Performance Parameters of Orin-X
• NVIDIA DRIVE Orin: Performance Parameters of Orin-N
• Nvidia NVIDIA DRIVE Orin
• Nvidia NVIDIA DRIVE Orin: Orin-X
• Nvidia NVIDIA DRIVE Xavier
• NVIDIA DRIVE Platform Software and Toolchain
• NVIDIA DRIVE Platform: Complete Ecosystem - Hardware (1)
• NVIDIA DRIVE Platform: Complete Ecosystem - Hardware (2)
• NVIDIA DRIVE Platform: Complete Ecosystem - Software (1)
• NVIDIA DRIVE Platform: Complete Ecosystem - Software (1)
• NVIDIA DRIVE Platform: Complete Ecosystem - Software (2)
• NVIDIA DRIVE Platform: Complete Ecosystem - Software (3)
• NVIDIA DRIVE Platform: Complete Ecosystem - Middleware
• NVIDIA DRIVE Platform: Complete Ecosystem - Safety Mechanism
• NVIDIA DRIVE Platform: Complete Ecosystem - Other
• 4.2 Qualcomm
• Intelligent Driving SoC Roadmap
• Intelligent Driving Solution: Intelligent Driving Full-Stack System
• Intelligent Driving System-Level Solution: Digital Chassis
• Intelligent Driving System-Level Solution: Digital Chassis Development Platform
• Intelligent Driving Business Solution
• Intelligent Driving Cooperation Model
• Intelligent Driving SoC Market: Installation Structure by Auto Brand, 2023-2024
• Cockpit-Driving Integration SoC: Snapdragon Ride Flex Series
• Cockpit-Driving Integration SoC: Snapdragon Ride Flex Series Architecture Design
• Cockpit-driving Integration SoC: Performance Parameters of 8799
• Cockpit-driving Integration SoC: Performance Parameters of 8797
• Cockpit-driving Integration SoC: Performance Parameters of SA8775P
• Qualcomm Gen2 Cockpit-Driving Integration SoC: Snapdragon Ride Elite, 8797/8799 (1)
• Qualcomm Gen2 Cockpit-Driving Integration SoC: Snapdragon Ride Elite, 8797/8799 (2)
• Qualcomm Gen2 Cockpit-Driving Integration SoC Solution: 8797-based Central Computing Platform
• Gen1 Cockpit-driving Integration SoC: Key Parameters of SA8775P (1)
• Gen1 Cockpit-driving Integration SoC: Key Parameters of SA8775P (2)
• Gen1 Cockpit-Driving Integration SoC: SA8775P Safety Island Design
• Gen1 Cockpit-Driving Integration SoC: Interfaces and Storage of SA8775P
• Gen1 Cockpit-Driving Integration SoC: Internal Block Diagram of QAM8775P Module
• Gen1 Cockpit-Driving Integration SoC: External Block Diagram of QAM8775P Module
• Gen1 Cockpit-Driving Integration SoC: Power Architecture of QAM8775P Module
• Gen1 Cockpit-Driving Integration SoC Solution: SA8775-based Cockpit-Driving Integration Central Computing Platform
• Intelligent Driving SoC: Snapdragon Ride Series
• Intelligent Driving SoC: Snapdragon Ride Series Software and Toolchain
• Gen2 Intelligent Driving SoC: Key Parameters of SA8650
• Intelligent Driving SoC Platform Solution: NavInfo's Intelligent Driving Solution Based on Qualcomm SA8620/SA8650 (1)
• Intelligent Driving SoC Platform Solution: NavInfo's Intelligent Driving Solution Based on Qualcomm SA8620/SA8650 (2)
• 4.3 Mobileye
• Intelligent Driving SoC Roadmap
• Intelligent Driving SoC Solution: L2-L4 Intelligent Driving Solutions (1)
• Intelligent Driving SoC Solution: L2-L4 Intelligent Driving Solutions (2)
• Intelligent Driving SoC Solution: L2-L4 Intelligent Driving Solutions (3)
• Intelligent Driving SoC Solution: L2-L4 Intelligent Driving Solutions (4)
• Intelligent Driving SoC Solution: ODD Extensions
• Intelligent Driving Redundancy Solution: True Redundancy(TM) (1)
• Intelligent Driving Redundancy Solution: True Redundancy(TM) (2)
• Intelligent Driving Redundancy Solution: True Redundancy(TM) (3)
• Intelligent Driving SoC Market: Installations and Model Brand Ratio, 2023-2024
• EyeQ Series: EyeQ Ultra Performance Parameters
• EyeQ Series: EyeQ6H Performance Parameters
• EyeQ Series: EyeQ6L Performance Parameters
• Intelligent Driving SoC: EyeQ Ultra
• Intelligent Driving SoC: EyeQ Ultra Key Parameters
• Intelligent Driving SoC Solution: Intelligent Driving Solution Based on EyeQ(R) Ultra(TM) - SuperVision (TM)
• Intelligent Driving SoC: EyeQ6H
• Intelligent Driving SoC: EyeQ6L
• Intelligent Driving SoC Solution: SuperVision(TM) Based on Dual EyeQ6H
• Intelligent Driving SoC Solution: Chauffeur(TM) Based on Multiple EyeQ6H
• Intelligent Driving SoC: EyeQ5
• Intelligent Driving SoC: EyeQ5 Open Platform
• Intelligent Driving SoC Solution: EyeQ5-based SuperVision(TM)
• Software and Toolchain
• Software and Toolchain: Algorithm Architecture, CAIS (Composite Artificial Intelligence System)
• Software and Toolchain: EyeQ Kit SDK
• Software and Toolchain: REM(TM) Map Technology (1)
• Software and Toolchain: REM(TM) Map Technology (2)
• Software and Toolchain: "Responsibility-Sensitive Safety" (RSS) Model
• Software and Toolchain: Driving Experience Platform (DXP)
• Software and Toolchain: Two Dimensions of Full Intelligent Driving
• Intelligent Driving Partners
• 4.4 TI
• Chip Business Capacity Layout
• Intelligent Driving SoC Roadmap (1)
• Intelligent Driving SoC Roadmap (2)
• Intelligent Driving Solution
• Intelligent Driving SoC Platform: TI Jacinto(TM) 7 Automotive Processor Platform
• Intelligent Driving SoC Platform: TI Jacinto(TM) 7 Automotive Processor Platform Realizes Multi-functional Integration of ADAS-SoC
• Intelligent Driving SoC Platform: TI Jacinto(TM) 7 Automotive Processor Platform Hyper-heterogeneous Design (1)
• Intelligent Driving SoC Platform: TI Jacinto(TM) 7 Automotive Processor Platform Hyper-heterogeneous Design (2)
• Intelligent Driving SoC Platform: Hyper-Heterogeneous Design of TI Jacinto(TM) 7 Automotive Processor Platform (3)
• Intelligent Driving SoC Platform: Hyper-Heterogeneous Design of TI Jacinto(TM) 7 Automotive Processor Platform (4)
• Intelligent Driving SoC Platform: TI Jacinto(TM) 7 TDA4x Evaluation Module Design Reference
• Intelligent Driving SoC Market: Installation Volume and Model Brand Ratio, 2023-2024
• TI Jacinto(TM) 7Intelligent Driving SoC: TDA4AH Performance Parameters
• TI Jacinto(TM) 7Intelligent Driving SoC: TDA4VH Performance Parameters
• TI Jacinto(TM) 7Intelligent Driving SoC: TDA4VM Performance Parameters
• Intelligent Driving SoC: TI TDA4x Series
• Jacinto(TM) 7Intelligent Driving SoC: TDA4AH
• Jacinto(TM) 7Intelligent Driving SoC: TDA4VH
• Jacinto(TM) 7 Intelligent Driving SoC: TDA4VM
• Jacinto(TM) 7 Intelligent Driving SoC: Matrix Multiplication Accelerator (MMA) of TI TDA4VM SoC Deep Learning
• Jacinto(TM) 7 Intelligent Driving Solution: Dual TDA4VM Based Driving-parking Integration Solution (1)
• Jacinto(TM) 7 Intelligent Driving Solution: Dual TDA4VM Based Driving-parking Integration Solution (2)
• Software and Toolchain: Sensor Fusion Technology
• Software and Toolchain: Software Algorithms, OpenVX (1)
• Software and Toolchain: Software Algorithms, OpenVX (2)
• Software and Toolchain: Software Algorithms, OpenVX (3)
• Software and Toolchain: Software Algorithms, OpenVX (4)
• 4.5 Renesas Electronics
• Intelligent Driving SoC Roadmap
• Intelligent Driving SoC Platform: Renesas Autonomy
• Intelligent Driving SoC Market: SoC Installations by Car Brand, 2023-2024
• R-CAR: Performance Parameters of R-Car X5H
• R-CAR: Performance Parameters of R-Car V4H
• R-Car Gen 5: Renesas R-Car X5H (1)
• R-Car Gen 5: Renesas R-Car X5H (2)
• Gen5 R-CAR Series: R-Car X5H (3)
• R-Car Gen 5: R-Car X5H Utilizes an Imagination GPU
• R-Car Gen 5: R-Car X5H Uses ARM Cortex-A720AE CPU
• R-Car Gen 4: R-Car V4M/V4H
• R-Car Gen 4: Key Parameters of R-Car V4M/V4H
• Gen3 R-CAR Series: R-Car V3U
• Gen3 R-CAR Series: R-Car V3U Architecture Design
• Gen3 R-CAR Series: R-Car V3U Internal Framework
• Gen3 R-CAR Series: R-Car V3U Modular Design
• Gen3 R-CAR Series: R-Car V3H
• Gen3 R-CAR Series: R-Car V3H Product Block Diagram
• Gen3 R-CAR Series: R-Car V3H Key Parameters
• Gen3 R-CAR Series: R-Car V3H Features Ultra-low Power Consumption
• Gen3 R-CAR Series: R-Car V3H Delivers Outstanding Visual Performance
• Gen3 R-CAR Series: R-Car V3H Applied to L4 Computing Platforms
• Gen3 R-CAR Series: R-Car V3H2
• Gen3 R-CAR Series: R-Car V3M
• Software and Toolchain: R-Car Open Access Platform (1)
• Software and Toolchain: R-Car Open Access Platform (2)
• Software and Toolchain: R-Car Software Development Kit (SDK)
• 4.6 Ambarella
• Chip Capacity Layout
• Intelligent Driving SoC Roadmap (1)
• Intelligent Driving SoC Roadmap (2)
• Intelligent Driving SoC Application Scenarios
• Intelligent Driving SoC Market: SoC Installations by Car Brand, 2023-2024
• CV3 Family of Automotive AI Domain Controllers: Performance Parameters of CV3-AD685
• Intelligent Driving SoC: CV3 Family of Automotive AI Domain Controllers
• CV3 AD Series: Fusing 4D Imaging Radar Software Algorithm
• CV3 AD Series: Neural Vector Processor (NVP) Equivalent Computing Power up to 500 eTOPS
• CV3 Family of Automotive AI Domain Controllers: Target ASIL-B on the Chip Level with an ASIL-D Safety Island
• CV3 AD Series: Key Parameters
• CV3 Family of Automotive AI Domain Controllers: CV3-AD685
• CV3 Family of Automotive AI Domain Controllers: CV3-AD655 for Urban NOA
• CV3 Family of Automotive AI Domain Controllers: CV3-AD685 for High-level Solutions
• Intelligent Driving SoC: Performance Parameters of CV72AQ
• Intelligent Driving SoC: CV72AQ
• Intelligent Driving SoC: Key Parameters of CV72AQ
• Intelligent Driving SoC: CV2x Series AI Vision Autonomous Driving Chips
• Intelligent Driving SoC: CV2x Series, Cooperation Cases
• CV2x Series CV22FS, CV2FS
• CV2x Series Architectural Designs of CV22FS and CV2FS
• Software and Toolchain
• Software and Toolchain: Intelligent Driving SoC Uses Self-developed ISP
• Software and Toolchain: Intelligent Driving SoC Uses self-developed CVflow(R)
• 4.7 Intel
• Automotive Business
• Automotive Business: ACU (Adaptive Control Unit) Concept
• Vehicle Platform Solutions
• Cockpit-Driving Integration SoC: Nominal Process 1.8nm, Mass Production in 2026
• SDV SoC: Second-generation AI-enhanced SDV SoC
• SDV SoC: Adopting Chiplet Architecture
• Software and Toolchain: Automotive Virtual Development Environment (VDE)
• Software and Toolchain: SDV Software Architecture

5 Chinese Intelligent Driving SoC Players and SoC Chip Design

• 5.1 Horizon
• Intelligent Driving SoC Roadmap
• Intelligent Driving SoC Planning
• Intelligent Driving SoC IP: Intelligent Computing Architecture BPU (1)
• Intelligent Driving SoC IP: Intelligent Computing Architecture BPU (2)
• Intelligent Driving SoC IP: Intelligent Computing Architecture BPU (3), IP Licensing Model
• Intelligent Driving SoC Ecosystem: Positioned as Tier 2, Offering Four Cooperation Model