チップレットの世界市場：2023-2030年

チップレット市場は、予測期間中（2023-2030年）にCAGR 6.4%で成長すると予測されます。チップレットは、通常、同一パッケージ内のI/Oコントローラチップによって制御されるサブプロセッシングユニットです。チップレット設計の概念には、プロセッサを構成するためのモジュール方式が含まれます。AMDやインテル・コーポレーションなどのCPUメーカーは、チップレット設計を製品ラインナップに採用しており、シリコンの歩留まりを向上させることで生産効率を高めています。歩留まりの向上とモジュール構造により、コア数の多いコンポーネントを製造する際の無駄を省くことができます。チップレットを使用することで、プロセッシング・ユニットの全パーツが1枚のシリコンに組み込まれているモノリシックCPU設計よりも、チップの歩留まりを向上させることができます。

セグメント別の展望

情報技術（IT）・通信分野での需要拡大が期待されるチップレット

IT・通信分野では、技術の進歩に伴い、より高い処理能力と性能に対する需要も高まっています。チップレットを使用することで、メーカーは複数の特殊チップを単一パッケージに統合し、性能を拡張することができます。また、チップレットは特定の消費電力プロファイルで設計できるため、エネルギーの効率的な利用とコスト削減が可能になります。さらに、チップレット業界における使用事例の増加や研究開発活動も、チップレット業界全体の需要を押し上げています。

情報技術や通信の分野では、急速な技術進歩により、処理能力や性能の向上に対するニーズが高まっています。この分野でのチップレット採用は、多数の特殊半導体チップを統一パッケージに統合することで、システム性能を向上させるソリューションをメーカーに提供します。これらのチップレットは、特定の消費電力プロファイルに準拠するように簡単に設計できるため、エネルギー資源をより賢明かつ経済的に使用することができます。また、アプリケーションの拡大とチップレット業界における研究開発の進行が、この分野全体の成長と需要を牽引しています。例えば、2023年10月には、TSMCの2nm製造プロセスが現在開発中であり、日本企業がArm Neoverseアーキテクチャを組み込んだチップレットベースのCPUを製造しています。カスタマイズされたチップレットを搭載することで、この斬新なチップは性能を最適化しながら多様な用途に対応できます。自動車、データセンター、ネットワーク、スマートデバイスなど様々な産業向けのシステムオンチップ（SoC）設計を提供する日本のソシオネクストは、チップレット技術を活用した新しい32コアArm CPUを発表しました。同社によると、この革新的なアプローチは、ハイパースケールデータセンターや、5Gおよび6Gネットワークをサポートするように設計されたものを含む最先端のモバイルインフラでの展開に理想的なスケーラブルな性能を提供することができます。

地域別展望

北米地域は、Intel Corp.、Nvidia、Texas Instrumentsなど、半導体業界やエンドユーザー業界の存在感が大きいことなどから、市場の大幅な成長が見込まれています。これらの企業は、戦略的イニシアチブの採用や製品投入に注力しています。例えば、2023年11月、エッジで必要不可欠な処理能力を提供することに特化した技術企業であるMercury Systems, Inc.は、防衛関連のエッジ処理を強化するための商用フォトニクスチップレットの利用を可能にすることを目的とした製造能力を確立するために、米国海軍との協力関係を明らかにしました。

加えて、過去数年間、地域政府は半導体産業の研究開発活動への傾斜を強めており、北米の市場成長をさらに後押ししています。例えば、米国政府は2022年にCHIPS and Science Actを通過させたが、これには520億米ドルのチップ製造インセンティブと研究投資、および半導体製造と半導体装置製造に対する投資税額控除が含まれています。半導体産業協会の2022年報告書によると、米国半導体企業は2021年に年間収益のおよそ5分の1にあたる502億米ドルを研究開発に投資し続けています。

チップレット市場はアジア太平洋地域で大きな成長が見込まれる

チップレットソリューションとサービスの需要はアジア太平洋地域で大きく伸びると予想されています。同地域は、自動車、家電、IT・通信などのエンドユーザー産業の生産・販売で最も高いシェアを占めています。国際自動車工業協会によると、2022年の年間自動車生産台数の上位4カ国はアジア太平洋地域であり、中国、日本、インド、韓国です。また、この地域は世界の半導体産業でも大きなシェアを占めています。半導体産業協会によると、アジア太平洋地域の半導体産業は2001年の398億米ドルから2022年には3,309億4,000万米ドル以上に成長します。さらに、地域政府によるチップレットと半導体産業への支援の高まりも需要を後押ししています。例えば、2023年5月、インドの先進コンピューティング開発センター（C-DAC）は、フラッグシップのAUMチップを含む一連のARMベースCPUの開発に取り組んでいると発表しました。また、2023年1月には、中国の電子設計自動化（EDA）企業Empyrean Technologyが、チップレットベースの先進パッケージングとAIベースの設計自動化の研究開発に取り組むと発表しました。

目次

第1章 レポート概要

• 業界の現状分析と成長ポテンシャルの展望
• 調査方法とツール
• 市場内訳
  • セグメント別
  • 地域別

第2章 市場概要と洞察

• 調査範囲
• アナリストの洞察と現在の市場動向
  • 主な調査結果
  • 推奨事項
  • 結論

第3章 競合情勢

• 主要企業分析
• Advanced Micro Devices, Inc.（AMD）
  • 概要
  • 財務分析
  • SWOT分析
• Alphawave IP Inc
  • 概要
  • 財務分析
  • SWOT分析
  • 最近の動向
• Arm Ltd.
  • 概要
  • 財務分析
  • SWOT分析
  • 最近の動向
• 主要戦略分析

第4章 市場セグメンテーション

• チップレットの世界市場：タイプ別
  • 中央処理装置（CPU）チップレット
  • グラフィックス・プロセッシング・ユニット（GPU）チップレット
  • FPGA（Field-Programmable Gate Array）チップレット
  • 特定用途向け集積回路（ASIC）チップレット
  • メモリチップレット
• チップレットの世界市場：エンドユーザー産業別
  • カーエレクトロニクス
  • 家庭用電子機器
  • 産業オートメーション
  • ヘルスケア
  • 軍事
  • IT・通信

第5章 地域分析

• 北米
  • 米国
  • カナダ
• 欧州
  • 英国
  • ドイツ
  • イタリア
  • スペイン
  • フランス
  • その他欧州
• アジア太平洋
  • 中国
  • インド
  • 日本
  • 韓国
  • その他アジア太平洋地域
• 世界のその他の地域

第6章 企業プロファイル

• Ampere Computing, Inc.
• ARTERIS, INC.
• ASE Technology Holding Co., Ltd.
• Ayar Labs, Inc.
• Cadence Design Systems, Inc.
• Intel Corp.oration
• International Business Machines Corp.
• Marvell Technology, Inc.
• MediaTek Inc.
• Netronome Systems, Inc.
• NHanced Semiconductors, Inc.
• Rambus Incorporated
• RANVOUS Inc.
• Samsung Electronics Co., Ltd.
• Taiwan Semiconductor Manufacturing Company, Ltd.

LIST OF TABLES

• 1. GLOBAL CHIPLET MARKET RESEARCH AND ANALYSIS BY TYPE, 2022-2030 ($ MILLION)
• 2. GLOBAL CPU CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 3. GLOBAL GPU CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 4. GLOBAL FPGA CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 5. GLOBAL ASIC CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 6. GLOBAL MEMORY CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 7. GLOBAL CHIPLET MARKET RESEARCH AND ANALYSIS BY END-USER INDUSTRY, 2022-2030 ($ MILLION)
• 8. GLOBAL CHIPLET FOR AUTOMOTIVE ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 9. GLOBAL CHIPLET FOR CONSUMER ELECTRONICS MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 10. GLOBAL CHIPLET FOR INDUSTRIAL AUTOMATION MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 11. GLOBAL CHIPLET FOR HEALTHCARE MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 12. GLOBAL CHIPLET FOR MILITARY MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 13. GLOBAL CHIPLET FOR IT AND TELECOMMUNICATION MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 14. GLOBAL CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 15. NORTH AMERICAN CHIPLET MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2022-2030 ($ MILLION)
• 16. NORTH AMERICAN CHIPLET MARKET RESEARCH AND ANALYSIS BY TYPE, 2022-2030 ($ MILLION)
• 17. NORTH AMERICAN CHIPLET MARKET RESEARCH AND ANALYSIS BY END-USER INDUSTRY, 2022-2030 ($ MILLION)
• 18. EUROPEAN CHIPLET MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2022-2030 ($ MILLION)
• 19. EUROPEAN CHIPLET MARKET RESEARCH AND ANALYSIS BY TYPE, 2022-2030 ($ MILLION)
• 20. EUROPEAN CHIPLET MARKET RESEARCH AND ANALYSIS BY END-USER INDUSTRY, 2022-2030 ($ MILLION)
• 21. ASIA-PACIFIC CHIPLET MARKET RESEARCH AND ANALYSIS BY COUNTRY, 2022-2030 ($ MILLION)
• 22. ASIA-PACIFIC CHIPLET MARKET RESEARCH AND ANALYSIS BY TYPE, 2022-2030 ($ MILLION)
• 23. ASIA-PACIFIC CHIPLET MARKET RESEARCH AND ANALYSIS BY END-USER INDUSTRY, 2022-2030 ($ MILLION)
• 24. REST OF THE WORLD CHIPLET MARKET RESEARCH AND ANALYSIS BY REGION, 2022-2030 ($ MILLION)
• 25. REST OF THE WORLD CHIPLET MARKET RESEARCH AND ANALYSIS BY TYPE, 2022-2030 ($ MILLION)
• 26. REST OF THE WORLD CHIPLET MARKET RESEARCH AND ANALYSIS BY END-USER INDUSTRY, 2022-2030 ($ MILLION)

LIST OF FIGURES

• 1. GLOBAL CHIPLET MARKET SHARE BY TYPE, 2022 VS 2030 (%)
• 2. GLOBAL CPU CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 3. GLOBAL GPU CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 4. GLOBAL FPGA CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 5. GLOBAL ASIC CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 6. GLOBAL MEMORY CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 7. GLOBAL CHIPLET MARKET SHARE BY END-USER INDUSTRY, 2022 VS 2030 (%)
• 8. GLOBAL CHIPLET FOR AUTOMOTIVE ELECTRONICS MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 9. GLOBAL CHIPLET FOR CONSUMER ELECTRONICS MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 10. GLOBAL CHIPLET INDUSTRIAL AUTOMATION MARKET SHARE BY REGION FOR, 2022 VS 2030 (%)
• 11. GLOBAL CHIPLET FOR HEALTHCARE MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 12. GLOBAL CHIPLET FOR MILITARY MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 13. GLOBAL CHIPLET FOR IT AND TELECOMMUNICATION MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 14. GLOBAL CHIPLET MARKET SHARE BY REGION, 2022 VS 2030 (%)
• 15. US CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 16. CANADA CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 17. UK CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 18. FRANCE CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 19. GERMANY CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 20. ITALY CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 21. SPAIN CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 22. REST OF EUROPE CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 23. INDIA CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 24. CHINA CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 25. JAPAN CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 26. SOUTH KOREA CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 27. REST OF ASIA-PACIFIC CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)
• 28. REST OF THE WORLD CHIPLET MARKET SIZE, 2022-2030 ($ MILLION)

Global Chiplet Market Size, Share & Trends Analysis Report by Type (Central Processing Unit (CPU) Chiplets, Graphics Processing Unit (GPU) Chiplets, Field-Programmable Gate Array (FPGA) Chiplets, Application-Specific Integrated Circuit (ASIC) Chiplets, and Memory Chiplets) and by End-User Industry (Automotive electronics, Consumer electronics, Industrial Automation, Healthcare, Military, and IT & Telecommunication) Forecast Period (2023-2030)

The Chiplet market is anticipated to grow at a CAGR of 6.4% during the forecast period (2023-2030). a chiplet is a sub-processing unit that is typically controlled by an I/O controller chip within the same package. The concept of chiplet design involves a modular method for constructing processors. CPU manufacturers such as AMD and Intel Corporation use chiplet designs in their product lineups which enhance production efficiency through improved silicon yields. Higher yields and modular construction help to reduce waste when manufacturing high core count components. Using chiplets allows manufacturers to increase yields of chips over monolithic CPU designs where all pieces of a processing unit are built into a single piece of silicon.

Segmental Outlook

The global chiplet market is segmented by type and end-user industry. By type, the market is sub-segmented into CP) chiplet, GPU chiplet, FPGA chiplet, ASIC chiplet, and memory chiplet. By end-user industry, the market is sub-segmented into automotive electronics, consumer electronics, industrial automation, healthcare, military, IT, and telecommunication. Among the end-users, the demand for chiplets is expected to grow in automotive electronics. The growth is primarily owing to the increasing demand for software-enabled use cases such as advanced driver assistance systems (ADAS), and infotainment systems. Additionally, growing technological advancements in automobiles and the growth of the global electric vehicles (EV) market is also driving demand for chiplets. According to the 2023 Global EV outlook by the International Energy Agency (IEA), the electric car market has seen exponential growth as sales exceeded 10 million in 2022. A total of 14% of all new cars sold were electric in 2022, up from around 9% in 2021 and less than 5% in 2020. In automobiles, chiplets offer multiple advantages over conventional monolithic chip designs. Their modular nature facilitates rapid customization and upgrades, leading to reduced development time and costs. This adaptability enables manufacturers to swiftly respond to shifting market trends and embrace technological breakthroughs. Additionally, car manufacturers (along with their tier 1 suppliers) gain greater flexibility in mixing and matching components from various subcontractors, eliminating the risk of vendor lock-in and fostering a more resilient, healthy, and dynamic supply chain. Considering the growing demand and advantages of using chiplets in automobiles, industries are also focusing on research and development and collaborations which is further driving demand. For instance, in May 2023, MediaTek partnered With NVIDIA to offer transform AI and accelerated computing solutions for automobiles. This collaboration will result in the development of automotive SoCs that incorporate NVIDIA GPU chiplets. These chiplets will be interconnected using an ultra-fast and coherent chiplet interconnect technology. Additionally, MediaTek will implement NVIDIA DRIVE OS, DRIVE IX, CUDA, and TensorRT software technologies on these new automotive SoCs to enable connected infotainment, in-cabin convenience, and safety features. This partnership is expected to expand the range of in-vehicle infotainment options available to automakers on the NVIDIA DRIVE platform.

The Demand for Chiplets Is Expected to Grow in the Information Technology (IT) and Telecommunications

In IT and telecommunications, with technological advancements, demand for higher processing power and performance is also growing. Using chiplets allows manufacturers to scale up performance by integrating multiple specialized chips into a single package. Chiplets can also be designed with specific power consumption profiles, allowing for more efficient use of energy and cost reduction. Additionally, growing use cases and research, and development activities in the chiplet industry are also driving demand for the overall chiplet industry.

In the field of information technology and telecommunications, rapid technological progress has resulted in a growing need for enhanced processing capabilities and performance. The adoption of chiplets within this domain offers manufacturers a solution to augment system performance by integrating numerous specialized semiconductor chips into a unified package. These chiplets can be easily engineered to adhere to specific power consumption profiles, thereby affording a more judicious and economical use of energy resources. Also, the expanding array of applications and ongoing research and development in the chiplet industry drive overall growth and demand within this sector. For instance, in October 2023, TSMC's 2 nm manufacturing process is currently in development, and a Japanese company is making a chiplet-based CPU that incorporates the Arm Neoverse architecture. With the inclusion of customized chiplets, this novel chip can cater to diverse purposes while optimizing performance. Socionext, a Japanese provider of System-on-Chip (SoC) designs catering to various industries such as automotive, data centers, networks, and smart devices, unveiled a new 32-core Arm CPU that leverages chiplet technology. According to the company, this innovative approach is capable of delivering scalable performance ideally suited for deployment in hyperscale data centers and cutting-edge mobile infrastructures, including those designed to support 5G and 6G networks.

Regional Outlook

The global chiplet market is further segmented based on geography including North America (the US, and Canada), Europe (UK, Italy, Spain, Germany, France, and the Rest of Europe), Asia-Pacific (India, China, Japan, South Korea, and Rest of Asia), and the Rest of the World (the Middle East & Africa, and Latin America). Among the, the market is expected to grow significantly in the North American region owing to factors including the significant presence of semiconductor and end-user industries such as Intel Corp., Nvidia, and Texas Instruments among others. These players are focusing on adopting strategic initiatives and product launches. For instance, in November 2023, Mercury Systems, Inc., a technology firm specializing in providing essential processing power at the edge, disclosed a collaboration with the US Navy to establish manufacturing capabilities aimed at enabling the utilization of commercial photonics chiplets for enhancing edge processing in defense-related contexts.

In addition, over the past few years, the regional government is increasingly inclined towards the R&D activities in semiconductor industry is further propelling the market growth in North America. For instance, in 2022, the US government passed the CHIPS and Science Act which includes $52.0 billion in chip manufacturing incentives and research investments, as well as an investment tax credit for semiconductor manufacturing and semiconductor equipment manufacturing. According to the 2022 report of the Semiconductor Industry Association, the US semiconductor companies continue to invest roughly one-fifth of annual revenue in R&D amounting to $50.2 billion in 2021.

The Chiplet Market is Expected to Grow Significantly in the Asia-Pacific Region

Among these, the demand for Chiplet solutions and services is expected to grow significantly in the Asia Pacific region. The region holds the highest share in production and sales of end-user industries such as automobiles, consumer electronics, IT, and telecommunications among others. According to the International Organization of Motor Vehicle Manufacturers, 4 out of the top countries are from Asia Pacific in terms of annual automobile production in 2022 which were China, Japan, India, and South Korea. Also, the region holds a significant share in the global semiconductor industry. According to the Semiconductor Industry Association, the Asia Pacific semiconductor industry has grown from $39.8 billion in 2001 to over $330.94 billion in 2022. Additionally, growing support for the chiplet and the semiconductor industry from regional governments is also driving the demand. For instance, in May 2023, India's Center for Development of Advanced Computing (C-DAC) announced that be working on a series of ARM-based CPUs including the flagship AUM chip. Also, in January 2023, China-based electronic design automation (EDA) company Empyrean Technology announced it to be working on research and development of chiplet-based advanced packaging as well as AI-based design automation.

Market Players Outlook

The major companies serving the global chiplet market are Ampere Computing, Inc., Taiwan Semiconductor Manufacturing Co., Ltd., Intel Corp., and Marvell Technology, Inc. among others. With growing demand, companies are working on R&D and collaboration to cater to the demand and stay competitive. For instance, in November 2022, Lam Research, a US-based semiconductor equipment manufacturer, acquired Semsysco, a company located in Austria, to enhance its chiplet packaging technology. This acquisition includes the integration of cleaning and plating capabilities for chiplet-to-chiplet or chiplet-to-substrate heterogeneous integration. This encompasses support for fan-out panel-level packaging, a method in which chips or chiplets are cut from a large, rectangular substrate sheet significantly larger than a conventional silicon wafer. This approach allows chip manufacturers to improve yield and reduce waste.

The Report Covers:

• Market value data analysis of 2022 and forecast to 2030.
• Annualized market revenues ($ million) for each market segment.
• Country-wise analysis of major geographical regions.
• Key companies operating in the chiplet market. Based on the availability of data, information related to new product launches, and relevant news is also available in the report.
• Analysis of business strategies by identifying the key market segments positioned for strong growth in the future.
• Analysis of market-entry and market expansion strategies.
• Competitive strategies by identifying 'who-stands-where' in the market.

Table of Contents

1. Report Summary

• Current Industry Analysis and Growth Potential Outlook
• 1.1. Research Methods and Tools
• 1.2. Market Breakdown
  • 1.2.1. By Segments
  • 1.2.2. By Region

2. Market Overview and Insights

• 2.1. Scope of the Report
• 2.2. Analyst Insight & Current Market Trends
  • 2.2.1. Key Findings
  • 2.2.2. Recommendations
  • 2.2.3. Conclusion

3. Competitive Landscape

• 3.1. Key Company Analysis
• 3.2. Advanced Micro Devices, Inc. (AMD)
  • 3.2.1. Overview
  • 3.2.2. Financial Analysis
  • 3.2.3. SWOT Analysis
• 3.3. Alphawave IP Inc
  • 3.3.1. Overview
  • 3.3.2. Financial Analysis
  • 3.3.3. SWOT Analysis
  • 3.3.4. Recent Developments
• 3.4. Arm Ltd.
  • 3.4.1. Overview
  • 3.4.2. Financial Analysis
  • 3.4.3. SWOT Analysis
  • 3.4.4. Recent Developments
• 3.5. Key Strategy Analysis

4. Market Segmentation

• 4.1. Global Chiplet Market by Type
  • 4.1.1. Central Processing Unit (CPU) Chiplet
  • 4.1.2. Graphics Processing Unit (GPU) Chiplet
  • 4.1.3. Field-Programmable Gate Array (FPGA) Chiplet
  • 4.1.4. Application-Specific Integrated Circuit (ASIC) Chiplet
  • 4.1.5. Memory Chiplet
• 4.2. Global Chiplet Market by End-user Industry
  • 4.2.1. Automotive electronics
  • 4.2.2. Consumer electronics
  • 4.2.3. Industrial automation
  • 4.2.4. Healthcare
  • 4.2.5. Military
  • 4.2.6. IT and telecommunication

5. Regional Analysis

• 5.1. North America
  • 5.1.1. United States
  • 5.1.2. Canada
• 5.2. Europe
  • 5.2.1. UK
  • 5.2.2. Germany
  • 5.2.3. Italy
  • 5.2.4. Spain
  • 5.2.5. France
  • 5.2.6. Rest of Europe
• 5.3. Asia-Pacific
  • 5.3.1. China
  • 5.3.2. India
  • 5.3.3. Japan
  • 5.3.4. South Korea
  • 5.3.5. Rest of Asia-Pacific
• 5.4. Rest of the World

6. Company Profiles

• 6.1. Ampere Computing, Inc.
• 6.2. ARTERIS, INC.
• 6.3. ASE Technology Holding Co., Ltd.
• 6.4. Ayar Labs, Inc.
• 6.5. Cadence Design Systems, Inc.
• 6.6. Intel Corp.oration
• 6.7. International Business Machines Corp.
• 6.8. Marvell Technology, Inc.
• 6.9. MediaTek Inc.
• 6.10. Netronome Systems, Inc.
• 6.11. NHanced Semiconductors, Inc.
• 6.12. Rambus Incorporated
• 6.13. RANVOUS Inc.
• 6.14. Samsung Electronics Co., Ltd.
• 6.15. Taiwan Semiconductor Manufacturing Company, Ltd.