日本の成形用複合材料市場 (2017～2031年)：成形タイプ・複合材料タイプ・エンドユーザー・地域別の機会および予測

日本の成形用複合材料の市場規模は、2023年の4億8,400万米ドルから、予測期間中は5.5％のCAGRで推移し、2031年には7億4,280万米ドルの規模に成長すると予測されています。

日本のエレクトロニクス分野の急速な進歩は、半導体、コンデンサ、トランジスタなどの小型エレクトロニクス製品のパッケージングにおいて優れた効率を確保するための成形用複合材料への需要に拍車をかけています。さらに、日本では、軽量材料の採用が増加しており、小型商用車や航空機などの輸送製品の燃費効率が大幅に向上しているため、優れた機械的特性と輸送製品全体の軽量化を可能にする成形用複合材料の需要が高まっています。これらのことから、日本で活況のエレクトロニクス産業と輸送産業が、同国の成形用複合材料市場の成長を促進しています。

日本政府は温室効果ガスの排出削減を目指し、再生可能エネルギー発電の割合を高めるための取り組みを積極的に行っています。その結果、風力、太陽光などの新しい再生可能エネルギープロジェクトの開発が近年増加しています。これらの新しい再生可能エネルギープロジェクトの開発も成形用複合材料の需要を促進すると予想されています。

エレクトロニクス産業の強化

エレクトロニクス産業は、半導体、電気部品、テレビ、その他のエレクトロニクス製品の生産に携わる大手事業者の存在により、日本のGDP成長全体への主要な貢献者となっています。熱硬化性ポリマー、エポキシ樹脂、ポリ (メタクリル酸メチル) などの材料で構成される成形用複合材料の主な技術的特性には、優れた電気絶縁性、優れた機械的特性、高温耐性などがあり、これらの特性は、優れた耐湿性と耐熱性を確保するため、エレクトロニクス産業にとって理想的なものとなっています。日本のエレクトロニクス産業の成長は、エレクトロニクス製品のR&D活動の増加やエレクトロニクス製造工場への投資の増加など、さまざまな動向に起因しています。

自動車産業における成形用複合材料の技術革新の増加

日本の自動車産業は主要経済分野の一つであり、4,000億米ドルの収益を上げています。シート成形用複合材料は、重量と燃料消費を最小限に抑えるため、OEMによって利用されています。また、自動車メーカーは、へこみ、衝撃、腐食から保護するために、熱硬化性ポリマーやエポキシ樹脂から製造されたシート成形用複合材料を採用しています。自動車産業で使用される成形用複合材料の最近の技術革新が市場成長を後押ししています。

当レポートでは、日本の成形用複合材料の市場を調査し、市場の定義と概要、市場規模の推移・予測、各種区分・地域別の詳細分析、産業構造、市場成長への影響因子の分析、ケーススタディ、競合情勢、主要企業のプロファイルなどをまとめています。

目次

第1章 調査手法

第2章 プロジェクトの範囲と定義

第3章 COVID-19の影響

第4章 ロシア・ウクライナ戦争の影響

第5章 エグゼクティブサマリー

第6章 顧客の声

• 市場認識と製品情報
• ブランドの認知度とロイヤルティ
• 購入決定時に考慮される要素
• 購入頻度
• 購入媒体

第7章 日本の成形用複合材料市場の展望

• 市場規模・予測
• 成形タイプ別
  • シートモールディングコンパウンド (SMC)
  • バルクモールディングコンパウンド (BMC)
  • 厚いモールディングコンパウンド (TMC)
• 複合材料タイプ別
  • 熱硬化性化合物
  • 長繊維強化複合材料
  • 熱可塑性複合材料
• エンドユーザー別
  • 航空宇宙
  • 自動車
  • 半導体・エレクトロニクス
  • 石油・ガス・エネルギー
  • その他
• 地域別
  • 北部
  • 中部
  • 南部
• 企業別市場シェア

第8章 サプライサイド分析

• 製造能力：企業別
• 製造規模：企業別
• 運転効率：企業別
• 主要な工場所在地 (最大25カ所)

第9章 市場マッピング

• 成形タイプ別
• 複合材料タイプ別
• エンドユーザー別
• 地域別

第10章 マクロ環境・産業構造

• 需給分析
• 輸出入分析
• サプライ/バリューチェーン分析
• PESTEL分析
• ポーターのファイブフォース分析

第11章 市場力学

• 成長促進因子
• 成長抑制因子 (課題・制約)

第12章 主要企業の情勢

• 市場リーダー上位5社の競合マトリックス
• 市場リーダー上位5社の市場収益分析
• M&A・ジョイントベンチャー (該当する場合)
• SWOT分析 (参入5社)
• 特許分析 (該当する場合)

第13章 価格分析

第14章 ケーススタディ

第15章 主要企業の見通し

• Resonac Electronic Materials Kyushu Corporation
• Huayuan
• Sumitomo Bakelite Co., Ltd.
• MOLYMER SSP Co., Ltd.
• BASF SE
• Hitachi, Ltd.
• Henkel AG & Co. KGaA
• Evonik
• SAMPE JAPAN
• Huntsman International LLC.

第16章 戦略的推奨事項

第17章 当社について・免責事項

List of Tables

• Table 1. Pricing Analysis of Products from Key Players
• Table 2. Competition Matrix of Top 5 Market Leaders
• Table 3. Mergers & Acquisitions/ Joint Ventures (If Applicable)
• Table 4. About Us - Regions and Countries Where We Have Executed Client Projects

List of Figures

• Figure 1. Japan Molding Compound Market, By Value, In USD Million, FY2017-FY2031F
• Figure 2. Japan Molding Compound Market, By Volume, In Unit Thousand, FY2017-FY2031F
• Figure 3. Japan Molding Compound Market Share, By Molding Type, In USD Million, FY2017-FY2031F
• Figure 4. Japan Molding Compound Market Share, By Compound Type, In USD Million, FY2017-FY2031F
• Figure 5. Japan Molding Compound Market Share, By End User, In USD Million, FY2017-FY2031F
• Figure 6. Japan Molding Compound Market Share, By Region, In USD Million, FY2017-FY2031F
• Figure 7. By Molding Type Map-Market Size (USD Million) & Growth Rate (%), FY2023
• Figure 8. By Compound Type Map-Market Size (USD Million) & Growth Rate (%), FY2023
• Figure 9. By End User Map-Market Size (USD Million) & Growth Rate (%), FY2023
• Figure 10. By Region Map-Market Size (USD Million) & Growth Rate (%), FY2023

Japan molding compound market size was valued at USD 484 million in FY2023, which is expected to grow to USD 742.8 million in FY2031, with a CAGR of 5.5% during the forecast period between FY2024 and FY2031. The rapid advancements in the Japanese electronics sector are spurring the demand for molding compounds to ensure superior efficiency in the packaging of miniaturized electronics products, including semiconductors, capacitors, transistors, and others. Furthermore, the rising adoption of lightweight materials in Japan ensures significant fuel efficiency for transportation products such as light commercial vehicles, aircraft, and others, supplementing the demand for molding compounds to enable superior mechanical properties and reduce the overall weight of the transportation products. As a result, Japan's booming electronics and transportation industry is fostering the molding compounds market growth in the country.

The Japanese government is targeting to reduce greenhouse emissions in the country. The government of Japan is taking prominent initiatives to boost the share of renewable energy in electricity generation. As a result, in recent years, the development of new renewable energy projects related to wind, solar, and others is increasing in Japan. Thus, developing new renewable energy projects in Japan is expected to fuel the demand for molding compounds. The molding types, such as sheet molding compound, offer vital benefits, including reduced cost per part integration, minimized tooling cost, and weight advantage. Therefore, developing new renewable energy projects in Japan will create a lucrative opportunity for the positive molding compound industry outlook in Japan during the projected forecast period.

Bolstering Electronics Industry

The electronics industry is the primary contributor to the overall GDP growth of Japan due to the presence of leading market players dealing in the production of semiconductors, electric parts, television, and other electronics products. The key technical properties of molding compounds composed of materials such as thermosetting polymer, epoxy resins, poly (methyl methacrylate), and others include superior electric insulation, excellent mechanical properties, and higher temperature resistance features. These properties of molding compounds make them ideal for the electronics industry to ensure superior moisture resistance and protection against heat. The growth of the electronics industry in Japan is attributed to various key trends such as increasing research & development (R&D) activities in electronics products and increasing investments in electronics manufacturing plants.

For instance, according to the recent data published by the Japan Electronics and Information Technology Industries Association (JEITA), in 2021, the production of the electrical and electronics industry in Japan was valued at USD 99,772.18 million, and USD 83,997.76 million in 2022 having a year-on-year growth rate of 0.2%. Hence, the bolstering electronics industry in Japan is driving the demand for molding types such as sheet molding compound and thick molding compound to protect the electronics products from corrosion, thereby ensuring superior durability of end products. This, in turn, is accelerating the Japan molding compounds market growth.

Increasing Technological Innovations for Molding Compounds Application in Automotive

The automotive industry in Japan is one of the major economic sectors in the country, generating revenue of USD 0.4 trillion. The sheet molding compound is utilized by original equipment manufacturers (OEM) to minimize weight and fuel consumption. Sheet molding materials are lightweight with robust resistance in comparison to aluminum sheets. Furthermore, as opposed to conventional steel decks, automotive manufacturers deploy sheet molding compounds manufactured from thermosetting polymer and epoxy resins for protection against dents, impact dings, and corrosion. The recent technological innovations for molding compounds with applications in the automotive industry are driving market growth.

For instance, in February 2023, Toray Industries, Inc., a leading material manufacturer in Japan introduced rapid integrated molding technology for application in carbon fiber reinforced plastic mobility components. Carbon fiber-reinforced plastic mobility components are deployed in automotive products such as passenger cars, light commercial vehicles, and heavy commercial vehicles. Therefore, the rising innovations for molding compounds with applications in the automotive sector fuel the deployment of technologically advanced molding compounds, propelling the market growth in Japan.

Impact of COVID-19

The stringent government measures were implemented in Japan, including the halt in non-essential commodities production and social distancing norms due to the rising prevalence of COVID-19 cases in 2020. As a result, production activities related to electronics, automotive, aerospace, and others were halted in Japan. Thus, the Japan molding compound market registered a revenue decline in 2020 since these industries are the major end-users of molding compounds manufactured from materials such as thermosetting polymer, epoxy resins, and others.

For instance, according to the Japan Electronics and Information Technology Industries Association (JEITA), in 2019, electrical and electronics production in Japan was valued at USD 96,643.61 million; in 2020, it was USD 93,389.82 million. In 2020, the electrical and electronics industry declined by 5.4% compared to 2019. The halt in the production activities associated with polymer, epoxy resins, poly (methyl methacrylate), and others restrained the production of molding compounds in Japan. However, by 2020, the Japanese government eased the restrictions to promote industrial growth activities. As a result, industries such as electronics, aerospace, and others registered favorable growth. Eventually, the impact of the COVID-19 pandemic will be negligible, thereby resulting in prominent growth potential for the Japan molding compounds market in the upcoming years.

Impact of Russia-Ukraine War

Materials such as polyester resin, epoxy resins, poly (methyl methacrylate), glass fiber reinforcement, and filler are vital for manufacturing sheet molding compounds. The Japanese economy highly relies on Russia for energy demand. As a result, the higher energy prices impact the overall pricing of materials such as thermosetting polymer, epoxy resins, poly (methyl methacrylate), and others. In addition, the volatility of petroleum prices directly impacts production costs. For instance, according to the World Bank, in 2022, due to the Russia-Ukraine war, the price of crude oil soared by USD 100 per barrel, reaching its highest level since 2013. These aspects are impeding market expansion.

Moreover, the supply chain constraint impacted the production activities associated with automotive in Japan. For instance, according to the Organisation Internationale des Constructeurs d'Automobiles (OICA), in 2021, passenger cars manufactured in Japan were 6,619,245 units, and in 2022, it was 6,566,356 units. In 2022, passenger cars manufactured in Japan registered a decline of 1% over 2021. Henceforth, the prolonged war between Russia and Ukraine is anticipated to impact the supply chain, and pricing of materials such as thermosetting polymer, epoxy resins, and others. This, in turn, may influence the growth rate of the Japan molding compound market in the forecasted period.

Key Players Landscape and Outlook

The Japan molding compound market is highly competitive, with major players dominating the market. These players are Resonac Electronic Materials Kyushu Corporation, Huayuan, Sumitomo Bakelite Co., Ltd., MOLYMER SSP Co., Ltd., BASF SE, Hitachi, Ltd., Henkel AG & Co. KGaA, Evonik, SAMPE JAPAN, and Huntsman International LLC. These companies have a strong brand presence, a wide distribution network, and a focus on innovation. They are constantly investing in research and development of technologies and products that meet the needs of their customers. The Japan Molding Compound Market is expected to be driven by the increasing demand for passenger cars, light commercial vehicles, and heavy-duty vehicles. The prominent market players in the Japan molding compound industry are adopting merger strategies to expand their market revenue in the country.

For instance, in February 2023, Japan Composite Co., Ltd. formed a merger with JC Kako Co., Ltd. The prime focus of the merger was to increase the company's overall market share in the Japan molding compounds market. Likewise, the development of new electric car manufacturing facilities in Japan and the rapidly rising government investment in the semiconductor industry are expected to accelerate the demand for sheet molding compounds. Henceforth, the above factors are anticipated to increase Japan's molding compounds market competition in the upcoming years.

Table of Contents

1. Research Methodology

2. Project Scope & Definitions

3. Impact of COVID-19 on the Japan Molding Compound Market

4. Impact of Russia-Ukraine War

5. Executive Summary

6. Voice of Customer

• 6.1. Market Awareness and Product Information
• 6.2. Brand Awareness and Loyalty
• 6.3. Factors Considered in Purchase Decision
  • 6.3.1. Brand Name
  • 6.3.2. Quality
  • 6.3.3. Quantity
  • 6.3.4. Price
  • 6.3.5. Product Specification
  • 6.3.6. Application Specification
  • 6.3.7. Shelf-Life
  • 6.3.8. Availability of Product
• 6.4. Frequency of Purchase
• 6.5. Medium of Purchase

7. Japan Molding Compound Market Outlook, FY2017-FY2031

• 7.1. Market Size & Forecast
  • 7.1.1. By Value
  • 7.1.2. By Volume
• 7.2. By Molding Type
  • 7.2.1. Sheet Molding Compound (SMC)
  • 7.2.2. Bulk Molding Compound (BMC)
  • 7.2.3. Thick Molding Compound (TMC)
• 7.3. By Compound Type
  • 7.3.1. Thermoset Compounds
    • 7.3.1.1. Phenolic
    • 7.3.1.2. Epoxy
    • 7.3.1.3. Silicone
    • 7.3.1.4. Unsaturated Polyester
    • 7.3.1.5. Diallyl Phthalate
    • 7.3.1.6. Others
  • 7.3.2. Long Fiber Reinforced Composites
  • 7.3.3. Thermoplastic Compounds
    • 7.3.3.1. Polyphenylene Sulfide (PPS)
    • 7.3.3.2. Polycarbonate (PC)
    • 7.3.3.3. Polyamide (PA)
• 7.4. By End-user
  • 7.4.1. Aerospace
    • 7.4.1.1. Passenger
    • 7.4.1.2. Commercial
    • 7.4.1.3. Defense
  • 7.4.2. Automotive
    • 7.4.2.1. Passenger Cars
    • 7.4.2.2. Light Commercial Vehicles (LCVs)
    • 7.4.2.3. Heavy Commercial Vehicles (HCVs)
  • 7.4.3. Semiconductors/Electronics Industry
  • 7.4.4. Oil, Gas, & Energy Industry
  • 7.4.5. Others
• 7.5. By Region
  • 7.5.1. North
  • 7.5.2. Central
  • 7.5.3. South
• 7.6. By Company Market Share (%), FY2023

8. Supply Side Analysis

• 8.1. Capacity, By Company
• 8.2. Production, By Company
• 8.3. Operating Efficiency, By Company
• 8.4. Key Plant Locations (Up to 25)

9. Market Mapping, FY2023

• 9.1. By Molding Type
• 9.2. By Compound Type
• 9.3. By End-user
• 9.4. By Region

10. Macro Environment and Industry Structure

• 10.1. Supply Demand Analysis
• 10.2. Import Export Analysis - Volume and Value
• 10.3. Supply/Value Chain Analysis
• 10.4. PESTEL Analysis
  • 10.4.1. Political Factors
  • 10.4.2. Economic System
  • 10.4.3. Social Implications
  • 10.4.4. Technological Advancements
  • 10.4.5. Environmental Impacts
  • 10.4.6. Legal Compliances and Regulatory Policies (Statutory Bodies Included)
• 10.5. Porter's Five Forces Analysis
  • 10.5.1. Supplier Power
  • 10.5.2. Buyer Power
  • 10.5.3. Substitution Threat
  • 10.5.4. Threat from New Entrant
  • 10.5.5. Competitive Rivalry

11. Market Dynamics

• 11.1. Growth Drivers
• 11.2. Growth Inhibitors (Challenges, Restraints)

12. Key Players Landscape

• 12.1. Competition Matrix of Top Five Market Leaders
• 12.2. Market Revenue Analysis of Top Five Market Leaders (in %, FY2023)
• 12.3. Mergers and Acquisitions/Joint Ventures (If Applicable)
• 12.4. SWOT Analysis (For Five Market Players)
• 12.5. Patent Analysis (If Applicable)

13. Pricing Analysis

14. Case Studies

15. Key Players Outlook

• 15.1. Resonac Electronic Materials Kyushu Corporation
  • 15.1.1. Company Details
  • 15.1.2. Key Management Personnel
  • 15.1.3. Products & Services
  • 15.1.4. Financials (As reported)
  • 15.1.5. Key Market Focus & Geographical Presence
  • 15.1.6. Recent Developments
• 15.2. Huayuan
• 15.3. Sumitomo Bakelite Co., Ltd.
• 15.4. MOLYMER SSP Co., Ltd.
• 15.5. BASF SE
• 15.6. Hitachi, Ltd.
• 15.7. Henkel AG & Co. KGaA
• 15.8. Evonik
• 15.9. SAMPE JAPAN
• 15.10. Huntsman International LLC.

Companies mentioned above DO NOT hold any order as per market share and can be changed as per information available during research work.

16. Strategic Recommendations

17. About Us & Disclaimer