5G高周波PCB市場の分析：動向、予測、競合分析 (2030年まで)

5G高周波PCBの動向と予測

世界の5G高周波PCB市場の将来は、通信、自動車、医療、航空宇宙市場での機会が期待できそうです。世界の5G高周波PCB市場は、2024年から2030年にかけてCAGR13.6%で成長すると予想されています。この市場の主な促進要因は、5Gネットワークにおける高速・低遅延通信の需要増加、5Gインフラにおけるミリ波技術の採用拡大、シグナルインテグリティと熱管理機能を向上させた高周波PCBに対する需要の高まりです。

• Lucintelの予測では、種類別では、4～16層が予測期間で最も高い成長を遂げる見込みです。
• 用途別では、通信が最も高い成長が見込まれています。
• 地域別では、アジア太平洋が予測期間中に最も高い成長が見込まれます。

5G高周波PCB市場の戦略的成長機会

5G高周波PCB市場は、技術の進歩や市場ニーズによって、主要な用途にいくつかの戦略的成長機会を提供しています。

• 通信機器：基地局、アンテナ、ネットワーク機器は、5Gインフラに不可欠な高周波PCBに大きな製造機会をもたらし、大きな収益機会を表しています。
• 民生用電子機器：5Gをスマートフォン、タブレット、ウェアラブルに統合することで、より優れた接続速度とデータ転送を可能にする高周波PCBの道が開けます。
• 自動車用途：自動車の接続性が高まるにつれ、車載アプリケーションにおける高周波PCBの需要も高まっています。主な応用分野には、ADAS (先進運転支援システム) や車載インフォテイメントなどがあります。
• 産業用IoT：スマート工場や接続された産業機器には、信頼性の高い性能を確保しながら、厳しい条件に耐える特注PCBが必要です。
• 医療機器：遠隔医療や遠隔モニタリングソリューションの台頭により、医療機器における高周波PCBの採用が加速しており、医療コネクティビティがより洗練され、効果的になっています。

これらの機会は、5G高周波PCB市場の幅広い成長の可能性を示しており、企業に新たな収益源を探るためのエントリーポイントを提供しています。

5G高周波PCB市場促進要因・課題

5G高周波PCB市場は様々な促進要因と課題の影響を受けており、戦略立案のためにはこれらの力学を理解することが極めて重要です。

5G高周波PCB市場を促進する要因は以下の通りです：

• 5Gネットワークへのニーズの高まり：5Gの世界の展開は、高周波PCBの需要を大幅に増加させ、メーカーに激しい成長の見通しを生み出しています。
• 継続的な技術改善：PCB材料と製造プロセスの進歩により、性能が向上し、複雑な設計が可能になります。
• インフラ投資の推進：政府と民間部門は通信インフラに多額の投資を行っており、高性能PCBの需要を促進しています。
• 民生用電子機器部門：民生用電子機器、特に5G対応デバイスの需要が高いため、高周波PCBのニーズが高まり、市場機会が拡大します。
• IoTソリューションへのシフト：IoTデバイスの展開が進むにつれ、ネットワークシステムの性能要件を効果的に満たすことができる、より洗練されたPCBが必要とされています。

5G高周波PCB市場の課題は以下の通りです：

• 高い製造コスト：高い製造コスト：高度な材料と洗練された製造技術により、高いコストが発生する可能性があり、製造業者にとって採算の合わない生産になる可能性があります。
• 激しい競合：業界内の多数の企業間の高い競争は、市場シェアを維持するために絶え間ない技術革新と差別化を余儀なくされます。
• 規制の遵守：環境規制の強化は生産者にとって課題であり、持続可能な慣行への多大な投資が必要となります。

5G高周波PCB市場は投資家にとって多くの機会を提供しますが、企業が成功するためには様々な課題を乗り越えなければなりません。

目次

第1章 エグゼクティブサマリー

第2章 世界の5G高周波PCB市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第4章 市場動向と予測分析：地域別 (2018～2030年)

• マクロ経済動向 (2018～2023年) と予測 (2024～2030年)
• 世界の5G高周波PCB市場の動向 (2018～2023年) と予測 (2024～2030年)
• 世界の5G高周波PCB市場：種類別
  • 4～16層
  • 16～32層
  • 32層以上
• 5G高周波PCB市場：用途別
  • 通信
  • 自動車
  • 医療
  • 航空宇宙
  • その他

第4章 市場動向と予測分析：地域別 (2018～2030年)

• 世界の5G高周波PCB市場：地域別
• 北米の5G高周波PCB市場
• 欧州の5G高周波PCB市場
• アジア太平洋の5G高周波PCB市場
• その他地域の5G高周波PCB市場

第5章 競合分析

• 製品ポートフォリオ分析
• 運用統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略分析

• 成長機会分析
  • 世界の5G高周波PCB市場の成長機会：種類別
  • 世界の5G高周波PCB市場の成長機会：用途別
  • 世界の5G高周波PCB市場の成長機会：地域別
• 世界の5G高周波PCB市場の新たな動向
• 戦略分析
  • 新製品開発
  • 世界の5G高周波PCB市場の生産能力拡大
  • 世界の5G高周波PCB市場における企業合併・買収 (M&A)、合弁事業
  • 認証とライセンシング

第7章 主要企業の企業プロファイル

• Nippon Mektron
• Samsung Electro-Mechanics
• Young Poong Electronics
• Daeduck
• Ibiden
• AT&S
• Hannstar Board
• Shennan Circuits
• Zhen Ding Tech
• TTM Technologies

5G High Frequency PCB Trends and Forecast

The future of the global 5G high frequency PCB market looks promising with opportunities in the communication, automotive, medical, and aerospace markets. The global 5G high frequency PCB market is expected to grow with a CAGR of 13.6% from 2024 to 2030. The major drivers for this market are the increasing demand for high-speed and low-latency communication in 5G networks, the growing adoption of millimeter-wave technology in 5G infrastructure, and the rising demand for high-frequency PCBs with improved signal integrity and thermal management capabilities.

• Lucintel forecasts that, within the type category, layer 4-16 are expected to witness the highest growth over the forecast period.
• Within the application category, communication is expected to witness the highest growth.
• In terms of regions, APAC is expected to witness the highest growth over the forecast period.

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Emerging Trends in the 5G High Frequency PCB Market

The 5G high-frequency PCB market is evolving with several trends that symbolize changes in technology and market requirements.

• Increased Use of Advanced Materials: The shift to high-frequency applications necessitates the use of low-loss dielectrics and high-temperature substrates, representing a trend toward increased performance and reliability in 5G systems.
• Automation in Manufacturing: Automation is now critical to PCB manufacturing processes, enhancing precision and efficiency. This trend allows manufacturers to meet the high-volume demands of 5G applications with minimal errors.
• Focus on Miniaturization: The need for miniaturized PCB designs is ever-increasing, driven by shrinking device sizes and complexities. Miniaturization enables the creation of compact, high-performance devices, which are crucial for 5G technologies.
• Incorporation of RF Components: PCB designs are increasingly incorporating radio frequency (RF) components. This incorporation simplifies designs, thereby enhancing signal integrity, a critical characteristic for most 5G applications.
• Sustainable Initiatives: The agenda for sustainability is driving the development of environmentally friendly materials and processes in PCB assembly. This trend aligns with global regulatory pressures and consumer demand for greener technologies.

These trends have reshaped the market through innovation, leading to improved performance and sustainability of 5G high-frequency PCBs.

Recent Developments in the 5G High Frequency PCB Market

Recent innovations in the 5G high-frequency PCB market are driving progress and enhancing manufacturing capabilities throughout the industry.

• New Material Innovations: Recent developments in material science have introduced low-loss substrates that improve signal integrity. These materials are essential for enhancing the performance of high-frequency applications.
• New Manufacturing Techniques: The adoption of newer manufacturing techniques, such as additive manufacturing and laser processing, is facilitating quicker production and improving the flexibility of PCB design fabrication.
• Strategic Alliances: Collaborations among PCB manufacturers and technology firms are penetrating R&D to develop PCBs that meet stricter performance requirements for 5G, ensuring faster time-to-market.
• IoT Devices: As IoT applications increase, the demand for specialized high-frequency PCBs is rising. Manufacturers are designing custom boards that cater to the specific needs of IoT devices operating on 5G networks.
• Heightened Regulatory Compliance: Due to growing concerns about electronic waste and sustainability, manufacturers are intensifying their research efforts to create solutions that satisfy regulatory compliance without compromising high performance. This trend is reshaping both product development and market approaches.

These developments further enhance the capabilities and competencies of 5G high-frequency PCBs, allowing companies to meet growing demand effectively.

Strategic Growth Opportunities for 5G High Frequency PCB Market

The 5G high-frequency PCB market offers several strategic growth opportunities across key applications driven by advancements in technology and market needs.

• Telecommunications Equipment: Base stations, antennas, and network equipment present significant manufacturing opportunities for high-frequency PCBs, essential for 5G infrastructure, representing a substantial revenue opportunity.
• Consumer Electronics: Integrating 5G with smartphones, tablets, and wearables creates avenues for high-frequency PCBs that enable better connectivity speeds and data transfer.
• Automotive Applications: As vehicle connectivity increases, the demand for high-frequency PCBs in automotive applications is also growing. Key application areas include advanced driver assistance systems and car infotainment.
• Industrial IoT: Smart factories and connected industrial equipment require bespoke PCBs that can withstand tough conditions while ensuring reliable performance.
• Medical Devices: The rise of telemedicine and remote monitoring solutions is boosting the adoption of high-frequency PCBs in medical devices, making healthcare connectivity more sophisticated and effective.

These opportunities illustrate the broad spectrum of growth potential in the 5G high-frequency PCB market, providing companies with entry points to explore new revenue streams.

5G High Frequency PCB Market Driver and Challenges

The 5G high-frequency PCB market is influenced by various driving factors and challenges, making it crucial to understand these dynamics for strategic planning.

The factors driving the 5G high-frequency PCB market include:

• Growing Need for 5G Networks: The global rollout of 5G is significantly increasing the demand for high-frequency PCBs, creating intense growth prospects for manufacturers.
• Continuous Technological Improvements: Advances in PCB materials and manufacturing processes enhance performance and enable complex designs.
• Infrastructure Investment Push: Governments and private sectors are heavily investing in telecommunication infrastructure, driving demand for high-performance PCBs.
• Consumer Electronics Sector: The high demand for consumer electronics, particularly 5G-enabled devices, drives the need for high-frequency PCBs and expands market opportunities.
• Shift Towards IoT Solutions: The increasing deployment of IoT devices requires more sophisticated PCBs that can effectively meet the performance requirements of networked systems.

Challenges in the 5G high-frequency PCB market include:

• High Production Costs: Advanced materials and sophisticated manufacturing techniques may incur high costs, potentially making production unprofitable for manufacturers.
• Intense Competition: High competition among numerous players in the industry compels constant innovation and differentiation to sustain market share.
• Regulatory Compliance: Stricter environmental regulations pose challenges for producers, necessitating significant investments in sustainable practices.

The 5G high-frequency PCB market presents numerous opportunities for investors, but companies must navigate various challenges to succeed.

List of 5G High Frequency PCB Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. Through these strategies 5G high frequency PCB companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the 5G high frequency PCB companies profiled in this report include-

• Nippon Mektron
• Samsung Electro-Mechanics
• Young Poong Electronics
• Daeduck
• Ibiden
• AT&S
• Hannstar Board
• Shennan Circuits
• Zhen Ding Tech
• TTM Technologies

5G High Frequency PCB by Segment

The study includes a forecast for the global 5G high frequency PCB by type, application, and region.

5G High Frequency PCB Market by Type [Analysis by Value from 2018 to 2030]:

• Layer 4-16
• Layer 16-32
• More than 32 layers

5G High Frequency PCB Market by Application [Analysis by Value from 2018 to 2030]:

• Communication
• Automotive
• Medical
• Aerospace
• Others

5G High Frequency PCB Market by Region [Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

Country Wise Outlook for the 5G High Frequency PCB Market

Advancements in the 5G high-frequency PCB market are occurring rapidly, driven by the need for faster and more reliable communication networks. Key countries leading these advancements include the United States, China, Germany, India, and Japan, each bringing a unique approach.

• United States: The U.S. is upgrading manufacturing capacity for high-frequency PCBs through investments in advanced materials and processes. Collaborations between technology companies and various institutions focus on developing next-generation PCBs to meet 5G requirements.
• China: Numerous projects have been initiated in China to aggressively expand 5G networks. The growing 5G infrastructure necessitates high-frequency PCBs. Local efforts in research and development aim to create substrate materials compatible with 5G technologies and support the government's ambitious rollout plans.
• Germany: Germany emphasizes sustainability in PCB fabrication, focusing on research related to environmentally friendly materials while complying with European regulatory laws. This approach has led to a range of high-frequency PCBs that meet both environmental and performance standards.
• India: The Indian government is positioning the country as a 5G hub, encouraging local manufacturing of high-frequency PCBs. Investments in training and infrastructure are improving local manufacturers' competitiveness in the global market.
• Japan: The Japanese advanced telecommunications sector fosters innovations in high-frequency PCB designs. Companies are researching and developing new materials and manufacturing techniques to enhance performance, particularly in urban areas where 5G networks are rapidly being deployed.

Features of the Global 5G High Frequency PCB Market

Market Size Estimates: 5G high frequency PCB market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: 5G high frequency PCB market size by type, application, and region in terms of value ($B).

Regional Analysis: 5G high frequency PCB market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different types, applications, and regions for the 5G high frequency PCB market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the 5G high frequency PCB market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

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This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the 5G high frequency PCB market by type (layer 4-16, layer 16-32, and more than 32 layers), application (communication, automotive, medical, aerospace, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global 5G High Frequency PCB Market : Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
• 3.2. Global 5G High Frequency PCB Market Trends (2018-2023) and Forecast (2024-2030)
• 3.3: Global 5G High Frequency PCB Market by Type
  • 3.3.1: Layer 4-16
  • 3.3.2: Layer 16-32
  • 3.3.3: More than 32 layers
• 3.4: Global 5G High Frequency PCB Market by Application
  • 3.4.1: Communication
  • 3.4.2: Automotive
  • 3.4.3: Medical
  • 3.4.4: Aerospace
  • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

• 4.1: Global 5G High Frequency PCB Market by Region
• 4.2: North American 5G High Frequency PCB Market
  • 4.2.1: North American Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
  • 4.2.2: North American Market by Application: Communication, Automotive, Medical, Aerospace, and Others
• 4.3: European 5G High Frequency PCB Market
  • 4.3.1: European Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
  • 4.3.2: European Market by Application: Communication, Automotive, Medical, Aerospace, and Others
• 4.4: APAC 5G High Frequency PCB Market
  • 4.4.1: APAC Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
  • 4.4.2: APAC Market by Application: Communication, Automotive, Medical, Aerospace, and Others
• 4.5: ROW 5G High Frequency PCB Market
  • 4.5.1: ROW Market by Type: Layer 4-16, Layer 16-32, and More than 32 layers
  • 4.5.2: ROW Market by Application: Communication, Automotive, Medical, Aerospace, and Others

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global 5G High Frequency PCB Market by Type
  • 6.1.2: Growth Opportunities for the Global 5G High Frequency PCB Market by Application
  • 6.1.3: Growth Opportunities for the Global 5G High Frequency PCB Market by Region
• 6.2: Emerging Trends in the Global 5G High Frequency PCB Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global 5G High Frequency PCB Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global 5G High Frequency PCB Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Nippon Mektron
• 7.2: Samsung Electro-Mechanics
• 7.3: Young Poong Electronics
• 7.4: Daeduck
• 7.5: Ibiden
• 7.6: AT&S
• 7.7: Hannstar Board
• 7.8: Shennan Circuits
• 7.9: Zhen Ding Tech
• 7.10: TTM Technologies