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先進半導体パッケージング市場レポート：2030年までの動向、予測、競合分析

Advanced Semiconductor Packaging Market Report: Trends, Forecast and Competitive Analysis to 2030
出版日: | 発行: Lucintel | ページ情報: 英文 150 - page report | 納期: 3営業日

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先進半導体パッケージング市場レポート：2030年までの動向、予測、競合分析
出版日: 2024年01月29日
発行: Lucintel
ページ情報: 英文 150 - page report
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

先進半導体パッケージングの動向と予測

世界の先進半導体パッケージング市場は、2024年から2030年までのCAGRが7.6%で、2030年には推定474億米ドルに達すると予想されています。この市場の主な促進要因は、電子デバイスの普及が進んでいること、ウエハーレベルパッケージへの注目が高まっていること、半導体パッケージング技術への投資と研究開発が拡大していることです。世界の先進半導体パッケージング市場の将来は、自動車、航空宇宙・防衛、医療機器、家電産業市場に機会があり、有望視されています。

先進半導体パッケージング市場の洞察

Lucintelは、優れた電気性能、高いコネクタ密度、小型フォームファクタにより、ファンアウトウエハーレベルパッケージが予測期間中最大のセグメントであり続けると予測しています。

アジア太平洋地域は、革新的なパッケージング技術に対する需要の増加、自動車、家電産業市場の急速な発展と拡大、5G、AI、IoTなどの新興技術の台頭により、予測期間中も最大セグメントであり続けると思われます。

よくある質問

Q1.市場規模は？

A1.世界の先進半導体パッケージング市場は、2030年までに推定474億米ドルに達すると予想されています。

Q2.市場の成長予測は？

A2.世界の先進半導体パッケージング市場は、2024年から2030年にかけてCAGR 7.6%で成長する見込みです。

Q3.市場の成長に影響を与える主な促進要因は？

A3.この市場の主な促進要因は、電子デバイスの採用が増加していること、ウエハーレベルパッケージへの注目が高まっていること、半導体パッケージング技術への投資と研究開発が拡大していることです。

Q4.市場の主要セグメントは？

A4.世界の先進半導体パッケージング市場の将来は、自動車、航空宇宙・防衛、医療機器、家電産業市場での機会により有望視されています。

Q5.市場の主要企業は？

A5.先進半導体パッケージングの主要企業は以下の通り。

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6.今後、最大となる市場セグメントは？

A6.Lucintelは、ファンアウトウエハーレベルパッケージは、その優れた電気的性能、高いコネクタ密度、小型フォームファクタにより、予測期間中最大のセグメントであり続けると予測しています。

Q7.市場において、今後5年間に最大になると予想される地域は？

A7.アジア太平洋は、革新的なパッケージング技術に対する需要の増加、自動車、家電産業市場の急速な発展と拡大、5G、AI、IoTなどの新興技術の台頭により、予測期間中も最大セグメントであり続ける。

Q8.レポートのカスタマイズは可能？

A8.はい、Lucintelは追加費用なしで10％のカスタマイズを提供します。

目次

第1章 エグゼクティブサマリー

第2章 世界の先進半導体パッケージング市場：市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

  • マクロ経済動向（2018～2023年）と予測（2024～2030年）
  • 世界の先進半導体パッケージング市場の動向（2018～2023年）と予測（2024～2030年）
  • タイプ別の世界の先進半導体パッケージング市場
    • ファンアウトウエハーレベルパッケージ
    • 5D/3D
    • ファンインウエハーレベルパッケージ
    • フリップチップ
  • アプリケーション別の世界の先進半導体パッケージング市場
    • 自動車
    • 航空宇宙と防衛
    • 医療機器
    • 家電
    • その他

第4章 2018年から2030年までの地域別の市場動向と予測分析

  • 地域別の世界の先進半導体パッケージング市場
  • 北米の先進半導体パッケージング市場
  • 欧州の先進半導体パッケージング市場
  • アジア太平洋の先進半導体パッケージング市場
  • その他地域の先進半導体パッケージング市場

第5章 競合の分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

  • 成長機会分析
    • タイプ別の世界の先進半導体パッケージング市場の成長機会
    • アプリケーション別の世界の先進半導体パッケージング市場の成長機会
    • 地域別の世界の先進半導体パッケージング市場の成長機会
  • 世界の先進半導体パッケージング市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界の先進半導体パッケージング市場の能力拡大
    • 世界の先進半導体パッケージング市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 有力企業の企業プロファイル

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP
目次

Advanced Semiconductor Packaging Trends and Forecast

The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets. The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030 with a CAGR of 7.6% from 2024 to 2030. The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

A more than 150-page report is developed to help in your business decisions.

Advanced Semiconductor Packaging by Segment

The study includes a forecast for the global advanced semiconductor packaging by type, application, and region.

Advanced Semiconductor Packaging Market by Type [Shipment Analysis by Value from 2018 to 2030]:

  • Fan-Out Wafer Level Package
  • 5D/3D
  • Fan-In Wafer Level Package
  • Flip Chip

Advanced Semiconductor Packaging Market by Application [Shipment Analysis by Value from 2018 to 2030]:

  • Automotive
  • Aerospace and Defence
  • Medical Devices
  • Consumer Electronics
  • Others

Advanced Semiconductor Packaging Market by Region [Shipment Analysis by Value from 2018 to 2030]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Advanced Semiconductor Packaging Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies advanced semiconductor packaging companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the advanced semiconductor packaging companies profiled in this report include-

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Advanced Semiconductor Packaging Market Insights

Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Features of the Global Advanced Semiconductor Packaging Market

Market Size Estimates: Advanced semiconductor packaging market size estimation in terms of value ($B).

Trend and Forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Advanced semiconductor packaging market size by type, application, and region in terms of value ($B).

Regional Analysis: Advanced semiconductor packaging market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different type, application, and regions for the advanced semiconductor packaging market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the advanced semiconductor packaging market.

Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the advanced semiconductor packaging market size?

Answer: The global advanced semiconductor packaging market is expected to reach an estimated $47.4 billion by 2030.

Q2. What is the growth forecast for advanced semiconductor packaging market?

Answer: The global advanced semiconductor packaging market is expected to grow with a CAGR of 7.6% from 2024 to 2030.

Q3. What are the major drivers influencing the growth of the advanced semiconductor packaging market?

Answer: The major drivers for this market are rising adoption of electronic devices, increasing focus on wafer-level packages, as well as, growing investments and R&D in semiconductor packaging technologies.

Q4. What are the major segments for advanced semiconductor packaging market?

Answer: The future of the global advanced semiconductor packaging market looks promising with opportunities in the automotive, aerospace and defence, medical device, and consumer electronics markets.

Q5. Who are the key advanced semiconductor packaging market companies?

Answer: Some of the key advanced semiconductor packaging companies are as follows.

  • Advanced Semiconductor Engineering
  • Intel
  • Advanced Micro Devices
  • Amkor Technology
  • Hitachi Chemical
  • Jiangsu Changjiang Electronics Technology
  • Infineon
  • Kyocera
  • Sumitomo Chemical
  • China Wafer Level CSP

Q6. Which advanced semiconductor packaging market segment will be the largest in future?

Answer: Lucintel forecasts that fan-out wafer level package will remain the largest segment over the forecast period due to its superior electrical performance, high connector density, and small form factor.

Q7. In advanced semiconductor packaging market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest segment over the forecast period due to region's increasing demand for innovative packaging technologies, rapid developments and expansion of automotive, and consumer electronics industries, as well as the rise of emerging technologies like 5G, AI, and IoT.

Q.8 Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the advanced semiconductor packaging market by type (fan-out wafer level package , 5D/3D, fan-in wafer level package , and flip chip), application (automotive, aerospace and defence, medical devices, consumer electronics, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Advanced Semiconductor Packaging Market : Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2018 to 2030

  • 3.1. Macroeconomic Trends (2018-2023) and Forecast (2024-2030)
  • 3.2. Global Advanced Semiconductor Packaging Market Trends (2018-2023) and Forecast (2024-2030)
  • 3.3: Global Advanced Semiconductor Packaging Market by Type
    • 3.3.1: Fan-out Wafer Level Package
    • 3.3.2: 5D/3D
    • 3.3.3: Fan-in Wafer Level Package
    • 3.3.4: Flip Chip
  • 3.4: Global Advanced Semiconductor Packaging Market by Application
    • 3.4.1: Automotive
    • 3.4.2: Aerospace and Defence
    • 3.4.3: Medical Devices
    • 3.4.4: Consumer Electronics
    • 3.4.5: Others

4. Market Trends and Forecast Analysis by Region from 2018 to 2030

  • 4.1: Global Advanced Semiconductor Packaging Market by Region
  • 4.2: North American Advanced Semiconductor Packaging Market
    • 4.2.2: North American Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.3: European Advanced Semiconductor Packaging Market
    • 4.3.1: European Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.3.2: European Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.4: APAC Advanced Semiconductor Packaging Market
    • 4.4.1: APAC Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.4.2: APAC Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others
  • 4.5: ROW Advanced Semiconductor Packaging Market
    • 4.5.1: ROW Advanced Semiconductor Packaging Market by Type: Fan-out Wafer Level Package , 5D/3D, Fan-in Wafer Level Package , and Flip Chip
    • 4.5.2: ROW Advanced Semiconductor Packaging Market by Application: Automotive, Aerospace and Defence, Medical Devices, Consumer Electronics, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Type
    • 6.1.2: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Application
    • 6.1.3: Growth Opportunities for the Global Advanced Semiconductor Packaging Market by Region
  • 6.2: Emerging Trends in the Global Advanced Semiconductor Packaging Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Advanced Semiconductor Packaging Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Advanced Semiconductor Packaging Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Advanced Semiconductor Engineering
  • 7.2: Intel
  • 7.3: Advanced Micro Devices
  • 7.4: Amkor Technology
  • 7.5: Hitachi Chemical
  • 7.6: Jiangsu Changjiang Electronics Technology
  • 7.7: Infineon
  • 7.8: Kyocera
  • 7.9: Sumitomo Chemical
  • 7.10: China Wafer Level CSP