IGBT用ピンフィンヒートシンク市場レポート：2030年までの動向、予測、競合分析

IGBT用ピンフィンヒートシンクの動向と予測

IGBT用ピンフィンヒートシンクの世界市場は、2024年から2030年までのCAGRが5.6%で、2030年には推定12億8,570万米ドルに達すると予測されています。この市場の主な促進要因は、最新の電子機器における効率的な冷却ソリューションに対する需要の増加、さまざまな自動化産業におけるIGBTの使用量の増加、ハイブリッド車や電気自動車におけるこのデバイスの用途の拡大です。世界のIGBT用ピンフィン・ヒートシンク市場の将来は、自動車分野や民生用エレクトロニクス・アプリケーションにおける機会によって有望視されています。

IGBT用ピンフィンヒートシンク市場洞察

Lucintelの予測では、アルミニウムは優れた熱伝導性、柔軟性、費用対効果により、メーカーに広く使用されているため、予測期間中に高い成長が見込まれます。

自動車分野は、電気自動車（EVS）の需要増と自動車におけるIGBTモジュールの大幅な統合により、予測期間中に高い成長が見込まれます。

アジア太平洋は、自動車産業の急速な拡大、電源装置の需要増加、同地域におけるホームオートメーションプロジェクトの出現により、予測期間中に最も高い成長が見込まれています。

本レポートでは、以下の11の主要な質問に回答している：

• Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か？
• Q.2.どのセグメントがより速いペースで成長するのか、またその理由は？
• Q.3.今後成長が加速すると思われる地域とその理由は？
• Q.4.市場力学に影響を与える主な要因は何か？市場における主な課題とビジネスリスクは？
• Q.5.この市場におけるビジネスリスクと競合の脅威は？
• Q.6.この市場における新たな動向とその理由は？
• Q.7.市場における顧客の需要の変化にはどのようなものがありますか？
• Q.8.この市場における新たな開発と、その開発をリードしている企業は？
• Q.9.この市場における主要企業は？主要企業は事業成長のためにどのような戦略的取り組みを進めているのか？
• Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替による市場シェア低下の脅威はどの程度ありますか？
• Q.11.過去5年間にどのようなM&Aが行われ、業界にどのような影響を与えましたか？

目次

第1章 エグゼクティブサマリー

第2章 世界のIGBT用ピンフィンヒートシンク市場：市場力学

• イントロダクション、背景、分類
• サプライチェーン
• 業界の促進要因と課題

第3章 2018年から2030年までの市場動向と予測分析

• マクロ経済動向（2018～2023年）と予測（2024～2030年）
• IGBT用ピンフィンヒートシンクの世界市場動向（2018～2023年）と予測（2024～2030年）
• 材料タイプ別：世界IGBT用ピンフィンヒートシンク市場
  • アルミニウム
  • 銅
• 用途別：世界のIGBT用ピンフィンヒートシンク市場
  • 自動車分野
  • 家電

第4章 2018年から2030年までの地域別の市場動向と予測分析

• 地域別の世界のIGBT用ピンフィンヒートシンク市場
• 北米のIGBT用ピンフィンヒートシンク市場
• 欧州のIGBT用ピンフィンヒートシンク市場
• アジア太平洋 IGBT用ピンフィンヒートシンク市場
• その他地域のIGBT用ピンフィンヒートシンク市場

第5章 競合の分析

• 製品ポートフォリオ分析
• 運用上の統合
• ポーターのファイブフォース分析

第6章 成長機会と戦略的分析

• 成長機会分析
• 世界のIGBT用ピンフィンヒートシンク市場の新たな動向
• 戦略的分析
  • 新製品の開発
  • 世界のIGBT用ピンフィンヒートシンク市場の能力拡大
  • 世界のIGBT用ピンフィンヒートシンク市場における合併、買収、合弁事業
  • 認証とライセンシング

第7章 有力企業の企業プロファイル

• Honeywell International
• Comair Rotron
• Aavid Thermalloy
• CUI
• Apex Microtechnology
• Allbrass Industrial
• Kunshan Googe
• Advanced Thermal Solutions

Pin Fin Heat Sink for IGBT Trends and forecast

The future of the global pin fin heat sink for IGBT market looks promising with opportunities in the automotive field and consumer electronic applications. The global pin fin heat sink for IGBT market is expected to reach an estimated $1285.7 million by 2030 with a CAGR of 5.6% from 2024 to 2030. The major drivers for this market are increasing demand for efficient cooling solutions in modern electronics, rising use of IGBTs across various automated industries,and growing application of this device in hybrid and electric vehicles.

A more than 150-page report is developed to help in your business decisions.

Pin Fin Heat Sink for IGBT by Segment

The study includes a forecast for the global pin fin heat sink for IGBT by material type, application, end use industry, technology, and region.

Pin Fin Heat Sink for IGBT Market by Material Type [Shipment Analysis by Value from 2018 to 2030]:

• Aluminium
• Copper

Pin Fin Heat Sink for IGBT Market by Application [Shipment Analysis by Value from 2018 to 2030]:

• Automotive Field
• Consumer Electronics

Pin Fin Heat Sink for IGBT Market by Region [Shipment Analysis by Value from 2018 to 2030]:

• North America
• Europe
• Asia Pacific
• The Rest of the World

List of Pin Fin Heat Sink for IGBT Companies

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies pin fin heat sink for IGBT companies cater increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the pin fin heat sink for IGBT companies profiled in this report include-

• Honeywell International
• Comair Rotron
• Aavid Thermalloy
• CUI
• Apex Microtechnology
• Allbrass Industrial
• Kunshan Googe
• Advanced Thermal Solutions

Pin Fin Heat Sink for IGBT Market Insights

Lucintel forecast that aluminium is expected to witness higher growth over the forecast period due to its significant use by manufacturers owing to its excellent thermal conductivity, flexibility, and cost-effectiveness.

Automotive field is expected to witness higher growth over the forecast perioddue to increasing demand for electric vehicles (EVS) and substantial integration of IGBT modules in automotive.

APAC is expected to witness highest growth over the forecast period due to rapid expansion of the automotive industry, rising demand for power supply equipment, and the emergence of home automation projects in the region.

Features of the Global Pin Fin Heat Sink for IGBT Market

Market Size Estimates: Pin fin heat sink for IGBT market size estimation in terms of value ($M).

Trend and forecast Analysis: Market trends (2018 to 2023) and forecast (2024 to 2030) by various segments and regions.

Segmentation Analysis: Pin fin heat sink for IGBT market size by material type, application, and region. in terms of value ($M).

Regional Analysis: Pin fin heat sink for IGBT market breakdown by North America, Europe, Asia Pacific, and Rest of the World.

Growth Opportunities: Analysis of growth opportunities in different material types, applications, and region.s for the pin fin heat sink for IGBT market.

Strategic Analysis: This includes M&A, new product development, and competitive landscape of the pin fin heat sink for IGBT market.

Analysis of competitive intensity of the industry based on Porter's Five forces model.

FAQ

Q.1. What is the pin fin heat sink for IGBT market size?

Answer: The global pin fin heat sink for IGBT market is expected to reach an estimated $1285.7 million by 2030.

Q.2. What is the growth forecast for pin fin heat sink for IGBT market?

Answer: The global pin fin heat sink for IGBT market is expected to grow with a CAGR of 5.6% from 2024 to 2030.

Q.3. What are the major drivers influencing the growth of the pin fin heat sink for IGBT market?

Answer: The major drivers for this market are increasing demand for efficient cooling solutions in modern electronics, rising use of IGBTs across various automated industries, and growing application of this device in hybrid and electric vehicles.

Q.4. What are the major segments for pin fin heat sink for IGBT market?

Answer: The future of the pin fin heat sink for IGBT market looks promising with opportunities in the automotive field and consumer electronic applications.

Q.5. Who are the key pin fin heat sink for IGBT market companies?

Answer: Some of the key pin fin heat sink for IGBT companies are as follows:

• Honeywell International
• Comair Rotron
• Aavid Thermalloy
• CUI
• Apex Microtechnology
• Allbrass Industrial
• Kunshan Googe
• Advanced Thermal Solutions

Q.6. Which pin fin heat sink for IGBT market segment will be the largest in future?

Answer: Lucintel forecast that aluminium is expected to witness higher growth over the forecast period due to its significant use by manufacturers owing to its excellent thermal conductivity, flexibility, and cost-effectiveness.

Q.7. In pin fin heat sink for IGBT market, which region is expected to be the largest in next 5 years?

Answer: APAC is expected to witness highest growth over the forecast period due to rapid expansion of the automotive industry, rising demand for power supply equipment, and the emergence of home automation projects in the region.

Q.8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10% customization without any additional cost.

This report answers following 11 key questions:

• Q.1. What are some of the most promising, high-growth opportunities for the pin fin heat sink for IGBT market by material type (aluminium and copper), application (automotive field and consumer electronics), and region. (North America, Europe, Asia Pacific, and the Rest of the World)?
• Q.2. Which segments will grow at a faster pace and why?
• Q.3. Which region will grow at a faster pace and why?
• Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
• Q.5. What are the business risks and competitive threats in this market?
• Q.6. What are the emerging trends in this market and the reasons behind them?
• Q.7. What are some of the changing demands of customers in the market?
• Q.8. What are the new developments in the market? Which companies are leading these developments?
• Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
• Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
• Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Pin Fin Heat Sink for IGBT Market: Market Dynamics

• 2.1: Introduction, Background, and Classifications
• 2.2: Supply Chain
• 2.3: Industry Drivers and Challenges

3. Market Trends and forecast Analysis from 2018 to 2030

• 3.1. Macroeconomic Trends (2018-2023) and forecast (2024-2030)
• 3.2. Global Pin Fin Heat Sink for IGBT Market Trends (2018-2023) and forecast (2024-2030)
• 3.3: Global Pin Fin Heat Sink for IGBT Market by Material Type
  • 3.3.1: Aluminium
  • 3.3.2: Copper
• 3.4: Global Pin Fin Heat Sink for IGBT Market by Application
  • 3.4.1: Automotive Field
  • 3.4.2: Consumer Electronics

4. Market Trends and forecast Analysis by Region from 2018 to 2030

• 4.1: Global Pin Fin Heat Sink for IGBT Market by Region
• 4.2: North American Pin Fin Heat Sink for IGBT Market
  • 4.2.1: North American Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
  • 4.2.2: North American Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
• 4.3: European Pin Fin Heat Sink for IGBT Market
  • 4.3.1: European Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
  • 4.3.2: European Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
• 4.4: APAC Pin Fin Heat Sink for IGBT Market
  • 4.4.1: APAC Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
  • 4.4.2: APAC Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics
• 4.5: ROW Pin Fin Heat Sink for IGBT Market
  • 4.5.1: ROW Pin Fin Heat Sink for IGBT Market by Material Type: Aluminium and Copper
  • 4.5.2: ROW Pin Fin Heat Sink for IGBT Market by Application: Automotive Field and Consumer Electronics

5. Competitor Analysis

• 5.1: Product Portfolio Analysis
• 5.2: Operational Integration
• 5.3: Porter's Five forces Analysis

6. Growth Opportunities and Strategic Analysis

• 6.1: Growth Opportunity Analysis
  • 6.1.1: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Material Type
  • 6.1.2: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Application
  • 6.1.3: Growth Opportunities for the Global Pin Fin Heat Sink for IGBT Market by Region
• 6.2: Emerging Trends in the Global Pin Fin Heat Sink for IGBT Market
• 6.3: Strategic Analysis
  • 6.3.1: New Product Development
  • 6.3.2: Capacity Expansion of the Global Pin Fin Heat Sink for IGBT Market
  • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Pin Fin Heat Sink for IGBT Market
  • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

• 7.1: Honeywell International
• 7.2: Comair Rotron
• 7.3: Aavid Thermalloy
• 7.4: CUI
• 7.5: Apex Microtechnology
• 7.6: Allbrass Industrial
• 7.7: Kunshan Googe
• 7.8: Advanced Thermal Solutions