Product Code: ELE0163
The global microelectronics semiconductor packaging (MIPAC) market was valued at US$44,187 million in 2021 and is projected to grow at a CAGR of 4.6% during the forecast period 2022-2032.
“The Microelectronics Semiconductor Packaging (MIPAC) Market Report 2022-2032”: This report will prove invaluable to leading firms striving for new revenue pockets if they wish to better understand the industry and its underlying dynamics. It will be useful for companies that would like to expand into different industries or to expand their existing operations in a new region.
Multi-Chip Packaging (MCP) Connects Several Integrated Circuits (ICs) in A Single Package Structure to Integrate an Electronic System
Multi-chip packaging (MCP), a recent advancement in electronic packaging, connects several integrated circuits (ICs) in a single package structure to integrate an electronic system. Both planar multi-chip modules (MCMs) and the 3D stacked chip packing known as system-in-package (SiP), which includes ICs stacked vertically, are used in MCP technology. To stack chips, one of two methods stacking single-chip packages, stacking many chips in a single package, or combining both methods can be used.
Wafer-level packaging (WLP), which includes making the package while the chips are still in wafer form and then slicing them to separate them, has lately gained popularity. By creating vias through the material used to physically separate the wafers, wafer-level packaging of stacked wafers connects the stacked chips. In light of this, system packaging at the wafer level is feasible and will enable the blending of many technologies in a single package.
High Capital Expenditures For Upscale Packaging Options
High capital expenditures are needed by high-end semiconductor packaging and testing enterprises to produce pricey equipment made by a few number of suppliers. Adoption of innovative packaging techniques has become necessary due to rising miniaturisation demands and low thermal ratings. Only a small number of firms are able to offer these solutions because to the high capital requirements, which restrains the market's expansion. Semiconductor technology advances in terms of both performance and economics. The cost per gate and wafer reduction is similar to the earlier trend of the 22nm Si node. To address the increasing demand for greater functionality, miniaturisation, cost reduction, and enhanced performance, semiconductor manufacturers are gradually implementing advanced packaging technologies such as 3D/2.5D integration with TSVs and interposers and fan-out wafer level packaging (FOWLP).
What Questions Should You Ask before Buying a Market Research Report?
- How is the microelectronics semiconductor packaging (MIPAC) market evolving?
- What is driving and restraining the microelectronics semiconductor packaging (MIPAC) market?
- How will each microelectronics semiconductor packaging (MIPAC) submarket segment grow over the forecast period and how much revenue will these submarkets account for in 2032?
- How will the market shares for each microelectronics semiconductor packaging (MIPAC) submarket develop from 2022 to 2032?
- What will be the main driver for the overall market from 2022 to 2032?
- Will leading microelectronics semiconductor packaging (MIPAC) markets broadly follow the macroeconomic dynamics, or will individual national markets outperform others?
- How will the market shares of the national markets change by 2032 and which geographical region will lead the market in 2032?
- Who are the leading players and what are their prospects over the forecast period?
- What are the microelectronics semiconductor packaging (MIPAC) projects for these leading companies?
- How will the industry evolve during the period between 2020 and 2032? What are the implications of microelectronics semiconductor packaging (MIPAC) projects taking place now and over the next 10 years?
- Is there a greater need for product commercialisation to further scale the microelectronics semiconductor packaging (MIPAC) market?
- Where is the microelectronics semiconductor packaging (MIPAC) market heading and how can you ensure you are at the forefront of the market?
- What are the best investment options for new product and service lines?
- What are the key prospects for moving companies into a new growth path and C-suite?
You need to discover how this will impact the microelectronics semiconductor packaging (MIPAC) market today, and over the next 10 years:
- Our 316-page report provides 182 tables and 164 charts/graphs exclusively to you.
- The report highlights key lucrative areas in the industry so you can target them - NOW.
- It contains in-depth analysis of global, regional and national sales and growth.
- It highlights for you the key successful trends, changes and revenue projections made by your competitors.
This report tells you TODAY how the microelectronics semiconductor packaging (MIPAC) market will develop in the next 10 years, and in line with the variations in COVID-19 economic recession and bounce. This market is more critical now than at any point over the last 10 years.
Forecasts to 2032 and other analyses reveal commercial prospects
- In addition to revenue forecasting to 2032, our new study provides you with recent results, growth rates, and market shares.
- You will find original analyses, with business outlooks and developments.
- Discover qualitative analyses (including market dynamics, drivers, opportunities, restraints and challenges), cost structure, impact of rising microelectronics semiconductor packaging (MIPAC) prices and recent developments.
This report includes data analysis and invaluable insight into how COVID-19 will affect the industry and your company. Four COVID-19 recovery patterns and their impact, namely, "V", "L", "W" and "U" are discussed in this report.
Segments Covered in the Report:
Market Segment by Material
- Simple Semiconductor Material
- Compound Semiconductor Material
- Other Semiconductor Material
Market Segment by Type
- Flip Chip
- Embedded DIE
- Fan-in WLP
- Fan-out WLP
Market Segment by End-User
- Consumer Electronics
- IT & Telecommunications
- Automotive
- Industrial
- Other End-Users
Market Segment by Technology
- Grid Array
- Small Outline Package
- Dual-flat no-leads (DFN)
- Quad-flat no-leads (QFN)
- Plastic Dual Inline Package (PDIP)
- Ceramic Dual Inline Package (CDIP)
In addition to the revenue predictions for the overall world market and segments, you will also find revenue forecasts for four regional and 20 leading national markets:
North America
Europe
- Germany
- Spain
- United Kingdom
- France
- Italy
- Rest of Europe
Asia Pacific
- China
- Japan
- Singapore
- Taiwan
- South Korea
- Rest of Asia Pacific
Middle East & Africa
- Turkey
- Saudi Arabia
- South Africa
- Rest of Middle East & Africa
South America
- Brazil
- Mexico
- Rest of South America
The report also includes profiles and for some of the leading companies in the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032, with a focus on this segment of these companies' operations.
Leading companies and the potential for market growth:
- Amkor Technology, Inc.
- ASE Group
- Chipbond Technology Corporation
- Chipmos Technologies, Inc.
- Fujitsu Ltd
- Intel Corporation
- Interconnect Systems, Inc. (ISI)
- Jcet/Stats Chippac Ltd
- Murata Electronics
- Powertech Technology, Inc.
- Samsung Electronics Co. Ltd
- Siliconware Precision Industries Co. Ltd (Spil)
- Tianshui Huatian Technology Co. Ltd
- Unisem (M) Berhad
- UTAC Group
Overall world revenue for Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 in terms of value the market will surpass US$46,043 million in 2022, our work calculates. We predict strong revenue growth through to 2032. Our work identifies which organizations hold the greatest potential. Discover their capabilities, progress, and commercial prospects, helping you stay ahead.
How will the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 report help you?
In summary, our 310+ page report provides you with the following knowledge:
- Revenue forecasts to 2032 for Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 Market, with forecasts for technology, material, end-user, type and company size, each forecast at a global and regional level - discover the industry's prospects, finding the most lucrative places for investments and revenues.
- Revenue forecasts to 2032 for four regional and 20 key national markets - See forecasts for the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032 market in North America, Europe, Asia-Pacific and LAMEA. Also forecasted is the market in the US, Canada, Taiwan, Brazil, Germany, France, UK, Italy, China, Singapore, Japan, and Australia among other prominent economies.
- Prospects for established firms and those seeking to enter the market - including company profiles for 15 of the major companies involved in the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032.
Find quantitative and qualitative analyses with independent predictions. Receive information that only our report contains, staying informed with invaluable business intelligence.
Information found nowhere else
With our new report, you are less likely to fall behind in knowledge or miss out on opportunities. See how our work could benefit your research, analyses, and decisions. Our study is for everybody needing commercial analyses for the Microelectronics Semiconductor Packaging (MIPAC) Market, 2022 to 2032, market-leading companies. You will find data, trends and predictions.
Table of Contents
1. Report Overview
- 1.1 Objectives of the Study
- 1.2 Introduction to Microelectronics Semiconductor Packaging (MIPAC) Market
- 1.3 What This Report Delivers
- 1.4 Why You Should Read This Report
- 1.5 Key Questions Answered By This Analytical Report Include:
- 1.6 Who is This Report For?
- 1.7 Methodology
- 1.7.1 Market Definitions
- 1.7.2 Market Evaluation & Forecasting Methodology
- 1.7.3 Data Validation
- 1.8 Frequently Asked Questions (FAQs)
- 1.9 Associated Reports
- 1.10 About
2 Executive Summary
3 Premium Insights
- 3.1 Region Segment: Global Microelectronics Semiconductor Packaging (MIPAC) Market
- 3.2 Materials Segment: Global Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 3.3 End-users Segment: Global Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 3.4 Technology Segment: Global Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 3.5 North America Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 3.6 Europe Microelectronics Semiconductor Packaging (MIPAC) Attractiveness Index
- 3.7 Asia-Pacific Microelectronics Semiconductor Packaging (MIPAC) Attractiveness Index
- 3.8 Middle East Africa Microelectronics Semiconductor Packaging (MIPAC) Attractiveness Index
- 3.9 South America Microelectronics Semiconductor Packaging (MIPAC) Attractiveness Index
4 Market Overview
- 4.1 Key Findings
- 4.2 Market Dynamics
- 4.2.1 Market Driving Factors
- 4.2.2 Market Restraining Factors
- 4.2.3 Market Opportunities
- 4.3 COVID-19 Impact Analysis
- 4.4 Porter's Five Forces Analysis
- 4.4.1 Supplier Power
- 4.4.2 Buyer Power
- 4.4.3 Competitive Rivalry
- 4.4.4 Threat from Substitutes
- 4.4.5 Threat of New Entrants
- 4.5 PESTLE Analysis
- 4.5.1 Political Factors
- 4.5.2 Economic Factors
- 4.5.3 Social Factors
- 4.5.4 Technology Factors
- 4.5.5 Environmental Factors
5 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Material
- 5.1 Key Findings
- 5.2 Materials Segment Growth Prospects
- 5.3 Global Microelectronics Semiconductor Packaging (MIPAC) Market Share by Materials, 2022 & 2032
- 5.4 Simple Semiconductor
- 5.5 Global Simple Semiconductor Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 5.6 Global Simple Semiconductor Market Size Estimation and Forecast by Region, 2022-2032 (%)
- 5.7 Compound Semiconductor
- 5.8 Global Compound Semiconductor Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 5.9 Global Compound Semiconductor Market Size Estimation and Forecast by Region, 2022-2032 (%)
- 5.10 Global Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
6 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Type
- 6.1 Key Findings
- 6.2 Type Segment Growth Prospects
- 6.3 Global Microelectronics Semiconductor Packaging (MIPAC) Market Share by Therapeutics, 2022 & 2032
- 6.4 Flip-Chip Packages
- 6.5 Global Flip-Chip Packages Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 6.6 Global Flip-Chip Packages Market Size Estimation and Forecast by Region, 2022-2032 (%)
- 6.7 Embedded Die
- 6.8 Global Embedded Die Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 6.9 Global Embedded Die Market Size Estimation and Forecast by Region, 2022-2032 (%)
- 6.10 Fan-in WLP
- 6.11 Global Fan-in WLP Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 6.12 Global Fan-in WLP Market Size Estimation and Forecast Region, 2022-2032 (%)
- 6.13 Fan-out WLP
- 6.14 Global Fan-Out WLP Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 6.15 Global Fan-Out WLP Market Size Estimation and Forecast, by Region, 2022-2032 (%)
- 6.16 Global Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
7 Global Microelectronics Semiconductor Packaging (MIPAC) Market by Technology
- 7.1 Key Findings
- 7.2 Technology Segment Growth Prospects
- 7.3 Global Microelectronics Semiconductor Packaging (MIPAC) Market Share by Therapeutics, 2022 & 2032
- 7.4 Grid Array
- 7.4.1 Global Grid Array Market Size Estimation and Forecast, 2022-2032 (US$Mn)
- 7.5 Global Grid Array Market Size Estimation and Forecast by Region, 2022-2032 (%)
- 7.6 Quad-Flat No-Leads (QFN)
- 7.7 Global Quad-Flat No-Leads (QFN) Market Size Estimation and Forecast
- 7.8 Global Quad-Flat No-Leads (QFN) Market Size Estimation and Forecast by Region
- 7.9 Dual-Flat No-Leads (DFN)
- 7.10 Global Dual-Flat No-Leads (QFN) Market Size Estimation and Forecast
- 7.11 Global Dual-Flat No-Leads (QFN) Market Size Estimation and Forecast by Region
- 7.12 Plastic Dual Inline Package (PDIP)
- 7.13 Global Plastic Dual Inline Package (PDIP) Market Size Estimation and Forecast
- 7.14 Global Plastic Dual Inline Package (PDIP) Market Size Estimation and Forecast by Region
- 7.15 Small Outline Package
- 7.16 Global Small Outline Package Market Size Estimation and Forecast
- 7.17 Global Small Outline Package Market Size Estimation and Forecast by Region
- 7.18 Ceramic Dual Inline Package (CDIP)
- 7.19 Global Ceramic Dual Inline Package (CDIP)Market Size Estimation and Forecast
- 7.20 Global Ceramic Dual Inline Package (CDIP) Market Size Estimation and Forecast by Region
- 7.21 Global Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Technology
8 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by End User
- 8.1 Key Findings
- 8.2 End User Segment Growth Prospects
- 8.3 Global Microelectronics Semiconductor Packaging (MIPAC) Market Share by End User, 2022 & 2032
- 8.4 Automotive
- 8.5 Global Automotive Market Size and Estimation Forecast
- 8.6 Global Automotive Market Size and Estimation Forecast by Region
- 8.7 Consumer Electronics
- 8.8 Global Consumer Electronics Market Size and Estimation Forecast
- 8.9 Global Consumer Electronics Market Size and Estimation Forecast by Region
- 8.10 Industrial
- 8.11 Global Industrial Market Size and Estimation Forecast
- 8.12 Global Industrial Market Size and Estimation by Region
- 8.13 IT & Telecommunications
- 8.14 Global IT & Telecommunication Market Size and Estimation Forecast
- 8.15 Global IT & Telecommunication Market Size and Estimation Forecast by Region
- 8.16 Global Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End User
9 Global Microelectronics Semiconductor Packaging (MIPAC) Market Analysis by Region
- 9.1 Key Findings
- 9.2 North America
- 9.3 Europe
- 9.4 Asia-Pacific
- 9.5 Middle East and Africa
- 9.6 South America
- 9.7 Regional Market Size Estimation and Forecast
10 North America Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
- 10.1 Key Findings
- 10.2 North American Semiconductor Manufacturing Equipment Demand
- 10.3 North America Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 10.4 North America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Country
- 10.5 North America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
- 10.6 North America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
- 10.7 North America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End-users
- 10.8 North America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Technology
- 10.9 U.S.
- 10.10 Canada
11 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
- 11.1 Key Findings
- 11.2 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 11.3 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Country
- 11.4 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
- 11.5 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
- 11.6 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End-users
- 11.7 Europe Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Technology
- 11.8 Germany Market
- 11.9 France Market
- 11.10 UK Market
- 11.11 Italy Market
- 11.12 Spain Market
- 11.13 Rest of Europe
12 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
- 12.1 Key Findings
- 12.2 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 12.3 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Country
- 12.4 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
- 12.5 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
- 12.6 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End-users
- 12.7 Asia-Pacific Market Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Technology
- 12.8 China Market
- 12.9 Taiwan Market
- 12.10 Japan Market
- 12.11 South Korea Market
- 12.12 Singapore Market
- 12.13 Rest of Asia-Pacific
13 South America Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
- 13.1 Key Findings
- 13.2 South America Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 13.3 South America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Country
- 13.4 South America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
- 13.5 South America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
- 13.6 South America Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End-users
- 13.7 Brazil Market
- 13.8 Mexico Market
- 13.9 Rest of South America
14 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Analysis
- 14.1 Key Findings
- 14.2 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Attractiveness Index
- 14.3 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Country
- 14.4 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Materials
- 14.5 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Type
- 14.6 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by End-users
- 14.7 Middle East & Africa Microelectronics Semiconductor Packaging (MIPAC) Market Size Estimation and Forecast by Technology
- 14.8 Saudi Arabia Market
- 14.9 Turkey Market
- 14.10 South Africa Market
- 14.11 Rest of Middle East & Africa
15 Competitive Landscape
- 15.1 Company Share Analysis
- 15.2 Key Business Strategy Analysis - Collaboration
- 15.3 Key Business Strategy Analysis - Acquisition
- 15.4 Key Business Strategy Analysis - Expansion
- 15.5 Key Business Strategy Analysis -Investment
- 15.6 Key Business Strategy Analysis - New Product Launch
- 15.6 Key Business Strategy Analysis - Partnership
- 15.8 Key Business Strategy Analysis - Agreement
16 Company Profiles
- 16.1 ASE Group
- 16.1.1 Company Snapshot
- 16.1.2 Company Overview
- 16.1.3 Financial Analysis
- 16.1.4 Product Benchmarking
- 16.1.5 Strategic Outlook
- 16.2 Amkor Technology
- 16.2.1 Company Snapshot
- 16.2.2 Company Overview
- 16.2.3 Financial Analysis
- 16.2.4 Product Benchmarking
- 16.2.5 Strategic Outlook
- 16.3 Jcet/Stats Chippac Ltd
- 16.3.1 Company Snapshot
- 16.3.2 Company Overview
- 16.3.3 Product Benchmarking
- 16.3.4 Strategic Outlook
- 16.4 Siliconware Precision Industries Co. Ltd (Spil)
- 16.4.1 Company Snapshot
- 16.4.2 Company Overview
- 16.4.3 Product Benchmarking
- 16.5 Powertech Technology, Inc.
- 16.5.1 Company Snapshot
- 16.5.2 Company Overview
- 16.6 Tianshui Huatian Technology Co. Ltd
- 16.6.1 Company Snapshot
- 16.6.2 Company Overview
- 16.6.3 Strategic Outlook
- 16.7 Fujitsu Ltd
- 16.7.1 Company Snapshot
- 16.7.2 Company Overview
- 16.7.3 Financial Analysis
- 16.7.4 Product Benchmarking
- 16.7.5 Strategic Outlook
- 16.8 UTAC Group
- 16.8.1 Company Snapshot
- 16.8.2 Company Overview
- 16.8.3 Product Benchmarking
- 16.8.4 Strategic Outlook
- 16.9 Chipmos Technologies, Inc.
- 16.9.1 Company Snapshot
- 16.9.2 Company Overview
- 16.9.3 Financial Analysis
- 16.9.4 Product Benchmarking
- 16.10 Chipbond Technology Corporation
- 16.10.1 Company Snapshot
- 16.10.2 Company Overview
- 16.10.3 Strategic Outlook
- 16.11 Intel Corporation
- 16.11.1 Company Snapshot
- 16.11.2 Company Overview
- 16.11.3 Financial Analysis
- 16.11.4 Product Benchmarking
- 16.11.5 Strategic Outlook
- 16.12 Samsung Electronics Co. Ltd
- 16.12.1 Company Snapshot
- 16.12.2 Company Overview
- 16.12.3 Product Benchmarking
- 16.12.4 Strategic Outlook
- 16.13 Unisem (M) Berhad
- 16.13.1 Company Snapshot
- 16.13.2 Company Overview
- 16.13.3 Product Benchmarking
- 16.14 Interconnect Systems, Inc. (ISI)
- 16.14.1 Company Snapshot
- 16.14.2 Company Overview
- 16.14.3 Product Benchmarking
- 16.15 Murata Electronics
- 16.15.1 Company Snapshot
- 16.15.2 Company Overview
- 16.15.3 Strategic Outlook
17 Conclusion and Recommendations
- 17.1 Concluding Remarks from
- 17.2 Recommendations for Market Players
- 17.2.1 Ensure that Export Controls Support Semiconductor Manufacturing and Advanced Packaging Supply Chain:
- 17.2.2 Incentivize increased domestic advanced packaging capacity by leveraging Chips Act funds.
- 17.2.3 Encourage the formation of a joint venture in the United States with a leading supplier of IC substrates used in advanced packaging.