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3Dスタッキングの世界市場規模、シェア、産業動向分析レポート：相互接続技術別、方法別、デバイスタイプ別、エンドユーザー別、地域別展望と予測、2023年～2030年

Global 3D Stacking Market Size, Share & Industry Trends Analysis Report By Interconnecting Technology, By Method, By Device Type, By End User, By Regional Outlook and Forecast, 2023 - 2030
出版日: | 発行: KBV Research | ページ情報: 英文 349 Pages | 納期: 即納可能 即納可能とは

価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=156.98円
3Dスタッキングの世界市場規模、シェア、産業動向分析レポート：相互接続技術別、方法別、デバイスタイプ別、エンドユーザー別、地域別展望と予測、2023年～2030年
出版日: 2023年10月31日
発行: KBV Research
ページ情報: 英文 349 Pages
納期: 即納可能 即納可能とは
  • 全表示
  • 概要
  • 図表
  • 目次
概要

3Dスタッキング市場規模は2030年までに43億米ドルに達し、予測期間中にCAGR 19.8%の市場成長率で上昇すると予測されています。

しかし、3Dスタッキングは先進パッケージング技術を伴うため、製造コストと複雑さが増す可能性があります。この技術には、特殊な装置やプロセスへの投資が必要です。特に中小企業や新興企業にとっては、初期コストの高さが参入障壁となります。複雑な製造工程は、生産上の課題にもつながります。これには、従来の2D半導体製造とは異なる複雑な製造プロセスが含まれます。これらの工程には、ウエハーの薄型化、ダイボンディング、TSV形成、インターコネクトなどがあり、それぞれに専用の装置や専門知識が必要となります。コストと複雑性に関する課題は、市場に影響を与える重要な要因です。

相互接続技術の展望

相互接続技術に基づき、市場は3Dハイブリッドボンディング、3D TSV（シリコン貫通電極）、モノリシック3D集積に分類されます。2022年の市場では、3Dハイブリッドボンディング分野が大きな収益シェアを獲得しました。3Dハイブリッドボンディングは、ロジック、メモリー、センサーなど、異なる種類の半導体ダイを1つのパッケージに一緒に積層することを可能にします。これにより異種集積が容易になり、多様な機能を持つ複雑なシステムオンチップ（SoC）の構築が可能になります。

方式の展望

市場は方式別に、ダイ・ツー・ダイ、ダイ・ツー・ウエハー、ウエハー・ツー・ウエハー、チップ・ツー・チップ、チップ・ツー・ウエハーに分類されます。2022年には、チップ・ツー・チップ・セグメンテーションが市場で最も高い収益シェアを占めました。3D積層は、さまざまな特殊チップを1つのパッケージに統合することを可能にします。チップ・ツー・チップの積層は、異なるメーカーのチップの統合を可能にし、その結果、ユニークな機能を提供できる異種チップ統合を実現します。インターコネクトの長さを短くし、チップ間の近接を可能にすることで、消費電力と発熱を抑え、エネルギー効率を高めることができます。

デバイスタイプの展望

デバイスタイプ別に見ると、市場はロジックIC、イメージング＆オプトエレクトロニクス、メモリーデバイス、MEMS/センサー、LED、その他に分けられます。2022年の市場では、LED分野が大きな収益シェアを獲得しました。LEDは、さまざまな照明やディスプレイ用途に使用されています。LEDを3D積層パッケージに組み込むことで、メーカーは照明やディスプレイ機能を内蔵した小型・薄型のデバイスを作ることができます。これは、スマートフォン、ウェアラブル、車載ディスプレイなどの用途に不可欠です。LEDは電子機器の視覚的魅力を高める。バックライト、ステータスインジケータ、アクセント照明に使用されます。

エンドユーザーの展望

エンドユーザー別では、家電、製造、通信、自動車、医療機器/ヘルスケア、その他に区分されます。自動車分野は、2022年の市場で顕著な収益シェアを記録しました。自動車は、より小さな物理的フットプリントで複数のコンポーネントや機能を統合することができます。これにより、自動車分野では電子制御ユニット（ECU）やセンサーの小型軽量化が進み、他の車両部品のためのスペースが確保され、全体的な重量が軽減されます。

地域別展望

地域別では、北米、欧州、アジア太平洋、LAMEAで市場を分析しています。2022年には、アジア太平洋地域が最も高い収益シェアを獲得して市場をリードしました。アジア太平洋地域は、大規模かつ急速に成長している家電部門の本拠地です。スマートフォンやタブレット端末、ウェアラブル端末など、より小型で高性能、かつエネルギー効率の高い機器への需要が、こうした目標を達成するための技術採用を後押ししています。アジア太平洋、特に中国、台湾、韓国、日本などの国々は、半導体や電子部品の世界の製造拠点となっています。

目次

第1章 市場範囲と調査手法

  • 市場の定義
  • 目的
  • 市場範囲
  • セグメンテーション
  • 調査手法

第2章 市場の概要

  • 主なハイライト

第3章 市場概要

  • イントロダクション
    • 概要
      • 市場構成とシナリオ
  • 市場に影響を与える主な要因
    • 市場促進要因
    • 市場抑制要因

第4章 競合分析- 世界

  • 市場シェア分析2022年
  • ポーターのファイブフォース分析

第5章 世界の3Dスタッキング市場：相互接続技術別

  • 世界の3DTSV（スルーシリコンビア）市場：地域別
  • 世界のモノリシック3Dインテグレーション市場：地域別
  • 世界の3Dハイブリッドボンディング市場：地域別

第6章 世界の3Dスタッキング市場：方法別

  • 世界のチップ・ツー・チップ市場：地域別
  • 世界のチップ・ツー・ウェーハ市場：地域別
  • 世界のダイ・ツー・ダイ市場：地域別
  • 世界のウェーハ・ツー・ウェーハ市場：地域別
  • 世界のダイ・ツー・ウェーハ市場：地域別

第7章 世界の3Dスタッキング市場：デバイスタイプ別

  • 世界のメモリデバイス市場：地域別
  • 世界のMEMS/センサー市場：地域別
  • 世界のLED市場：地域別
  • 世界のロジックIC市場：地域別
  • 世界のイメージングおよびオプトエレクトロニクス市場：地域別
  • 世界のその他の市場：地域別

第8章 世界の3Dスタッキング市場：エンドユーザー別

  • 世界の家電市場：地域別
  • 世界の医療機器/ヘルスケア市場：地域別
  • 世界の製造業市場：地域別
  • 世界の通信市場：地域別
  • 世界の自動車市場：地域別
  • 世界のその他の市場：地域別

第9章 世界の3Dスタッキング市場：地域別

  • 北米
    • 北米の市場：国別
      • 米国
      • カナダ
      • メキシコ
      • その他北米地域
  • 欧州
    • 欧州の市場：国別
      • ドイツ
      • 英国
      • フランス
      • ロシア
      • スペイン
      • イタリア
      • その他欧州地域
  • アジア太平洋
    • アジア太平洋の市場：国別
      • 中国
      • 日本
      • 台湾
      • 韓国
      • インド
      • マレーシア
      • その他アジア太平洋地域
  • ラテンアメリカ・中東・アフリカ
    • ラテンアメリカ・中東・アフリカの市場：国別
      • ブラジル
      • アルゼンチン
      • アラブ首長国連邦
      • サウジアラビア
      • 南アフリカ
      • ナイジェリア
      • その他ラテンアメリカ・中東・アフリカ地域

第10章 企業プロファイル

  • Taiwan Semiconductor Manufacturing Company Limited
  • GLOBALFOUNDRIES Inc
  • Advanced Micro Devices, Inc
  • Qualcomm, Inc
  • Intel Corporation
  • Samsung Electronics Co, Ltd.（Samsung Group）
  • ASE Group（ASE Technology Holding Co, Ltd.）
  • IBM Corporation
  • Toshiba Corporation
  • STMicroelectronics NV

第11章 市場の成功必須条件

図表

LIST OF TABLES

  • TABLE 1 Global 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 2 Global 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 3 Global 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 4 Global 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 5 Global 3D TSV (Through-Silicon Via) Market by Region, 2019 - 2022, USD Million
  • TABLE 6 Global 3D TSV (Through-Silicon Via) Market by Region, 2023 - 2030, USD Million
  • TABLE 7 Global Monolithic 3D Integration Market by Region, 2019 - 2022, USD Million
  • TABLE 8 Global Monolithic 3D Integration Market by Region, 2023 - 2030, USD Million
  • TABLE 9 Global 3D Hybrid Bonding Market by Region, 2019 - 2022, USD Million
  • TABLE 10 Global 3D Hybrid Bonding Market by Region, 2023 - 2030, USD Million
  • TABLE 11 Global 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 12 Global 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 13 Global Chip-to-Chip Market by Region, 2019 - 2022, USD Million
  • TABLE 14 Global Chip-to-Chip Market by Region, 2023 - 2030, USD Million
  • TABLE 15 Global Chip-to-Wafer Market by Region, 2019 - 2022, USD Million
  • TABLE 16 Global Chip-to-Wafer Market by Region, 2023 - 2030, USD Million
  • TABLE 17 Global Die-to-Die Market by Region, 2019 - 2022, USD Million
  • TABLE 18 Global Die-to-Die Market by Region, 2023 - 2030, USD Million
  • TABLE 19 Global Wafer-to-Wafer Market by Region, 2019 - 2022, USD Million
  • TABLE 20 Global Wafer-to-Wafer Market by Region, 2023 - 2030, USD Million
  • TABLE 21 Global Die-to-Wafer Market by Region, 2019 - 2022, USD Million
  • TABLE 22 Global Die-to-Wafer Market by Region, 2023 - 2030, USD Million
  • TABLE 23 Global 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 24 Global 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 25 Global Memory Devices Market by Region, 2019 - 2022, USD Million
  • TABLE 26 Global Memory Devices Market by Region, 2023 - 2030, USD Million
  • TABLE 27 Global MEMS/Sensors Market by Region, 2019 - 2022, USD Million
  • TABLE 28 Global MEMS/Sensors Market by Region, 2023 - 2030, USD Million
  • TABLE 29 Global LEDs Market by Region, 2019 - 2022, USD Million
  • TABLE 30 Global LEDs Market by Region, 2023 - 2030, USD Million
  • TABLE 31 Global Logic ICs Market by Region, 2019 - 2022, USD Million
  • TABLE 32 Global Logic ICs Market by Region, 2023 - 2030, USD Million
  • TABLE 33 Global Imaging & Optoelectronics Market by Region, 2019 - 2022, USD Million
  • TABLE 34 Global Imaging & Optoelectronics Market by Region, 2023 - 2030, USD Million
  • TABLE 35 Global Others Market by Region, 2019 - 2022, USD Million
  • TABLE 36 Global Others Market by Region, 2023 - 2030, USD Million
  • TABLE 37 Global 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 38 Global 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 39 Global Consumer Electronics Market by Region, 2019 - 2022, USD Million
  • TABLE 40 Global Consumer Electronics Market by Region, 2023 - 2030, USD Million
  • TABLE 41 Global Medical Devices/Healthcare Market by Region, 2019 - 2022, USD Million
  • TABLE 42 Global Medical Devices/Healthcare Market by Region, 2023 - 2030, USD Million
  • TABLE 43 Global Manufacturing Market by Region, 2019 - 2022, USD Million
  • TABLE 44 Global Manufacturing Market by Region, 2023 - 2030, USD Million
  • TABLE 45 Global Communications Market by Region, 2019 - 2022, USD Million
  • TABLE 46 Global Communications Market by Region, 2023 - 2030, USD Million
  • TABLE 47 Global Automotive Market by Region, 2019 - 2022, USD Million
  • TABLE 48 Global Automotive Market by Region, 2023 - 2030, USD Million
  • TABLE 49 Global Others Market by Region, 2019 - 2022, USD Million
  • TABLE 50 Global Others Market by Region, 2023 - 2030, USD Million
  • TABLE 51 Global 3D Stacking Market by Region, 2019 - 2022, USD Million
  • TABLE 52 Global 3D Stacking Market by Region, 2023 - 2030, USD Million
  • TABLE 53 North America 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 54 North America 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 55 North America 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 56 North America 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 57 North America 3D TSV (Through-Silicon Via) Market by Country, 2019 - 2022, USD Million
  • TABLE 58 North America 3D TSV (Through-Silicon Via) Market by Country, 2023 - 2030, USD Million
  • TABLE 59 North America Monolithic 3D Integration Market by Country, 2019 - 2022, USD Million
  • TABLE 60 North America Monolithic 3D Integration Market by Country, 2023 - 2030, USD Million
  • TABLE 61 North America 3D Hybrid Bonding Market by Country, 2019 - 2022, USD Million
  • TABLE 62 North America 3D Hybrid Bonding Market by Country, 2023 - 2030, USD Million
  • TABLE 63 North America 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 64 North America 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 65 North America Chip-to-Chip Market by Country, 2019 - 2022, USD Million
  • TABLE 66 North America Chip-to-Chip Market by Country, 2023 - 2030, USD Million
  • TABLE 67 North America Chip-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 68 North America Chip-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 69 North America Die-to-Die Market by Country, 2019 - 2022, USD Million
  • TABLE 70 North America Die-to-Die Market by Country, 2023 - 2030, USD Million
  • TABLE 71 North America Wafer-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 72 North America Wafer-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 73 North America Die-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 74 North America Die-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 75 North America 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 76 North America 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 77 North America Memory Devices Market by Country, 2019 - 2022, USD Million
  • TABLE 78 North America Memory Devices Market by Country, 2023 - 2030, USD Million
  • TABLE 79 North America MEMS/Sensors Market by Country, 2019 - 2022, USD Million
  • TABLE 80 North America MEMS/Sensors Market by Country, 2023 - 2030, USD Million
  • TABLE 81 North America LEDs Market by Country, 2019 - 2022, USD Million
  • TABLE 82 North America LEDs Market by Country, 2023 - 2030, USD Million
  • TABLE 83 North America Logic ICs Market by Country, 2019 - 2022, USD Million
  • TABLE 84 North America Logic ICs Market by Country, 2023 - 2030, USD Million
  • TABLE 85 North America Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
  • TABLE 86 North America Imaging & Optoelectronics Market by Country, 2023 - 2030, USD Million
  • TABLE 87 North America Others Market by Country, 2019 - 2022, USD Million
  • TABLE 88 North America Others Market by Country, 2023 - 2030, USD Million
  • TABLE 89 North America 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 90 North America 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 91 North America Consumer Electronics Market by Country, 2019 - 2022, USD Million
  • TABLE 92 North America Consumer Electronics Market by Country, 2023 - 2030, USD Million
  • TABLE 93 North America Medical Devices/Healthcare Market by Country, 2019 - 2022, USD Million
  • TABLE 94 North America Medical Devices/Healthcare Market by Country, 2023 - 2030, USD Million
  • TABLE 95 North America Manufacturing Market by Country, 2019 - 2022, USD Million
  • TABLE 96 North America Manufacturing Market by Country, 2023 - 2030, USD Million
  • TABLE 97 North America Communications Market by Country, 2019 - 2022, USD Million
  • TABLE 98 North America Communications Market by Country, 2023 - 2030, USD Million
  • TABLE 99 North America Automotive Market by Country, 2019 - 2022, USD Million
  • TABLE 100 North America Automotive Market by Country, 2023 - 2030, USD Million
  • TABLE 101 North America Others Market by Country, 2019 - 2022, USD Million
  • TABLE 102 North America Others Market by Country, 2023 - 2030, USD Million
  • TABLE 103 North America 3D Stacking Market by Country, 2019 - 2022, USD Million
  • TABLE 104 North America 3D Stacking Market by Country, 2023 - 2030, USD Million
  • TABLE 105 US 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 106 US 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 107 US 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 108 US 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 109 US 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 110 US 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 111 US 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 112 US 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 113 US 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 114 US 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 115 Canada 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 116 Canada 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 117 Canada 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 118 Canada 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 119 Canada 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 120 Canada 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 121 Canada 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 122 Canada 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 123 Canada 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 124 Canada 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 125 Mexico 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 126 Mexico 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 127 Mexico 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 128 Mexico 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 129 Mexico 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 130 Mexico 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 131 Mexico 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 132 Mexico 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 133 Mexico 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 134 Mexico 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 135 Rest of North America 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 136 Rest of North America 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 137 Rest of North America 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 138 Rest of North America 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 139 Rest of North America 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 140 Rest of North America 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 141 Rest of North America 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 142 Rest of North America 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 143 Rest of North America 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 144 Rest of North America 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 145 Europe 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 146 Europe 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 147 Europe 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 148 Europe 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 149 Europe 3D TSV (Through-Silicon Via) Market by Country, 2019 - 2022, USD Million
  • TABLE 150 Europe 3D TSV (Through-Silicon Via) Market by Country, 2023 - 2030, USD Million
  • TABLE 151 Europe Monolithic 3D Integration Market by Country, 2019 - 2022, USD Million
  • TABLE 152 Europe Monolithic 3D Integration Market by Country, 2023 - 2030, USD Million
  • TABLE 153 Europe 3D Hybrid Bonding Market by Country, 2019 - 2022, USD Million
  • TABLE 154 Europe 3D Hybrid Bonding Market by Country, 2023 - 2030, USD Million
  • TABLE 155 Europe 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 156 Europe 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 157 Europe Chip-to-Chip Market by Country, 2019 - 2022, USD Million
  • TABLE 158 Europe Chip-to-Chip Market by Country, 2023 - 2030, USD Million
  • TABLE 159 Europe Chip-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 160 Europe Chip-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 161 Europe Die-to-Die Market by Country, 2019 - 2022, USD Million
  • TABLE 162 Europe Die-to-Die Market by Country, 2023 - 2030, USD Million
  • TABLE 163 Europe Wafer-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 164 Europe Wafer-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 165 Europe Die-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 166 Europe Die-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 167 Europe 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 168 Europe 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 169 Europe Memory Devices Market by Country, 2019 - 2022, USD Million
  • TABLE 170 Europe Memory Devices Market by Country, 2023 - 2030, USD Million
  • TABLE 171 Europe MEMS/Sensors Market by Country, 2019 - 2022, USD Million
  • TABLE 172 Europe MEMS/Sensors Market by Country, 2023 - 2030, USD Million
  • TABLE 173 Europe LEDs Market by Country, 2019 - 2022, USD Million
  • TABLE 174 Europe LEDs Market by Country, 2023 - 2030, USD Million
  • TABLE 175 Europe Logic ICs Market by Country, 2019 - 2022, USD Million
  • TABLE 176 Europe Logic ICs Market by Country, 2023 - 2030, USD Million
  • TABLE 177 Europe Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
  • TABLE 178 Europe Imaging & Optoelectronics Market by Country, 2023 - 2030, USD Million
  • TABLE 179 Europe Others Market by Country, 2019 - 2022, USD Million
  • TABLE 180 Europe Others Market by Country, 2023 - 2030, USD Million
  • TABLE 181 Europe 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 182 Europe 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 183 Europe Consumer Electronics Market by Country, 2019 - 2022, USD Million
  • TABLE 184 Europe Consumer Electronics Market by Country, 2023 - 2030, USD Million
  • TABLE 185 Europe Medical Devices/Healthcare Market by Country, 2019 - 2022, USD Million
  • TABLE 186 Europe Medical Devices/Healthcare Market by Country, 2023 - 2030, USD Million
  • TABLE 187 Europe Manufacturing Market by Country, 2019 - 2022, USD Million
  • TABLE 188 Europe Manufacturing Market by Country, 2023 - 2030, USD Million
  • TABLE 189 Europe Communications Market by Country, 2019 - 2022, USD Million
  • TABLE 190 Europe Communications Market by Country, 2023 - 2030, USD Million
  • TABLE 191 Europe Automotive Market by Country, 2019 - 2022, USD Million
  • TABLE 192 Europe Automotive Market by Country, 2023 - 2030, USD Million
  • TABLE 193 Europe Others Market by Country, 2019 - 2022, USD Million
  • TABLE 194 Europe Others Market by Country, 2023 - 2030, USD Million
  • TABLE 195 Europe 3D Stacking Market by Country, 2019 - 2022, USD Million
  • TABLE 196 Europe 3D Stacking Market by Country, 2023 - 2030, USD Million
  • TABLE 197 Germany 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 198 Germany 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 199 Germany 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 200 Germany 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 201 Germany 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 202 Germany 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 203 Germany 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 204 Germany 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 205 Germany 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 206 Germany 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 207 UK 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 208 UK 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 209 UK 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 210 UK 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 211 UK 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 212 UK 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 213 UK 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 214 UK 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 215 UK 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 216 UK 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 217 France 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 218 France 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 219 France 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 220 France 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 221 France 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 222 France 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 223 France 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 224 France 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 225 France 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 226 France 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 227 Russia 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 228 Russia 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 229 Russia 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 230 Russia 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 231 Russia 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 232 Russia 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 233 Russia 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 234 Russia 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 235 Russia 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 236 Russia 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 237 Spain 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 238 Spain 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 239 Spain 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 240 Spain 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 241 Spain 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 242 Spain 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 243 Spain 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 244 Spain 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 245 Spain 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 246 Spain 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 247 Italy 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 248 Italy 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 249 Italy 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 250 Italy 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 251 Italy 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 252 Italy 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 253 Italy 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 254 Italy 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 255 Italy 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 256 Italy 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 257 Rest of Europe 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 258 Rest of Europe 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 259 Rest of Europe 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 260 Rest of Europe 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 261 Rest of Europe 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 262 Rest of Europe 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 263 Rest of Europe 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 264 Rest of Europe 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 265 Rest of Europe 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 266 Rest of Europe 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 267 Asia Pacific 3D Stacking Market, 2019 - 2022, USD Million
  • TABLE 268 Asia Pacific 3D Stacking Market, 2023 - 2030, USD Million
  • TABLE 269 Asia Pacific 3D Stacking Market by Interconnecting Technology, 2019 - 2022, USD Million
  • TABLE 270 Asia Pacific 3D Stacking Market by Interconnecting Technology, 2023 - 2030, USD Million
  • TABLE 271 Asia Pacific 3D TSV (Through-Silicon Via) Market by Country, 2019 - 2022, USD Million
  • TABLE 272 Asia Pacific 3D TSV (Through-Silicon Via) Market by Country, 2023 - 2030, USD Million
  • TABLE 273 Asia Pacific Monolithic 3D Integration Market by Country, 2019 - 2022, USD Million
  • TABLE 274 Asia Pacific Monolithic 3D Integration Market by Country, 2023 - 2030, USD Million
  • TABLE 275 Asia Pacific 3D Hybrid Bonding Market by Country, 2019 - 2022, USD Million
  • TABLE 276 Asia Pacific 3D Hybrid Bonding Market by Country, 2023 - 2030, USD Million
  • TABLE 277 Asia Pacific 3D Stacking Market by Method, 2019 - 2022, USD Million
  • TABLE 278 Asia Pacific 3D Stacking Market by Method, 2023 - 2030, USD Million
  • TABLE 279 Asia Pacific Chip-to-Chip Market by Country, 2019 - 2022, USD Million
  • TABLE 280 Asia Pacific Chip-to-Chip Market by Country, 2023 - 2030, USD Million
  • TABLE 281 Asia Pacific Chip-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 282 Asia Pacific Chip-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 283 Asia Pacific Die-to-Die Market by Country, 2019 - 2022, USD Million
  • TABLE 284 Asia Pacific Die-to-Die Market by Country, 2023 - 2030, USD Million
  • TABLE 285 Asia Pacific Wafer-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 286 Asia Pacific Wafer-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 287 Asia Pacific Die-to-Wafer Market by Country, 2019 - 2022, USD Million
  • TABLE 288 Asia Pacific Die-to-Wafer Market by Country, 2023 - 2030, USD Million
  • TABLE 289 Asia Pacific 3D Stacking Market by Device Type, 2019 - 2022, USD Million
  • TABLE 290 Asia Pacific 3D Stacking Market by Device Type, 2023 - 2030, USD Million
  • TABLE 291 Asia Pacific Memory Devices Market by Country, 2019 - 2022, USD Million
  • TABLE 292 Asia Pacific Memory Devices Market by Country, 2023 - 2030, USD Million
  • TABLE 293 Asia Pacific MEMS/Sensors Market by Country, 2019 - 2022, USD Million
  • TABLE 294 Asia Pacific MEMS/Sensors Market by Country, 2023 - 2030, USD Million
  • TABLE 295 Asia Pacific LEDs Market by Country, 2019 - 2022, USD Million
  • TABLE 296 Asia Pacific LEDs Market by Country, 2023 - 2030, USD Million
  • TABLE 297 Asia Pacific Logic ICs Market by Country, 2019 - 2022, USD Million
  • TABLE 298 Asia Pacific Logic ICs Market by Country, 2023 - 2030, USD Million
  • TABLE 299 Asia Pacific Imaging & Optoelectronics Market by Country, 2019 - 2022, USD Million
  • TABLE 300 Asia Pacific Imaging & Optoelectronics Market by Country, 2023 - 2030, USD Million
  • TABLE 301 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
  • TABLE 302 Asia Pacific Others Market by Country, 2023 - 2030, USD Million
  • TABLE 303 Asia Pacific 3D Stacking Market by End User, 2019 - 2022, USD Million
  • TABLE 304 Asia Pacific 3D Stacking Market by End User, 2023 - 2030, USD Million
  • TABLE 305 Asia Pacific Consumer Electronics Market by Country, 2019 - 2022, USD Million
  • TABLE 306 Asia Pacific Consumer Electronics Market by Country, 2023 - 2030, USD Million
  • TABLE 307 Asia Pacific Medical Devices/Healthcare Market by Country, 2019 - 2022, USD Million
  • TABLE 308 Asia Pacific Medical Devices/Healthcare Market by Country, 2023 - 2030, USD Million
  • TABLE 309 Asia Pacific Manufacturing Market by Country, 2019 - 2022, USD Million
  • TABLE 310 Asia Pacific Manufacturing Market by Country, 2023 - 2030, USD Million
  • TABLE 311 Asia Pacific Communications Market by Country, 2019 - 2022, USD Million
  • TABLE 312 Asia Pacific Communications Market by Country, 2023 - 2030, USD Million
  • TABLE 313 Asia Pacific Automotive Market by Country, 2019 - 2022, USD Million
  • TABLE 314 Asia Pacific Automotive Market by Country, 2023 - 2030, USD Million
  • TABLE 315 Asia Pacific Others Market by Country, 2019 - 2022, USD Million
  • TABLE 316 Asia Pacific Others Market by Country, 2023 - 2030, USD Million
  • TABLE 317 Asia Pacific 3D Stacking Market by Country, 2019 - 2022, USD Million
  • TABLE 318 Asia Pacific 3D Stacking Market by Country, 2023 - 2030, USD Million
目次

The Global 3D stacking Market size is expected to reach $4.3 billion by 2030, rising at a market growth of 19.8% CAGR during the forecast period.

Wafer-to-wafer bonding allows for stacking entire wafers, which can contain numerous semiconductors dies. This results in significantly higher levels of integration and increased functionality within a single package. Therefore, the Wafer-to-wafer segment captured $132.1 million in 2022. Wafer-level packaging technologies, such as through-silicon vias (TSVs) and fine-pitch bonding techniques, are often employed in W2W stacking. As technology advances, the role of W2W bonding in shaping its future will likely become increasingly significant. Some of the factors impacting the market are heterogeneous integration and component optimization, rapid expansion of semiconductor applications across multiple sectors, and costs and complexity in 3D stacking.

3D stacking enables the integration of different types of semiconductor components, such as processors, memory, sensors, and communication modules, into a single package. This facilitates heterogeneous integration and the creation of multifunctional devices with diverse capabilities. Heterogeneous integration allows for incorporating diverse functionalities within a single package, enhancing the device's overall capabilities. For example, it can combine logic, memory, and sensor functionalities in a compact form factor. This technology offers a range of benefits, including improved performance, energy efficiency, and space savings, making it a versatile solution for various industries. Data centers require high-performance computing solutions to handle increasing data volumes. It provides high memory bandwidth and capacity, improving data processing and energy efficiency. Data analytics, machine learning, and cloud computing benefit from 3D-stacked memory solutions, enabling faster data processing and reducing latency. This, in turn, will drive further growth in the market.

However, 3D stacking involves advanced packaging techniques, which can increase manufacturing costs and complexity. The technology requires investments in specialized equipment and processes. High initial costs are a barrier to entry, especially for smaller companies and startups. Complex manufacturing processes can also lead to production challenges. This involves complex manufacturing processes that differ from traditional 2D semiconductor manufacturing. These processes include wafer thinning, die bonding, TSV formation, and interconnects, each requiring specialized equipment and expertise. The challenges related to costs and complexity are significant factors that impact the market.

Interconnecting Technology Outlook

Based on interconnecting technology, the market is classified into 3D hybrid bonding, 3D TSV (through-silicon via), and monolithic 3D integration. The 3D hybrid bonding segment acquired a substantial revenue share in the market in 2022. 3D hybrid bonding allows different types of semiconductor die, including logic, memory, sensors, and more, to be stacked together in a single package. This facilitates heterogeneous integration, enabling the creation of complex systems-on-chip (SoCs) with diverse functionalities.

Method Outlook

By method, the market is categorized into die-to-die, die-to-wafer, wafer-to-wafer, chip-to-chip, and chip-to-wafer. In 2022, the chip-to-chip segment held the highest revenue share in the market. 3D stacking allows for the integration of various specialized chips into a single package. Chip-to-chip stacking enables the integration of chips from different manufacturers, resulting in heterogeneous chip integration that can offer unique functionalities. By reducing the length of interconnects and enabling closer proximity between chips, it reduces power consumption and heat generation, making it more energy efficient.

Device Type Outlook

On the basis of device type, the market is divided into logic ICs, imaging & optoelectronics, memory devices, MEMS/sensors, LEDs, and others. The LEDs segment garnered a significant revenue share in the market in 2022. LEDs are used for various lighting and display applications. By integrating LEDs into 3D stacked packages, manufacturers create compact, thin devices with built-in lighting or display functionality. This is essential for applications like smartphones, wearables, and automotive displays. LEDs enhance the visual appeal of electronic devices. They are used for backlighting, status indicators, and accent lighting.

End User Outlook

By end user, the market is segmented into consumer electronics, manufacturing, communications, automotive, medical devices/healthcare, and others. The automotive segment recorded a remarkable revenue share in the market in 2022. This enables the integration of multiple components and functions within a smaller physical footprint. This can lead to more compact and lightweight electronic control units (ECUs) and sensors in the automotive sector, freeing up space for other vehicle components and reducing overall weight.

Regional Outlook

Region-wise, the market is analyzed across North America, Europe, Asia Pacific, and LAMEA. In 2022, the Asia Pacific region led the market by generating the highest revenue share. Asia Pacific is home to a large and rapidly growing consumer electronics sector. The demand for smaller, more powerful, and energy-efficient devices, such as smartphones, tablets, and wearables, drives the adoption of these technologies to achieve these goals. Asia Pacific, particularly countries like China, Taiwan, South Korea, and Japan, is a global manufacturing hub for semiconductors and electronic components.

The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Taiwan Semiconductor Manufacturing Company Limited, GLOBALFOUNDRIES Inc., Advanced Micro Devices, Inc., Qualcomm, Inc., Intel Corporation, Samsung Electronics Co., Ltd. (Samsung Group), ASE Group (ASE Technology Holding Co., Ltd.), IBM Corporation, Toshiba Corporation, and STMicroelectronics N.V.

Scope of the Study

Market Segments covered in the Report:

By Interconnecting Technology

  • 3D TSV (Through-Silicon Via)
  • Monolithic 3D Integration
  • 3D Hybrid Bonding

By Method

  • Chip-to-Chip
  • Chip-to-Wafer
  • Die-to-Die
  • Wafer-to-Wafer
  • Die-to-Wafer

By Device Type

  • Memory Devices
  • MEMS/Sensors
  • LEDs
  • Logic ICs
  • Imaging & Optoelectronics
  • Others

By End User

  • Consumer Electronics
  • Medical Devices/Healthcare
  • Manufacturing
  • Communications
  • Automotive
  • Others

By Geography

  • North America
    • US
    • Canada
    • Mexico
    • Rest of North America
  • Europe
    • Germany
    • UK
    • France
    • Russia
    • Spain
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • India
    • Malaysia
    • Rest of Asia Pacific
  • LAMEA
    • Brazil
    • Argentina
    • UAE
    • Saudi Arabia
    • South Africa
    • Nigeria
    • Rest of LAMEA

Companies Profiled

  • Taiwan Semiconductor Manufacturing Company Limited
  • GLOBALFOUNDRIES Inc.
  • Advanced Micro Devices, Inc.
  • Qualcomm, Inc.
  • Intel Corporation
  • Samsung Electronics Co., Ltd. (Samsung Group)
  • ASE Group (ASE Technology Holding Co., Ltd.)
  • IBM Corporation
  • Toshiba Corporation
  • STMicroelectronics N.V.

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Table of Contents

Chapter 1. Market Scope & Methodology

  • 1.1 Market Definition
  • 1.2 Objectives
  • 1.3 Market Scope
  • 1.4 Segmentation
    • 1.4.1 Global 3D Stacking Market, by Interconnecting Technology
    • 1.4.2 Global 3D Stacking Market, by Method
    • 1.4.3 Global 3D Stacking Market, by Device Type
    • 1.4.4 Global 3D Stacking Market, by End User
    • 1.4.5 Global 3D Stacking Market, by Geography
  • 1.5 Methodology for the research

Chapter 2. Market at a Glance

  • 2.1 Key Highlights

Chapter 3. Market Overview

  • 3.1 Introduction
    • 3.1.1 Overview
      • 3.1.1.1 Market Composition and Scenario
  • 3.2 Key Factors Impacting the Market
    • 3.2.1 Market Drivers
    • 3.2.2 Market Restraints

Chapter 4. Competition Analysis - Global

  • 4.1 Market Share Analysis, 2022
  • 4.2 Porter's Five Forces Analysis

Chapter 5. Global 3D Stacking Market by Interconnecting Technology

  • 5.1 Global 3D TSV (Through-Silicon Via) Market by Region
  • 5.2 Global Monolithic 3D Integration Market by Region
  • 5.3 Global 3D Hybrid Bonding Market by Region

Chapter 6. Global 3D Stacking Market by Method

  • 6.1 Global Chip-to-Chip Market by Region
  • 6.2 Global Chip-to-Wafer Market by Region
  • 6.3 Global Die-to-Die Market by Region
  • 6.4 Global Wafer-to-Wafer Market by Region
  • 6.5 Global Die-to-Wafer Market by Region

Chapter 7. Global 3D Stacking Market by Device Type

  • 7.1 Global Memory Devices Market by Region
  • 7.2 Global MEMS/Sensors Market by Region
  • 7.3 Global LEDs Market by Region
  • 7.4 Global Logic ICs Market by Region
  • 7.5 Global Imaging & Optoelectronics Market by Region
  • 7.6 Global Others Market by Region

Chapter 8. Global 3D Stacking Market by End User

  • 8.1 Global Consumer Electronics Market by Region
  • 8.2 Global Medical Devices/Healthcare Market by Region
  • 8.3 Global Manufacturing Market by Region
  • 8.4 Global Communications Market by Region
  • 8.5 Global Automotive Market by Region
  • 8.6 Global Others Market by Region

Chapter 9. Global 3D Stacking Market by Region

  • 9.1 North America 3D Stacking Market
    • 9.1.1 North America 3D Stacking Market by Interconnecting Technology
      • 9.1.1.1 North America 3D TSV (Through-Silicon Via) Market by Country
      • 9.1.1.2 North America Monolithic 3D Integration Market by Country
      • 9.1.1.3 North America 3D Hybrid Bonding Market by Country
    • 9.1.2 North America 3D Stacking Market by Method
      • 9.1.2.1 North America Chip-to-Chip Market by Country
      • 9.1.2.2 North America Chip-to-Wafer Market by Country
      • 9.1.2.3 North America Die-to-Die Market by Country
      • 9.1.2.4 North America Wafer-to-Wafer Market by Country
      • 9.1.2.5 North America Die-to-Wafer Market by Country
    • 9.1.3 North America 3D Stacking Market by Device Type
      • 9.1.3.1 North America Memory Devices Market by Country
      • 9.1.3.2 North America MEMS/Sensors Market by Country
      • 9.1.3.3 North America LEDs Market by Country
      • 9.1.3.4 North America Logic ICs Market by Country
      • 9.1.3.5 North America Imaging & Optoelectronics Market by Country
      • 9.1.3.6 North America Others Market by Country
    • 9.1.4 North America 3D Stacking Market by End User
      • 9.1.4.1 North America Consumer Electronics Market by Country
      • 9.1.4.2 North America Medical Devices/Healthcare Market by Country
      • 9.1.4.3 North America Manufacturing Market by Country
      • 9.1.4.4 North America Communications Market by Country
      • 9.1.4.5 North America Automotive Market by Country
      • 9.1.4.6 North America Others Market by Country
    • 9.1.5 North America 3D Stacking Market by Country
      • 9.1.5.1 US 3D Stacking Market
        • 9.1.5.1.1 US 3D Stacking Market by Interconnecting Technology
        • 9.1.5.1.2 US 3D Stacking Market by Method
        • 9.1.5.1.3 US 3D Stacking Market by Device Type
        • 9.1.5.1.4 US 3D Stacking Market by End User
      • 9.1.5.2 Canada 3D Stacking Market
        • 9.1.5.2.1 Canada 3D Stacking Market by Interconnecting Technology
        • 9.1.5.2.2 Canada 3D Stacking Market by Method
        • 9.1.5.2.3 Canada 3D Stacking Market by Device Type
        • 9.1.5.2.4 Canada 3D Stacking Market by End User
      • 9.1.5.3 Mexico 3D Stacking Market
        • 9.1.5.3.1 Mexico 3D Stacking Market by Interconnecting Technology
        • 9.1.5.3.2 Mexico 3D Stacking Market by Method
        • 9.1.5.3.3 Mexico 3D Stacking Market by Device Type
        • 9.1.5.3.4 Mexico 3D Stacking Market by End User
      • 9.1.5.4 Rest of North America 3D Stacking Market
        • 9.1.5.4.1 Rest of North America 3D Stacking Market by Interconnecting Technology
        • 9.1.5.4.2 Rest of North America 3D Stacking Market by Method
        • 9.1.5.4.3 Rest of North America 3D Stacking Market by Device Type
        • 9.1.5.4.4 Rest of North America 3D Stacking Market by End User
  • 9.2 Europe 3D Stacking Market
    • 9.2.1 Europe 3D Stacking Market by Interconnecting Technology
      • 9.2.1.1 Europe 3D TSV (Through-Silicon Via) Market by Country
      • 9.2.1.2 Europe Monolithic 3D Integration Market by Country
      • 9.2.1.3 Europe 3D Hybrid Bonding Market by Country
    • 9.2.2 Europe 3D Stacking Market by Method
      • 9.2.2.1 Europe Chip-to-Chip Market by Country
      • 9.2.2.2 Europe Chip-to-Wafer Market by Country
      • 9.2.2.3 Europe Die-to-Die Market by Country
      • 9.2.2.4 Europe Wafer-to-Wafer Market by Country
      • 9.2.2.5 Europe Die-to-Wafer Market by Country
    • 9.2.3 Europe 3D Stacking Market by Device Type
      • 9.2.3.1 Europe Memory Devices Market by Country
      • 9.2.3.2 Europe MEMS/Sensors Market by Country
      • 9.2.3.3 Europe LEDs Market by Country
      • 9.2.3.4 Europe Logic ICs Market by Country
      • 9.2.3.5 Europe Imaging & Optoelectronics Market by Country
      • 9.2.3.6 Europe Others Market by Country
    • 9.2.4 Europe 3D Stacking Market by End User
      • 9.2.4.1 Europe Consumer Electronics Market by Country
      • 9.2.4.2 Europe Medical Devices/Healthcare Market by Country
      • 9.2.4.3 Europe Manufacturing Market by Country
      • 9.2.4.4 Europe Communications Market by Country
      • 9.2.4.5 Europe Automotive Market by Country
      • 9.2.4.6 Europe Others Market by Country
    • 9.2.5 Europe 3D Stacking Market by Country
      • 9.2.5.1 Germany 3D Stacking Market
        • 9.2.5.1.1 Germany 3D Stacking Market by Interconnecting Technology
        • 9.2.5.1.2 Germany 3D Stacking Market by Method
        • 9.2.5.1.3 Germany 3D Stacking Market by Device Type
        • 9.2.5.1.4 Germany 3D Stacking Market by End User
      • 9.2.5.2 UK 3D Stacking Market
        • 9.2.5.2.1 UK 3D Stacking Market by Interconnecting Technology
        • 9.2.5.2.2 UK 3D Stacking Market by Method
        • 9.2.5.2.3 UK 3D Stacking Market by Device Type
        • 9.2.5.2.4 UK 3D Stacking Market by End User
      • 9.2.5.3 France 3D Stacking Market
        • 9.2.5.3.1 France 3D Stacking Market by Interconnecting Technology
        • 9.2.5.3.2 France 3D Stacking Market by Method
        • 9.2.5.3.3 France 3D Stacking Market by Device Type
        • 9.2.5.3.4 France 3D Stacking Market by End User
      • 9.2.5.4 Russia 3D Stacking Market
        • 9.2.5.4.1 Russia 3D Stacking Market by Interconnecting Technology
        • 9.2.5.4.2 Russia 3D Stacking Market by Method
        • 9.2.5.4.3 Russia 3D Stacking Market by Device Type
        • 9.2.5.4.4 Russia 3D Stacking Market by End User
      • 9.2.5.5 Spain 3D Stacking Market
        • 9.2.5.5.1 Spain 3D Stacking Market by Interconnecting Technology
        • 9.2.5.5.2 Spain 3D Stacking Market by Method
        • 9.2.5.5.3 Spain 3D Stacking Market by Device Type
        • 9.2.5.5.4 Spain 3D Stacking Market by End User
      • 9.2.5.6 Italy 3D Stacking Market
        • 9.2.5.6.1 Italy 3D Stacking Market by Interconnecting Technology
        • 9.2.5.6.2 Italy 3D Stacking Market by Method
        • 9.2.5.6.3 Italy 3D Stacking Market by Device Type
        • 9.2.5.6.4 Italy 3D Stacking Market by End User
      • 9.2.5.7 Rest of Europe 3D Stacking Market
        • 9.2.5.7.1 Rest of Europe 3D Stacking Market by Interconnecting Technology
        • 9.2.5.7.2 Rest of Europe 3D Stacking Market by Method
        • 9.2.5.7.3 Rest of Europe 3D Stacking Market by Device Type
        • 9.2.5.7.4 Rest of Europe 3D Stacking Market by End User
  • 9.3 Asia Pacific 3D Stacking Market
    • 9.3.1 Asia Pacific 3D Stacking Market by Interconnecting Technology
      • 9.3.1.1 Asia Pacific 3D TSV (Through-Silicon Via) Market by Country
      • 9.3.1.2 Asia Pacific Monolithic 3D Integration Market by Country
      • 9.3.1.3 Asia Pacific 3D Hybrid Bonding Market by Country
    • 9.3.2 Asia Pacific 3D Stacking Market by Method
      • 9.3.2.1 Asia Pacific Chip-to-Chip Market by Country
      • 9.3.2.2 Asia Pacific Chip-to-Wafer Market by Country
      • 9.3.2.3 Asia Pacific Die-to-Die Market by Country
      • 9.3.2.4 Asia Pacific Wafer-to-Wafer Market by Country
      • 9.3.2.5 Asia Pacific Die-to-Wafer Market by Country
    • 9.3.3 Asia Pacific 3D Stacking Market by Device Type
      • 9.3.3.1 Asia Pacific Memory Devices Market by Country
      • 9.3.3.2 Asia Pacific MEMS/Sensors Market by Country
      • 9.3.3.3 Asia Pacific LEDs Market by Country
      • 9.3.3.4 Asia Pacific Logic ICs Market by Country
      • 9.3.3.5 Asia Pacific Imaging & Optoelectronics Market by Country
      • 9.3.3.6 Asia Pacific Others Market by Country
    • 9.3.4 Asia Pacific 3D Stacking Market by End User
      • 9.3.4.1 Asia Pacific Consumer Electronics Market by Country
      • 9.3.4.2 Asia Pacific Medical Devices/Healthcare Market by Country
      • 9.3.4.3 Asia Pacific Manufacturing Market by Country
      • 9.3.4.4 Asia Pacific Communications Market by Country
      • 9.3.4.5 Asia Pacific Automotive Market by Country
      • 9.3.4.6 Asia Pacific Others Market by Country
    • 9.3.5 Asia Pacific 3D Stacking Market by Country
      • 9.3.5.1 China 3D Stacking Market
        • 9.3.5.1.1 China 3D Stacking Market by Interconnecting Technology
        • 9.3.5.1.2 China 3D Stacking Market by Method
        • 9.3.5.1.3 China 3D Stacking Market by Device Type
        • 9.3.5.1.4 China 3D Stacking Market by End User
      • 9.3.5.2 Japan 3D Stacking Market
        • 9.3.5.2.1 Japan 3D Stacking Market by Interconnecting Technology
        • 9.3.5.2.2 Japan 3D Stacking Market by Method
        • 9.3.5.2.3 Japan 3D Stacking Market by Device Type
        • 9.3.5.2.4 Japan 3D Stacking Market by End User
      • 9.3.5.3 Taiwan 3D Stacking Market
        • 9.3.5.3.1 Taiwan 3D Stacking Market by Interconnecting Technology
        • 9.3.5.3.2 Taiwan 3D Stacking Market by Method
        • 9.3.5.3.3 Taiwan 3D Stacking Market by Device Type
        • 9.3.5.3.4 Taiwan 3D Stacking Market by End User
      • 9.3.5.4 South Korea 3D Stacking Market
        • 9.3.5.4.1 South Korea 3D Stacking Market by Interconnecting Technology
        • 9.3.5.4.2 South Korea 3D Stacking Market by Method
        • 9.3.5.4.3 South Korea 3D Stacking Market by Device Type
        • 9.3.5.4.4 South Korea 3D Stacking Market by End User
      • 9.3.5.5 India 3D Stacking Market
        • 9.3.5.5.1 India 3D Stacking Market by Interconnecting Technology
        • 9.3.5.5.2 India 3D Stacking Market by Method
        • 9.3.5.5.3 India 3D Stacking Market by Device Type
        • 9.3.5.5.4 India 3D Stacking Market by End User
      • 9.3.5.6 Malaysia 3D Stacking Market
        • 9.3.5.6.1 Malaysia 3D Stacking Market by Interconnecting Technology
        • 9.3.5.6.2 Malaysia 3D Stacking Market by Method
        • 9.3.5.6.3 Malaysia 3D Stacking Market by Device Type
        • 9.3.5.6.4 Malaysia 3D Stacking Market by End User
      • 9.3.5.7 Rest of Asia Pacific 3D Stacking Market
        • 9.3.5.7.1 Rest of Asia Pacific 3D Stacking Market by Interconnecting Technology
        • 9.3.5.7.2 Rest of Asia Pacific 3D Stacking Market by Method
        • 9.3.5.7.3 Rest of Asia Pacific 3D Stacking Market by Device Type
        • 9.3.5.7.4 Rest of Asia Pacific 3D Stacking Market by End User
  • 9.4 LAMEA 3D Stacking Market
    • 9.4.1 LAMEA 3D Stacking Market by Interconnecting Technology
      • 9.4.1.1 LAMEA 3D TSV (Through-Silicon Via) Market by Country
      • 9.4.1.2 LAMEA Monolithic 3D Integration Market by Country
      • 9.4.1.3 LAMEA 3D Hybrid Bonding Market by Country
    • 9.4.2 LAMEA 3D Stacking Market by Method
      • 9.4.2.1 LAMEA Chip-to-Chip Market by Country
      • 9.4.2.2 LAMEA Chip-to-Wafer Market by Country
      • 9.4.2.3 LAMEA Die-to-Die Market by Country
      • 9.4.2.4 LAMEA Wafer-to-Wafer Market by Country
      • 9.4.2.5 LAMEA Die-to-Wafer Market by Country
    • 9.4.3 LAMEA 3D Stacking Market by Device Type
      • 9.4.3.1 LAMEA Memory Devices Market by Country
      • 9.4.3.2 LAMEA MEMS/Sensors Market by Country
      • 9.4.3.3 LAMEA LEDs Market by Country
      • 9.4.3.4 LAMEA Logic ICs Market by Country
      • 9.4.3.5 LAMEA Imaging & Optoelectronics Market by Country
      • 9.4.3.6 LAMEA Others Market by Country
    • 9.4.4 LAMEA 3D Stacking Market by End User
      • 9.4.4.1 LAMEA Consumer Electronics Market by Country
      • 9.4.4.2 LAMEA Medical Devices/Healthcare Market by Country
      • 9.4.4.3 LAMEA Manufacturing Market by Country
      • 9.4.4.4 LAMEA Communications Market by Country
      • 9.4.4.5 LAMEA Automotive Market by Country
      • 9.4.4.6 LAMEA Others Market by Country
    • 9.4.5 LAMEA 3D Stacking Market by Country
      • 9.4.5.1 Brazil 3D Stacking Market
        • 9.4.5.1.1 Brazil 3D Stacking Market by Interconnecting Technology
        • 9.4.5.1.2 Brazil 3D Stacking Market by Method
        • 9.4.5.1.3 Brazil 3D Stacking Market by Device Type
        • 9.4.5.1.4 Brazil 3D Stacking Market by End User
      • 9.4.5.2 Argentina 3D Stacking Market
        • 9.4.5.2.1 Argentina 3D Stacking Market by Interconnecting Technology
        • 9.4.5.2.2 Argentina 3D Stacking Market by Method
        • 9.4.5.2.3 Argentina 3D Stacking Market by Device Type
        • 9.4.5.2.4 Argentina 3D Stacking Market by End User
      • 9.4.5.3 UAE 3D Stacking Market
        • 9.4.5.3.1 UAE 3D Stacking Market by Interconnecting Technology
        • 9.4.5.3.2 UAE 3D Stacking Market by Method
        • 9.4.5.3.3 UAE 3D Stacking Market by Device Type
        • 9.4.5.3.4 UAE 3D Stacking Market by End User
      • 9.4.5.4 Saudi Arabia 3D Stacking Market
        • 9.4.5.4.1 Saudi Arabia 3D Stacking Market by Interconnecting Technology
        • 9.4.5.4.2 Saudi Arabia 3D Stacking Market by Method
        • 9.4.5.4.3 Saudi Arabia 3D Stacking Market by Device Type
        • 9.4.5.4.4 Saudi Arabia 3D Stacking Market by End User
      • 9.4.5.5 South Africa 3D Stacking Market
        • 9.4.5.5.1 South Africa 3D Stacking Market by Interconnecting Technology
        • 9.4.5.5.2 South Africa 3D Stacking Market by Method
        • 9.4.5.5.3 South Africa 3D Stacking Market by Device Type
        • 9.4.5.5.4 South Africa 3D Stacking Market by End User
      • 9.4.5.6 Nigeria 3D Stacking Market
        • 9.4.5.6.1 Nigeria 3D Stacking Market by Interconnecting Technology
        • 9.4.5.6.2 Nigeria 3D Stacking Market by Method
        • 9.4.5.6.3 Nigeria 3D Stacking Market by Device Type
        • 9.4.5.6.4 Nigeria 3D Stacking Market by End User
      • 9.4.5.7 Rest of LAMEA 3D Stacking Market
        • 9.4.5.7.1 Rest of LAMEA 3D Stacking Market by Interconnecting Technology
        • 9.4.5.7.2 Rest of LAMEA 3D Stacking Market by Method
        • 9.4.5.7.3 Rest of LAMEA 3D Stacking Market by Device Type
        • 9.4.5.7.4 Rest of LAMEA 3D Stacking Market by End User

Chapter 10. Company Profiles

  • 10.1 Taiwan Semiconductor Manufacturing Company Limited
    • 10.1.1 Company overview
    • 10.1.2 Financial Analysis
    • 10.1.3 Regional Analysis
    • 10.1.4 Research & Development Expenses
    • 10.1.5 Recent strategies and developments:
      • 10.1.5.1 Product Launches and Product Expansions:
    • 10.1.6 SWOT Analysis
  • 10.2 GLOBALFOUNDRIES Inc.
    • 10.2.1 Company Overview
    • 10.2.2 Financial Analysis
    • 10.2.3 Regional Analysis
    • 10.2.4 Research & Development Expenses
    • 10.2.5 SWOT Analysis
  • 10.3 Advanced Micro Devices, Inc.
    • 10.3.1 Company Overview
    • 10.3.2 Financial Analysis
    • 10.3.3 Segmental and Regional Analysis
    • 10.3.4 Research & Development Expenses
    • 10.3.5 SWOT Analysis
  • 10.4 Qualcomm, Inc.
    • 10.4.1 Company Overview
    • 10.4.2 Financial Analysis
    • 10.4.3 Segmental and Regional Analysis
    • 10.4.4 Research & Development Expense
    • 10.4.5 SWOT Analysis
  • 10.5 Intel Corporation
    • 10.5.1 Company Overview
    • 10.5.2 Financial Analysis
    • 10.5.3 Segmental and Regional Analysis
    • 10.5.4 Research & Development Expenses
    • 10.5.5 SWOT Analysis
  • 10.6 Samsung Electronics Co., Ltd. (Samsung Group)
    • 10.6.1 Company Overview
    • 10.6.2 Financial Analysis
    • 10.6.3 Segmental and Regional Analysis
    • 10.6.4 Recent strategies and developments:
      • 10.6.4.1 Partnerships, Collaborations, and Agreements:
      • 10.6.4.2 Product Launches and Product Expansions:
    • 10.6.5 SWOT Analysis
  • 10.7 ASE Group (ASE Technology Holding Co., Ltd.)
    • 10.7.1 Company Overview
    • 10.7.2 Financial Analysis
    • 10.7.3 Segmental and Regional Analysis
    • 10.7.4 Research & Development Expenses
    • 10.7.5 SWOT Analysis
  • 10.8 IBM Corporation
    • 10.8.1 Company Overview
    • 10.8.2 Financial Analysis
    • 10.8.3 Regional & Segmental Analysis
    • 10.8.4 Research & Development Expenses
    • 10.8.5 Recent strategies and developments:
      • 10.8.5.1 Acquisition and Mergers:
  • 10.9 Toshiba Corporation
    • 10.9.1 Company Overview
    • 10.9.2 Financial Analysis
    • 10.9.3 Segmental and Regional Analysis
    • 10.9.4 Research and Development Expense
    • 10.9.5 SWOT Analysis
  • 10.10. STMicroelectronics N.V.
    • 10.10.1 Company Overview
    • 10.10.2 Financial Analysis
    • 10.10.3 Segmental and Regional Analysis
    • 10.10.4 Research & Development Expense
    • 10.10.5 SWOT Analysis

Chapter 11. Winning Imperatives of 3D Stacking Market