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市場調査レポート
商品コード
1154886
薄型ウエハーの世界市場規模、シェア、産業動向分析レポート:ウェハーサイズ別(300mm、200mm、125mm)、技術別(ダイシング、研磨、研削)、用途別、地域別展望、予測、2022年~2028年Global Thin Wafer Market Size, Share & Industry Trends Analysis Report By Wafer Size (300 mm, 200 mm and 125 mm), By Technology (Dicing, Polishing and Grinding), By Application, By Regional Outlook and Forecast, 2022 - 2028 |
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薄型ウエハーの世界市場規模、シェア、産業動向分析レポート:ウェハーサイズ別(300mm、200mm、125mm)、技術別(ダイシング、研磨、研削)、用途別、地域別展望、予測、2022年~2028年 |
出版日: 2022年10月31日
発行: KBV Research
ページ情報: 英文 228 Pages
納期: 即納可能
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薄型ウエハーの世界市場規模は、2028年には222億米ドルに達し、予測期間中にCAGR13.0%で上昇すると予測されています。
ウエハーは、純度99.9999999percentage points(9N)以上の極めて純度の高い、ほとんど欠陥のない材料でできています。結晶性ウエハーの製造方法のひとつに、ポーランドの化学者ヤン・チョクラルスキーが開発した「チョクラルスキー法」があります。融液から種結晶を引き抜くと、シリコンやゲルマニウムなどの高純度単結晶半導体の円柱状のインゴット「ブール」ができます。シリコンの場合はホウ素やリンなどの不純物原子を正確な割合で添加し、n型またはp型の外部半導体を形成することができます。
このブールをウエハーソー(ワイヤーソーの一種)でウエハー状に切断し、平坦度を高めるための機械加工、機械加工による結晶損傷を除去するための化学消去、研磨加工を経て完成します。太陽電池用ウエハーは、大きさが100~200mm角、厚さが100~500m、電子部品用ウエハーは、直径100~450mmが使われています。最も大きなウェーハは直径450mmだが、まだ普及していないです。
COVID-19影響度分析
薄型ウエハー産業には、多数の国に分散している製造施設を持つティア1およびティア2のメーカーが含まれます。これらの企業は、エレクトロニクス、自動車、医療など、さまざまなエンドマーケットで利用される薄型ウエハーを生産しています。COVID-19は、上記分野の企業だけでなく、ウエハーメーカー各社の事業にも影響を与えました。また、自動車や電子機器分野のMEMS製品の市場も縮小することが予想されます。COVID-19の大流行により、ウエハー加工・ダイシング装置市場は大きな打撃を受け、主要産業拠点で生産活動が一時的に停止し、大幅な生産減退を余儀なくされています。
市場成長要因
電気デバイスの小型化5g技術の採用が進む
世界中の企業が、業務効率の向上と取引量の増加を目的として、5G接続への切り替えを進めています。また、5Gネットワークは、通信速度の大幅な向上とダウンロード時間の短縮が可能であるため、自動車やスマートシティ開発などの分野での使用に適しています。GaNベースの薄型ウエハーは、50%以上の電力付加効率(PAE)を達成する可能性があり、普及が期待されます。さらに、5G技術は、AI、無人運転車、拡張現実などの分野で広く利用されると予測されています。さらに、オランダのチップメーカーNXPは、5G通信機器を強化する意図でアリゾナにGaN 5Gチップ製造施設を開設しました。これが市場拡大の推進力となっています。
自動車分野でのIoTとAIの利用拡大
自動車産業におけるインダストリー4.0やIoT、AIなどの新技術の導入は、薄型ウエハーの市場拡大に大きな影響を与えるでしょう。自動車のコネクティビティに対するニーズの高まりは、新しい産業の進歩に拍車をかけるでしょう。さらに、タッチフリーヒューマンマシンインターフェースのような現在の動向が自動車産業を変化させる結果、リンクされた自動車の関連性が拡大します。今後のIoT接続の成長を促す主な要因の1つは、自動車の安全性と通信技術におけるIoTの統合です。アダプティブクルーズコントロール、インテリジェントパーキング支援システム、先進運転支援システム(ADAS)などの新技術の登場は、市場の拡大にさらに拍車をかけるでしょう。
市場の抑制要因
狭小ウエハーの効率性維持が重要課題
薄型ウエハーの導入に伴い、効率性が大きな課題となっています。特に厚さ50m以下の狭小ウエハーは、長波長の光を吸収する能力が低く、長波長の光を完全に吸収するためには、ウエハーを大きく移動させなければならないです。薄型ウエハーの主な目的は、チップメーカーが高性能、低消費電力、ダイ面積の縮小など、あらゆる利点を利用できるようにすることでした。薄型ウエハーを導入する際に、企業が直面する最大の課題は、おそらく性能であろう。特に厚さが50m以下の薄型ウエハーは、長波長吸収能力が低いです。薄型ウエハーの効率的なメンテナンスが、薄型ウエハー市場の成長と普及を妨げています。
ウエハーサイズの展望
ウエハーサイズに基づき、薄型ウエハー市場は、125mm、200mm、300mmに区分されます。300 mmセグメントは、2021年の薄型ウエハー市場で最高の収益シェアを獲得しました。300mmウエハーは、その高い歩留まりにより、LEDなどのアプリケーションでますます使用されるようになっており、これが薄型ウエハー市場の拡大を後押ししています。300mmウェーハは、LEDメーカーが必要とするスケールメリットと収益性の向上を実現します。このウエハーを使えば、一度に多くの製品を作ることができます。
技術展望
薄型ウエハー市場は、技術別にグラインディング、ポリッシング、ダイシングに分類されます。研削分野は、2021年の薄型ウエハー市場で大きな収益シェアを記録しました。集積回路の積層や高密度実装を可能にするため、ウェーハバックグランド(IC)と呼ばれる半導体デバイスの製造工程でウェーハの厚みが減少します。複数の加工工程を経た薄型ウエハー上にICが形成されます。
アプリケーションの展望
薄型ウエハーの市場は、アプリケーションによって、MEMS、CIS、メモリー、RFデバイス、LED、インターポーザー、ロジック、その他に分類されます。2021年の薄型ウエハー市場では、メモリー分野が最も高い収益シェアを獲得しました。メモリは、複雑なスタックを分離するために、主にブレードとレーザーダイシングの混合に依存してきました。最上層のブレードダイシングだけでは、金属濃度が高いため剥離の問題が発生します。しかし、50mの薄さのウエハーを安全にシミュレーションすることは困難です。
地域別の展望
地域別では、北米、欧州、アジア太平洋、LAMEAで分析されています。アジア太平洋セグメントは、2021年に薄型ウエハー市場で最高の収益シェアを獲得しました。中国と日本がスマートウォッチやスマートホームガジェットなどのハイエンド消費財の使用で爆発的な成長を遂げたため。良好な経済状況と民生用電子機器の需要増加により、アジア太平洋地域は半導体市場で大きな成長を遂げると予測されています。
List of Figures
The Global Thin Wafer Market size is expected to reach $22.2 billion by 2028, rising at a market growth of 13.0% CAGR during the forecast period.
While creating integrated circuits, a thin wafer is a slice of semiconductor material. One of the main drivers of a thin wafer market's expansion is the rising demand for semiconductor devices in sectors like telecommunications, consumer electronics, and automotive.
Wafer, also known as a slice or a substrate, is a thin semiconductor slice used in electronics for the production of solar cells and integrated circuits made of crystalline silicon (c-Si). The wafer, which serves as the foundation for those devices, is built inside of and on top. It undergoes numerous microfabrication techniques, such as photolithographic patterning, electrodeposition, doping, etching, and thin-film deposition of various materials. The individual microcircuits are separated by wafer dicing, and they are subsequently assembled into an integrated circuit.
Wafers are made of material that is extremely pure, almost defect-free and has a purity of 99.9999999percentage points (9N) or higher. The C zochralski method, developed by Polish chemist Jan Czochralski, is one method for producing crystalline wafers. Pulling a seed crystal from a melt creates a boule, a cylindrical ingot of a high-purity monocrystalline semiconductor like silicon or germanium. The molten intrinsic material can be doped to create an extrinsic semiconductor of the n-type or p-type by adding donor impurity atoms in exact proportions, such as boron or phosphorus in the case of silicon.
The boule is then cut into wafer-shaped pieces using a wafer saw (a sort of wire saw), machined to increase flatness, chemically erased to remove machining-related crystal damage, and polished to finish. Photovoltaic wafers range in size from 100 to 200 mm square and range in thickness from 100 to 500 m. Electronics employ wafers with diameters ranging from 100 to 450 mm. The largest manufactured wafers are 450 mm in diameter, although they are not yet in widespread use.
COVID-19 Impact Analysis
The thin wafer industry includes producers of Tier 1 and Tier 2 with manufacturing facilities dispersed across numerous nations. These companies produce thin wafers that are utilized in a variety of end markets, including electronics, automobiles, medical, and a few more. Covid-19 had an impact on both enterprises in the aforementioned sectors as well as thin wafer industry players' operations. The market for MEMS products from the automotive and electronic goods sectors is also anticipated to decrease. The present COVID-19 pandemic has harmed the market for thin wafer processing and dicing equipment, causing a sizable output slowdown as manufacturing activities are momentarily suspended throughout key industrial centers.
Market Growth Factors
Smaller Electrical Device Sizes High 5g Technology Adoption
Companies all around the world are switching to 5G connectivity to boost operational effectiveness and increase transaction volumes. Additionally, 5G networks can give substantially faster speeds and shorter download times, making them suitable for use in sectors like automotive and smart city development. GaN-based thin wafers, which have the potential to achieve power-added efficiencies (PAE) of 50% or more, are expected to gain popularity. Additionally, it is projected that 5G technology would be widely used in fields like AI, driverless vehicles, and augmented reality. Additionally, the Dutch chipmaker NXP opened a GaN 5G chip manufacturing facility in Arizona intending to enhance 5G communications equipment. This is propelling market expansion.
Increasing IoT And AI Usage In The Automotive Sector
The introduction of Industry 4.0 and new technologies like IoT and AI in the automobile industry will have a big impact on the expansion of the thin wafer market. The rising need for car connectivity will spur new industry advancements. Additionally, the relevance of linked cars is expanding as a result of current trends like touch-free human-machine interfaces, which are transforming the automotive industry. One of the main drivers of future IoT connection growth is the integration of IoT in vehicle safety and communication technologies. The advent of new technologies including adaptive cruise control, intelligent parking assistance systems, and advanced driver assistance systems (ADAS) will further spur market expansion.
Market Restraining Factors
The Maintenance Of Narrow Wafer Efficiency Is A Critical Issue
Efficiency is the major problem businesses are currently having while implementing thin wafers. A narrow wafer has poor capability for long-wavelength light absorption, especially if its thickness is less than 50 m. In the case of long wavelengths, the light must travel a great distance before it can be entirely absorbed by the wafer. The main goal in creating a thin wafer was to provide chip makers access to all of its advantages, including high performance, low power consumption, and a smaller die area. Performance is perhaps the biggest challenge that businesses are encountering when deploying thin wafers. The thin wafer has a poor ability for long wavelength absorption, especially if its thickness is less than 50 m. The efficient maintenance of the thin wafers hampers the growth and adoption of the thin wafer market.
Wafer Size Outlook
Based on the Wafer Size, the Thin Wafer Market is segmented into 125 mm, 200 mm, and 300 mm. The 300 mm segment acquired the highest revenue share in the thin wafer market in 2021. Due to their higher yield, 300 mm wafers are increasingly being used in applications like LED, which is boosting the thin wafer market's expansion. These wafers provide the scale economies and increased profitability that LED makers now find to be necessary. With the help of these wafers, producers may create a large number of products in a single batch.
Technology Outlook
By Technology, the Thin Wafer Market is classified into Grinding, Polishing, and Dicing. The grinding segment recorded a substantial revenue share in the thin wafer market in 2021. To enable stacking and high-density packing of integrated circuits, the wafer thickness is decreased during the semiconductor device manufacture process known as wafer backgrounding (IC). On thin wafers that undergo several processing processes, ICs are created.
Application Outlook
Based on the Application, the Thin Wafer Market is bifurcated into MEMS, CIS, Memory, RF Devices, LED, Interposer, Logic, and Others. The memory segment garnered the highest revenue share in the thin wafer market in 2021. Memory has relied mainly on a mixture of blades and laser dicing to separate complicated stacks. The high metal concentration causes delamination problems when just blade dicing is used on top layers. However, it is challenging to simulate 50 m thin wafers safely.
Regional Outlook
Region-wise, the Thin Wafer Market is analyzed across North America, Europe, Asia Pacific, and LAMEA.The Asia Pacific segment acquired the highest revenue share in the thin wafer market in 2021. Due to China's and Japan's explosive growth in the use of high-end consumer goods, including smartwatches and smart home gadgets. Due to good economic conditions and rising consumer electronics demand, the Asia Pacific region is predicted to experience significant growth in the semiconductor market.
The market research report covers the analysis of key stake holders of the market. Key companies profiled in the report include Shin-Etsu Chemical Co., Ltd., SUMCO Corporation, GlobalWafers Co., Ltd., Siltronic AG, SK Siltron Co., Ltd., SUSS MicroTec SE, Soitec, DISCO Corporation, 3M Company, and Applied Materials, Inc.
Strategies deployed in Thin Wafer Market
May-2022: Soitec launched a 200 mm silicon carbide SmartSiC wafer. With this launch, Soitec would broaden its SiC product offering a further 150 mm, take the production of its SmartSiC wafers to the next grade, and meet the increasing demand of the automotive industry.
Mar-2022: Wafer supplier Soitec expanded its geographical footprint by establishing a fabrication facility at its headquarters in Bernin, France. This expansion would fulfill the need for silicon carbide for electric vehicles and industrial purposes, with wafers produced utilizing the SmartSiC production procedure. Moreover, it would sustain the production of 300mm diameter silicon-on-insulator (SOI) wafers.
Nov-2021: Soitec completed the acquisition of NOVASiC, an advanced technology business specializing in polishing and reclaiming wafers on silicon carbide. With this acquisition, Soitec would propel the growth of semiconductors for power supply systems in industrial and electromobility applications.
Sep-2019: SK Siltron completed the acquisition of DuPont's wafer business, which manufactures a broad array of industrial chemicals, and synthetic fibers. With this acquisition, DuPont's SiC unit would provide SK Siltron with a sturdy wafer supply and develop synergy within the group.
May-2019: Soitec took over EpiGaN, a foremost European supplier of GaN epitaxial wafer (epi-wafer) materials. Under this acquisition, EpiGaN would develop new supplementary growth possibilities within Soitec's living Power-SOI products given GaN's benefit in power transistor structures.
Mar-2019: Soitec joined hands with Agency for Science, Technology and Research's (A*STAR) Institute of Microelectronics. Together, the companies aimed to design and incorporate a new layer transfer process within developed wafer-level multi-chip packaging techniques. Additionally, IME's Fan-Out Wafer Level Packaging (FOWLP) and 2.5D Through Silicon Interposer (TSI) technologies along with Soitec's Smart Cut(TM) technology, the latest cost-competitive approach delivers energy efficiency, higher commission, and improved product output.
Feb-2019: SUSS MicroOptics expanded its geographical footprint by establishing an excellence center in Neuchatel Switzerland for manufacturing wafer-level optics. This expansion aimed to satisfy the need for precision optics applications.
Dec-2018: DISCO Corporation introduced DFG8640, a new completely automatic grinder consistent with 8-inch wafers and capable to grind a broad variety of materials, such as silicon, LiNbO3, LiTaO3, and SiC. The new DFG8640 contains high accuracy grinding; optimizing the processing point layout decreases consistency variation for both separate wafers and between wafers; a new spindle with high stability, lower vibration, and minor rotation speed change.
Market Segments covered in the Report:
By Wafer Size
By Technology
By Application
By Geography
Companies Profiled
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