表紙:薄型ウエハー市場:動向、機会、競合分析【2023-2028年】
市場調査レポート
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1285027

薄型ウエハー市場:動向、機会、競合分析【2023-2028年】

Thin Wafer Market: Trends, Opportunities and Competitive Analysis [2023-2028]

出版日: | 発行: Lucintel | ページ情報: 英文 150 Pages | 納期: 3営業日

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薄型ウエハー市場:動向、機会、競合分析【2023-2028年】
出版日: 2023年05月01日
発行: Lucintel
ページ情報: 英文 150 Pages
納期: 3営業日
ご注意事項 :
本レポートは最新情報反映のため適宜更新し、内容構成変更を行う場合があります。ご検討の際はお問い合わせください。
  • 全表示
  • 概要
  • 目次
概要

薄型ウエハーの市場動向と予測

世界の薄型ウエハー市場は、2023年から2028年までのCAGRが10.2%で、2028年までに推定205億米ドルに達すると予測されています。この市場の主な促進要因は、スマートフォンや携帯型健康監視デバイスの普及、電子デバイスの小型化動向の高まり、自動車におけるIoTやAIの統合の進展です。薄型ウエハー市場の将来は、MEMS、CIS、メモリー、RFデバイス、LED、インターポーザー、ロジックの各市場において有望視されています。

薄型ウエハー市場参入企業一覧

市場の企業は、提供する製品の品質に基づいて競争しています。この市場の主要企業は、製造施設の拡大、研究開発投資、インフラ整備、バリューチェーン全体における統合機会の活用に注力しています。これらの戦略により、ウエハー企業は需要の増加に対応し、競争力を確保し、革新的な製品と技術を開発し、製造コストを削減し、顧客基盤を拡大しています。

薄型ウエハー市場の洞察

  • Lucintelは、先端半導体製品の需要増と太陽エネルギー分野の需要増により、予測期間中、300mmが最大セグメントであり続けると予測しています。
  • CISは、携帯電話やその他のコンシューマーエレクトロニクス機器への応用が進んでいるため、引き続き最大セグメントとなる見込みです。
  • APACは、コンシューマーエレクトロニクス機器の需要増と半導体メーカーの存在により、引き続き最大地域となる見込みです。

本レポートでは、以下の11の主要な質問に回答しています:

  • Q.1.市場セグメントのうち、最も有望かつ高成長な機会は何か?
  • Q.2.どのセグメントがより速いペースで成長するのか、またその理由は?
  • Q.3.どの地域がより速いペースで成長すると思うか、またその理由は?
  • Q.4.市場力学に影響を与える主要因は何か?この市場における主な課題とビジネスリスクは何か?
  • Q.5.この市場におけるビジネスリスクと競合の脅威は何か?
  • Q.6.この市場における新たな動向とその理由は何か?
  • Q.7.この市場における顧客の要求の変化にはどのようなものがあるか?
  • Q.8.市場における新たな開発は何か?これらの開発をリードしているのはどの企業か?
  • Q.9.この市場における主要なプレーヤーは誰か?主要プレーヤーは事業成長のためにどのような戦略的取り組みを進めているのか?
  • Q.10.この市場における競合製品にはどのようなものがあり、材料や製品の代替別市場シェア損失の脅威はどの程度あるのか?
  • Q.11.過去5年間で、どのようなM&Aが行われ、業界にどのような影響を与えたか?

目次

第1章 エグゼクティブサマリー

第2章 世界の薄型ウエハー市場:市場力学

  • イントロダクション、背景、分類
  • サプライチェーン
  • 業界の推進力と課題

第3章 2017年から2028年までの市場動向と予測分析

  • マクロ経済動向(2017~2022年)と予測(2023~2028年)
  • 世界の薄型ウエハー市場動向(2017~2022年)と予測(2023~2028年)
  • ウエハーサイズ別の世界の薄型ウエハー市場
    • 125mm
    • 200mm
    • 300mm
  • プロセス別の世界の薄型ウエハー市場
    • 仮接着・剥離
    • キャリアレス/TAIKOプロセス
  • アプリケーション別の世界の薄型ウエハー市場
    • MEMS
    • CIS
    • メモリー
    • RFデバイス
    • LED
    • インターポーザー
    • ロジック
    • その他

第4章 2017年から2028年までの地域別の市場動向と予測分析

  • 地域別の世界の薄型ウエハー市場
  • 北米の薄型ウエハー市場
  • 欧州の薄型ウエハー市場
  • アジア太平洋の薄型ウエハー市場
  • その他の地域の薄型ウエハー市場

第5章 競合分析

  • 製品ポートフォリオ分析
  • 運用上の統合
  • ポーターのファイブフォース分析

第6章 成長機会と戦略分析

  • 成長機会分析
    • ウエハーサイズ別の世界の薄型ウエハー市場の成長機会
    • プロセス別の世界の薄型ウエハー市場の成長機会
    • アプリケーション別の世界の薄型ウエハー市場の成長機会
    • 地域別の世界の薄型ウエハー市場の成長機会
  • 世界の薄型ウエハー市場の新たな動向
  • 戦略的分析
    • 新製品の開発
    • 世界の薄型ウエハー市場の生産能力拡大
    • 世界の薄型ウエハー市場における合併、買収、合弁事業
    • 認証とライセンシング

第7章 主要企業プロファイル

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials
目次

Thin Wafer Market Trends and Forecast

The future of the thin wafer market looks promising with in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets. The global thin wafer market is expected to reach an estimated $20.5 billion by 2028 with a CAGR of 10.2% from 2023 to 2028. The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

A more than 150-page report is developed to help in your business decisions. Sample figures with some insights are shown below.

Thin Wafer Market by Segment

The study includes a forecast for the global thin wafer market by wafer size, process, application, and region, as follows.

Thin Wafer Market by Wafer Size [Value ($B) Shipment Analysis from 2017 to 2028]:

  • 125 mm
  • 200 mm
  • 300 mm

Thin Wafer Market by Process [Value ($B) Shipment Analysis from 2017 to 2028]:

  • Temporary Bonding & Debonding
  • Carrier-less/Taiko Process

Thin Wafer Market by Application [Value ($B) Shipment Analysis from 2017 to 2028]:

  • MEMS
  • CIS
  • Memory
  • RF Devices
  • LED
  • Interposer
  • Logic
  • Others

Thin Wafer Market by Region [Value ($B) Shipment Analysis from 2017 to 2028]:

  • North America
  • Europe
  • Asia Pacific
  • The Rest of the World

List of Thin Wafer Market Companie

Companies in the market compete on the basis of product quality offered. Major players in this market focus on expanding their manufacturing facilities, R&D investments, infrastructural development, and leverage integration opportunities across the value chain. With these strategies thin wafer companies cater to increasing demand, ensure competitive effectiveness, develop innovative products & technologies, reduce production costs, and expand their customer base. Some of the thin wafer companies profiled in this report include.

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Thin Wafer Market Insights

  • Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.
  • CIS is expected to remain the largest segment due to its increasing application in mobile phones and other consumer electronic devices.
  • APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Features of the Thin Wafer Market

  • Market Size Estimates: Thin wafer market size estimation in terms of value ($B)
  • Trend And Forecast Analysis: Market trends (2017-2022) and forecast (2023-2028) by various segments and regions.
  • Segmentation Analysis: Thin wafer market size by various segments, such as by wafer size, process, application, and region
  • Regional Analysis: Thin wafer market breakdown by North America, Europe, Asia Pacific, and the Rest of the World.
  • Growth Opportunities: Analysis on growth opportunities in different by wafer size, process, application, and regions for the thin wafer market.
  • Strategic Analysis: This includes M&A, new product development, and competitive landscape for the thin wafer market.
  • Analysis of competitive intensity of the industry based on Porter's Five Forces model.

FAQ

Q1. What is the thin wafer market size?

Answer: The global thin wafer market is expected to reach an estimated $20.5 billion by 2028.

Q2. What is the growth forecast for thin wafer market?

Answer: The global thin wafer market is expected to grow with a CAGR of 10.2% from 2023 to 2028.

Q3. What are the major drivers influencing the growth of the thin wafer market?

Answer: The major drivers for this market are growing adoption of smartphones and portable health monitoring devices, rising trend of miniaturization of electronic devices, and increasing integration of IoT and AI in vehicles.

Q4. What are the major segments for thin wafer market?

Answer: The future of the thin wafer market looks promising with opportunities in the MEMS, CIS, memory, RF device, LED, interposer, and logic markets.

Q5. Who are the key thin wafer companies?

Answer: Some of the key thin wafer companies are as follows:

  • Shin-Etsu Chemical
  • SUMCO Corporation
  • GlobalWafers Co.
  • Siltronic
  • SK Siltron
  • SUSS MicroTec
  • Soitec
  • DISCO Corporation
  • 3M
  • Applied Materials

Q6. Which thin wafer segment will be the largest in future?

Answer: Lucintel forecasts that 300 mm will remain the largest segment over the forecast period due to increasing demand for advanced semiconductor products and growing demand from the solar energy sector.

Q7. In thin wafer market, which region is expected to be the largest in next 5 years?

Answer: APAC will remain the largest region due to increasing demand for consumer electronics and presence of semiconductor manufacturers in the region.

Q8. Do we receive customization in this report?

Answer: Yes, Lucintel provides 10.2% Customization Without any Additional Cost.

This report answers following 11 key questions:

  • Q.1. What are some of the most promising, high-growth opportunities for the thin wafer market by wafer size (125 mm, 200 mm, and 300 mm), process (temporary bonding & debonding and carrier-less/taiko process), application (MEMS, CIS, memory, RF devices, LED, interposer, logic, and others), and region (North America, Europe, Asia Pacific, and the Rest of the World)?
  • Q.2. Which segments will grow at a faster pace and why?
  • Q.3. Which region will grow at a faster pace and why?
  • Q.4. What are the key factors affecting market dynamics? What are the key challenges and business risks in this market?
  • Q.5. What are the business risks and competitive threats in this market?
  • Q.6. What are the emerging trends in this market and the reasons behind them?
  • Q.7. What are some of the changing demands of customers in the market?
  • Q.8. What are the new developments in the market? Which companies are leading these developments?
  • Q.9. Who are the major players in this market? What strategic initiatives are key players pursuing for business growth?
  • Q.10. What are some of the competing products in this market and how big of a threat do they pose for loss of market share by material or product substitution?
  • Q.11. What M&A activity has occurred in the last 5 years and what has its impact been on the industry?

Table of Contents

1. Executive Summary

2. Global Thin Wafer Market: Market Dynamics

  • 2.1: Introduction, Background, and Classifications
  • 2.2: Supply Chain
  • 2.3: Industry Drivers and Challenges

3. Market Trends and Forecast Analysis from 2017 to 2028

  • 3.1: Macroeconomic Trends (2017-2022) and Forecast (2023-2028)
  • 3.2: Global Thin Wafer Market Trends (2017-2022) and Forecast (2023-2028)
  • 3.3: Global Thin Wafer Market by Wafer Size
    • 3.3.1: 125 mm
    • 3.3.2: 200 mm
    • 3.3.3: 300 mm
  • 3.4: Global Thin Wafer Market by Process
    • 3.4.1: Temporary Bonding & Debonding
    • 3.4.2: Carrier-less/Taiko Process
  • 3.5: Global Thin Wafer Market by Application
    • 3.5.1: MEMS
    • 3.5.2: CIS
    • 3.5.3: Memory
    • 3.5.4: RF Devices
    • 3.5.5: LED
    • 3.5.6: Interposer
    • 3.5.7: Logic
    • 3.5.8: Others

4. Market Trends and Forecast Analysis by Region from 2017 to 2028

  • 4.1: Global Thin Wafer Market by Region
  • 4.2: North American Thin Wafer Market
    • 4.2.1: North American Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm: 125 mm, 200 mm, and 300 mm
    • 4.2.2: North American Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.3: European Thin Wafer Market
    • 4.3.1: European Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.3.2: European Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.4: APAC Thin Wafer Market
    • 4.4.1: APAC Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.4.2: APAC Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others
  • 4.5: ROW Thin Wafer Market
    • 4.5.1: ROW Thin Wafer Market by Wafer Size: 125 mm, 200 mm, and 300 mm
    • 4.5.2: ROW Thin Wafer Market by Application: CIS, Memory, RF Devices, LED, Interposer, Logic, and Others

5. Competitor Analysis

  • 5.1: Product Portfolio Analysis
  • 5.2: Operational Integration
  • 5.3: Porter's Five Forces Analysis

6. Growth Opportunities and Strategic Analysis

  • 6.1: Growth Opportunity Analysis
    • 6.1.1: Growth Opportunities for the Global Thin Wafer Market by Wafer Size
    • 6.1.2: Growth Opportunities for the Global Thin Wafer Market by Process
    • 6.1.3: Growth Opportunities for the Global Thin Wafer Market by Application
    • 6.1.4: Growth Opportunities for the Global Thin Wafer Market by Region
  • 6.2: Emerging Trends in the Global Thin Wafer Market
  • 6.3: Strategic Analysis
    • 6.3.1: New Product Development
    • 6.3.2: Capacity Expansion of the Global Thin Wafer Market
    • 6.3.3: Mergers, Acquisitions, and Joint Ventures in the Global Thin Wafer Market
    • 6.3.4: Certification and Licensing

7. Company Profiles of Leading Players

  • 7.1: Shin-Etsu Chemical
  • 7.2: SUMCO Corporation
  • 7.3: GlobalWafers Co.
  • 7.4: Siltronic
  • 7.5: SK Siltron
  • 7.6: SUSS MicroTec
  • 7.7: Soitec
  • 7.8: DISCO Corporation
  • 7.9: 3M
  • 7.10: Applied Materials