薄型ウエハ市場：技術、ウエハサイズ、プロセス、用途別-2025-2030年の世界予測

薄型ウエハ市場の2023年の市場規模は104億7,000万米ドルで、2024年には113億米ドルに達すると予測され、CAGR 7.94％で成長し、2030年には178億9,000万米ドルに達すると予測されています。

薄ウエハーとは、一般的に200マイクロメートル以下の厚さにスライスされた半導体材料のことで、スマートフォンやタブレット、高度なIoTデバイスなど、高度な電子アプリケーションや小型化に欠かせないです。薄型ウエハーの必要性が高まっている背景には、家電、通信、自動車、航空宇宙産業におけるフォームファクターの縮小や高性能要件に後押しされ、コンパクトで効率的な半導体デバイスに対する需要が急増していることがあります。アプリケーションはメモリー・デバイス、微小電気機械システム（MEMS）、パワー・デバイス、ロジック・デバイスに及び、エンドユーザーは半導体メーカーから装置サプライヤーまで多岐にわたる。市場成長は、5G技術のエスカレーション、IoTの進歩、人工知能の採用増加の影響を大きく受けており、これらの技術には薄型ウエハーが提供する処理能力と電力効率の向上が必要です。ウェアラブル技術や、ファンアウト・ウェーハレベル・パッケージング（FOWLP）のような革新的なパッケージング技術向けに、より薄くて弾力性のあるウェハー材料の探求に潜在的なビジネスチャンスがあります。しかし、課題としては、製造コストの高さ、機械的な脆さ、超薄型ウェハーの取り扱いの複雑さなどがあり、普及の妨げとなる可能性があります。研究と技術革新は、プラズマダイシングやドライエッチング技術のようなコスト効率の高い製造プロセスの開発や、市場浸透を強化するためのウエハー品質の向上に注力すべきです。市場はダイナミックで競争が激しく、急速な技術進歩とプロセス技術の絶え間ない革新を特徴としています。持続的な成長は、半導体メーカーや研究機関との戦略的提携を通じて、業界特有の要件に対応する革新的なウエハーソリューションを共同開発することで達成できると思われます。企業はまた、精度と歩留まりを向上させるための自動製造システムへの投資も検討すべきです。技術動向を常に把握し、堅牢でコスト効率の高いソリューションの構築に注力することで、企業は薄型ウエハ市場の成長ポテンシャルを活用し、電子機器の効率化と小型化に対する需要の高まりに応えることができます。

市場力学：急速に進化する薄型ウエハ市場の主要市場インサイトを公開

薄型ウエハ市場は、需要と供給のダイナミックな相互作用によって変貌を遂げています。このような市場力学の進化を理解することで、企業は十分な情報に基づいた投資決定、戦略的決定の精緻化、そして新たなビジネスチャンスの獲得に備えることができます。これらの動向を包括的に把握することで、企業は政治的、地理的、技術的、社会的、経済的な領域にわたる様々なリスクを軽減することができ、また、消費者行動とそれが製造コストや購買動向に与える影響をより明確に理解することができます。

• 市場促進要因
  • ウエハ薄化技術、材料科学、チップ設計の進歩
  • 3Dパッケージング技術の採用
  • 半導体産業と小型化デバイスの急成長
• 市場抑制要因
  • 薄ウェーハの効率維持の難しさ
• 市場機会
  • IoT、AI、自動車、ヘルスケアなどの分野における半導体デバイスの応用拡大
  • 携帯機器やウェアラブル電子機器への注目の高まり
• 市場の課題
  • 高圧力による損傷に対する脆弱性の懸念

ポーターのファイブフォース：薄型ウエハ市場をナビゲートする戦略ツール

ポーターのファイブフォースフレームワークは、市場情勢の競合情勢を理解するための重要なツールです。ポーターのファイブフォース・フレームワークは、企業の競争力を評価し、戦略的機会を探るための明確な手法を提供します。このフレームワークは、企業が市場内の勢力図を評価し、新規事業の収益性を判断するのに役立ちます。これらの洞察により、企業は自社の強みを活かし、弱みに対処し、潜在的な課題を回避することができ、より強靭な市場でのポジショニングを確保することができます。

PESTLE分析：薄型ウエハ市場における外部からの影響の把握

外部マクロ環境要因は、薄型ウエハ市場の業績ダイナミクスを形成する上で極めて重要な役割を果たします。政治的、経済的、社会的、技術的、法的、環境的要因の分析は、これらの影響をナビゲートするために必要な情報を提供します。PESTLE要因を調査することで、企業は潜在的なリスクと機会をよりよく理解することができます。この分析により、企業は規制、消費者の嗜好、経済動向の変化を予測し、先を見越した積極的な意思決定を行う準備ができます。

市場シェア分析薄型ウエハ市場における競合情勢の把握

薄型ウエハ市場の詳細な市場シェア分析により、ベンダーの業績を包括的に評価することができます。企業は、収益、顧客ベース、成長率などの主要指標を比較することで、競争上のポジショニングを明らかにすることができます。この分析により、市場の集中、断片化、統合の動向が明らかになり、ベンダーは競争が激化する中で自社の地位を高める戦略的意思決定を行うために必要な知見を得ることができます。

FPNVポジショニング・マトリックス薄型ウエハ市場におけるベンダーのパフォーマンス評価

FPNVポジショニングマトリックスは、薄型ウエハ市場においてベンダーを評価するための重要なツールです。このマトリックスにより、ビジネス組織はベンダーのビジネス戦略と製品満足度に基づき評価することで、目標に沿った十分な情報に基づいた意思決定を行うことができます。4つの象限によってベンダーを明確かつ正確にセグメント化し、戦略目標に最適なパートナーやソリューションを特定することができます。

戦略分析と推奨薄型ウエハ市場における成功への道筋を描く

薄型ウエハ市場の戦略分析は、世界市場でのプレゼンス強化を目指す企業にとって不可欠です。主要なリソース、能力、業績指標を見直すことで、企業は成長機会を特定し、改善に取り組むことができます。このアプローチにより、競合情勢における課題を克服し、新たなビジネスチャンスを活かして長期的な成功を収めるための体制を整えることができます。

本レポートでは、主要な注目分野を網羅した市場の包括的な分析を提供しています：

1.市場の浸透度：現在の市場環境の詳細なレビュー、主要企業による広範なデータ、市場でのリーチと全体的な影響力の評価。

2.市場の開拓度：新興市場における成長機会を特定し、既存分野における拡大可能性を評価し、将来の成長に向けた戦略的ロードマップを提供します。

3.市場の多様化：最近の製品発売、未開拓の地域、業界の主要な進歩、市場を形成する戦略的投資を分析します。

4.競合の評価と情報：競合情勢を徹底的に分析し、市場シェア、事業戦略、製品ポートフォリオ、認証、規制当局の承認、特許動向、主要企業の技術進歩などを検証します。

5.製品開発およびイノベーション：将来の市場成長を促進すると期待される最先端技術、研究開発活動、製品イノベーションをハイライトしています。

また、利害関係者が十分な情報を得た上で意思決定できるよう、重要な質問にも答えています：

1.現在の市場規模と今後の成長予測は？

2.最高の投資機会を提供する製品、セグメント、地域はどこか？

3.市場を形成する主な技術動向と規制の影響とは？

4.主要ベンダーの市場シェアと競合ポジションは？

5.ベンダーの市場参入・撤退戦略の原動力となる収益源と戦略的機会は何か？

目次

第1章 序文

第2章 調査手法

第3章 エグゼクティブサマリー

第4章 市場の概要

第5章 市場洞察

• 市場力学
  • 促進要因
    • ウエハー薄化技術、材料科学、チップ設計の進歩
    • 3Dパッケージング技術の導入
    • 半導体産業の急速な成長と小型化デバイス
  • 抑制要因
    • 薄型ウェーハの効率維持の難しさ
  • 機会
    • IoT、AI、自動車、ヘルスケアなどの分野で半導体デバイスの用途が拡大
    • ポータブルおよびウェアラブル電子機器への注目の高まり
  • 課題
    • 高圧による被害を受けやすくなる懸念
• 市場セグメンテーション分析
  • 技術：電子機器の正確な要求に合わせてウェハの厚さを調整するための研削プロセスの改善
  • 用途：高度な3D構成をサポートするメモリチップの薄型ウェーハに対する新たなニーズ
• ポーターのファイブフォース分析
• PESTEL分析
  • 政治的
  • 経済
  • 社交
  • 技術的
  • 法律上
  • 環境

第6章 薄型ウエハ市場：技術別

• さいの目に切る
• 研削
• 研磨

第7章 薄型ウエハ市場ウエハーサイズ別

• 125ミリメートル
• 200ミリメートル
• 300ミリメートル

第8章 薄型ウエハ市場：プロセス別

• キャリアレス/太鼓プロセス
• 一時的な接着と剥離

第9章 薄型ウエハ市場：用途別

• CMOSイメージセンサー
• インターポーザー
• 導かれた
• 論理
• メモリ
• マイクロ電気機械システム
• RFデバイス

第10章 南北アメリカの薄型ウエハ市場

• アルゼンチン
• ブラジル
• カナダ
• メキシコ
• 米国

第11章 アジア太平洋地域の薄型ウエハ市場

• オーストラリア
• 中国
• インド
• インドネシア
• 日本
• マレーシア
• フィリピン
• シンガポール
• 韓国
• 台湾
• タイ
• ベトナム

第12章 欧州・中東・アフリカの薄型ウエハ市場

• デンマーク
• エジプト
• フィンランド
• フランス
• ドイツ
• イスラエル
• イタリア
• オランダ
• ナイジェリア
• ノルウェー
• ポーランド
• カタール
• ロシア
• サウジアラビア
• 南アフリカ
• スペイン
• スウェーデン
• スイス
• トルコ
• アラブ首長国連邦
• 英国

第13章 競合情勢

• 市場シェア分析2023
• FPNVポジショニングマトリックス, 2023
• 競合シナリオ分析
  • 東京エレクトロン、300mmウエハー製造向けウエハー薄化装置「Ulucus G」を発売
  • 中国、12インチ2D半導体ウエハーの量産で画期的進歩
  • ルネサスとウルフスピード、10年間のSiCウエハー契約を締結
• 戦略分析と提言

企業一覧

• 3M Company
• Aixtron SE
• Atecom Technology Co., Ltd.
• Brewer Science, Inc.
• Chipmetrics Oy
• DISCO Corporation
• EV Group
• Globalwafers Co., Ltd.
• Hangzhou Semiconductor Wafer Co., Ltd .
• LDK Solar High-Tech Co., Ltd.
• Okmetic Oy
• ROHM Co., Ltd. by KYOCERA AVX
• Shin-Etsu Chemical Co., Ltd.
• Siltronic AG
• Siltronix Silicon Technologies
• SK Siltron Co., Ltd.
• Soitec
• SPTS Technologies Ltd.
• Sumco Corporation
• SUSS MicroTec SE
• UniversityWafer, Inc.
• Virginia Semiconductor Inc.
• Wafer World Inc.

LIST OF FIGURES

• FIGURE 1. THIN WAFER MARKET RESEARCH PROCESS
• FIGURE 2. THIN WAFER MARKET SIZE, 2023 VS 2030
• FIGURE 3. GLOBAL THIN WAFER MARKET SIZE, 2018-2030 (USD MILLION)
• FIGURE 4. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 5. GLOBAL THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 6. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2023 VS 2030 (%)
• FIGURE 7. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 8. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2023 VS 2030 (%)
• FIGURE 9. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 10. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2023 VS 2030 (%)
• FIGURE 11. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 12. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2023 VS 2030 (%)
• FIGURE 13. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 14. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 15. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 16. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2023 VS 2030 (%)
• FIGURE 17. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 18. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 19. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 20. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2030 (%)
• FIGURE 21. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2023 VS 2024 VS 2030 (USD MILLION)
• FIGURE 22. THIN WAFER MARKET SHARE, BY KEY PLAYER, 2023
• FIGURE 23. THIN WAFER MARKET, FPNV POSITIONING MATRIX, 2023

LIST OF TABLES

• TABLE 1. THIN WAFER MARKET SEGMENTATION & COVERAGE
• TABLE 2. UNITED STATES DOLLAR EXCHANGE RATE, 2018-2023
• TABLE 3. GLOBAL THIN WAFER MARKET SIZE, 2018-2030 (USD MILLION)
• TABLE 4. GLOBAL THIN WAFER MARKET SIZE, BY REGION, 2018-2030 (USD MILLION)
• TABLE 5. GLOBAL THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 6. THIN WAFER MARKET DYNAMICS
• TABLE 7. GLOBAL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 8. GLOBAL THIN WAFER MARKET SIZE, BY DICING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 9. GLOBAL THIN WAFER MARKET SIZE, BY GRINDING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 10. GLOBAL THIN WAFER MARKET SIZE, BY POLISHING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 11. GLOBAL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 12. GLOBAL THIN WAFER MARKET SIZE, BY 125 MM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 13. GLOBAL THIN WAFER MARKET SIZE, BY 200 MM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 14. GLOBAL THIN WAFER MARKET SIZE, BY 300 MM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 15. GLOBAL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 16. GLOBAL THIN WAFER MARKET SIZE, BY CARRIER-LESS/TAIKO PROCESS, BY REGION, 2018-2030 (USD MILLION)
• TABLE 17. GLOBAL THIN WAFER MARKET SIZE, BY TEMPORARY BONDING & DEBONDING, BY REGION, 2018-2030 (USD MILLION)
• TABLE 18. GLOBAL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 19. GLOBAL THIN WAFER MARKET SIZE, BY CMOS IMAGE SENSOR, BY REGION, 2018-2030 (USD MILLION)
• TABLE 20. GLOBAL THIN WAFER MARKET SIZE, BY INTERPOSER, BY REGION, 2018-2030 (USD MILLION)
• TABLE 21. GLOBAL THIN WAFER MARKET SIZE, BY LED, BY REGION, 2018-2030 (USD MILLION)
• TABLE 22. GLOBAL THIN WAFER MARKET SIZE, BY LOGIC, BY REGION, 2018-2030 (USD MILLION)
• TABLE 23. GLOBAL THIN WAFER MARKET SIZE, BY MEMORY, BY REGION, 2018-2030 (USD MILLION)
• TABLE 24. GLOBAL THIN WAFER MARKET SIZE, BY MICRO-ELECTROMECHANICAL SYSTEM, BY REGION, 2018-2030 (USD MILLION)
• TABLE 25. GLOBAL THIN WAFER MARKET SIZE, BY RF DEVICES, BY REGION, 2018-2030 (USD MILLION)
• TABLE 26. AMERICAS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 27. AMERICAS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 28. AMERICAS THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 29. AMERICAS THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 30. AMERICAS THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 31. ARGENTINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 32. ARGENTINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 33. ARGENTINA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 34. ARGENTINA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 35. BRAZIL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 36. BRAZIL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 37. BRAZIL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 38. BRAZIL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 39. CANADA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 40. CANADA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 41. CANADA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 42. CANADA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 43. MEXICO THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 44. MEXICO THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 45. MEXICO THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 46. MEXICO THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 47. UNITED STATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 48. UNITED STATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 49. UNITED STATES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 50. UNITED STATES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 51. UNITED STATES THIN WAFER MARKET SIZE, BY STATE, 2018-2030 (USD MILLION)
• TABLE 52. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 53. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 54. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 55. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 56. ASIA-PACIFIC THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 57. AUSTRALIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 58. AUSTRALIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 59. AUSTRALIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 60. AUSTRALIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 61. CHINA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 62. CHINA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 63. CHINA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 64. CHINA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 65. INDIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 66. INDIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 67. INDIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 68. INDIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 69. INDONESIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 70. INDONESIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 71. INDONESIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 72. INDONESIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 73. JAPAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 74. JAPAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 75. JAPAN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 76. JAPAN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 77. MALAYSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 78. MALAYSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 79. MALAYSIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 80. MALAYSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 81. PHILIPPINES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 82. PHILIPPINES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 83. PHILIPPINES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 84. PHILIPPINES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 85. SINGAPORE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 86. SINGAPORE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 87. SINGAPORE THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 88. SINGAPORE THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 89. SOUTH KOREA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 90. SOUTH KOREA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 91. SOUTH KOREA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 92. SOUTH KOREA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 93. TAIWAN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 94. TAIWAN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 95. TAIWAN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 96. TAIWAN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 97. THAILAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 98. THAILAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 99. THAILAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 100. THAILAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 101. VIETNAM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 102. VIETNAM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 103. VIETNAM THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 104. VIETNAM THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 105. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 106. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 107. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 108. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 109. EUROPE, MIDDLE EAST & AFRICA THIN WAFER MARKET SIZE, BY COUNTRY, 2018-2030 (USD MILLION)
• TABLE 110. DENMARK THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 111. DENMARK THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 112. DENMARK THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 113. DENMARK THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 114. EGYPT THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 115. EGYPT THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 116. EGYPT THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 117. EGYPT THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 118. FINLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 119. FINLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 120. FINLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 121. FINLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 122. FRANCE THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 123. FRANCE THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 124. FRANCE THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 125. FRANCE THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 126. GERMANY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 127. GERMANY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 128. GERMANY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 129. GERMANY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 130. ISRAEL THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 131. ISRAEL THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 132. ISRAEL THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 133. ISRAEL THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 134. ITALY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 135. ITALY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 136. ITALY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 137. ITALY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 138. NETHERLANDS THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 139. NETHERLANDS THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 140. NETHERLANDS THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 141. NETHERLANDS THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 142. NIGERIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 143. NIGERIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 144. NIGERIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 145. NIGERIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 146. NORWAY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 147. NORWAY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 148. NORWAY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 149. NORWAY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 150. POLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 151. POLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 152. POLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 153. POLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 154. QATAR THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 155. QATAR THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 156. QATAR THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 157. QATAR THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 158. RUSSIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 159. RUSSIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 160. RUSSIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 161. RUSSIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 162. SAUDI ARABIA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 163. SAUDI ARABIA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 164. SAUDI ARABIA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 165. SAUDI ARABIA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 166. SOUTH AFRICA THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 167. SOUTH AFRICA THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 168. SOUTH AFRICA THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 169. SOUTH AFRICA THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 170. SPAIN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 171. SPAIN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 172. SPAIN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 173. SPAIN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 174. SWEDEN THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 175. SWEDEN THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 176. SWEDEN THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 177. SWEDEN THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 178. SWITZERLAND THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 179. SWITZERLAND THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 180. SWITZERLAND THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 181. SWITZERLAND THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 182. TURKEY THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 183. TURKEY THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 184. TURKEY THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 185. TURKEY THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 186. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 187. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 188. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 189. UNITED ARAB EMIRATES THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 190. UNITED KINGDOM THIN WAFER MARKET SIZE, BY TECHNOLOGY, 2018-2030 (USD MILLION)
• TABLE 191. UNITED KINGDOM THIN WAFER MARKET SIZE, BY WAFER SIZE, 2018-2030 (USD MILLION)
• TABLE 192. UNITED KINGDOM THIN WAFER MARKET SIZE, BY PROCESS, 2018-2030 (USD MILLION)
• TABLE 193. UNITED KINGDOM THIN WAFER MARKET SIZE, BY APPLICATION, 2018-2030 (USD MILLION)
• TABLE 194. THIN WAFER MARKET SHARE, BY KEY PLAYER, 2023
• TABLE 195. THIN WAFER MARKET, FPNV POSITIONING MATRIX, 2023

The Thin Wafer Market was valued at USD 10.47 billion in 2023, expected to reach USD 11.30 billion in 2024, and is projected to grow at a CAGR of 7.94%, to USD 17.89 billion by 2030.

Thin wafers are semiconductor materials that are sliced to a thickness typically below 200 micrometers, crucial for advanced electronic applications and miniaturization, including smartphones, tablets, and sophisticated IoT devices. The rising necessity for thin wafers is driven by the burgeoning demand for compact and efficient semiconductor devices, propelled by shrinking form factors and high-performance requirements in consumer electronics, telecommunications, automotive, and aerospace industries. Applications span across memory devices, micro-electromechanical systems (MEMS), power devices, and logic devices, with end-users ranging from semiconductor manufacturers to equipment suppliers. Market growth is significantly influenced by the escalation of 5G technology, IoT advancements, and increasing adoption of artificial intelligence, which require enhanced processing capabilities and power efficiency provided by thin wafers. Potential opportunities lie in exploring thinner and more resilient wafer materials for wearable technologies and innovative packaging techniques like fan-out wafer-level packaging (FOWLP). However, challenges include high production costs, mechanical fragility, and complexities in handling ultra-thin wafers that can impede widespread adoption. Research and innovation should focus on developing cost-effective manufacturing processes, like plasma dicing and dry etching techniques, and enhancing wafer quality to bolster market penetration. The market is dynamic and highly competitive, characterized by rapid technological advancements and continuous innovation in process technologies. Sustainable growth could be achieved through strategic collaborations with semiconductor manufacturers and research institutions to co-develop innovative wafer solutions that address industry-specific requirements. Companies should also consider investing in automated manufacturing systems to improve precision and yield. By staying attuned to technological trends and focusing on building robust, cost-effective solutions, businesses can leverage the growth potential in the thin wafer market, meeting the increasing demands for efficiency and miniaturization in electronic devices.

Market Dynamics: Unveiling Key Market Insights in the Rapidly Evolving Thin Wafer Market

The Thin Wafer Market is undergoing transformative changes driven by a dynamic interplay of supply and demand factors. Understanding these evolving market dynamics prepares business organizations to make informed investment decisions, refine strategic decisions, and seize new opportunities. By gaining a comprehensive view of these trends, business organizations can mitigate various risks across political, geographic, technical, social, and economic domains while also gaining a clearer understanding of consumer behavior and its impact on manufacturing costs and purchasing trends.

• Market Drivers
  • Advancements in wafer thinning technologies, material science, and chip design
  • Adoption of 3D packaging technologies
  • Proliferating growth of semiconductor industry and miniaturization devices
• Market Restraints
  • Difficulties in efficiency maintenance of thin wafers
• Market Opportunities
  • Expanding applications of semiconductor devices in areas such as IoT, AI, automotive, and healthcare
  • Growing focus towards the portable and wearable electronic devices
• Market Challenges
  • Concerns of more vulnerable to damages caused by high pressure

Porter's Five Forces: A Strategic Tool for Navigating the Thin Wafer Market

Porter's five forces framework is a critical tool for understanding the competitive landscape of the Thin Wafer Market. It offers business organizations with a clear methodology for evaluating their competitive positioning and exploring strategic opportunities. This framework helps businesses assess the power dynamics within the market and determine the profitability of new ventures. With these insights, business organizations can leverage their strengths, address weaknesses, and avoid potential challenges, ensuring a more resilient market positioning.

PESTLE Analysis: Navigating External Influences in the Thin Wafer Market

External macro-environmental factors play a pivotal role in shaping the performance dynamics of the Thin Wafer Market. Political, Economic, Social, Technological, Legal, and Environmental factors analysis provides the necessary information to navigate these influences. By examining PESTLE factors, businesses can better understand potential risks and opportunities. This analysis enables business organizations to anticipate changes in regulations, consumer preferences, and economic trends, ensuring they are prepared to make proactive, forward-thinking decisions.

Market Share Analysis: Understanding the Competitive Landscape in the Thin Wafer Market

A detailed market share analysis in the Thin Wafer Market provides a comprehensive assessment of vendors' performance. Companies can identify their competitive positioning by comparing key metrics, including revenue, customer base, and growth rates. This analysis highlights market concentration, fragmentation, and trends in consolidation, offering vendors the insights required to make strategic decisions that enhance their position in an increasingly competitive landscape.

FPNV Positioning Matrix: Evaluating Vendors' Performance in the Thin Wafer Market

The Forefront, Pathfinder, Niche, Vital (FPNV) Positioning Matrix is a critical tool for evaluating vendors within the Thin Wafer Market. This matrix enables business organizations to make well-informed decisions that align with their goals by assessing vendors based on their business strategy and product satisfaction. The four quadrants provide a clear and precise segmentation of vendors, helping users identify the right partners and solutions that best fit their strategic objectives.

Strategy Analysis & Recommendation: Charting a Path to Success in the Thin Wafer Market

A strategic analysis of the Thin Wafer Market is essential for businesses looking to strengthen their global market presence. By reviewing key resources, capabilities, and performance indicators, business organizations can identify growth opportunities and work toward improvement. This approach helps businesses navigate challenges in the competitive landscape and ensures they are well-positioned to capitalize on newer opportunities and drive long-term success.

Key Company Profiles

The report delves into recent significant developments in the Thin Wafer Market, highlighting leading vendors and their innovative profiles. These include 3M Company, Aixtron SE, Atecom Technology Co., Ltd., Brewer Science, Inc., Chipmetrics Oy, DISCO Corporation, EV Group, Globalwafers Co., Ltd., Hangzhou Semiconductor Wafer Co., Ltd ., LDK Solar High-Tech Co., Ltd., Okmetic Oy, ROHM Co., Ltd. by KYOCERA AVX, Shin-Etsu Chemical Co., Ltd., Siltronic AG, Siltronix Silicon Technologies, SK Siltron Co., Ltd., Soitec, SPTS Technologies Ltd., Sumco Corporation, SUSS MicroTec SE, UniversityWafer, Inc., Virginia Semiconductor Inc., and Wafer World Inc..

Market Segmentation & Coverage

This research report categorizes the Thin Wafer Market to forecast the revenues and analyze trends in each of the following sub-markets:

• Based on Technology, market is studied across Dicing, Grinding, and Polishing.
• Based on Wafer Size, market is studied across 125 mm, 200 mm, and 300 mm.
• Based on Process, market is studied across Carrier-less/Taiko Process and Temporary Bonding & Debonding.
• Based on Application, market is studied across CMOS Image Sensor, Interposer, LED, Logic, Memory, Micro-Electromechanical System, and RF Devices.
• Based on Region, market is studied across Americas, Asia-Pacific, and Europe, Middle East & Africa. The Americas is further studied across Argentina, Brazil, Canada, Mexico, and United States. The United States is further studied across California, Florida, Illinois, New York, Ohio, Pennsylvania, and Texas. The Asia-Pacific is further studied across Australia, China, India, Indonesia, Japan, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, and Vietnam. The Europe, Middle East & Africa is further studied across Denmark, Egypt, Finland, France, Germany, Israel, Italy, Netherlands, Nigeria, Norway, Poland, Qatar, Russia, Saudi Arabia, South Africa, Spain, Sweden, Switzerland, Turkey, United Arab Emirates, and United Kingdom.

The report offers a comprehensive analysis of the market, covering key focus areas:

1. Market Penetration: A detailed review of the current market environment, including extensive data from top industry players, evaluating their market reach and overall influence.

2. Market Development: Identifies growth opportunities in emerging markets and assesses expansion potential in established sectors, providing a strategic roadmap for future growth.

3. Market Diversification: Analyzes recent product launches, untapped geographic regions, major industry advancements, and strategic investments reshaping the market.

4. Competitive Assessment & Intelligence: Provides a thorough analysis of the competitive landscape, examining market share, business strategies, product portfolios, certifications, regulatory approvals, patent trends, and technological advancements of key players.

5. Product Development & Innovation: Highlights cutting-edge technologies, R&D activities, and product innovations expected to drive future market growth.

The report also answers critical questions to aid stakeholders in making informed decisions:

1. What is the current market size, and what is the forecasted growth?

2. Which products, segments, and regions offer the best investment opportunities?

3. What are the key technology trends and regulatory influences shaping the market?

4. How do leading vendors rank in terms of market share and competitive positioning?

5. What revenue sources and strategic opportunities drive vendors' market entry or exit strategies?

Table of Contents

1. Preface

• 1.1. Objectives of the Study
• 1.2. Market Segmentation & Coverage
• 1.3. Years Considered for the Study
• 1.4. Currency & Pricing
• 1.5. Language
• 1.6. Stakeholders

2. Research Methodology

• 2.1. Define: Research Objective
• 2.2. Determine: Research Design
• 2.3. Prepare: Research Instrument
• 2.4. Collect: Data Source
• 2.5. Analyze: Data Interpretation
• 2.6. Formulate: Data Verification
• 2.7. Publish: Research Report
• 2.8. Repeat: Report Update

3. Executive Summary

4. Market Overview

5. Market Insights

• 5.1. Market Dynamics
  • 5.1.1. Drivers
    • 5.1.1.1. Advancements in wafer thinning technologies, material science, and chip design
    • 5.1.1.2. Adoption of 3D packaging technologies
    • 5.1.1.3. Proliferating growth of semiconductor industry and miniaturization devices
  • 5.1.2. Restraints
    • 5.1.2.1. Difficulties in efficiency maintenance of thin wafers
  • 5.1.3. Opportunities
    • 5.1.3.1. Expanding applications of semiconductor devices in areas such as IoT, AI, automotive, and healthcare
    • 5.1.3.2. Growing focus towards the portable and wearable electronic devices
  • 5.1.4. Challenges
    • 5.1.4.1. Concerns of more vulnerable to damages caused by high pressure
• 5.2. Market Segmentation Analysis
  • 5.2.1. Technology: Advancements to improve the grinding process in order to prepare the wafer's thickness for the precise demands of electronic devices
  • 5.2.2. Application: Emerging need for thin wafers in memory chips to support advanced 3D configurations
• 5.3. Porter's Five Forces Analysis
  • 5.3.1. Threat of New Entrants
  • 5.3.2. Threat of Substitutes
  • 5.3.3. Bargaining Power of Customers
  • 5.3.4. Bargaining Power of Suppliers
  • 5.3.5. Industry Rivalry
• 5.4. PESTLE Analysis
  • 5.4.1. Political
  • 5.4.2. Economic
  • 5.4.3. Social
  • 5.4.4. Technological
  • 5.4.5. Legal
  • 5.4.6. Environmental

6. Thin Wafer Market, by Technology

• 6.1. Introduction
• 6.2. Dicing
• 6.3. Grinding
• 6.4. Polishing

7. Thin Wafer Market, by Wafer Size

• 7.1. Introduction
• 7.2. 125 mm
• 7.3. 200 mm
• 7.4. 300 mm

8. Thin Wafer Market, by Process

• 8.1. Introduction
• 8.2. Carrier-less/Taiko Process
• 8.3. Temporary Bonding & Debonding

9. Thin Wafer Market, by Application

• 9.1. Introduction
• 9.2. CMOS Image Sensor
• 9.3. Interposer
• 9.4. LED
• 9.5. Logic
• 9.6. Memory
• 9.7. Micro-Electromechanical System
• 9.8. RF Devices

10. Americas Thin Wafer Market

• 10.1. Introduction
• 10.2. Argentina
• 10.3. Brazil
• 10.4. Canada
• 10.5. Mexico
• 10.6. United States

11. Asia-Pacific Thin Wafer Market

• 11.1. Introduction
• 11.2. Australia
• 11.3. China
• 11.4. India
• 11.5. Indonesia
• 11.6. Japan
• 11.7. Malaysia
• 11.8. Philippines
• 11.9. Singapore
• 11.10. South Korea
• 11.11. Taiwan
• 11.12. Thailand
• 11.13. Vietnam

12. Europe, Middle East & Africa Thin Wafer Market

• 12.1. Introduction
• 12.2. Denmark
• 12.3. Egypt
• 12.4. Finland
• 12.5. France
• 12.6. Germany
• 12.7. Israel
• 12.8. Italy
• 12.9. Netherlands
• 12.10. Nigeria
• 12.11. Norway
• 12.12. Poland
• 12.13. Qatar
• 12.14. Russia
• 12.15. Saudi Arabia
• 12.16. South Africa
• 12.17. Spain
• 12.18. Sweden
• 12.19. Switzerland
• 12.20. Turkey
• 12.21. United Arab Emirates
• 12.22. United Kingdom

13. Competitive Landscape

• 13.1. Market Share Analysis, 2023
• 13.2. FPNV Positioning Matrix, 2023
• 13.3. Competitive Scenario Analysis
  • 13.3.1. Tokyo Electron Launches Ulucus G, a Wafer Thinning System for 300mm Wafer Fabrication
  • 13.3.2. China Makes Breakthrough In Mass Production of 12-inch 2D Semiconductor Wafer
  • 13.3.3. Renesas and Wolfspeed Sign 10 Year SiC Wafer Agreement
• 13.4. Strategy Analysis & Recommendation

Companies Mentioned

• 1. 3M Company
• 2. Aixtron SE
• 3. Atecom Technology Co., Ltd.
• 4. Brewer Science, Inc.
• 5. Chipmetrics Oy
• 6. DISCO Corporation
• 7. EV Group
• 8. Globalwafers Co., Ltd.
• 9. Hangzhou Semiconductor Wafer Co., Ltd .
• 10. LDK Solar High-Tech Co., Ltd.
• 11. Okmetic Oy
• 12. ROHM Co., Ltd. by KYOCERA AVX
• 13. Shin-Etsu Chemical Co., Ltd.
• 14. Siltronic AG
• 15. Siltronix Silicon Technologies
• 16. SK Siltron Co., Ltd.
• 17. Soitec
• 18. SPTS Technologies Ltd.
• 19. Sumco Corporation
• 20. SUSS MicroTec SE
• 21. UniversityWafer, Inc.
• 22. Virginia Semiconductor Inc.
• 23. Wafer World Inc.