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市場調査レポート
商品コード
1459549
半導体製造装置の世界市場 2024-2028Global Semiconductor Manufacturing Equipment Market 2024-2028 |
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カスタマイズ可能
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半導体製造装置の世界市場 2024-2028 |
出版日: 2024年03月20日
発行: TechNavio
ページ情報: 英文 157 Pages
納期: 即納可能
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半導体製造装置市場は2023-2028年に466億8,000万米ドル、予測期間中のCAGRは7.74%で成長すると予測されます。
当レポートでは、半導体製造装置市場の全体的な分析、市場規模・予測、動向、成長促進要因、課題、約25のベンダーを網羅したベンダー分析などを掲載しています。
現在の市場シナリオ、最新動向と促進要因、市場環境全体に関する最新分析を提供しています。市場は、半導体製造への投資の増加、高度な半導体製造能力を必要とする5Gネットワークの拡大、アジア太平洋における半導体組立テスト(OSAT)アウトソーシングベンダーの増加によって牽引されています。
市場範囲 | |
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基準年 | 2024 |
終了年 | 2028 |
予測期間 | 2024-2028 |
成長モメンタム | 加速 |
前年比2024年 | 7.26% |
CAGR | 7.74% |
増分額 | 466億8,000万米ドル |
本調査では、半導体製造装置業界の発展が、今後数年間の半導体製造装置市場成長を牽引する主要因の一つであると分析しています。また、より小さなノードサイズへの先進リソグラフィ技術の採用、ウエハーレベルパッケージングとヘテロジニアスインテグレーションへの注目の高まりは、市場の大きな需要につながります。
Exhibits:
The semiconductor manufacturing equipment market is forecasted to grow by USD 46.68 bn during 2023-2028, accelerating at a CAGR of 7.74% during the forecast period. The report on the semiconductor manufacturing equipment market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors.
The report offers an up-to-date analysis regarding the current market scenario, the latest trends and drivers, and the overall market environment. The market is driven by increasing investment in semiconductor fabrication, expansion of 5G networks requiring advanced semiconductor fabrication capabilities, and growing number of outsourced semiconductor assembly and test (OSAT) vendors in APAC.
Technavio's semiconductor manufacturing equipment market is segmented as below:
Market Scope | |
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Base Year | 2024 |
End Year | 2028 |
Series Year | 2024-2028 |
Growth Momentum | Accelerate |
YOY 2024 | 7.26% |
CAGR | 7.74% |
Incremental Value | $46.68bn |
By Application
By Type
By Geography
This study identifies the developments in semiconductor manufacturing equipment industry as one of the prime reasons driving the semiconductor manufacturing equipment market growth during the next few years. Also, adoption of advanced lithography technologies for smaller node sizes and increasing focus on wafer-level packaging and heterogeneous integration will lead to sizable demand in the market.
The report on the semiconductor manufacturing equipment market covers the following areas:
The robust vendor analysis is designed to help clients improve their market position, and in line with this, this report provides a detailed analysis of several leading semiconductor manufacturing equipment market vendors that include Applied Materials Inc., ASM International NV, ASML, Axcelis Technologies Inc, EV Group, Hitachi Ltd., KLA Corp., Lam Research Corp., Nikon Corp., Nova Measuring Instruments Ltd., Onto Innovation Inc., PLASMA THERM, Screen Holdings Co. Ltd., Teradyne Inc., Tokyo Electron Ltd., and Veeco Instruments Inc.. Also, the semiconductor manufacturing equipment market analysis report includes information on upcoming trends and challenges that will influence market growth. This is to help companies strategize and leverage all forthcoming growth opportunities.
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The publisher presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research - both primary and secondary. The market research reports provide a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast the accurate market growth.