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半導体ウエハー研磨・研削装置市場：タイプ・エンドユーザー・地域別レポート 2024年～2032年

Semiconductor Wafer Polishing and Grinding Equipment Market Report by Type (Semiconductor Wafer Polishing Equipment, Semiconductor Wafer Grinding Equipment), End User (Foundries, Memory Manufacturers, IDMs, and Others), and Region 2024-2032
出版日: | 発行: IMARC | ページ情報: 英文 146 Pages | 納期: 2～3営業日

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価格
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半導体ウエハー研磨・研削装置市場：タイプ・エンドユーザー・地域別レポート 2024年～2032年
出版日: 2024年07月01日
発行: IMARC
ページ情報: 英文 146 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

半導体ウエハー研磨・研削装置市場の世界市場規模は2023年に4億3,120万米ドルに達しました。今後、IMARC Groupは、市場は2032年までに6億4,780万に達し、2024-2032年の成長率（CAGR）は4.5%になると予測しています。

研磨・研削装置とは、一般的に半導体ウエハーの製造に使用される高度で不可欠な部品を指します。これらの装置には、蒸着、リソグラフィ、イオン注入、エッチング、洗浄が含まれ、金属組織検査装置、ディスク仕上げ装置、ラップ盤の助けを借りて行われる標準的な方法があります。半導体ウエハーの研磨・研削装置は、平滑で損傷のない表面を確保しながら、膜から不要な物質を除去し、製品を薄くして精製するのに役立ちます。このような特性から、集積回路を構成するファウンドリーやメモリーメーカーに広く利用されています。

半導体ウエハー研磨・研削装置市場動向：

エレクトロニクス産業の急速な拡大に伴い、スマートフォン、ノートパソコン、デスクトップパソコンなど、さまざまな消費者向け電子製品の製造に使用される微小電気機械システム（MEMS）、マイクロチップ、集積回路に対する需要が高まっています。その結果、ウエハーの薄型化とダメージ軽減のために、先進的な半導体ウエハー研磨・琢磨装置の普及が促進され、これが現在の市場成長を牽引する主な要因の一つとなっています。これに伴い、生産工程でウエハー表面形状を維持するための金属-酸化膜-半導体（MOS）および化学-機械-研磨（CMP）ソリューションの採用など、大幅な技術進歩が他の成長促進要因として作用しています。また、モノのインターネット（IoT）や人工知能（AI）を含むワイヤレス技術の大規模な統合が市場を支えており、スマートデバイスの製造に役立っています。さらに、システムオンチップ（SoC）サイコロを製造するためにウエハー製造工場で研磨・研削装置が広く利用されていることも、市場の成長に寄与しています。その他の要因としては、ウエハーの薄型化による電子デバイスの小型化ニーズの高まり、研究開発（R&D）活動への継続的な投資、高性能ウエハー研磨・研削装置の導入に向けた主要企業間の戦略的提携などがあり、市場に明るい見通しをもたらしています。

目次

第1章 序文

第2章 調査範囲と調査手法

  • 調査の目的
  • ステークホルダー
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 調査手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要業界動向

第5章 世界の半導体ウエハー研磨・研削装置市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場予測

第6章 市場内訳：タイプ別

  • 半導体ウエハー研磨装置
    • 市場動向
    • 市場予測
  • 半導体ウエハー研削装置
    • 市場動向
    • 市場予測

第7章 市場内訳：エンドユーザー別

  • 鋳造所
    • 市場動向
    • 市場予測
  • メモリメーカー
    • 市場動向
    • 市場予測
  • IDM
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第8章 市場内訳：地域別

  • 北米
    • 米国
    • カナダ
  • アジア太平洋
    • 中国
    • 日本
    • インド
    • 韓国
    • オーストラリア
    • インドネシア
    • その他
  • 欧州
    • ドイツ
    • フランス
    • 英国
    • イタリア
    • スペイン
    • ロシア
    • その他
  • ラテンアメリカ
    • ブラジル
    • メキシコ
    • その他
  • 中東・アフリカ
    • 市場動向
    • 市場内訳：国別
    • 市場予測

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターのファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の程度
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • Accretech（Europe）Gmbh（Tokyo Seimitsu Co. Ltd.）
    • Amtech Systems Inc.
    • Axus Technology
    • BBS Kinmei Co Ltd
    • Disco Corporation
    • Dynavest Pte Ltd
    • Ebara Corporation
    • Gigamat Technologies Inc.
    • Lapmaster Wolters GmbH（Lapmaster International LLC）
    • Logitech Ltd.
    • Okamoto Machine Tool Works Ltd
    • Revasum Inc.
図表

List of Figures

  • Figure 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Major Drivers and Challenges
  • Figure 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018-2023
  • Figure 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Type (in %), 2023
  • Figure 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by End User (in %), 2023
  • Figure 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Region (in %), 2023
  • Figure 7: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 8: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Polishing Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 9: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 10: Global: Semiconductor Wafer Polishing and Grinding Equipment (Semiconductor Wafer Grinding Equipment) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 11: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 12: Global: Semiconductor Wafer Polishing and Grinding Equipment (Foundries) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 13: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 14: Global: Semiconductor Wafer Polishing and Grinding Equipment (Memory Manufacturers) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 15: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 16: Global: Semiconductor Wafer Polishing and Grinding Equipment (IDMs) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 17: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 18: Global: Semiconductor Wafer Polishing and Grinding Equipment (Other End Users) Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 19: North America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 20: North America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 21: United States: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 22: United States: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 23: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 24: Canada: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 25: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 26: Asia-Pacific: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 27: China: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 28: China: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 29: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 30: Japan: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 31: India: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 32: India: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 33: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 34: South Korea: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 35: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 36: Australia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 37: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 38: Indonesia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 39: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 40: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 41: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 42: Europe: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 43: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 44: Germany: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 45: France: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 46: France: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 47: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 48: United Kingdom: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 49: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 50: Italy: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 51: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 52: Spain: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 53: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 54: Russia: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 55: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 56: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 57: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 58: Latin America: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 59: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 60: Brazil: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 61: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 62: Mexico: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 63: Others: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 64: Others: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 65: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Sales Value (in Million US$), 2018 & 2023
  • Figure 66: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market: Breakup by Country (in %), 2023
  • Figure 67: Middle East and Africa: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Sales Value (in Million US$), 2024-2032
  • Figure 68: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: SWOT Analysis
  • Figure 69: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Value Chain Analysis
  • Figure 70: Global: Semiconductor Wafer Polishing and Grinding Equipment Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Industry Highlights, 2023 and 2032
  • Table 2: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Type (in Million US$), 2024-2032
  • Table 3: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by End User (in Million US$), 2024-2032
  • Table 4: Global: Semiconductor Wafer Polishing and Grinding Equipment Market Forecast: Breakup by Region (in Million US$), 2024-2032
  • Table 5: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Competitive Structure
  • Table 6: Global: Semiconductor Wafer Polishing and Grinding Equipment Market: Key Players
目次
Product Code: SR112024A5866

The global semiconductor wafer polishing and grinding equipment market size reached US$ 431.2 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 647.8 Million by 2032, exhibiting a growth rate (CAGR) of 4.5% during 2024-2032.

Polishing and grinding equipment refer to advanced, indispensable components generally used while fabricating semiconductor wafers. They involve deposition, lithography, Ion implant, etching, and cleaning as some of the standard methods performed with the assistance of metallographic tools, disc finishing, and lapping machines. Semiconductor wafer polishing and grinding equipment aid in removing unwarranted material from a film and thinning and refining the product while ensuring a smooth and damage-free surface. On account of these properties, they are extensively utilized by foundries and memory manufacturers for composing integrated circuits.

Semiconductor Wafer Polishing and Grinding Equipment Market Trends:

With the rapid expansion in the electronics industry, there has been increasing demand for microelectromechanical systems (MEMS), microchips and integrated circuits for manufacturing various consumer electronic goods, including smartphones, laptops and desktops. This, in turn, has facilitated the widespread adoption of advanced semiconductor wafer grinding and polishing machinery for thinning and mitigating damage from wafers, which represents one of the prime factors currently driving the market growth. In line with this, significant technological advancements, such as the employment of metal-oxide-semiconductor (MOS) and chemical-mechanical-polishing (CMP) solutions to maintain the wafer surface profile during production processes, are acting as other growth-inducing factors. The market is also being supported by the large-scale integration of wireless technologies, including the Internet of Things (IoT) and artificial intelligence (AI), that help manufacturers engineer smart devices. Additionally, the extensive utilization of polishing and grinding equipment in wafer fabrication plants to manufacture a system on a chip (SoC) dice is contributing to the market growth. Other factors, such as the rising need for miniaturized electronic devices with thinner wafers, continuous investments in research and development (R&D) activities, and strategic collaborations amongst key players to introduce high-performance wafer polishing and grinding tools are creating a positive outlook for the market.

Key Market Segmentation:

IMARC Group provides an analysis of the key trends in each sub-segment of the global semiconductor wafer polishing and grinding equipment market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on type and end user.

Breakup by Type:

Semiconductor Wafer Polishing Equipment

Semiconductor Wafer Grinding Equipment

Breakup by End User:

Foundries

Memory Manufacturers

IDMs

Others

Breakup by Region:

North America

United States

Canada

Asia-Pacific

China

Japan

India

South Korea

Australia

Indonesia

Others

Europe

Germany

France

United Kingdom

Italy

Spain

Russia

Others

Latin America

Brazil

Mexico

Others

Middle East and Africa

Competitive Landscape:

The competitive landscape of the industry has also been examined along with the profiles of the key players being Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.), Amtech Systems Inc., Axus Technology, BBS Kinmei Co Ltd, Disco Corporation, Dynavest Pte Ltd, Ebara Corporation, Gigamat Technologies Inc., Lapmaster Wolters GmbH (Lapmaster International LLC), Logitech Ltd., Okamoto Machine Tool Works Ltd and Revasum Inc.

Key Questions Answered in This Report:

  • How has the global semiconductor wafer polishing and grinding equipment market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global semiconductor wafer polishing and grinding equipment market?
  • What are the key regional markets?
  • What is the breakup of the market based on the type?
  • What is the breakup of the market based on the end user?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global semiconductor wafer polishing and grinding equipment market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global Semiconductor Wafer Polishing and Grinding Equipment Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Type

  • 6.1 Semiconductor Wafer Polishing Equipment
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 Semiconductor Wafer Grinding Equipment
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast

7 Market Breakup by End User

  • 7.1 Foundries
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Memory Manufacturers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 IDMs
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Others
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 Accretech (Europe) Gmbh (Tokyo Seimitsu Co. Ltd.)
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
    • 13.3.2 Amtech Systems Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
      • 13.3.2.3 Financials
    • 13.3.3 Axus Technology
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 BBS Kinmei Co Ltd
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
    • 13.3.5 Disco Corporation
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
      • 13.3.5.3 Financials
    • 13.3.6 Dynavest Pte Ltd
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Ebara Corporation
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
      • 13.3.7.4 SWOT Analysis
    • 13.3.8 Gigamat Technologies Inc.
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 Lapmaster Wolters GmbH (Lapmaster International LLC)
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
    • 13.3.10 Logitech Ltd.
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
    • 13.3.11 Okamoto Machine Tool Works Ltd
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Revasum Inc.
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio
      • 13.3.12.3 Financials