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ダイアタッチマシンの市場レポート:タイプ、技術、用途、地域別、2024~2032年Die Attach Machine Market Report by Type, Technique, Application, and Region 2024-2032 |
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ダイアタッチマシンの市場レポート:タイプ、技術、用途、地域別、2024~2032年 |
出版日: 2024年04月08日
発行: IMARC
ページ情報: 英文 136 Pages
納期: 2~3営業日
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世界のダイアタッチマシン市場規模は2023年に11億2,110万米ドルに達しました。今後、IMARC Groupは、2024~2032年にかけての成長率(CAGR)は4.4%を示し、2032年には16億7,890万米ドルに達すると予測しています。半導体の生産量の増加、再生可能エネルギー源の需要増加、自律走行車、電気自動車、高級車の販売台数の増加が、市場を牽引する主要要因となっています。
ダイアタッチとは、半導体チップを基板やパッケージに取り付ける工程です。さまざまな種類のパッケージングの基本であり、エポキシ、ポリイミド、銀入りガラスなどさまざまな材料を使用します。ダイアタッチマシンは、高い精度と正確さでダイを基板やパッケージに配置するように設計されています。ダイアタッチマシンは、ダイマウントマシンやダイボンドマシンとしても知られ、ダイが適切に位置決めされ、加熱接着剤や熱圧着プロセスで接着されるよう、ビジョンシステムやその他のセンサーが装備されています。現在、民生用電子機器の販売台数が増加しており、ダイアタッチマシンの需要が世界中で高まっています。
マイクロプロセッサ、メモリチップ、その他の集積回路(IC)などの半導体デバイスの生産において、ダイアタッチマシンの利用が増加していることが、世界の市場成長の主要要因の1つとなっています。さらに、半導体デバイスのパッケージングにおけるダイアタッチマシンの使用が増加していることも、市場の成長を後押ししています。さらに、さまざまな電子機器の電子部品を接続するプリント回路基板(PCB)製造におけるダイアタッチマシンの用途拡大も、市場にプラスの影響を与えています。これとは別に、自動車産業では、センサー、エンジンとトランスミッションの制御モジュール、安全、ナビゲーション、オーディオシステム、ADAS(先進運転支援システム)、電気モーターコントローラーなど、自動車のさまざまな部品を製造するために、ダイアタッチマシンが採用されています。これに加え、所得水準の上昇を背景に電気自動車や高級車の販売が増加していることが、市場の成長に寄与しています。さらに、ペースメーカー、インスリンポンプ、埋め込み型機器、グルコースメーター、血圧モニターなどの医療機器へのダイアタッチマシンの採用が増加しています。これに加え、重篤な病状の急増が市場成長を後押ししています。さらに、スマートウォッチやフィットネストラッカーなどのウェアラブルデバイスの需要が増加していることも、市場に明るい展望をもたらしています。このほか、風力タービンやソーラーパネルなどの再生可能エネルギー源に対する需要の高まりが、ダイアタッチマシンのニーズを後押ししています。
The global die attach machine market size reached US$ 1,121.1 Million in 2023. Looking forward, IMARC Group expects the market to reach US$ 1,678.9 Million by 2032, exhibiting a growth rate (CAGR) of 4.4% during 2024-2032. The increasing production of semiconductors, rising demand for renewable energy sources and the growing sales of autonomous, electric, and luxury vehicles represent some of the key factors driving the market.
Die attach is the process wherein a semiconductor chip is attached to a substrate or package. It is considered fundamental to different types of packaging and uses various materials, such as epoxy, polyimide, and silver-filled glass. It is operated using a die attach machine that is designed to handle and place the die onto the substrate or package with high accuracy and precision. A die attach machine, also known as a die mount or die bond machine, is equipped with vision systems and other sensors to ensure that the die is adequately positioned and bonded using a heated adhesive or a thermocompression bonding process. At present, rising sales of consumer electronic devices are catalyzing the demand for die attach machine across the globe.
The increasing utilization of die attach machines in the production of semiconductor devices, such as microprocessors, memory chips, and other integrated circuits (ICs), represents one of the major factors strengthening the market growth around the world. Moreover, the rising use of die attach machines in the packaging of semiconductor devices is favoring the market growth. In addition, the growing usage of die attach machines in the manufacturing of printed circuit boards (PCBs) to connect electronic components in different electronic devices is influencing the market positively. Apart from this, die attach machines are employed in the automotive industry to manufacture various parts of vehicles, including sensors, engine and transmission control modules, safety, navigation, and audio systems, advanced driver assistance systems (ADAS), and electric motor controllers. This, coupled with the increasing sales of electric and luxury vehicles on account of inflating income levels, is contributing to the market growth. Furthermore, there is a rise in the adoption of die attach machines in medical devices like pacemakers, insulin pumps, implantable devices, glucose meters, and blood pressure monitors. This, along with the surging prevalence of severe medical conditions, is fueling the market growth. Additionally, the increasing demand for wearable devices, such as smartwatches and fitness trackers, is creating a positive outlook for the market. Besides this, the growing demand for renewable energy sources, such as wind turbines and solar panels, is driving the need for die attach machines.
IMARC Group provides an analysis of the key trends in each segment of the global die attach machine market, along with forecasts at the global, regional, and country level from 2024-2032. Our report has categorized the market based on type, technique, and application.
Flip Chip Bonder
Die Bonder
The report has provided a detailed breakup and analysis of the die attach machine market based on the type. This includes flip chip bonder and die bonder. According to the report, die bonder represented the largest segment.
Epoxy
Soft Solder
Sintering
Eutectic
Others
A detailed breakup and analysis of the die attach machine market based on the technique has also been provided in the report. This includes epoxy, soft solder, sintering, eutectic, and others. According to the report, epoxy represented the largest segment.
RF and MEMS
Optoelectronics
Logic
Memory
CMOS Image Sensors
LED
Others
The report has provided a detailed breakup and analysis of the die attach machine market based on the application. This includes RF and MEMS, optoelectronics, logic, memory, CMOS image sensors, LED, and others. According to the report, LED represented the largest segment.
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, Asia Pacific was the largest market for die attach machines. Some of the factors driving the Asia Pacific die attach machine market included the increasing demand for semiconductor devices, advancements in packaging technology, and rising adoption of automation in the semiconductor industry.
The report has also provided a comprehensive analysis of the competitive landscape in the global die attach machine market. Competitive analysis such as market structure, market share by key players, player positioning, top winning strategies, competitive dashboard, and company evaluation quadrant has been covered in the report. Also, detailed profiles of all major companies have been provided. Some of the companies covered Anza Technology Inc., ASM Pacific Technology Limited, Be Semiconductor Industries N.V., Dr. Tresky AG, Fasford Technology Co Ltd. (Fuji Machinery Co., Ltd), Hybond Inc., Inseto UK Limited, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., MRSI Systems (Mycronic AB (Publ)), Palomar Technologies Inc., Shinkawa Ltd. (Yamaha Motor Co. Ltd.), etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.