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市場調査レポート
商品コード
1467721
SOI(Silicon-on-Insulator)市場レポート:ウエハサイズ、ウエハタイプ、技術、製品、用途、地域別、2024~2032年Silicon on Insulator Market Report by Wafer Size, Wafer Type, Technology, Product, Application, and Region 2024-2032 |
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SOI(Silicon-on-Insulator)市場レポート:ウエハサイズ、ウエハタイプ、技術、製品、用途、地域別、2024~2032年 |
出版日: 2024年04月08日
発行: IMARC
ページ情報: 英文 135 Pages
納期: 2~3営業日
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SOI(Silicon-on-Insulator)の世界市場規模は2023年に15億米ドルに達しました。今後、IMARC Groupは、2024~2032年にかけて12.7%の成長率(CAGR)を示し、2032年には46億米ドルに達すると予測しています。
SOI(Silicon-on-Insulator)とは、マイクロチップや半導体デバイスの製造技術の一つで、集積回路(IC)の製造を効率化するために、単結晶シリコンの薄膜を絶縁体の上に配置するものです。接合キャパシタンスの低減、高速化、電荷リークの排除、SOIベースデバイスの性能の最適化を支援し、同時に消費電力を最小限に抑えます。このような特性により、さまざまな民生用電子機器、マイクロプロセッサー、無線周波数(RF)信号プロセッサー、バイオテクノロジーチップ、微小電気機械システム(MEMS)の製造に広く使用されています。現在、完全空乏型と部分空乏型が市販されています。
SOI(Silicon-on-Insulator)市場を牽引する主要要因の一つは、エレクトロニクスセグメントの大幅な拡大であり、スマートフォン、ノートパソコン、デジタルカメラ、デスクトップなどの高性能マイクロエレクトロニクス機器や民生用電子機器に対する需要の増加です。これに伴い、ADAS(先進運転支援システム)や半自動運転システムなどの様々な自動車ソリューションに、熱機械的堅牢性、操作の安全性、低消費電力、長期信頼性などの特性から、完全空乏型シリコン絶縁膜(FD-SOI)が組み込まれることも、他の主要な成長促進要因として作用しています。さらに、RF-SOI(Radio Frequency Silicon-on-Insulator)ウエハーのスマートフォンへの大規模な統合など、セルラー信号を保持し、複数の場所から中断のない接続を受信するための大幅な技術進歩が、市場の成長に寄与しています。さらに、低消費電力で手頃な価格の半導体や集積回路(IC)に対するニーズの高まりが、集積デバイスメーカー(IDM)の間でSOIの普及を促進し、市場成長をさらに後押ししています。その他の要因として、研究開発(R&D)活動への継続的な投資や、集積回路(IC)技術を進歩させるための主要企業間の頻繁な合併・買収(M&A)などが、市場に明るい展望をもたらしています。
The global silicon on insulator market size reached US$ 1.5 Billion in 2023. Looking forward, IMARC Group expects the market to reach US$ 4.6 Billion by 2032, exhibiting a growth rate (CAGR) of 12.7% during 2024-2032.
Silicon on insulator (SOI) refers to a microchip or semiconductor device manufacturing technique, wherein engineers place thin films of single-crystalline silicon on top of an insulator for streamlining the fabrication of integrated circuits (IC). It aids in reducing junction capacitance, resulting in higher speed, eliminating charge leakage, and optimizing the performance of SOI-based devices, while ensuring minimal power consumption. On account of these properties, they are extensively used for producing various consumer electronics, microprocessors, radio frequency (RF) signal processors, biotechnological chips, and microelectromechanical systems (MEMS). At present, it is commercially available in fully and partially depleted silicon on insulator types.
One of the major factors driving the SOI market is the significant expansion in the electronics sector, along with the increasing demand for high-performance microelectronic and consumer electronic devices, including smartphones, notebooks, digital cameras, and desktops. In line with this, the incorporation of fully depleted silicon on insulators (FD-SOI) in various automobile solutions, such as advanced driver assistance systems (ADAS) and semi-autonomous driving systems, due to their thermos-mechanical robustness, operational safety, low-power consumption, and long-term reliability properties are acting as other major growth-inducing factors. Additionally, significant technological advancements, such as the large-scale integration of radio frequency silicon on insulator (RF-SOI) wafers into smartphones to hold cellular signals and receive an uninterrupted connection from multiple locations, are contributing to the market growth. Moreover, the rising need for low-power and affordable semiconductors and integrated circuits (IC) has facilitated the widespread adoption of SOI amongst the integrated device manufacturer (IDM) community, which is further propelling the market growth. Other factors, such as continuous investments in research and development (R&D) activities and frequent mergers and acquisitions (M&A) amongst key players to progress integrated circuit (IC) technology, are creating a positive outlook for the market.
IMARC Group provides an analysis of the key trends in each sub-segment of the global silicon on insulator market report, along with forecasts at the global, regional and country level from 2024-2032. Our report has categorized the market based on wafer size, wafer type, technology, product and application.
FD-SOI
RF-SOI
PD-SOI
Others
Smart Cut
BESOI
SiMOX
ELTRAN
SoS
RF FEM Products
MEMS Devices
Power Products
Optical Communication
Image Sensing
Consumer Electronics
Automotive
Datacom and Telecom
Industrial
Photonics
Others
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The competitive landscape of the industry has also been examined along with the profiles of the key players being GlobalWafers Co. Ltd. (Sino-American Silicon Products Inc.), GlobalFoundries Inc., Murata Manufacturing Co. Ltd., NXP Semiconductors N.V., Shanghai Simgui Technology Co. Ltd., Shin-Etsu Chemical Co. Ltd., Silicon Valley Microelectronics Inc., Soitec, STMicroelectronics, SUMCO Corporation, Tower Semiconductor Ltd. and United Microelectronics Corporation.