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ベアダイ出荷・ハンドリングおよび加工・保管市場レポート:製品別、用途別、地域別、2023-2028年Bare Die Shipping & Handling and Processing & Storage Market Report by Product, Application, and Region 2023-2028 |
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ベアダイ出荷・ハンドリングおよび加工・保管市場レポート:製品別、用途別、地域別、2023-2028年 |
出版日: 2023年09月04日
発行: IMARC
ページ情報: 英文 145 Pages
納期: 2~3営業日
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世界のベアダイ出荷・ハンドリングおよび加工・保管市場規模は、2022年に10億1,400万米ドルに達しました。今後、IMARC Groupは、2023-2028年の成長率(CAGR)は5.90%を示し、2028年には14億3,300万米ドルに達すると予測しています。成長を続けるハイテク産業や自動車産業からの需要増加、エレクトロニクスの小型化という新たな動向、電気自動車や自律走行車の販売増加、急速な技術進歩などが市場を牽引する主な要因となっています。
ベアダイ出荷・ハンドリングとは、包装されていない半導体チップ、すなわち「ベアダイ」の輸送に関わる物流手順を指します。通常の保護パッケージから取り除かれたこれらの部品は、損傷を防ぎ純度を確保するために慎重な取り扱いが必要です。そのため、出荷プロセスには、品質と完全性を維持するための先進的な保護パッケージング技術や気候制御された輸送システムが含まれることが多いです。一方、ベアダイの加工と保管は、ベアダイの受領後に行われる作業です。これには、機能性と一貫性のテスト、仕様に基づく分類、必要なときまで管理された条件下での保管が含まれます。湿気、静電気放電、粒子汚染などの環境要因に対して脆弱であるため、これらのダイは通常、湿度管理され、ESD保護された環境で保管されます。自動在庫システムは、各ダイのステータスと位置を追跡するために使用され、後続のパッケージング、より大きなアセンブリへの統合、または顧客への直接出荷のための効率的な回収を保証します。
電子機器やハイテク機器に対する需要の高まりによる半導体産業の急速な拡大が、市場成長の主な要因となっています。このほか、デジタル変革の進行や、人工知能(AI)、モノのインターネット(IoT)、5Gなどの技術の進歩も、成長を促す主な要因となっています。また、電子機器の小型化が進むにつれ、小型回路基板に直接組み込むことができるベアダイの需要が世界的に高まっています。これとともに、半導体を大量に必要とする電気自動車や自律走行車の生産と販売の増加が、市場の成長を支えています。これとは別に、地政学的緊張の高まりやパンデミック関連のサプライチェーンの混乱に起因する、弾力性のあるサプライチェーンの重要性に対する意識の高まりが、専門的な出荷・ハンドリングサービスの必要性を高めています。さらに、大手企業は自動化、AI、ブロックチェーン技術を活用して透明性を向上させ、効率的で正確な取り扱い、処理、保管手順を実現しています。これに伴い、規制遵守を確実にし、カーボンフットプリントを最小限に抑えるために、環境に優しく持続可能な慣行を出荷・ハンドリングプロセスに導入することが、市場の成長を促進しています。ベアダイの出荷とハンドリングにおける厳格な品質管理に対する需要の高まり、厳しい環境規制、自動車部門の急成長、高度なパッケージング技術の開発など、その他の要因もまた、良好な市場見通しを生み出しています。
The global bare die shipping & handling and processing & storage market size reached US$ 1,014 Million in 2022. Looking forward, IMARC Group expects the market to reach US$ 1,433 Million by 2028, exhibiting a growth rate (CAGR) of 5.90% during 2023-2028. The rising demand from the growing high-tech and automotive industries, the emerging trend of electronics miniaturization, increasing sales of electric and autonomous vehicles, and rapid technological advancements represent some of the key factors driving the market.
Bare die shipping & handling refers to the logistical procedures involved in transporting unpackaged semiconductor chips, or "bare dies." These components, stripped of their usual protective packaging, necessitate careful handling to prevent damage and ensure purity. Consequently, shipping processes often include advanced protective packaging techniques and climate-controlled transport systems to maintain quality and integrity. On the other hand, bare die processing & storage pertains to the operations undertaken after the bare dies have been received. This involves testing for functionality and consistency, classifying based on specifications, and storing under controlled conditions until needed. Due to their vulnerability to environmental factors such as moisture, electrostatic discharge, and particulate contamination, these dies are typically stored in humidity-controlled, ESD-protected environments. Automated inventory systems are used to track each die's status and location, ensuring efficient retrieval for subsequent packaging, integration into larger assemblies, or direct shipment to customers.
The rapid expansion of the semiconductor industry owing to the escalating demand for electronics and high-tech devices represents the primary factor driving the market growth. Besides this, the ongoing digital transformation and advancements in technologies such as artificial intelligence (AI), the Internet of Things (IoT), and 5G are other major growth-inducing factors. In addition, as electronics continue to shrink in size due to the emerging trend of miniaturization, the demand for bare dies, which can be integrated directly into compact circuit boards, is escalating worldwide. Along with this, the increasing production and sales of electric and autonomous vehicles, which require significant semiconductor content, are supporting the market growth. Apart from this, the growing awareness about the importance of resilient supply chains owing to elevating geopolitical tensions and pandemic-related supply chain disruptions is strengthening the need for professional shipping and handling services. Furthermore, the leading players are leveraging automation, AI, and blockchain technologies for improved transparency and efficient and precise handling, processing, and storage procedures. In line with this, the implementation of eco-friendly and sustainable practices in the shipping and handling processes to ensure regulatory compliance and minimize carbon footprint is propelling market growth. Other factors, including the augmenting demand for stringent quality control in bare die shipping and handling, stringent environmental regulations, rapid automotive sector growth, and the development of advanced packaging techniques, are also creating a favorable market outlook.
IMARC Group provides an analysis of the key trends in each segment of the global bare die shipping & handling and processing & storage market, along with forecasts at the global, regional, and country levels from 2023-2028. Our report has categorized the market based on product and application.
Shipping Tubes
Trays
Carrier Tapes
Others
The report has provided a detailed breakup and analysis of the bare die shipping & handling and processing & storage market based on the product. This includes shipping tubes, trays, carrier tapes, and others. According to the report, trays represented the largest segment.
Communications
Computers
Consumer Electronics
Automotive
Industrial and Medical
Defense
A detailed breakup and analysis of the bare die shipping & handling and processing & storage market based on the application has also been provided in the report. This includes communications, computers, consumer electronics, automotive, industrial and medical, and defense. According to the report, communications accounted for the largest market share.
North America
United States
Canada
Asia-Pacific
China
Japan
India
South Korea
Australia
Indonesia
Others
Europe
Germany
France
United Kingdom
Italy
Spain
Russia
Others
Latin America
Brazil
Mexico
Others
Middle East and Africa
The report has also provided a comprehensive analysis of all the major regional markets, which include North America (the United States and Canada); Asia-Pacific (China, Japan, India, South Korea, Australia, Indonesia, and others); Europe (Germany, France, the United Kingdom, Italy, Spain, Russia, and others); Latin America (Brazil, Mexico, and others); and the Middle East and Africa. According to the report, North America was the largest market for bare die shipping & handling and processing & storage. Some of the factors driving the North America bare die shipping & handling and processing & storage market included its strong presence of semiconductor companies, rapid growth in high-tech industries, early adoption of novel technologies, robust regulatory environment, etc.
The report has also provided a comprehensive analysis of the competitive landscape in the global bare die shipping & handling and processing & storage market. Detailed profiles of all major companies have been provided. Some of the companies covered include Achilles Usa Inc. (The Achilles Corporation), Brooks Automation Inc., Entegris Inc., ePAK International Inc., Keaco LLC, Malaster Company Inc., Ted Pella Inc., etc. Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.
Kindly note that this only represents a partial list of companies, and the complete list has been provided in the report.