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1225410

高密度相互接続（HDI）PCB市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年の予測

High-Density Interconnect (HDI) PCB Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028
出版日: | 発行: IMARC | ページ情報: 英文 142 Pages | 納期: 2～3営業日

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価格
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高密度相互接続（HDI）PCB市場：世界の産業動向、シェア、規模、成長、機会、2023-2028年の予測
出版日: 2023年02月03日
発行: IMARC
ページ情報: 英文 142 Pages
納期: 2～3営業日
  • 全表示
  • 概要
  • 図表
  • 目次
概要

市場概要

  • 高密度相互接続（HDI）PCBの世界市場規模は、2022年に82億米ドルに達しました。今後、IMARCグループは、2023年から2028年の間に5.5%の成長率（CAGR）を示し、2028年までに115億米ドルに達すると予測しています。
  • 高密度配線基板（HDI）とは、従来の配線基板よりも単位あたりの配線密度が高い配線基板です。ブラインドビアや埋込ビアにより、従来の回路基板よりも高い回路密度を持ちながら、従来の回路基板よりも直径が小さく、パッド密度が相対的に高いマイクロビアを含んでいます。高密度PCB技術により、エンジニアは設計の自由度と柔軟性を高め、より小さく、より近くに部品を配置できるようになり、信号損失と交差遅延を減らすことができるようになりました。高密度のインターコネクトPCBは、設計者が作業できる表面積を増やすことができます。その結果、高密度インターコネクトPCBは、より良い信号品質と高速な信号伝送を実現することができるのです。

高密度インターコネクト（HDI）PCBの市場動向

  • 世界市場は、通信、家電、自動車など多くの最終用途産業における製品需要の高まりが主な要因となっています。これは、タッチスクリーン機器、携帯電話、ノートパソコン、デジタルカメラなど、さまざまな電子機器での製品利用が急速に進んでいることに起因しています。また、電子機器の小型化傾向や高性能ガジェットへの要求が高まっていることも、市場を活性化させています。また、医療費の拡大別医療機器・装置の普及も、市場に明るい兆しをもたらしています。さらに、航空機用電子部品やコンポーネントの生産量が増加していることも、市場の成長を促す重要な要因となっています。その他の市場開拓要因としては、高度な安全システムの普及、自律走行の増加傾向、スマートデバイスやゲーム機の販売拡大、可処分所得水準の上昇、大規模な研究開発活動などが挙げられます。

主要市場のセグメンテーション

  • IMARC Groupは、世界の高密度相互接続（HDI）PCB市場レポートの各サブセグメントにおける主要動向の分析と、2023年から2028年までの世界、地域、国レベルでの予測を掲載しています。当レポートでは、HDI層数および最終用途産業に基づいて市場を分類しています。

HDIレイヤーの数別内訳

  • 4-6層HDIプリント基板
  • 8-10層HDI PCBs
  • 10層以上HDI PCB

最終使用産業別内訳

  • スマートフォン、タブレット
  • コンピュータ
  • テレコム/データコム
  • 民生用電子機器
  • 車載
  • その他

地域別の内訳

  • 北米
  • 米国
  • カナダ
  • アジア太平洋地域
  • 中国
  • 日本
  • インド
  • 韓国
  • オーストラリア
  • インドネシア
  • その他
  • 欧州
  • ドイツ
  • フランス
  • 英国
  • イタリア
  • スペイン
  • ロシア
  • その他
  • ラテンアメリカ
  • ブラジル
  • メキシコ
  • その他
  • 中東とアフリカ

本レポートで回答した主な質問

  • 世界の高密度相互接続（HDI）PCB市場はこれまでどのように推移し、今後どのように推移していくのか？
  • COVID-19は世界の高密度相互接続（HDI）PCB市場にどのような影響を与えたか？
  • 主要な地域別市場とは？
  • HDI層数別市場の内訳は？
  • 最終用途産業別の市場内訳は？
  • 業界のバリューチェーンにおける様々なステージとは？
  • 業界における主要な促進要因と課題は何か？
  • 世界の高密度相互接続（HDI）PCB市場の構造、主要プレイヤーは？
  • 業界における競合の程度は？

目次

第1章 序文

第2章 調査手法と範囲

  • 調査の目的
  • 利害関係者
  • データソース
    • 一次情報
    • 二次情報
  • 市場推定
    • ボトムアップアプローチ
    • トップダウンアプローチ
  • 予測手法

第3章 エグゼクティブサマリー

第4章 イントロダクション

  • 概要
  • 主要な産業動向

第5章 高密度相互接続（HDI）PCBの世界市場

  • 市場概要
  • 市場実績
  • COVID-19の影響
  • 市場展望

第6章 HDIレイヤー数別市場内訳

  • 4～6層HDIプリント基板
    • 市場動向
    • 市場展望
  • 8-10層HDIプリント基板
    • 市場動向
    • 市場展望
  • 10層以上のHDIプリント基板
    • 市場動向
    • 市場展望

第7章 エンドユーザー産業別市場内訳

  • スマートフォン、タブレット
    • 市場動向
    • 市場予測
  • コンピューター
    • 市場動向
    • 市場予測
  • テレコム/データコム
    • 市場動向
    • 市場予測
  • コンシューマーエレクトロニクス
    • 市場動向
    • 市場予測
  • 自動車
    • 市場動向
    • 市場予測
  • その他
    • 市場動向
    • 市場予測

第8章 地域別市場内訳

  • 北米
    • 米国
      • 市場動向
      • 市場予測
    • カナダ
      • 市場動向
      • 市場展望
  • アジア太平洋地域
    • 中国
      • 市場動向
      • 市場展望
    • 日本
      • 市場動向
      • 市場予測
    • インド
      • 市場動向
      • 市場展望
    • 韓国市場
      • 市場動向
      • 市場展望
    • オーストラリア
      • 市場動向
      • 市場展望
    • インドネシア
      • 市場動向
      • 市場展望
    • その他
      • 市場動向
      • 市場予測
  • 欧州
    • ドイツ
      • 市場動向
      • 市場展望
    • フランス
      • 市場動向
      • 市場予測
    • 英国
      • 市場動向
      • 市場予測
    • イタリア
      • 市場動向
      • 市場展望
    • スペイン
      • 市場動向
      • 市場展望
    • ロシア
      • 市場動向
      • 市場展望
    • その他
      • 市場動向
      • 市場予測
  • ラテンアメリカ
    • ブラジル
      • 市場動向
      • 市場展望
    • メキシコ
      • 市場動向
      • 市場展望
    • その他
      • 市場動向
      • 市場予測
  • 中東・アフリカ地域
    • 市場動向
    • 国別市場内訳
    • 市場展望

第9章 SWOT分析

  • 概要
  • 強み
  • 弱み
  • 機会
  • 脅威

第10章 バリューチェーン分析

第11章 ポーターズファイブフォース分析

  • 概要
  • 買い手の交渉力
  • 供給企業の交渉力
  • 競合の度合い
  • 新規参入業者の脅威
  • 代替品の脅威

第12章 価格分析

第13章 競合情勢

  • 市場構造
  • 主要企業
  • 主要企業のプロファイル
    • AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Bittele Electronics Inc.
    • Fineline Ltd.
    • Meiko Electronics Co. Ltd.
    • Millennium Circuits Limited
    • Mistral Solutions Pvt. Ltd.
    • Shenzhen Kinwong Electronic Co. Ltd.
    • Sierra Circuits
    • TTM Technologies Inc.
    • Unimicron Technology Corporation（United Microelectronics Corporation）
    • Unitech Printed Circuit Board Corp.
    • Wurth Elektronik GmbH & Co. KG
図表

List of Figures

  • Figure 1: Global: High-Density Interconnect PCB Market: Major Drivers and Challenges
  • Figure 2: Global: High-Density Interconnect PCB Market: Sales Value (in Billion US$), 2017-2022
  • Figure 3: Global: High-Density Interconnect PCB Market Forecast: Sales Value (in Billion US$), 2023-2028
  • Figure 4: Global: High-Density Interconnect PCB Market: Breakup by Number of HDI Layer (in %), 2022
  • Figure 5: Global: High-Density Interconnect PCB Market: Breakup by End Use Industry (in %), 2022
  • Figure 6: Global: High-Density Interconnect PCB Market: Breakup by Region (in %), 2022
  • Figure 7: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 8: Global: High-Density Interconnect PCB (4-6 Layers HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 9: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 10: Global: High-Density Interconnect PCB (8-10 Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 11: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 12: Global: High-Density Interconnect PCB (10+ Layer HDI PCBs) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 13: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 14: Global: High-Density Interconnect PCB (Smartphones and Tablets) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 15: Global: High-Density Interconnect PCB (Computers) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 16: Global: High-Density Interconnect PCB (Computers) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 17: Global: High-Density Interconnect PCB (Telecom/Datacom) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 18: Global: High-Density Interconnect PCB (Telecom/Datacom) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 19: Global: High-Density Interconnect PCB (Consumer Electronics) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 20: Global: High-Density Interconnect PCB (Consumer Electronics) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 21: Global: High-Density Interconnect PCB (Automotive) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 22: Global: High-Density Interconnect PCB (Automotive) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 23: Global: High-Density Interconnect PCB (Other End Use Industries) Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 24: Global: High-Density Interconnect PCB (Other End Use Industries) Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 25: North America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 26: North America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 27: United States: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 28: United States: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 29: Canada: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 30: Canada: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 31: Asia-Pacific: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 32: Asia-Pacific: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 33: China: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 34: China: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 35: Japan: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 36: Japan: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 37: India: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 38: India: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 39: South Korea: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 40: South Korea: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 41: Australia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 42: Australia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 43: Indonesia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 44: Indonesia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 45: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 46: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 47: Europe: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 48: Europe: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 49: Germany: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 50: Germany: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 51: France: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 52: France: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 53: United Kingdom: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 54: United Kingdom: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 55: Italy: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 56: Italy: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 57: Spain: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 58: Spain: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 59: Russia: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 60: Russia: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 61: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 62: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 63: Latin America: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 64: Latin America: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 65: Brazil: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 66: Brazil: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 67: Mexico: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 68: Mexico: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 69: Others: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 70: Others: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 71: Middle East and Africa: High-Density Interconnect PCB Market: Sales Value (in Million US$), 2017 & 2022
  • Figure 72: Middle East and Africa: High-Density Interconnect PCB Market: Breakup by Country (in %), 2022
  • Figure 73: Middle East and Africa: High-Density Interconnect PCB Market Forecast: Sales Value (in Million US$), 2023-2028
  • Figure 74: Global: High-Density Interconnect PCB Industry: SWOT Analysis
  • Figure 75: Global: High-Density Interconnect PCB Industry: Value Chain Analysis
  • Figure 76: Global: High-Density Interconnect PCB Industry: Porter's Five Forces Analysis

List of Tables

  • Table 1: Global: High-Density Interconnect PCB Market: Key Industry Highlights, 2022 and 2028
  • Table 2: Global: High-Density Interconnect PCB Market Forecast: Breakup by Number of HDI Layer (in Million US$), 2023-2028
  • Table 3: Global: High-Density Interconnect PCB Market Forecast: Breakup by End Use Industry (in Million US$), 2023-2028
  • Table 4: Global: High-Density Interconnect PCB Market Forecast: Breakup by Region (in Million US$), 2023-2028
  • Table 5: Global: High-Density Interconnect PCB Market: Competitive Structure
  • Table 6: Global: High-Density Interconnect PCB Market: Key Players
目次
Product Code: SR1423A251_Report

Market Overview:

  • The global high-density interconnect (HDI) PCB market size reached US$ 8.2 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 11.5 Billion by 2028, exhibiting a growth rate (CAGR) of 5.5% during 2023-2028.
  • Interconnecting printed circuit boards (PCBs) with high-density interconnects (HDIs) are circuit boards having a better wiring density per unit than conventional circuit boards. With blind and buried vias, it contains micro-vias that are smaller in diameter and have a relatively greater pad density than conventional circuit boards while having a higher circuitry density than traditional counterparts. High-density PCB technology has allowed engineers an enhanced design freedom and flexibility, thus allowing them to place smaller and closer components, which reduces signal loss and crossing delays. An interconnect PCB with high density gives designers more surface area to work with. As a result, high-density interconnect PCBs deliver better signal quality and faster signal transmission.

High-Density Interconnect (HDI) PCB Market Trends:

  • The global market is primarily driven by the escalating product demand in numerous end-use industries, including telecommunication, consumer electronics, and automotive. This can be attributed to the rapid product utilization in various electronic devices like touch-screen devices, mobile phones, laptop computers, and digital cameras. In addition to this, the rising trend of electronic device miniaturization and the increasing demand for high-performance gadgets are also providing an impetus to the market. Besides this, the expanding medical expenditure resulting in a higher uptake of medical devices and equipment is also creating a positive outlook for the market. Furthermore, the augmenting production rates of electronic aircraft parts and components are acting as a significant growth-inducing factor for the market. Some of the other factors contributing to the market growth include the widespread adoption of sophisticated safety systems, the rising trend of autonomous driving, escalating sales of smart devices and gaming consoles, inflating disposable income levels and extensive research and development (R&D) activities.

Key Market Segmentation:

  • IMARC Group provides an analysis of the key trends in each sub-segment of the global high-density interconnect (HDI) PCB market report, along with forecasts at the global, regional and country level from 2023-2028. Our report has categorized the market based on number of HDI layer and end use industry.

Breakup by Number of HDI Layer:

  • 4-6 Layers HDI PCBs
  • 8-10 Layer HDI PCBs
  • 10+ Layer HDI PCBs

Breakup by End Use Industry:

  • Smartphones and Tablets
  • Computers
  • Telecom/Datacom
  • Consumer Electronics
  • Automotive
  • Others

Breakup by Region:

  • North America
  • United States
  • Canada
  • Asia-Pacific
  • China
  • Japan
  • India
  • South Korea
  • Australia
  • Indonesia
  • Others
  • Europe
  • Germany
  • France
  • United Kingdom
  • Italy
  • Spain
  • Russia
  • Others
  • Latin America
  • Brazil
  • Mexico
  • Others
  • Middle East and Africa

Competitive Landscape:

  • The competitive landscape of the industry has also been examined along with the profiles of the key players being AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Bittele Electronics Inc., Fineline Ltd., Meiko Electronics Co. Ltd., Millennium Circuits Limited, Mistral Solutions Pvt. Ltd., Shenzhen Kinwong Electronic Co. Ltd., Sierra Circuits, TTM Technologies Inc., Unimicron Technology Corporation (United Microelectronics Corporation), Unitech Printed Circuit Board Corp. and Wurth Elektronik GmbH & Co. KG.

Key Questions Answered in This Report:

  • How has the global high-density interconnect (HDI) PCB market performed so far and how will it perform in the coming years?
  • What has been the impact of COVID-19 on the global high-density interconnect (HDI) PCB market?
  • What are the key regional markets?
  • What is the breakup of the market based on the number of HDI layer?
  • What is the breakup of the market based on the end use industry?
  • What are the various stages in the value chain of the industry?
  • What are the key driving factors and challenges in the industry?
  • What is the structure of the global high-density interconnect (HDI) PCB market and who are the key players?
  • What is the degree of competition in the industry?

Table of Contents

1 Preface

2 Scope and Methodology

  • 2.1 Objectives of the Study
  • 2.2 Stakeholders
  • 2.3 Data Sources
    • 2.3.1 Primary Sources
    • 2.3.2 Secondary Sources
  • 2.4 Market Estimation
    • 2.4.1 Bottom-Up Approach
    • 2.4.2 Top-Down Approach
  • 2.5 Forecasting Methodology

3 Executive Summary

4 Introduction

  • 4.1 Overview
  • 4.2 Key Industry Trends

5 Global High-Density Interconnect (HDI) PCB Market

  • 5.1 Market Overview
  • 5.2 Market Performance
  • 5.3 Impact of COVID-19
  • 5.4 Market Forecast

6 Market Breakup by Number of HDI Layer

  • 6.1 4-6 Layers HDI PCBs
    • 6.1.1 Market Trends
    • 6.1.2 Market Forecast
  • 6.2 8-10 Layer HDI PCBs
    • 6.2.1 Market Trends
    • 6.2.2 Market Forecast
  • 6.3 10+ Layer HDI PCBs
    • 6.3.1 Market Trends
    • 6.3.2 Market Forecast

7 Market Breakup by End Use Industry

  • 7.1 Smartphones and Tablets
    • 7.1.1 Market Trends
    • 7.1.2 Market Forecast
  • 7.2 Computers
    • 7.2.1 Market Trends
    • 7.2.2 Market Forecast
  • 7.3 Telecom/Datacom
    • 7.3.1 Market Trends
    • 7.3.2 Market Forecast
  • 7.4 Consumer Electronics
    • 7.4.1 Market Trends
    • 7.4.2 Market Forecast
  • 7.5 Automotive
    • 7.5.1 Market Trends
    • 7.5.2 Market Forecast
  • 7.6 Others
    • 7.6.1 Market Trends
    • 7.6.2 Market Forecast

8 Market Breakup by Region

  • 8.1 North America
    • 8.1.1 United States
      • 8.1.1.1 Market Trends
      • 8.1.1.2 Market Forecast
    • 8.1.2 Canada
      • 8.1.2.1 Market Trends
      • 8.1.2.2 Market Forecast
  • 8.2 Asia-Pacific
    • 8.2.1 China
      • 8.2.1.1 Market Trends
      • 8.2.1.2 Market Forecast
    • 8.2.2 Japan
      • 8.2.2.1 Market Trends
      • 8.2.2.2 Market Forecast
    • 8.2.3 India
      • 8.2.3.1 Market Trends
      • 8.2.3.2 Market Forecast
    • 8.2.4 South Korea
      • 8.2.4.1 Market Trends
      • 8.2.4.2 Market Forecast
    • 8.2.5 Australia
      • 8.2.5.1 Market Trends
      • 8.2.5.2 Market Forecast
    • 8.2.6 Indonesia
      • 8.2.6.1 Market Trends
      • 8.2.6.2 Market Forecast
    • 8.2.7 Others
      • 8.2.7.1 Market Trends
      • 8.2.7.2 Market Forecast
  • 8.3 Europe
    • 8.3.1 Germany
      • 8.3.1.1 Market Trends
      • 8.3.1.2 Market Forecast
    • 8.3.2 France
      • 8.3.2.1 Market Trends
      • 8.3.2.2 Market Forecast
    • 8.3.3 United Kingdom
      • 8.3.3.1 Market Trends
      • 8.3.3.2 Market Forecast
    • 8.3.4 Italy
      • 8.3.4.1 Market Trends
      • 8.3.4.2 Market Forecast
    • 8.3.5 Spain
      • 8.3.5.1 Market Trends
      • 8.3.5.2 Market Forecast
    • 8.3.6 Russia
      • 8.3.6.1 Market Trends
      • 8.3.6.2 Market Forecast
    • 8.3.7 Others
      • 8.3.7.1 Market Trends
      • 8.3.7.2 Market Forecast
  • 8.4 Latin America
    • 8.4.1 Brazil
      • 8.4.1.1 Market Trends
      • 8.4.1.2 Market Forecast
    • 8.4.2 Mexico
      • 8.4.2.1 Market Trends
      • 8.4.2.2 Market Forecast
    • 8.4.3 Others
      • 8.4.3.1 Market Trends
      • 8.4.3.2 Market Forecast
  • 8.5 Middle East and Africa
    • 8.5.1 Market Trends
    • 8.5.2 Market Breakup by Country
    • 8.5.3 Market Forecast

9 SWOT Analysis

  • 9.1 Overview
  • 9.2 Strengths
  • 9.3 Weaknesses
  • 9.4 Opportunities
  • 9.5 Threats

10 Value Chain Analysis

11 Porters Five Forces Analysis

  • 11.1 Overview
  • 11.2 Bargaining Power of Buyers
  • 11.3 Bargaining Power of Suppliers
  • 11.4 Degree of Competition
  • 11.5 Threat of New Entrants
  • 11.6 Threat of Substitutes

12 Price Analysis

13 Competitive Landscape

  • 13.1 Market Structure
  • 13.2 Key Players
  • 13.3 Profiles of Key Players
    • 13.3.1 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
      • 13.3.1.1 Company Overview
      • 13.3.1.2 Product Portfolio
      • 13.3.1.3 Financials
    • 13.3.2 Bittele Electronics Inc.
      • 13.3.2.1 Company Overview
      • 13.3.2.2 Product Portfolio
    • 13.3.3 Fineline Ltd.
      • 13.3.3.1 Company Overview
      • 13.3.3.2 Product Portfolio
    • 13.3.4 Meiko Electronics Co. Ltd.
      • 13.3.4.1 Company Overview
      • 13.3.4.2 Product Portfolio
      • 13.3.4.3 Financials
    • 13.3.5 Millennium Circuits Limited
      • 13.3.5.1 Company Overview
      • 13.3.5.2 Product Portfolio
    • 13.3.6 Mistral Solutions Pvt. Ltd.
      • 13.3.6.1 Company Overview
      • 13.3.6.2 Product Portfolio
    • 13.3.7 Shenzhen Kinwong Electronic Co. Ltd.
      • 13.3.7.1 Company Overview
      • 13.3.7.2 Product Portfolio
      • 13.3.7.3 Financials
    • 13.3.8 Sierra Circuits
      • 13.3.8.1 Company Overview
      • 13.3.8.2 Product Portfolio
    • 13.3.9 TTM Technologies Inc.
      • 13.3.9.1 Company Overview
      • 13.3.9.2 Product Portfolio
      • 13.3.9.3 Financials
      • 13.3.9.4 SWOT Analysis
    • 13.3.10 Unimicron Technology Corporation (United Microelectronics Corporation)
      • 13.3.10.1 Company Overview
      • 13.3.10.2 Product Portfolio
      • 13.3.10.3 Financials
    • 13.3.11 Unitech Printed Circuit Board Corp.
      • 13.3.11.1 Company Overview
      • 13.3.11.2 Product Portfolio
      • 13.3.11.3 Financials
    • 13.3.12 Wurth Elektronik GmbH & Co. KG
      • 13.3.12.1 Company Overview
      • 13.3.12.2 Product Portfolio