ウエハー製造の世界市場

ウエハー製造の世界市場は2030年までに1,012億米ドルに到達

2024年に730億米ドルと推定されるウエハー製造の世界市場は、2024年から2030年にかけてCAGR 5.6%で成長し、2030年には1,012億米ドルに達すると予測されます。本レポートで分析したセグメントの一つである65nmは、CAGR6.5%を記録し、分析期間終了までに292億米ドルに達すると予想されます。45nmセグメントの成長率は、分析期間中CAGR 5.9%と推定されます。

米国市場は推定199億米ドル、中国はCAGR 9.0％で成長予測

米国のウエハー製造市場は、2024年に199億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに205億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは9.0%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ2.7%と5.6%と予測されています。欧州では、ドイツがCAGR 3.7%で成長すると予測されています。

世界のウエハー製造市場- 主要動向と促進要因のまとめ

ウエハー製造は現代の半導体イノベーションの基盤をどのように築いているのか？

ウエハー製造は半導体産業の要であり、スマートフォンやコンピュータから自動車や産業機械に至るまで、あらゆるものに電力を供給する集積回路やマイクロエレクトロニクスデバイスの作成において極めて重要な役割を果たしています。そのプロセスには、超クリーンな環境で行われる複数の複雑な工程が含まれ、シリコンウエハーがフォトリソグラフィー、エッチング、ドーピング、蒸着、メタライゼーションを通じて機能的なチップに生まれ変わる。各ウエハーには数千個のチップが含まれることがあり、製造時に要求される精度は、高い歩留まりと性能を確保するために非常に重要です。電子デバイスの小型化、高速化、エネルギー効率の向上に伴い、ウエハー製造技術は、ノードサイズの縮小とトランジスタ密度の向上という要求に応えるべく、常に進化し続けなければなりません。極端紫外線（EUV）のような高度なリソグラフィ技術は、現在、5ナノメートル以下の製造を可能にするために採用されており、メーカーがムーアの法則の限界を押し広げることを可能にしています。さらに、材料科学の革新は、高性能アプリケーション向けに優れた熱的・電気的特性を提供する炭化ケイ素（SiC）や窒化ガリウム（GaN）など、従来のシリコンウエハーに代わるものを導入しています。鋳造はまた、精度を高め、欠陥を減らし、全体的な生産性を向上させるために、自動化、AI主導のプロセス制御、スマート分析に多額の投資を行っています。その結果、ウエハー製造は単なる製造活動ではなく、複数の産業や世界経済における技術進歩を支える高度に戦略的なプロセスとなっています。

ウエハー製造プロセスに革命をもたらす技術的進歩とは？

ウエハー製造プロセスは、精度を高め、コストを削減し、生産サイクルを加速させることを目的とした一連の技術的進歩によって革命を起こしつつあります。最も革新的な開発の一つは、極端紫外線（EUV）リソグラフィーの統合です。これにより、メーカーは、前例のない精度で7ナノメートル以下の形状に回路を印刷することができます。この能力は、人工知能、5G、高性能コンピューティングに使用される高度なプロセッサの開発に不可欠です。EUVと並んで、原子層堆積（ALD）と化学的機械的平坦化（CMP）技術は、ウエハー製造中の層の均一性と完全性を向上させるために改良されています。装置メーカーも、深さ、角度、均一性をよりよく制御できる次世代エッチングシステムやイオン注入装置を導入しています。一方、炭化ケイ素や窒化ガリウム基板の使用が増加しており、特に高温性能が重要な自動車や航空宇宙産業で、パワーエレクトロニクスの応用範囲が拡大しています。機械学習によるスマート製造技術は、予知保全、歩留まり最適化、リアルタイムの工程調整を可能にし、ウエハー製造ラインをより効率的で弾力性のあるものにしています。さらに、クリーンルーム設計と汚染制御の進歩は、これまで以上に繊細でコンパクトなチップ構造の製造をサポートしています。これらの技術革新は、メーカーが消費者や産業界の需要に追いつくことを可能にするだけでなく、世界のデジタルトランスフォーメーションを促進する半導体のブレークスルーの次の波を後押ししています。

なぜ世界半導体大手は世界中でウエハー製造生産能力を拡大させているのか？

世界の半導体企業は、民生用電子機器、自動車システム、データセンター、そして人工知能やモノのインターネットなどの新興技術におけるチップの爆発的な需要に対応するため、ウエハー製造の生産能力を急速に拡大しています。世界経済のほぼすべての分野でデジタル化が進むにつれ、サプライチェーンにはかつてない圧力がかかり、既存の製造能力の脆弱性を露呈するチップ不足が発生しています。これに対応するため、大手鋳造メーカーや集積デバイスメーカーは、米国、欧州、台湾、韓国、中国などの地域で、ファブとも呼ばれる新しい製造工場に数十億米ドルを投資しています。こうした投資は、商業的な考慮だけでなく、政府がチップ生産の現地化とサプライチェーンの強靭性の確保を求める地政学的要因によっても推進されています。官民パートナーシップ、政府のインセンティブ、国家安全保障政策がこの拡大を加速させており、新しい施設はレガシー・ノード生産と最先端プロセス技術の両方に焦点を当てています。企業はまた、パワー半導体、車載グレードチップ、センサーに特化した工場を建設することで、技術力を多様化しています。300mmウエハープロセシングへの移行と、将来的にはさらに大きなウエハの導入により、スケールメリットが向上し、チップあたりの製造コストが削減されることが期待されます。さらに、人材格差に対処し、先端半導体製造のための持続可能なエコシステムを構築するために、人材開発と世界の協力の取り組みが開始されています。この世界のウエハー製造生産能力の急増は、単に短期的な不足に対する反応ではなく、現代世界のデジタルインフラを将来にわたって支えるための戦略的な取り組みです。

ウエハー製造業界の将来を形作る市場力と戦略動向とは？

ウエハー製造市場の成長は、市場力学、技術進化、官民双方の利害関係者による戦略的計画のミックスによってもたらされています。中心的な原動力の一つは、ウェアラブルヘルスモニターやスマートホームデバイスから自律走行車や量子コンピューティングシステムに至るまで、エレクトロニクスが生活のあらゆる面に統合されつつあることです。このような需要の爆発的増加には、多様なデバイス・アーキテクチャと性能仕様をサポートできる、堅牢でスケーラブルなウエハー製造インフラが必要です。市場を再形成するもう一つの動向は、産業環境における従来のITと運用技術の融合であり、これにより独自の熱特性や性能特性を持つカスタムチップに対する新たな需要が生まれています。また、環境の持続可能性も重要な検討事項として浮上しており、ファブでは有害物質を責任を持って管理しながら、水とエネルギーの消費量を削減するグリーン製造手法を採用するよう促しています。鋳造所、装置サプライヤー、大学、設計事務所間の戦略的コラボレーションは、技術革新を促進し、次世代チップの市場投入までの時間を短縮しています。知的財産の安全性、サプライチェーンの透明性、地域の自給自足は、競争が激しく地政学的に敏感な業界において、重要な差別化要因になりつつあります。さらに、ベンチャーキャピタルや政府からの資金提供は、3Dスタッキング、チップレット、フォトニックインテグレーションなどの画期的なウエハーレベルの技術を開発する新興企業や研究所にますます向けられるようになっています。これらの動向が相まって、ウエハー製造は半導体産業のみならず、世界のコネクティビティ、オートメーション、デジタルインテリジェンスの進歩に不可欠な、技術進歩の中心的な柱として位置づけられています。

セグメント

サイズ（65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm, 7 nm）;製造プロセス（Back End of Line Processing, Front End of Line Processing）;エンドユーザー（Integrated Device Manufacturer End-use, Foundry End-use, Memory End-use）

調査対象企業の例

• Applied Materials, Inc.
• ASML Holding N.V.
• Canon Inc.
• DB HiTek Co., Ltd.
• Fujitsu Semiconductor Limited
• GlobalFoundries Inc.
• Hua Hong Semiconductor Limited
• Infineon Technologies AG
• Intel Corporation
• KLA Corporation
• Lam Research Corporation
• Micron Technology, Inc.
• Nikon Corporation
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Semiconductor Manufacturing International Corporation（SMIC）
• SK hynix Inc.
• STMicroelectronics N.V.
• Taiwan Semiconductor Manufacturing Company（TSMC）
• Texas Instruments Incorporated

AIインテグレーション

当社は、有効な専門家向けコンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

• 市場概要
• 主要企業
• 市場動向と促進要因
• 世界市場の見通し

第3章 市場分析

• 米国
• カナダ
• 日本
• 中国
• 欧州
• フランス
• ドイツ
• イタリア
• 英国
• スペイン
• ロシア
• その他欧州
• アジア太平洋
• オーストラリア
• インド
• 韓国
• その他アジア太平洋地域
• ラテンアメリカ
• アルゼンチン
• ブラジル
• メキシコ
• その他ラテンアメリカ
• 中東
• イラン
• イスラエル
• サウジアラビア
• アラブ首長国連邦
• その他中東
• アフリカ

第4章 競合

Global Wafer Fabrication Market to Reach US$101.2 Billion by 2030

The global market for Wafer Fabrication estimated at US$73.0 Billion in the year 2024, is expected to reach US$101.2 Billion by 2030, growing at a CAGR of 5.6% over the analysis period 2024-2030. 65 nm, one of the segments analyzed in the report, is expected to record a 6.5% CAGR and reach US$29.2 Billion by the end of the analysis period. Growth in the 45 nm segment is estimated at 5.9% CAGR over the analysis period.

The U.S. Market is Estimated at US$19.9 Billion While China is Forecast to Grow at 9.0% CAGR

The Wafer Fabrication market in the U.S. is estimated at US$19.9 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$20.5 Billion by the year 2030 trailing a CAGR of 9.0% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.7% and 5.6% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 3.7% CAGR.

Global Wafer Fabrication Market - Key Trends & Drivers Summarized

How Is Wafer Fabrication Laying the Foundation for Modern Semiconductor Innovation?

Wafer fabrication is the cornerstone of the semiconductor industry, playing a pivotal role in the creation of integrated circuits and microelectronic devices that power everything from smartphones and computers to automobiles and industrial machinery. The process involves multiple complex steps carried out in ultra-clean environments, where silicon wafers are transformed into functional chips through photolithography, etching, doping, deposition, and metallization. Each wafer can contain thousands of individual chips, and the precision required during fabrication is critical to ensure high yield and performance. As electronic devices become smaller, faster, and more energy-efficient, wafer fabrication techniques must continually evolve to meet the demands of shrinking node sizes and increased transistor density. Advanced lithography technologies such as extreme ultraviolet (EUV) are now being adopted to enable sub-5-nanometer production, allowing manufacturers to push the limits of Moore's Law. Additionally, innovations in materials science are introducing alternatives to traditional silicon wafers, including silicon carbide (SiC) and gallium nitride (GaN), which offer better thermal and electrical properties for high-performance applications. Foundries are also investing heavily in automation, AI-driven process control, and smart analytics to enhance precision, reduce defects, and improve overall productivity. As a result, wafer fabrication is not just a manufacturing activity but a highly strategic process that underpins technological advancement across multiple industries and global economies.

What Technological Advancements Are Revolutionizing the Wafer Fabrication Process?

The wafer fabrication process is being revolutionized by a series of technological advancements that aim to increase precision, reduce costs, and accelerate production cycles. One of the most transformative developments is the integration of extreme ultraviolet (EUV) lithography, which enables manufacturers to print circuits at sub-7-nanometer geometries with unprecedented accuracy. This capability is essential for developing advanced processors used in artificial intelligence, 5G, and high-performance computing. Alongside EUV, atomic layer deposition (ALD) and chemical mechanical planarization (CMP) techniques are being refined to improve the uniformity and integrity of layers during wafer construction. Equipment manufacturers are also introducing next-generation etching systems and ion implantation tools that offer better control over depth, angle, and uniformity. Meanwhile, the increasing use of silicon carbide and gallium nitride substrates is expanding the range of applications for power electronics, especially in automotive and aerospace industries where high-temperature performance is critical. Smart manufacturing technologies powered by machine learning are enabling predictive maintenance, yield optimization, and real-time process adjustments, making wafer fabrication lines more efficient and resilient. Additionally, advances in cleanroom design and contamination control are supporting the production of ever more delicate and compact chip structures. These innovations are not only enabling manufacturers to keep pace with consumer and industrial demands but are also driving the next wave of semiconductor breakthroughs that will fuel global digital transformation.

Why Are Global Semiconductor Giants Scaling Up Wafer Fabrication Capacity Worldwide?

Global semiconductor companies are rapidly scaling up wafer fabrication capacity to meet the explosive demand for chips across consumer electronics, automotive systems, data centers, and emerging technologies such as artificial intelligence and the Internet of Things. The increasing digitization of nearly every sector of the global economy has created unprecedented pressure on supply chains, leading to chip shortages that have exposed vulnerabilities in existing manufacturing capacity. In response, leading foundries and integrated device manufacturers are investing billions of dollars in new fabrication plants, also known as fabs, in regions such as the United States, Europe, Taiwan, South Korea, and China. These investments are being driven not only by commercial considerations but also by geopolitical factors, as governments seek to localize chip production and ensure supply chain resilience. Public-private partnerships, government incentives, and national security policies are accelerating this expansion, with new facilities focusing on both legacy node production and cutting-edge process technologies. Companies are also diversifying their technological capabilities by building specialized fabs for power semiconductors, automotive-grade chips, and sensors. The move toward 300mm wafer processing and the introduction of even larger wafers in the future are expected to improve economies of scale and reduce per-chip manufacturing costs. Moreover, workforce development and global collaboration efforts are being launched to address the talent gap and create a sustainable ecosystem for advanced semiconductor manufacturing. This global surge in wafer fabrication capacity is not just a reaction to short-term shortages but a strategic initiative to future-proof the digital infrastructure of the modern world.

What Market Forces and Strategic Trends Are Shaping the Future of the Wafer Fabrication Industry?

The growth in the wafer fabrication market is being driven by a mix of market dynamics, technological evolution, and strategic planning by both public and private stakeholders. One of the central forces is the rising integration of electronics into every facet of life, from wearable health monitors and smart home devices to autonomous vehicles and quantum computing systems. This explosion in demand requires a robust and scalable wafer production infrastructure capable of supporting diverse device architectures and performance specifications. Another trend reshaping the market is the convergence of traditional IT with operational technologies in industrial environments, which is creating new demand for custom chips with unique thermal and performance characteristics. Environmental sustainability is also emerging as a key consideration, prompting fabs to adopt green manufacturing practices that reduce water and energy consumption while managing hazardous materials responsibly. Strategic collaborations between foundries, equipment suppliers, universities, and design firms are fostering innovation and accelerating time to market for next-generation chips. Intellectual property security, supply chain transparency, and regional self-sufficiency are becoming critical differentiators in a highly competitive and geopolitically sensitive industry. Additionally, venture capital and government funding are increasingly directed toward startups and research labs developing breakthrough wafer-level technologies such as 3D stacking, chiplets, and photonic integration. These combined trends are positioning wafer fabrication as a central pillar of technological progress, essential not just for the semiconductor industry but for the advancement of global connectivity, automation, and digital intelligence.

SCOPE OF STUDY:

The report analyzes the Wafer Fabrication market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Size (65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm, 7 nm); Fabrication Process (Back End of Line Processing, Front End of Line Processing); End-Use (Integrated Device Manufacturer End-Use, Foundry End-Use, Memory End-Use)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 42 Featured) -

• Applied Materials, Inc.
• ASML Holding N.V.
• Canon Inc.
• DB HiTek Co., Ltd.
• Fujitsu Semiconductor Limited
• GlobalFoundries Inc.
• Hua Hong Semiconductor Limited
• Infineon Technologies AG
• Intel Corporation
• KLA Corporation
• Lam Research Corporation
• Micron Technology, Inc.
• Nikon Corporation
• Renesas Electronics Corporation
• Samsung Electronics Co., Ltd.
• Semiconductor Manufacturing International Corporation (SMIC)
• SK hynix Inc.
• STMicroelectronics N.V.
• Taiwan Semiconductor Manufacturing Company (TSMC)
• Texas Instruments Incorporated

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TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

• 1. MARKET OVERVIEW
  • Influencer Market Insights
  • World Market Trajectories
  • Tariff Impact on Global Supply Chain Patterns
  • Wafer Fabrication - Global Key Competitors Percentage Market Share in 2025 (E)
  • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
• 2. FOCUS ON SELECT PLAYERS
• 3. MARKET TRENDS & DRIVERS
  • Global Semiconductor Demand Surge Throws the Spotlight on Wafer Fabrication Capacity Constraints
  • Proliferation of Advanced Nodes Drives Investment in Sub Ten Nanometer Process Technologies
  • How AI and HPC Applications Are Accelerating Development of High Performance Logic Wafers
  • National Security and Tech Sovereignty Agendas Propel Onshoring of Fab Facilities Across Key Regions
  • Push for Automotive Grade Semiconductors Strengthens the Case for 300mm Wafer Process Optimization
  • Rising Costs of Lithography and EUV Integration Influence Strategic Fab Partnership Models
  • Here's How Chiplet Architectures and Heterogeneous Integration Are Reshaping Fabrication Requirements
  • Emergence of Gallium Nitride and Silicon Carbide Expands the Scope of Compound Semiconductor Fabs
  • Sustainability Pressures in Manufacturing Drive Adoption of Energy Efficient and Low Waste Fab Processes
  • Growth in IoT and Edge Devices Increases Demand for Mature Node and Mixed Signal Wafer Production
  • Talent Shortages in Engineering and Cleanroom Operations Challenge Scaling Efforts in New Fab Projects
  • Geopolitical Tensions and Export Controls Shape Global Investment Strategies in Fab Location and Equipment Sourcing
• 4. GLOBAL MARKET PERSPECTIVE
  • TABLE 1: World Wafer Fabrication Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
  • TABLE 2: World Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 3: World Historic Review for Wafer Fabrication by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 4: World 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2014, 2025 & 2030
  • TABLE 5: World Recent Past, Current & Future Analysis for 65 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 6: World Historic Review for 65 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 7: World 16-Year Perspective for 65 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 8: World Recent Past, Current & Future Analysis for 45 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 9: World Historic Review for 45 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 10: World 16-Year Perspective for 45 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 11: World Recent Past, Current & Future Analysis for 32 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 12: World Historic Review for 32 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 13: World 16-Year Perspective for 32 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 14: World Recent Past, Current & Future Analysis for 22 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 15: World Historic Review for 22 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 16: World 16-Year Perspective for 22 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 17: World Recent Past, Current & Future Analysis for 14 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 18: World Historic Review for 14 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 19: World 16-Year Perspective for 14 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 20: World Recent Past, Current & Future Analysis for 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 21: World Historic Review for 10 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 22: World 16-Year Perspective for 10 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 23: World Recent Past, Current & Future Analysis for 7 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 24: World Historic Review for 7 nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 25: World 16-Year Perspective for 7 nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 26: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 27: World Historic Review for Integrated Device Manufacturer End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 28: World 16-Year Perspective for Integrated Device Manufacturer End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 29: World Recent Past, Current & Future Analysis for Foundry End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 30: World Historic Review for Foundry End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 31: World 16-Year Perspective for Foundry End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 32: World Recent Past, Current & Future Analysis for Memory End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 33: World Historic Review for Memory End-Use by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 34: World 16-Year Perspective for Memory End-Use by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 35: World Recent Past, Current & Future Analysis for Back End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 36: World Historic Review for Back End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 37: World 16-Year Perspective for Back End of Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030
  • TABLE 38: World Recent Past, Current & Future Analysis for Front End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 39: World Historic Review for Front End of Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 40: World 16-Year Perspective for Front End of Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2014, 2025 & 2030

III. MARKET ANALYSIS

• UNITED STATES
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
  • TABLE 41: USA Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 42: USA Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 43: USA 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 44: USA Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 45: USA Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 46: USA 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 47: USA Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 48: USA Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 49: USA 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• CANADA
  • TABLE 50: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 51: Canada Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 52: Canada 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 53: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 54: Canada Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 55: Canada 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 56: Canada Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 57: Canada Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 58: Canada 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• JAPAN
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
  • TABLE 59: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 60: Japan Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 61: Japan 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 62: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 63: Japan Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 64: Japan 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 65: Japan Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 66: Japan Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 67: Japan 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• CHINA
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
  • TABLE 68: China Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 69: China Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 70: China 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 71: China Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 72: China Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 73: China 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 74: China Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 75: China Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 76: China 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• EUROPE
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
  • TABLE 77: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 78: Europe Historic Review for Wafer Fabrication by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 79: Europe 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2014, 2025 & 2030
  • TABLE 80: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 81: Europe Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 82: Europe 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 83: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 84: Europe Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 85: Europe 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 86: Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 87: Europe Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 88: Europe 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• FRANCE
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
  • TABLE 89: France Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 90: France Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 91: France 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 92: France Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 93: France Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 94: France 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 95: France Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 96: France Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 97: France 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• GERMANY
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
  • TABLE 98: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 99: Germany Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 100: Germany 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 101: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 102: Germany Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 103: Germany 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 104: Germany Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 105: Germany Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 106: Germany 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• ITALY
  • TABLE 107: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 108: Italy Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 109: Italy 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 110: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 111: Italy Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 112: Italy 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 113: Italy Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 114: Italy Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 115: Italy 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• UNITED KINGDOM
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
  • TABLE 116: UK Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 117: UK Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 118: UK 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 119: UK Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 120: UK Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 121: UK 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 122: UK Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 123: UK Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 124: UK 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• SPAIN
  • TABLE 125: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 126: Spain Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 127: Spain 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 128: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 129: Spain Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 130: Spain 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 131: Spain Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 132: Spain Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 133: Spain 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• RUSSIA
  • TABLE 134: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 135: Russia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 136: Russia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 137: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 138: Russia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 139: Russia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 140: Russia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 141: Russia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 142: Russia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• REST OF EUROPE
  • TABLE 143: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 144: Rest of Europe Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 145: Rest of Europe 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 146: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 147: Rest of Europe Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 148: Rest of Europe 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 149: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 150: Rest of Europe Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 151: Rest of Europe 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• ASIA-PACIFIC
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
  • TABLE 152: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 153: Asia-Pacific Historic Review for Wafer Fabrication by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 154: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2014, 2025 & 2030
  • TABLE 155: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 156: Asia-Pacific Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 157: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 158: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 159: Asia-Pacific Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 160: Asia-Pacific 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 161: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 162: Asia-Pacific Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 163: Asia-Pacific 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• AUSTRALIA
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
  • TABLE 164: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 165: Australia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 166: Australia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 167: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 168: Australia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 169: Australia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 170: Australia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 171: Australia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 172: Australia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• INDIA
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
  • TABLE 173: India Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 174: India Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 175: India 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 176: India Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 177: India Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 178: India 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 179: India Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 180: India Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 181: India 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• SOUTH KOREA
  • TABLE 182: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 183: South Korea Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 184: South Korea 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 185: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 186: South Korea Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 187: South Korea 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 188: South Korea Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 189: South Korea Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 190: South Korea 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• REST OF ASIA-PACIFIC
  • TABLE 191: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 192: Rest of Asia-Pacific Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 193: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 194: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 195: Rest of Asia-Pacific Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 196: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 197: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 198: Rest of Asia-Pacific Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 199: Rest of Asia-Pacific 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• LATIN AMERICA
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
  • TABLE 200: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 201: Latin America Historic Review for Wafer Fabrication by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 202: Latin America 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2014, 2025 & 2030
  • TABLE 203: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 204: Latin America Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 205: Latin America 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 206: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 207: Latin America Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 208: Latin America 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 209: Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 210: Latin America Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 211: Latin America 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• ARGENTINA
  • TABLE 212: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 213: Argentina Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 214: Argentina 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 215: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 216: Argentina Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 217: Argentina 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 218: Argentina Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 219: Argentina Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 220: Argentina 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• BRAZIL
  • TABLE 221: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 222: Brazil Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 223: Brazil 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 224: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 225: Brazil Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 226: Brazil 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 227: Brazil Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 228: Brazil Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 229: Brazil 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• MEXICO
  • TABLE 230: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 231: Mexico Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 232: Mexico 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 233: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 234: Mexico Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 235: Mexico 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 236: Mexico Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 237: Mexico Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 238: Mexico 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• REST OF LATIN AMERICA
  • TABLE 239: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 240: Rest of Latin America Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 241: Rest of Latin America 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 242: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 243: Rest of Latin America Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 244: Rest of Latin America 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 245: Rest of Latin America Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 246: Rest of Latin America Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 247: Rest of Latin America 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• MIDDLE EAST
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
  • TABLE 248: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
  • TABLE 249: Middle East Historic Review for Wafer Fabrication by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 250: Middle East 16-Year Perspective for Wafer Fabrication by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2014, 2025 & 2030
  • TABLE 251: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 252: Middle East Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 253: Middle East 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 254: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 255: Middle East Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 256: Middle East 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 257: Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 258: Middle East Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 259: Middle East 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• IRAN
  • TABLE 260: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 261: Iran Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 262: Iran 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 263: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 264: Iran Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 265: Iran 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 266: Iran Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 267: Iran Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 268: Iran 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• ISRAEL
  • TABLE 269: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 270: Israel Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 271: Israel 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 272: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 273: Israel Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 274: Israel 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 275: Israel Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 276: Israel Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 277: Israel 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• SAUDI ARABIA
  • TABLE 278: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 279: Saudi Arabia Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 280: Saudi Arabia 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 281: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 282: Saudi Arabia Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 283: Saudi Arabia 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 284: Saudi Arabia Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 285: Saudi Arabia Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 286: Saudi Arabia 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• UNITED ARAB EMIRATES
  • TABLE 287: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 288: UAE Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 289: UAE 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 290: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 291: UAE Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 292: UAE 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 293: UAE Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 294: UAE Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 295: UAE 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• REST OF MIDDLE EAST
  • TABLE 296: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 297: Rest of Middle East Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 298: Rest of Middle East 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 299: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 300: Rest of Middle East Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 301: Rest of Middle East 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 302: Rest of Middle East Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 303: Rest of Middle East Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 304: Rest of Middle East 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030
• AFRICA
  • Wafer Fabrication Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
  • TABLE 305: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 306: Africa Historic Review for Wafer Fabrication by Size - 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 307: Africa 16-Year Perspective for Wafer Fabrication by Size - Percentage Breakdown of Value Sales for 65 nm, 45 nm, 32 nm, 22 nm, 14 nm, 10 nm and 7 nm for the Years 2014, 2025 & 2030
  • TABLE 308: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 309: Africa Historic Review for Wafer Fabrication by End-Use - Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 310: Africa 16-Year Perspective for Wafer Fabrication by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer End-Use, Foundry End-Use and Memory End-Use for the Years 2014, 2025 & 2030
  • TABLE 311: Africa Recent Past, Current & Future Analysis for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
  • TABLE 312: Africa Historic Review for Wafer Fabrication by Fabrication Process - Back End of Line Processing and Front End of Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2023 and % CAGR
  • TABLE 313: Africa 16-Year Perspective for Wafer Fabrication by Fabrication Process - Percentage Breakdown of Value Sales for Back End of Line Processing and Front End of Line Processing for the Years 2014, 2025 & 2030

IV. COMPETITION