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ウエハーファブ装置の世界市場

Wafer Fab Equipment

出版日
ページ情報
英文 233 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=147.66円
ウエハーファブ装置の世界市場
出版日: 2025年06月27日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 233 Pages
納期: 即日から翌営業日
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概要

ウエハーファブ装置の世界市場は2030年までに744億米ドルに達する見込み

2024年に646億米ドルと推定されるウエハーファブ装置の世界市場は、2024年から2030年にかけてCAGR 2.4%で成長し、2030年には744億米ドルに達すると予測されます。本レポートで分析したセグメントの1つであるFront-End-of-Line Processingは、CAGR 1.9%を記録し、分析期間終了時には479億米ドルに達すると予測されます。バックエンド・オブ・ライン処理セグメントの成長率は、分析期間中CAGR 3.4%と推定されます。

米国市場は推定170億米ドル、中国はCAGR2.3％で成長予測

米国のウエハーファブ装置市場は2024年に170億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに120億米ドルの市場規模に達すると予測され、分析期間2024-2030年のCAGRは2.3%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ2.2%と1.9%と予測されています。欧州では、ドイツがCAGR 2.0%で成長すると予測されています。

世界の「ウエハーファブ装置」市場- 主要動向と促進要因のまとめ

なぜウエハーファブ装置が世界半導体ブームの中核なのか？

世界経済のデジタル化が進むにつれ、ウエハー製造（ファブ）装置は、現存するほぼすべての電子機器に電力を供給する半導体の生産の中心的役割を担うようになりました。スマートフォンやノートパソコンから電気自動車やデータセンターまで、半導体の需要は高まっているだけでなく、加速しています。フォトリソグラフィ、蒸着、エッチング、イオン注入、洗浄などの工程に使用される機械を含むウエハーファブ装置は、集積回路（IC）製造の基盤となっています。これらの精密ツールにより、メーカーはシリコンウエハーをナノメートル単位で操作し、チップの性能、効率、小型化を実現しています。5G、人工知能（AI）、モノのインターネット（IoT）、高性能コンピューティング（HPC）といった技術の爆発的な普及は、半導体のサプライチェーンに大きな圧力をかけ、鋳造所や集積デバイスメーカー（IDM）に生産能力の急速な拡大と最先端装置の採用を促しています。さらに、最近の世界の危機によって露呈した地政学的なシフトと供給の脆弱性は、特に米国、欧州、東アジアにおける国内チップ生産への大幅な政府投資につながっており、先端ファブ装置への需要をさらに押し上げています。その結果、この分野は成長しているだけでなく、現代の技術進歩のバックボーンになりつつあります。

技術ノードとプロセスの複雑性は、装置イノベーションにどのような影響を与えているか？

より小さく、より速く、より効率的なチップへの絶え間ない進撃は、ウエハーファブ装置テクノロジーに驚異的な進化を促しています。業界が7nm、5nm、さらには3nmプロセスノード以下に移行するにつれ、半導体製造の複雑さは指数関数的に増大しています。最先端の製造には、極小の特徴を比類のない精度でパターニングできる極端紫外線（EUV）リソグラフィ・システムが必要です。ASML、アプライドマテリアルズ、東京エレクトロン、ラムリサーチなどの企業は、これらのノードのユニークな要求を満たすことができる成膜、エッチング、および計測のための次世代ツールの開発の最前線にいます。トランジスタ密度の増加、3Dチップ積層、ゲートオールアラウンド（GAA）トランジスタアーキテクチャは、装置メーカーに新しい材料と原子レベルの処理技術の開発を促しています。さらに、ばらつきがより重要になるにつれて、歩留まりを最適化し、異常を検出するために、リアルタイムのデータ分析とAI主導の制御システムがファブツールに統合されつつあります。これにより、装置はもはや単なるハードウェアではなく、デジタル接続され、自己修正するエコシステムの一部となる「スマート・ファブ」が誕生しています。エネルギー効率、汚染管理、持続可能性も、ファブの規模と複雑さが増すにつれて、設計上の重要な優先事項となってきています。要するに、最新のチップの洗練度は、それを製造するために使用されるツールの技術革新によって直接反映されるのです。

ウエハー製造インフラへの世界的投資はどこに集中しているか？

ウエハーファブ装置への世界の投資は、半導体生産を支配し、技術的な自給自足に投資している地域に大きく集中しています。台湾、韓国、中国、そして日本がファブ建設と装置輸入でリードしています。台湾のTSMC、韓国のサムスン、中国のSMICは、先端ノード製造とレガシーノード製造の両方に数十億米ドル規模の投資を行っており、あらゆるカテゴリーのファブ装置に対する安定した需要パイプラインを確保しています。米国は、地政学的緊張とサプライチェーンリスクに対応するため、CHIPS法や科学法などの法律を通じて、国内製造業を活性化させるための多額の補助金を開始しています。Intel、GlobalFoundriesなど米国を拠点とする企業は、積極的なスケジュールで新施設を建設しており、装置需要をさらに押し上げています。欧州もまた、2030年までに世界のチップ生産シェアを倍増させることを目指し、欧州チップ法のような取り組みを通じて半導体への意欲を高めています。さらに、東南アジアはバックエンドプロセスと装置サービスの戦略的ハブとして台頭しており、インドは将来の半導体製造拠点となるべく積極的な投資誘致を行っています。この投資の波は、単にチップを生産するだけでなく、ウエハーレベルでの生産手段をコントロールするための世界の競争を反映しています。

ウエハーファブ装置市場の成長にはいくつかの要因がある...

ウエハーファブ装置市場の成長は、半導体技術の進歩、各地域の生産能力拡大、エンドユーザー要件の進化に関連するいくつかの要因によって牽引されています。最も大きな原動力の1つは、先端ノード（5nm以下）への推進であり、より微細な形状や複雑なトランジスタ構造を扱うために、高度に専門化されたリソグラフィ、成膜、エッチング装置が必要となります。AI、5G、エッジコンピューティング、自律システムの普及は、高性能で低消費電力のチップの必要性を煽り、最先端装置の対応可能な市場を拡大しています。これと並行して、自動車、産業、IoT分野からの需要により、レガシーノードの製造は堅調を維持しており、成熟したプロセスツールの成長も保証されています。米国、EU、韓国、中国を中心とする地域的な投資優遇措置は、工場建設を刺激し、技術ノード全体の装置の大量購入を促進しています。さらに、チップレットアーキテクチャと異種集積への移行が、先進パッケージング装置とプロセス固有の技術革新に対する需要に拍車をかけています。AI、機械学習、ビッグデータの統合を通じたファブ運用におけるハードウェアとソフトウェアの融合も、装置ベンダーに新たなバリューチェーンとサービス機会を生み出しています。シリコンに対する世界の需要が急増し続ける中、ウエハーファブ装置は半導体エコシステムの柱として不可欠であり、拡大を続けています。

セグメント

製造プロセス（フロントエンド・オブ・ライン・プロセッシング、バックエンド・オブ・ライン・プロセッシング）、ノードサイズ（7nm以下、10nm、14nm、22nm、65nm以上）、最終用途（鋳造、メモリ、集積デバイスメーカー、その他の最終用途）

調査対象企業の例（計44社）

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International N.V.
  • ASML Holding N.V.
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group（EVG）
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited（TEL）
  • ULVAC, Inc.
  • Veeco Instruments Inc.

AIインテグレーション

当社は、有効な専門家向けコンテンツとAIツールにより、市場情報と競合情報を変革しています。

Global Industry Analystsは、LLMや業界固有のSLMを照会する一般的な規範に従う代わりに、ビデオ記録、ブログ、検索エンジン調査、膨大な量の企業、製品/サービス、市場データなど、世界中の専門家から収集したコンテンツのリポジトリを構築しました。

関税影響係数

Global Industry Analystsは、本社の国、製造拠点、輸出入（完成品とOEM）に基づく企業の競争力の変化を予測しています。この複雑で多面的な市場力学は、売上原価（COGS）の増加、収益性の低下、サプライチェーンの再構築など、ミクロおよびマクロの市場力学の中でも特に競合他社に影響を与える見込みです。

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP35992

Global Wafer Fab Equipment Market to Reach US$74.4 Billion by 2030

The global market for Wafer Fab Equipment estimated at US$64.6 Billion in the year 2024, is expected to reach US$74.4 Billion by 2030, growing at a CAGR of 2.4% over the analysis period 2024-2030. Front-End-of-Line Processing, one of the segments analyzed in the report, is expected to record a 1.9% CAGR and reach US$47.9 Billion by the end of the analysis period. Growth in the Back-End-of-Line Processing segment is estimated at 3.4% CAGR over the analysis period.

The U.S. Market is Estimated at US$17.0 Billion While China is Forecast to Grow at 2.3% CAGR

The Wafer Fab Equipment market in the U.S. is estimated at US$17.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$12.0 Billion by the year 2030 trailing a CAGR of 2.3% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 2.2% and 1.9% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 2.0% CAGR.

Global "Wafer Fab Equipment" Market - Key Trends & Drivers Summarized

Why Is Wafer Fab Equipment at the Core of the Global Semiconductor Boom?

As the global economy becomes increasingly digitized, wafer fabrication (fab) equipment has taken center stage in the production of semiconductors that power virtually every electronic device in existence. From smartphones and laptops to electric vehicles and data centers, the demand for semiconductors is not only rising-it’s accelerating. Wafer fab equipment, which includes machinery used for processes such as photolithography, deposition, etching, ion implantation, and cleaning, is foundational to the manufacture of integrated circuits (ICs). These precision tools enable manufacturers to manipulate silicon wafers at the nanometer scale, ensuring the performance, efficiency, and miniaturization of chips. The explosion of technologies like 5G, artificial intelligence (AI), Internet of Things (IoT), and high-performance computing (HPC) has put enormous pressure on semiconductor supply chains, pushing foundries and integrated device manufacturers (IDMs) to rapidly expand capacity and adopt cutting-edge equipment. Moreover, geopolitical shifts and supply vulnerabilities exposed by recent global crises have led to substantial government investments in domestic chip production-particularly in the U.S., Europe, and East Asia-further boosting demand for advanced fab equipment. As a result, this segment is not just growing-it’s becoming the backbone of modern technological progress.

How Are Technology Nodes and Process Complexity Influencing Equipment Innovation?

The relentless march toward smaller, faster, and more efficient chips is driving an extraordinary evolution in wafer fab equipment technology. As the industry moves below the 7nm, 5nm, and even 3nm process nodes, the complexity of semiconductor manufacturing has grown exponentially. Leading-edge fabrication now requires extreme ultraviolet (EUV) lithography systems capable of patterning minuscule features with unparalleled precision. Companies like ASML, Applied Materials, Tokyo Electron, and Lam Research are at the forefront of developing next-gen tools for deposition, etching, and metrology that can meet the unique demands of these nodes. Increasing transistor density, 3D chip stacking, and gate-all-around (GAA) transistor architecture are pushing equipment makers to develop new materials and atomic-level processing techniques. Additionally, as variability becomes more critical, real-time data analytics and AI-driven control systems are being integrated into fab tools to optimize yield and detect anomalies. This has given rise to “smart fabs” where equipment is no longer just hardware, but part of a digitally connected, self-correcting ecosystem. Energy efficiency, contamination control, and sustainability are also becoming key design priorities as fabs grow in size and complexity. In essence, the sophistication of modern chips is directly mirrored by the innovation in the tools used to produce them.

Where Is the Global Investment in Wafer Fabrication Infrastructure Concentrated?

Global investment in wafer fab equipment is largely concentrated in regions that dominate semiconductor production and are investing in technological self-sufficiency. East Asia remains the powerhouse of the semiconductor world, with Taiwan, South Korea, China, and Japan leading the way in fab construction and equipment imports. Taiwan’s TSMC, South Korea’s Samsung, and China’s SMIC are making multi-billion-dollar investments in both advanced and legacy node manufacturing, ensuring a steady demand pipeline for all categories of fab equipment. The United States, in response to geopolitical tensions and supply chain risks, has initiated substantial subsidies through legislation such as the CHIPS and Science Act to spur domestic manufacturing. Intel, GlobalFoundries, and other U.S.-based players are constructing new facilities with aggressive timelines, further bolstering equipment demand. Europe, too, is ramping up its semiconductor ambitions through initiatives like the European Chips Act, aiming to double its share of global chip production by 2030. Additionally, Southeast Asia is emerging as a strategic hub for backend processes and equipment servicing, while India is actively courting investments to become a future semiconductor manufacturing base. This wave of investment reflects a global race not just to produce chips-but to control the means of production at the wafer level.

The Growth in the Wafer Fab Equipment Market Is Driven by Several Factors…

The growth in the wafer fab equipment market is driven by several factors linked to semiconductor technology advancements, regional capacity expansion, and evolving end-user requirements. One of the foremost drivers is the push toward advanced nodes (5nm and below), which necessitate highly specialized lithography, deposition, and etch equipment to handle smaller geometries and complex transistor structures. The proliferation of AI, 5G, edge computing, and autonomous systems is fueling the need for high-performance, low-power chips-thereby expanding the addressable market for leading-edge equipment. In parallel, legacy node manufacturing remains robust due to demand from automotive, industrial, and IoT sectors, ensuring growth in mature process tools as well. Regional investment incentives, particularly from the U.S., EU, South Korea, and China, are stimulating fab construction and driving bulk purchases of equipment across technology nodes. Additionally, the move toward chiplet architectures and heterogeneous integration is spurring demand for advanced packaging equipment and process-specific innovation. The convergence of hardware and software in fab operations-through the integration of AI, machine learning, and big data-has also created new value chains and service opportunities for equipment vendors. As the global appetite for silicon continues to surge, wafer fab equipment remains an essential and expanding pillar of the semiconductor ecosystem.

SCOPE OF STUDY:

The report analyzes the Wafer Fab Equipment market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Fabrication Process (Front-End-of-Line Processing, Back-End-of-Line Processing); Node Size (7 Nm & Below, 10 Nm, 14 Nm, 22 Nm, 65 Nm & Above); End-Use (Foundry, Memory, Integrated Device Manufacturer, Other End-Uses)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; and Rest of Europe); Asia-Pacific; Rest of World.

Select Competitors (Total 44 Featured) -

  • Advantest Corporation
  • Applied Materials, Inc.
  • ASM International N.V.
  • ASML Holding N.V.
  • Brooks Automation, Inc.
  • Canon Inc.
  • Dainippon Screen Mfg. Co., Ltd.
  • Ebara Corporation
  • EV Group (EVG)
  • Hitachi High-Tech Corporation
  • KLA Corporation
  • Lam Research Corporation
  • Nikon Corporation
  • Plasma-Therm LLC
  • Rudolph Technologies, Inc.
  • SUSS MicroTec SE
  • Teradyne, Inc.
  • Tokyo Electron Limited (TEL)
  • ULVAC, Inc.
  • Veeco Instruments Inc.

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Instead of following the general norm of querying LLMs and Industry-specific SLMs, we built repositories of content curated from domain experts worldwide including video transcripts, blogs, search engines research, and massive amounts of enterprise, product/service, and market data.

TARIFF IMPACT FACTOR

Our new release incorporates impact of tariffs on geographical markets as we predict a shift in competitiveness of companies based on HQ country, manufacturing base, exports and imports (finished goods and OEM). This intricate and multifaceted market reality will impact competitors by increasing the Cost of Goods Sold (COGS), reducing profitability, reconfiguring supply chains, amongst other micro and macro market dynamics.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Tariff Impact on Global Supply Chain Patterns
    • Wafer Fab Equipment - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Escalating Demand for Advanced Semiconductor Nodes Propels Growth in Wafer Fab Equipment
    • Rise of AI, HPC, and Data Center Markets Expands Demand for Cutting-Edge Fabrication Tools
    • Miniaturization of Devices Strengthens Business Case for EUV Lithography Systems
    • Increasing Chip Complexity and Layer Count Spur Adoption of Advanced Etching and Deposition Equipment
    • Surge in Electric Vehicle Production Generates Demand for Power Semiconductor Manufacturing
    • Technological Innovations in Process Control Tools Sustain Equipment Market Momentum
    • Expansion of 3D Packaging and Heterogeneous Integration Throws Spotlight on Backend Fab Equipment
    • Supply Chain Resilience Efforts Create Opportunities for Localized Equipment Production
    • Rising Importance of Yield Optimization Drives Adoption of AI-Powered Monitoring Systems
    • Continued Foundry Competition Spurs Capex in Cutting-Edge Tooling
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Wafer Fab Equipment Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World Historic Review for Wafer Fab Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 4: World 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2015, 2025 & 2030
    • TABLE 5: World Recent Past, Current & Future Analysis for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 6: World Historic Review for Front-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 7: World 15-Year Perspective for Front-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 8: World Recent Past, Current & Future Analysis for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 9: World Historic Review for Back-End-of-Line Processing by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 10: World 15-Year Perspective for Back-End-of-Line Processing by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 11: World Recent Past, Current & Future Analysis for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 12: World Historic Review for Integrated Device Manufacturer by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 13: World 15-Year Perspective for Integrated Device Manufacturer by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 14: World Recent Past, Current & Future Analysis for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 15: World Historic Review for Other End-Uses by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 16: World 15-Year Perspective for Other End-Uses by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 17: World Recent Past, Current & Future Analysis for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 18: World Historic Review for Foundry by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 19: World 15-Year Perspective for Foundry by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 20: World Recent Past, Current & Future Analysis for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 21: World Historic Review for Memory by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 22: World 15-Year Perspective for Memory by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 23: World Recent Past, Current & Future Analysis for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 24: World Historic Review for 7 Nm & Below by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 25: World 15-Year Perspective for 7 Nm & Below by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 26: World Recent Past, Current & Future Analysis for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 27: World Historic Review for 10 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 28: World 15-Year Perspective for 10 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 29: World Recent Past, Current & Future Analysis for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 30: World Historic Review for 14 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 31: World 15-Year Perspective for 14 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 33: World Historic Review for 22 Nm by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 34: World 15-Year Perspective for 22 Nm by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030
    • TABLE 35: World Recent Past, Current & Future Analysis for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 36: World Historic Review for 65 Nm & Above by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 37: World 15-Year Perspective for 65 Nm & Above by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2015, 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 38: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 40: USA 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 41: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 42: USA Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 43: USA 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 44: USA Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: USA Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 46: USA 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CANADA
    • TABLE 47: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 48: Canada Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 49: Canada 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 50: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Canada Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 52: Canada 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 53: Canada Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 54: Canada Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 55: Canada 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • JAPAN
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 56: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Japan Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 58: Japan 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 59: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 60: Japan Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 61: Japan 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 62: Japan Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Japan Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 64: Japan 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • CHINA
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 65: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 66: China Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 67: China 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 68: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: China Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 70: China 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 71: China Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 72: China Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 73: China 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • EUROPE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 74: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 75: Europe Historic Review for Wafer Fab Equipment by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 76: Europe 15-Year Perspective for Wafer Fab Equipment by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2015, 2025 & 2030
    • TABLE 77: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 78: Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 79: Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 80: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 81: Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 82: Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 83: Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 84: Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 85: Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • FRANCE
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 86: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 87: France Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 88: France 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 89: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 90: France Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 91: France 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 92: France Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 93: France Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 94: France 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • GERMANY
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 95: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 96: Germany Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 97: Germany 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 98: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 99: Germany Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 100: Germany 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 101: Germany Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 102: Germany Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 103: Germany 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ITALY
    • TABLE 104: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 105: Italy Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 106: Italy 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 107: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 108: Italy Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 109: Italy 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 110: Italy Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 111: Italy Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 112: Italy 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • UNITED KINGDOM
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 113: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 114: UK Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 115: UK 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 116: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 117: UK Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 118: UK 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 119: UK Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 120: UK Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 121: UK 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF EUROPE
    • TABLE 122: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 123: Rest of Europe Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 124: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 125: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 126: Rest of Europe Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 127: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 128: Rest of Europe Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 129: Rest of Europe Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 130: Rest of Europe 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • ASIA-PACIFIC
    • Wafer Fab Equipment Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 131: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 132: Asia-Pacific Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 133: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 134: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 135: Asia-Pacific Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 136: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 137: Asia-Pacific Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 138: Asia-Pacific Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 139: Asia-Pacific 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030
  • REST OF WORLD
    • TABLE 140: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 141: Rest of World Historic Review for Wafer Fab Equipment by Fabrication Process - Front-End-of-Line Processing and Back-End-of-Line Processing Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 142: Rest of World 15-Year Perspective for Wafer Fab Equipment by Fabrication Process - Percentage Breakdown of Value Sales for Front-End-of-Line Processing and Back-End-of-Line Processing for the Years 2015, 2025 & 2030
    • TABLE 143: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 144: Rest of World Historic Review for Wafer Fab Equipment by End-Use - Integrated Device Manufacturer, Other End-Uses, Foundry and Memory Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 145: Rest of World 15-Year Perspective for Wafer Fab Equipment by End-Use - Percentage Breakdown of Value Sales for Integrated Device Manufacturer, Other End-Uses, Foundry and Memory for the Years 2015, 2025 & 2030
    • TABLE 146: Rest of World Recent Past, Current & Future Analysis for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 147: Rest of World Historic Review for Wafer Fab Equipment by Node Size - 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above Markets - Independent Analysis of Annual Sales in US$ Million for Years 2015 through 2023 and % CAGR
    • TABLE 148: Rest of World 15-Year Perspective for Wafer Fab Equipment by Node Size - Percentage Breakdown of Value Sales for 7 Nm & Below, 10 Nm, 14 Nm, 22 Nm and 65 Nm & Above for the Years 2015, 2025 & 2030

IV. COMPETITION