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先進エレクトロニクスパッケージングの世界市場

Advanced Electronic Packaging

出版日
ページ情報
英文 78 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.99円
先進エレクトロニクスパッケージングの世界市場
出版日: 2025年02月07日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 78 Pages
納期: 即日から翌営業日
GIIご利用のメリット
  • 全表示
  • 概要
  • 目次
概要

先進エレクトロニクスパッケージングの世界市場は2030年までに132億米ドルに達する見込み

2024年に79億米ドルと推定される先進エレクトロニクスパッケージングの世界市場は、2024年から2030年にかけてCAGR 9.0%で成長し、2030年には132億米ドルに達すると予測されます。ウエハーレベルのチップスケールパッケージングは、本レポートで分析したセグメントの1つであり、CAGRは8.5%を記録し、分析期間終了時には75億米ドルに達すると予測されています。スルーシリコンビア（Tsv）パッケージング分野の成長率は、分析期間中CAGR 9.8%と推定されます。

米国市場は推定20億米ドル、中国はCAGR11.9%で成長予測

米国の先進エレクトロニクスパッケージング市場は2024年に20億米ドルと推定されます。世界第2位の経済大国である中国は、分析期間2024-2030年のCAGR 11.9%を牽引し、2030年までに30億米ドルの市場規模に達すると予測されています。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ5.8%と7.2%と予測されています。欧州では、ドイツがCAGR約6.8%で成長すると予測されています。

世界の先進エレクトロニクスパッケージング市場- 主要動向と促進要因のまとめ

先進エレクトロニクスパッケージングは半導体製造をどう変えるか？

先進エレクトロニクスパッケージングは、より効率的で強力かつコンパクトなデバイスを実現することで、半導体業界に革命をもたらしています。単純なワイヤーボンディング技術を伴う従来のパッケージング手法は、システムインパッケージ（SiP）、3Dスタッキング、ウエハーレベルパッケージング（WLP）などの洗練されたパッケージングソリューションに取って代わられつつあります。これらの先進パッケージング技術は、単一パッケージ内に複数のコンポーネントを統合することを可能にし、電子デバイスの性能を向上させ、全体的な実装面積を縮小します。この進化は、高速処理、低消費電力、小型化を必要とする最新のアプリケーションの要求を満たす上で極めて重要です。例えば、スマートフォン、IoTデバイス、高性能コンピューティングシステムはすべて、優れた熱管理とシグナルインテグリティを提供する先進パッケージング技術の恩恵を受けています。こうした技術の統合は、デバイスの能力を高めるだけでなく、自動車、ヘルスケア、通信など、さまざまな分野のイノベーションを促進しています。

どのような技術革新が先進エレクトロニクスパッケージングを形成しているのか？

技術革新はエレクトロニクス・パッケージングの進歩の核心であり、性能、信頼性、拡張性の向上を推進しています。重要なブレークスルーの一つは、複数の半導体ダイを垂直に積み重ねることができる3D IC（集積回路）技術の開発です。この3Dアプローチにより、処理能力とメモリー容量が大幅に強化されるとともに、レイテンシーが低減されます。もう一つの重要な技術革新は、より高い集積密度と優れた熱性能を提供するファンアウト・ウエハーレベル・パッケージング（FOWLP）の登場です。さらに、シリコンインターポーザや有機基板などの先端材料が、電気的性能と放熱を向上させるために利用されています。シリコン貫通ビア（TSV）やマイクロバンピング技術の採用により、パッケージの接続性と性能がさらに向上しています。これらの技術的進歩は、複雑化する現代の電子システムの性能要件に対応する上で極めて重要です。

市場動向は先進パッケージング・ソリューションの採用にどのような影響を与えているか？

市場動向は、先進パッケージング・ソリューションの採用に極めて重要な役割を果たしています。電子機器の小型化、高速化、高効率化に対する需要の高まりが、先進パッケージング技術へのシフトを後押ししています。民生用電子機器、特にスマートフォンやウェアラブルデバイスには、高度な集積度と性能が要求されるが、先進パッケージングではこれを実現することができます。電気自動車（EV）や自律走行システムに向けた自動車業界の推進も、これらのアプリケーションで必要とされる高性能コンピューティングやセンサー統合をサポートする先進パッケージングを必要としています。さらに、5G技術の採用拡大により、より高い周波数とデータレートに対応できる先進パッケージング・ソリューションの需要が加速しています。データセンターやクラウド・コンピューティング・インフラにおける熱管理と電力効率の改善に対するニーズは、先進パッケージングの採用をさらに促進しています。こうした動向が市場情勢を形成し、メーカー各社に最先端のパッケージング技術の革新と採用を促しています。

先進エレクトロニクスパッケージング市場の成長を促す要因とは？

先進エレクトロニクスパッケージング市場の成長は、いくつかの要因によって牽引されています。半導体製造とパッケージングにおける技術の先進化により、電子機器の性能と信頼性が向上し、エンドユーザーにとって魅力的なものとなっています。民生用電子機器、自動車システム、通信機器の複雑化と高機能化は、先進パッケージング・ソリューションに対する大きな需要を生み出しています。5Gネットワークとモノのインターネット（IoT）へのシフトは、高性能でコンパクト、かつエネルギー効率の高いパッケージング技術に新たな機会を生み出しています。さらに、電子機器におけるエネルギー効率と熱管理の重視の高まりが、先進材料とパッケージング手法の採用を促進しています。政府の取り組みや半導体研究開発への投資も、特に半導体製造能力の強化を目指す地域の市場成長に寄与しています。これらの要因は、小型化と性能向上のあくなき追求と相まって、先進エレクトロニクスパッケージング市場を前進させています。

セグメント

テクノロジー（ウエハーレベルのチップスケールパッケージング、貫通電極（TSV）パッケージング）

調査対象企業の例（全38件）

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation（SMIC）
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd.（TSMC）
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • スペイン
  • ロシア
  • その他欧州
  • アジア太平洋
  • オーストラリア
  • インド
  • 韓国
  • その他アジア太平洋地域
  • ラテンアメリカ
  • アルゼンチン
  • ブラジル
  • メキシコ
  • その他ラテンアメリカ
  • 中東
  • イラン
  • イスラエル
  • サウジアラビア
  • アラブ首長国連邦
  • その他中東
  • アフリカ

第4章 競合

目次
Product Code: MCP-1203

Global Advanced Electronic Packaging Market to Reach US$13.2 Billion by 2030

The global market for Advanced Electronic Packaging estimated at US$7.9 Billion in the year 2024, is expected to reach US$13.2 Billion by 2030, growing at a CAGR of 9.0% over the analysis period 2024-2030. Wafer-Level Chip-Scale Packaging, one of the segments analyzed in the report, is expected to record a 8.5% CAGR and reach US$7.5 Billion by the end of the analysis period. Growth in the Through Silicon via (Tsv) Packaging segment is estimated at 9.8% CAGR over the analysis period.

The U.S. Market is Estimated at US$2.0 Billion While China is Forecast to Grow at 11.9% CAGR

The Advanced Electronic Packaging market in the U.S. is estimated at US$2.0 Billion in the year 2024. China, the world's second largest economy, is forecast to reach a projected market size of US$3.0 Billion by the year 2030 trailing a CAGR of 11.9% over the analysis period 2024-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 5.8% and 7.2% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 6.8% CAGR.

Global Advanced Electronic Packaging Market - Key Trends and Drivers Summarized

How Is Advanced Electronic Packaging Transforming Semiconductor Manufacturing?

Advanced electronic packaging is revolutionizing the semiconductor industry by enabling more efficient, powerful, and compact devices. Traditional packaging methods, which involved simple wire bonding techniques, are being replaced by sophisticated packaging solutions such as system-in-package (SiP), 3D stacking, and wafer-level packaging (WLP). These advanced techniques allow for the integration of multiple components within a single package, enhancing performance and reducing the overall footprint of electronic devices. This evolution is critical in meeting the demands of modern applications that require high-speed processing, low power consumption, and miniaturization. For instance, smartphones, IoT devices, and high-performance computing systems all benefit from advanced packaging technologies that provide superior thermal management and signal integrity. The integration of these technologies is not only enhancing device capabilities but also driving innovation across various sectors, including automotive, healthcare, and telecommunications.

What Technological Innovations Are Shaping Advanced Electronic Packaging?

Technological innovations are at the heart of advancements in electronic packaging, driving improvements in performance, reliability, and scalability. One of the significant breakthroughs is the development of 3D IC (integrated circuit) technology, which allows for the vertical stacking of multiple semiconductor dies. This 3D approach significantly enhances processing power and memory capacity while reducing latency. Another key innovation is the advent of fan-out wafer-level packaging (FOWLP), which offers higher integration density and better thermal performance. Additionally, advanced materials such as silicon interposers and organic substrates are being utilized to improve electrical performance and heat dissipation. The incorporation of through-silicon vias (TSVs) and micro-bumping techniques further enhances the connectivity and performance of these packages. These technological advancements are crucial in addressing the growing complexity and performance requirements of modern electronic systems.

How Are Market Trends Influencing the Adoption of Advanced Packaging Solutions?

Market trends are playing a pivotal role in influencing the adoption of advanced packaging solutions. The increasing demand for smaller, faster, and more efficient electronic devices is driving the shift towards advanced packaging technologies. Consumer electronics, particularly smartphones and wearable devices, require high levels of integration and performance, which advanced packaging can deliver. The automotive industry's push towards electric vehicles (EVs) and autonomous driving systems also necessitates advanced packaging to support the high-performance computing and sensor integration required in these applications. Additionally, the growing adoption of 5G technology is accelerating the demand for advanced packaging solutions that can handle higher frequencies and greater data rates. The need for improved thermal management and power efficiency in data centers and cloud computing infrastructures is further driving the adoption of advanced packaging. These trends are shaping the market landscape, pushing manufacturers to innovate and adopt cutting-edge packaging technologies.

What Factors Are Driving Growth in the Advanced Electronic Packaging Market?

The growth in the advanced electronic packaging market is driven by several factors. Technological advancements in semiconductor fabrication and packaging are enhancing the performance and reliability of electronic devices, making them more attractive to end-users. The increasing complexity and functionality of consumer electronics, automotive systems, and communication devices are generating significant demand for advanced packaging solutions. The shift towards 5G networks and the Internet of Things (IoT) is creating new opportunities for high-performance, compact, and energy-efficient packaging technologies. Additionally, the growing emphasis on energy efficiency and thermal management in electronic devices is driving the adoption of advanced materials and packaging methods. Government initiatives and investments in semiconductor research and development are also contributing to market growth, particularly in regions aiming to strengthen their semiconductor manufacturing capabilities. These factors, coupled with the relentless pursuit of miniaturization and enhanced performance, are propelling the advanced electronic packaging market forward.

SCOPE OF STUDY:

The report analyzes the Advanced Electronic Packaging market in terms of units by the following Segments, and Geographic Regions/Countries:

Segments:

Technology (Wafer-Level Chip-Scale Packaging, Through Silicon Via (TSV) Packaging)

Geographic Regions/Countries:

World; United States; Canada; Japan; China; Europe (France; Germany; Italy; United Kingdom; Spain; Russia; and Rest of Europe); Asia-Pacific (Australia; India; South Korea; and Rest of Asia-Pacific); Latin America (Argentina; Brazil; Mexico; and Rest of Latin America); Middle East (Iran; Israel; Saudi Arabia; United Arab Emirates; and Rest of Middle East); and Africa.

Select Competitors (Total 38 Featured) -

  • Amkor Technology, Inc.
  • Analog Devices, Inc.
  • ASE Technology Holding, Co., Ltd.
  • Fujitsu Ltd.
  • Hitachi Ltd.
  • Ibiden Co., Ltd.
  • Infineon Technologies AG
  • Intel Corporation
  • Micron Technology, Inc.
  • Microsemi Corporation
  • Molex LLC
  • NXP Semiconductors NV
  • Orient Semiconductor Electronics Ltd.
  • Samsung Electronics Co., Ltd.
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Semtech Corporation
  • STATS ChipPAC Pte., Ltd.
  • Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC)
  • Texas Instruments, Inc.
  • Thomas & Betts Corporation
  • Toshiba America Electronic Components, Inc.
  • TSI Group Ltd.

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • Global Economic Update
    • Advanced Electronic Packaging - Global Key Competitors Percentage Market Share in 2025 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2025 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturization Throws the Spotlight on Advanced Packaging Solutions
    • Integration of Advanced Materials Expands Addressable Market Opportunity
    • Adoption of Fan-Out Wafer-Level Packaging (FOWLP) Spurs Growth in High-Density Applications
    • Technological Innovations Propel Growth in 3D IC Technology
    • Growing Prevalence of 5G Technology Strengthens Business Case for Advanced Packaging
    • Shift Towards Electric Vehicles (EVs) and Autonomous Driving Generates Demand for High-Performance Packaging
    • Increased Complexity in Consumer Electronics Drives Adoption of Advanced Packaging Technologies
    • Need for Improved Thermal Management in Data Centers Propels Growth in Advanced Packaging
    • Emergence of Internet of Things (IoT) Expands Addressable Market Opportunity for Compact and Efficient Packaging
    • Advancements in Through-Silicon Vias (TSVs) and Micro-Bumping Techniques Drive Market Expansion
    • Technological Integration in Automotive Systems Generates Demand for Robust Packaging Solutions
    • Increasing Use of Wearable Devices and Smart Gadgets Throws the Spotlight on Miniaturized Packaging
    • Expansion of Cloud Computing and AI Applications Propels Growth in Advanced Electronic Packaging
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Advanced Electronic Packaging Market Analysis of Annual Sales in US$ Million for Years 2015 through 2030
    • TABLE 2: World Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 3: World 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets for Years 2025 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for Wafer-Level Chip-Scale Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 5: World 6-Year Perspective for Wafer-Level Chip-Scale Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030
    • TABLE 6: World Recent Past, Current & Future Analysis for Through Silicon via (Tsv) Packaging by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 7: World 6-Year Perspective for Through Silicon via (Tsv) Packaging by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America, Middle East and Africa for Years 2025 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2025 (E)
    • TABLE 8: USA Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 9: USA 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CANADA
    • TABLE 10: Canada Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 11: Canada 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • JAPAN
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2025 (E)
    • TABLE 12: Japan Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 13: Japan 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • CHINA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2025 (E)
    • TABLE 14: China Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 15: China 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • EUROPE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2025 (E)
    • TABLE 16: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 17: Europe 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK, Spain, Russia and Rest of Europe Markets for Years 2025 & 2030
    • TABLE 18: Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 19: Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • FRANCE
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2025 (E)
    • TABLE 20: France Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 21: France 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • GERMANY
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2025 (E)
    • TABLE 22: Germany Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 23: Germany 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ITALY
    • TABLE 24: Italy Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 25: Italy 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED KINGDOM
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2025 (E)
    • TABLE 26: UK Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 27: UK 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SPAIN
    • TABLE 28: Spain Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 29: Spain 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • RUSSIA
    • TABLE 30: Russia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 31: Russia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF EUROPE
    • TABLE 32: Rest of Europe Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 33: Rest of Europe 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ASIA-PACIFIC
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2025 (E)
    • TABLE 34: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Australia, India, South Korea and Rest of Asia-Pacific Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 35: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Australia, India, South Korea and Rest of Asia-Pacific Markets for Years 2025 & 2030
    • TABLE 36: Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 37: Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AUSTRALIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Australia for 2025 (E)
    • TABLE 38: Australia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 39: Australia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • INDIA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in India for 2025 (E)
    • TABLE 40: India Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 41: India 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SOUTH KOREA
    • TABLE 42: South Korea Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 43: South Korea 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF ASIA-PACIFIC
    • TABLE 44: Rest of Asia-Pacific Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 45: Rest of Asia-Pacific 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • LATIN AMERICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Latin America for 2025 (E)
    • TABLE 46: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Argentina, Brazil, Mexico and Rest of Latin America Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 47: Latin America 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Argentina, Brazil, Mexico and Rest of Latin America Markets for Years 2025 & 2030
    • TABLE 48: Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 49: Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ARGENTINA
    • TABLE 50: Argentina Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 51: Argentina 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • BRAZIL
    • TABLE 52: Brazil Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 53: Brazil 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MEXICO
    • TABLE 54: Mexico Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 55: Mexico 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF LATIN AMERICA
    • TABLE 56: Rest of Latin America Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 57: Rest of Latin America 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • MIDDLE EAST
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Middle East for 2025 (E)
    • TABLE 58: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Geographic Region - Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets - Independent Analysis of Annual Sales in US$ Million for Years 2024 through 2030 and % CAGR
    • TABLE 59: Middle East 6-Year Perspective for Advanced Electronic Packaging by Geographic Region - Percentage Breakdown of Value Sales for Iran, Israel, Saudi Arabia, UAE and Rest of Middle East Markets for Years 2025 & 2030
    • TABLE 60: Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 61: Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • IRAN
    • TABLE 62: Iran Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 63: Iran 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • ISRAEL
    • TABLE 64: Israel Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 65: Israel 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • SAUDI ARABIA
    • TABLE 66: Saudi Arabia Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 67: Saudi Arabia 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • UNITED ARAB EMIRATES
    • TABLE 68: UAE Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 69: UAE 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • REST OF MIDDLE EAST
    • TABLE 70: Rest of Middle East Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 71: Rest of Middle East 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030
  • AFRICA
    • Advanced Electronic Packaging Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Africa for 2025 (E)
    • TABLE 72: Africa Recent Past, Current & Future Analysis for Advanced Electronic Packaging by Technology - Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging - Independent Analysis of Annual Sales in US$ Million for the Years 2024 through 2030 and % CAGR
    • TABLE 73: Africa 6-Year Perspective for Advanced Electronic Packaging by Technology - Percentage Breakdown of Value Sales for Wafer-Level Chip-Scale Packaging and Through Silicon via (Tsv) Packaging for the Years 2025 & 2030

IV. COMPETITION