先進チップパッケージングの世界市場レポート2025年

先進チップパッケージング市場規模は、今後数年で急成長が見込まれます。2029年にはCAGR17.5％で275億6,000万米ドルに成長します。予測期間の成長は、5G技術の普及、モノのインターネット（IoT）デバイスの成長、人工知能（AI）と機械学習の台頭、ウェアラブル技術の拡大に起因すると考えられます。予測期間の先進パッケージング動向には、3Dパッケージング技術の採用拡大、高度な熱管理、高密度相互接続技術の進歩、ファンアウトウエハーレベルパッケージング技術の拡大、フレキシブルおよびストレッチャブルパッケージング技術の開発などが含まれます。

今後5年間の成長率17.5%という予測は、この市場の前回予測からの0.7%という小幅な減少を反映しています。この減少は主に米国と他国との間の関税の影響によるものです。これは、台湾とシンガポールに大きく依存している基板とインターポーザー材料のボトルネックを通じて米国に直接影響し、半導体生産のスケジュールを遅らせる可能性が高いです。また、相互関税や、貿易の緊張と制限の高まりによる世界経済と貿易への悪影響により、その影響はより広範囲に及ぶと思われます。

民生用電子機器に対する需要の高まりが、先進チップパッケージング市場の成長を牽引すると予想されます。民生用電子機器には、スマートフォン、タブレット、ノートパソコンなどがあり、個人の家庭で日常的に使用されるように設計されています。インターネットやワイヤレスネットワークの拡大により、これらの機器の需要が大幅に増加しています。先進チップパッケージング技術は、高性能な民生用電子機器に不可欠な複数の機能をコンパクトな設計に統合することを容易にします。これらの技術は、処理能力、効率、放熱を向上させ、機能豊富でコンパクトなデバイスの作成を可能にします。例えば、日本電子情報技術産業協会が2023年5月に発表した報告書によると、コンシューマー・エレクトロニクスの生産額は2億950万米ドルに達し、前年比127%増となりました。その結果、民生用電子機器に対する需要の高まりが、先進チップパッケージング市場の拡大に拍車をかけています。

目次

第1章 エグゼクティブサマリー

第2章 市場の特徴

第3章 市場動向と戦略

第4章 市場：金利、インフレ、地政学、貿易戦争と関税、そしてコロナ禍と回復が市場に与える影響を含むマクロ経済シナリオ

第5章 世界の成長分析と戦略分析フレームワーク

• 世界の先進チップパッケージング：PESTEL分析（政治、社会、技術、環境、法的要因、促進要因と抑制要因）
• 最終用途産業の分析
• 世界の先進チップパッケージング市場：成長率分析
• 世界の先進チップパッケージング市場の実績：規模と成長, 2019-2024
• 世界の先進チップパッケージング市場の予測：規模と成長, 2024-2029, 2034F
• 世界の先進チップパッケージング：総潜在市場規模（TAM）

第6章 市場セグメンテーション

• 世界の先進チップパッケージング市場：パッケージング別、実績と予測, 2019-2024, 2024-2029F, 2034F
• ボールグリッドアレイ（BGA）
• クアッドフラットパッケージ（QFP）
• チップスケールパッケージ（CSP）
• ウェーハレベルチップスケールパッケージ（WLCSP）
• 世界の先進チップパッケージング市場：技術別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 5次元（5D）パッケージング
• 3次元（3D）パッケージ
• ファンアウト型ウェーハレベルパッケージング
• フリップチップパッケージング
• システムインパッケージソリューション
• 世界の先進チップパッケージング市場：最終用途産業別、実績と予測, 2019-2024, 2024-2029F, 2034F
• エレクトロニクス
• 自動車
• 通信
• 産業
• ヘルスケア
• 航空宇宙および防衛
• 世界の先進チップパッケージング市場ボールグリッドアレイ（BGA）のサブセグメンテーション（タイプ別）、実績と予測, 2019-2024, 2024-2029F, 2034F
• マイクロBGA
• テープBGA
• プラスチックBGA（PBGA）
• セラミックBGA（CBGA）
• 世界の先進チップパッケージング市場、クアッドフラットパッケージ（QFP）のタイプ別サブセグメンテーション、実績と予測, 2019-2024, 2024-2029F, 2034F
• 薄型QFP（TQFP）
• プラスチックQFP（PQFP）
• ロープロファイルQFP（LQFP）
• ヒートシンクQFP（HQFP）
• 世界の先進チップパッケージング市場チップスケールパッケージ（CSP）の種類別サブセグメンテーション、実績と予測, 2019-2024, 2024-2029F, 2034F
• フリップチップCSP
• ウェーハレベルCSP
• ファンインCSP
• ファンアウトCSP
• 世界の先進チップパッケージング市場、ウェーハレベルチップスケールパッケージ（WLCSP）の種類別サブセグメンテーション、実績と予測, 2019-2024, 2024-2029F, 2034F
• フリップチップWLCSP
• 再配線層（RDL）WLCSP
• ファンアウトWLCSP
• バンプされたWLCSP

第7章 地域別・国別分析

• 世界の先進チップパッケージング市場：地域別、実績と予測, 2019-2024, 2024-2029F, 2034F
• 世界の先進チップパッケージング市場：国別、実績と予測, 2019-2024, 2024-2029F, 2034F

第8章 アジア太平洋市場

第9章 中国市場

第10章 インド市場

第11章 日本市場

第12章 オーストラリア市場

第13章 インドネシア市場

第14章 韓国市場

第15章 西欧市場

第16章 英国市場

第17章 ドイツ市場

第18章 フランス市場

第19章 イタリア市場

第20章 スペイン市場

第21章 東欧市場

第22章 ロシア市場

第23章 北米市場

第24章 米国市場

第25章 カナダ市場

第26章 南米市場

第27章 ブラジル市場

第28章 中東市場

第29章 アフリカ市場

第30章 競合情勢と企業プロファイル

• 先進チップパッケージング市場：競合情勢
• 先進チップパッケージング市場：企業プロファイル
  • Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
  • Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
  • Henkel Group Overview, Products and Services, Strategy and Financial Analysis
  • Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

第31章 その他の大手企業と革新的企業

• Lam Research Corporation
• NXP Semiconductors
• Onsemi
• Amkor Technology
• Nordson Corporation
• Siliconware Precision Industries Co. Ltd.
• Kulicke and Soffa Industries Inc.
• ChipMOS Technologies Inc.
• SUSS MicroTec SE
• EV Group
• Indium Corporation
• Palomar Technologies
• Brewer Science Inc.
• MacDermid Alpha Electronics Solutions
• Universal Instruments Corporation

第32章 世界の市場競合ベンチマーキングとダッシュボード

第33章 主要な合併と買収

第34章 最近の市場動向

第35章 市場の潜在力が高い国、セグメント、戦略

• 先進チップパッケージング市場2029：新たな機会を提供する国
• 先進チップパッケージング市場2029：新たな機会を提供するセグメント
• 先進チップパッケージング市場2029：成長戦略
  • 市場動向に基づく戦略
  • 競合の戦略

第36章 付録

Advanced chip packaging refers to advanced processes and technologies used to encase and connect semiconductor devices (chips) to their external environments, commonly found within electronic devices. This method offers design flexibility, allowing for the creation of tailored solutions for specific applications and performance requirements.

The main types of advanced chip packaging include ball grid array (BGA), quad flat package (QFP), chip scale package (CSP), and wafer-level chip scale package (WLCSP). A ball grid array is an integrated circuit packaging type that employs an array of solder balls on the bottom of the package to provide electrical connections to the printed circuit board. This design facilitates higher pin counts, enhanced thermal performance, and more compact designs compared to traditional pin-based packages. Technologies such as five-dimensional (5D) packaging, three-dimensional (3D) packaging, fan-out wafer-level packaging, flip-chip packaging, and system-in-package solutions are utilized in various industries, including electronics, automotive, telecommunications, industrial, healthcare, aerospace, and defense.

Note that the outlook for this market is being affected by rapid changes in trade relations and tariffs globally. The report will be updated prior to delivery to reflect the latest status, including revised forecasts and quantified impact analysis. The report's Recommendations and Conclusions sections will be updated to give strategies for entities dealing with the fast-moving international environment.

The sharp escalation of U.S. tariffs and resulting trade tensions in spring 2025 are significantly affecting the electrical and electronics sector. Key components such as semiconductors, display panels, and rare-earth metals crucial for batteries and motors are now facing heavy duties. Consumer electronics companies are seeing profit margins shrink, as fierce competition makes it difficult to pass on rising costs to consumers. At the same time, industrial electronics firms are experiencing project delays due to shortages of tariff-impacted parts like printed circuit boards. In response, businesses are shifting assembly operations to tariff-exempt nations, building up inventory reserves, and redesigning products to reduce reliance on restricted materials.

The advanced chip packaging market research report is one of a series of new reports from The Business Research Company that provides advanced chip packaging market statistics, including the advanced chip packaging industry global market size, regional shares, competitors with the advanced chip packaging market share, detailed advanced chip packaging market segments, market trends, and opportunities, and any further data you may need to thrive in the advanced chip packaging industry. These advanced chip packaging market research reports deliver a complete perspective of everything you need, with an in-depth analysis of the current and future scenarios of the industry.

The advanced chip packaging market size has grown rapidly in recent years. It will grow from $12.41 billion in 2024 to $14.45 billion in 2025 at a compound annual growth rate (CAGR) of 16.5%. The growth in the historic period can be attributed to the demand for smaller, more powerful consumer electronics, the rise of mobile devices and smartphones, the growth of high-speed data networks, increasing automotive electronics, and the evolution of computing needs.

The advanced chip packaging market size is expected to see rapid growth in the next few years. It will grow to $27.56 billion in 2029 at a compound annual growth rate (CAGR) of 17.5%. The growth in the forecast period can be attributed to the proliferation of 5G technology, the growth of the Internet of Things (IoT) devices, the rise of artificial intelligence (AI) and machine learning, the expansion of wearable technology. Major trends in the forecast period include the growing adoption of 3D packaging technologies, advanced thermal management, advancements in high-density interconnect technologies, expansion of fan-out wafer-level packaging technologies, and development of flexible and stretchable packaging technologies.

The forecast of 17.5% growth over the next five years reflects a modest reduction of 0.7% from the previous estimate for this market. This reduction is primarily due to the impact of tariffs between the US and other countries. This is likely to directly affect the US through bottlenecks in substrate and interposer materials, heavily reliant on Taiwan and Singapore, delaying semiconductor production timelines. The effect will also be felt more widely due to reciprocal tariffs and the negative effect on the global economy and trade due to increased trade tensions and restrictions.

The rising demand for consumer electronic devices is anticipated to drive the growth of the advanced chip packaging market. Consumer electronic devices, which are designed for everyday use in private homes, include smartphones, tablets, and laptops. The expansion of internet and wireless networks has significantly increased the demand for these devices. Advanced chip packaging technologies facilitate the integration of multiple functions into compact designs, which are essential for high-performance consumer electronics. These technologies improve processing power, efficiency, and heat dissipation, enabling the creation of feature-rich, compact devices. For instance, a report published by the Japan Electronics and Information Technology Industries Association in May 2023 indicated that consumer electronics production reached $209.50 million, representing a 127% increase compared to the previous year. Consequently, the growing demand for consumer electronic devices is fueling the expansion of the advanced chip packaging market.

Major players in the advanced chip packaging market are focusing on the development of chip-scale package (CSP) technology to enhance semiconductor device performance, miniaturization, and reliability. CSP technology involves packaging where the package dimensions are nearly the same as the semiconductor chip itself. In September 2022, Bridgelux Inc., a US-based LED innovation company, introduced its Chip Scale Package (CSP) LEDs, which range from 1800K to 6500K, with CRI values from 70 to 95, and offer RGB color to full spectrum. Utilizing flip-chip technology with a phosphor coating, these LEDs eliminate the need for bond wires and plastic molds, resulting in improved heat management and increased luminous flux production. The CSP2727 model boasts an industry-leading efficacy of 209 lm/W at 350 mA and 190 lm/W at 700 mA, making it well-suited for commercial lighting applications. The CSP LEDs facilitate smooth and flexible board assembly, allowing for the creation of customer-specific Chip-on-Board (COB) modules for various lighting applications including commercial, entertainment, industrial, and outdoor settings.

In November 2022, Lam Research Corporation, a US-based semiconductor company, acquired SEMSYSCO GmbH for an undisclosed amount. This acquisition expands Lam Research's capabilities in innovative packaging solutions, particularly for advanced logic chips and chipset-based systems. The acquisition includes a state-of-the-art research and development facility located in Austria, which enhances Lam Research's expertise in next-generation substrates and heterogeneous packaging. SEMSYSCO GmbH, an Austria-based provider of wet-processing semiconductor equipment, will contribute to Lam Research's advanced chip packaging efforts.

Major companies operating in the advanced chip packaging market are Samsung Electronics Co. Ltd., Advanced Micro Devices Inc., Advanced Semiconductor Engineering Inc, Henkel Group, Texas Instruments Incorporated, Lam Research Corporation, NXP Semiconductors, Onsemi, Amkor Technology, Nordson Corporation, Siliconware Precision Industries Co. Ltd., Kulicke and Soffa Industries Inc., ChipMOS Technologies Inc., SUSS MicroTec SE, EV Group, Indium Corporation, Palomar Technologies, Brewer Science Inc., MacDermid Alpha Electronics Solutions, Universal Instruments Corporation, CHIPBOND Technology Corporation

Asia-Pacific was the largest region in the advanced chip packaging market in 2024. The regions covered in the advanced chip packaging market report are Asia-Pacific, Western Europe, Eastern Europe, North America, South America, Middle East, Africa.

The countries covered in the advanced chip packaging market report are Australia, Brazil, China, France, Germany, India, Indonesia, Japan, Russia, South Korea, UK, USA, Canada, Italy, Spain.

The advanced chip packaging market consists of revenues earned by entities by providing services such as multi-chip modules, through-silicon vias, lead frame packages, and embedded die packaging. The market value includes the value of related goods sold by the service provider or included within the service offering. The advanced chip packaging market also includes sales of wire bonders, encapsulation equipment, die-attach equipment, and test and inspection equipment. Values in this market are 'factory gate' values, that is, the value of goods sold by the manufacturers or creators of the goods, whether to other entities (including downstream manufacturers, wholesalers, distributors, and retailers) or directly to end customers. The value of goods in this market includes related services sold by the creators of the goods.

The market value is defined as the revenues that enterprises gain from the sale of goods and/or services within the specified market and geography through sales, grants, or donations in terms of the currency (in USD, unless otherwise specified).

The revenues for a specified geography are consumption values that are revenues generated by organizations in the specified geography within the market, irrespective of where they are produced. It does not include revenues from resales along the supply chain, either further along the supply chain or as part of other products.

Advanced Chip Packaging Global Market Report 2025 from The Business Research Company provides strategists, marketers and senior management with the critical information they need to assess the market.

This report focuses on advanced chip packaging market which is experiencing strong growth. The report gives a guide to the trends which will be shaping the market over the next ten years and beyond.

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Where is the largest and fastest growing market for advanced chip packaging ? How does the market relate to the overall economy, demography and other similar markets? What forces will shape the market going forward, including technological disruption, regulatory shifts, and changing consumer preferences? The advanced chip packaging market global report from the Business Research Company answers all these questions and many more.

The report covers market characteristics, size and growth, segmentation, regional and country breakdowns, competitive landscape, market shares, trends and strategies for this market. It traces the market's historic and forecast market growth by geography.

• The market characteristics section of the report defines and explains the market.
• The market size section gives the market size ($b) covering both the historic growth of the market, and forecasting its development.
• The forecasts are made after considering the major factors currently impacting the market. These include:

The forecasts are made after considering the major factors currently impacting the market. These include the technological advancements such as AI and automation, Russia-Ukraine war, trade tariffs (government-imposed import/export duties), elevated inflation and interest rates.

• Market segmentations break down the market into sub markets.
• The regional and country breakdowns section gives an analysis of the market in each geography and the size of the market by geography and compares their historic and forecast growth.
• The competitive landscape chapter gives a description of the competitive nature of the market, market shares, and a description of the leading companies. Key financial deals which have shaped the market in recent years are identified.
• The trends and strategies section analyses the shape of the market as it emerges from the crisis and suggests how companies can grow as the market recovers.

Scope

• Markets Covered:1) By Packaging: Ball Grid Array (BGA); Quad Flat Package (QFP); Chip Scale Package (CSP); Wafer-Level Chip Scale Package (WLCSP)
• 2) By Technology: Five-Dimensional (5D) Packaging; Three-Dimensional (3D) Packaging; Fan-Out Wafer-Level Packaging; Flip-Chip Packaging; System-In-Package Solutions
• 3) By End-Use Industry: Electronics; Automotive; Telecommunications; Industrial; Healthcare; Aerospace And Defense
• Subsegments:
• 1) By Ball Grid Array (BGA): Micro BGA; Tape BGA; Plastic BGA (PBGA); Ceramic BGA (CBGA)
• 2) By Quad Flat Package (QFP): Thin QFP (TQFP); Plastic QFP (PQFP); Low-Profile QFP (LQFP); Heat Sink QFP (HQFP)
• 3) By Chip Scale Package (CSP): Flip-Chip CSP; Wafer-Level CSP; Fan-In CSP; Fan-Out CSP
• 4) By Wafer-Level Chip Scale Package (WLCSP): Flip-Chip WLCSP; Redistribution Layer (RDL) WLCSP; Fan-Out WLCSP; Bumped WLCSP
• Companies Mentioned:Samsung Electronics Co. Ltd.; Advanced Micro Devices Inc.; Advanced Semiconductor Engineering Inc; Henkel Group; Texas Instruments Incorporated; Lam Research Corporation; NXP Semiconductors; Onsemi; Amkor Technology; Nordson Corporation; Siliconware Precision Industries Co. Ltd.; Kulicke and Soffa Industries Inc.; ChipMOS Technologies Inc.; SUSS MicroTec SE; EV Group; Indium Corporation; Palomar Technologies; Brewer Science Inc.; MacDermid Alpha Electronics Solutions; Universal Instruments Corporation; CHIPBOND Technology Corporation
• Countries: Australia; Brazil; China; France; Germany; India; Indonesia; Japan; Russia; South Korea; UK; USA; Canada; Italy; Spain
• Regions: Asia-Pacific; Western Europe; Eastern Europe; North America; South America; Middle East; Africa
• Time Series: Five years historic and ten years forecast.
• Data: Ratios of market size and growth to related markets, GDP proportions, expenditure per capita,
• Data Segmentations: country and regional historic and forecast data, market share of competitors, market segments.
• Sourcing and Referencing: Data and analysis throughout the report is sourced using end notes.
• Delivery Format: PDF, Word and Excel Data Dashboard.

Table of Contents

1. Executive Summary

2. Advanced Chip Packaging Market Characteristics

3. Advanced Chip Packaging Market Trends And Strategies

4. Advanced Chip Packaging Market - Macro Economic Scenario Including The Impact Of Interest Rates, Inflation, Geopolitics, Trade Wars and Tariffs, And Covid And Recovery On The Market

• 4.1. Supply Chain Impact from Tariff War & Trade Protectionism

5. Global Advanced Chip Packaging Growth Analysis And Strategic Analysis Framework

• 5.1. Global Advanced Chip Packaging PESTEL Analysis (Political, Social, Technological, Environmental and Legal Factors, Drivers and Restraints)
• 5.2. Analysis Of End Use Industries
• 5.3. Global Advanced Chip Packaging Market Growth Rate Analysis
• 5.4. Global Advanced Chip Packaging Historic Market Size and Growth, 2019 - 2024, Value ($ Billion)
• 5.5. Global Advanced Chip Packaging Forecast Market Size and Growth, 2024 - 2029, 2034F, Value ($ Billion)
• 5.6. Global Advanced Chip Packaging Total Addressable Market (TAM)

6. Advanced Chip Packaging Market Segmentation

• 6.1. Global Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Ball Grid Array (BGA)
• Quad Flat Package (QFP)
• Chip Scale Package (CSP)
• Wafer-Level Chip Scale Package (WLCSP)
• 6.2. Global Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Five-Dimensional (5D) Packaging
• Three-Dimensional (3D) Packaging
• Fan-Out Wafer-Level Packaging
• Flip-Chip Packaging
• System-In-Package Solutions
• 6.3. Global Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Electronics
• Automotive
• Telecommunications
• Industrial
• Healthcare
• Aerospace And Defence
• 6.4. Global Advanced Chip Packaging Market, Sub-Segmentation Of Ball Grid Array (BGA), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Micro BGA
• Tape BGA
• Plastic BGA (PBGA)
• Ceramic BGA (CBGA)
• 6.5. Global Advanced Chip Packaging Market, Sub-Segmentation Of Quad Flat Package (QFP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Thin QFP (TQFP)
• Plastic QFP (PQFP)
• Low-Profile QFP (LQFP)
• Heat Sink QFP (HQFP)
• 6.6. Global Advanced Chip Packaging Market, Sub-Segmentation Of Chip Scale Package (CSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Flip-Chip CSP
• Wafer-Level CSP
• Fan-In CSP
• Fan-Out CSP
• 6.7. Global Advanced Chip Packaging Market, Sub-Segmentation Of Wafer-Level Chip Scale Package (WLCSP), By Type, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• Flip-Chip WLCSP
• Redistribution Layer (RDL) WLCSP
• Fan-Out WLCSP
• Bumped WLCSP

7. Advanced Chip Packaging Market Regional And Country Analysis

• 7.1. Global Advanced Chip Packaging Market, Split By Region, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 7.2. Global Advanced Chip Packaging Market, Split By Country, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

8. Asia-Pacific Advanced Chip Packaging Market

• 8.1. Asia-Pacific Advanced Chip Packaging Market Overview
• Region Information, Market Information, Background Information, Government Initiatives, Regulations, Regulatory Bodies, Major Associations, Taxes Levied, Corporate Tax Structure, Investments, Major Companies
• 8.2. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.3. Asia-Pacific Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 8.4. Asia-Pacific Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

9. China Advanced Chip Packaging Market

• 9.1. China Advanced Chip Packaging Market Overview
• 9.2. China Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.3. China Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion
• 9.4. China Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F,$ Billion

10. India Advanced Chip Packaging Market

• 10.1. India Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.2. India Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 10.3. India Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

11. Japan Advanced Chip Packaging Market

• 11.1. Japan Advanced Chip Packaging Market Overview
• 11.2. Japan Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.3. Japan Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 11.4. Japan Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

12. Australia Advanced Chip Packaging Market

• 12.1. Australia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.2. Australia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 12.3. Australia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

13. Indonesia Advanced Chip Packaging Market

• 13.1. Indonesia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.2. Indonesia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 13.3. Indonesia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

14. South Korea Advanced Chip Packaging Market

• 14.1. South Korea Advanced Chip Packaging Market Overview
• 14.2. South Korea Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.3. South Korea Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 14.4. South Korea Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

15. Western Europe Advanced Chip Packaging Market

• 15.1. Western Europe Advanced Chip Packaging Market Overview
• 15.2. Western Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.3. Western Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 15.4. Western Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

16. UK Advanced Chip Packaging Market

• 16.1. UK Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.2. UK Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 16.3. UK Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

17. Germany Advanced Chip Packaging Market

• 17.1. Germany Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.2. Germany Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 17.3. Germany Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

18. France Advanced Chip Packaging Market

• 18.1. France Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.2. France Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 18.3. France Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

19. Italy Advanced Chip Packaging Market

• 19.1. Italy Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.2. Italy Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 19.3. Italy Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

20. Spain Advanced Chip Packaging Market

• 20.1. Spain Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.2. Spain Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 20.3. Spain Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

21. Eastern Europe Advanced Chip Packaging Market

• 21.1. Eastern Europe Advanced Chip Packaging Market Overview
• 21.2. Eastern Europe Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.3. Eastern Europe Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 21.4. Eastern Europe Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

22. Russia Advanced Chip Packaging Market

• 22.1. Russia Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.2. Russia Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 22.3. Russia Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

23. North America Advanced Chip Packaging Market

• 23.1. North America Advanced Chip Packaging Market Overview
• 23.2. North America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.3. North America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 23.4. North America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

24. USA Advanced Chip Packaging Market

• 24.1. USA Advanced Chip Packaging Market Overview
• 24.2. USA Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.3. USA Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 24.4. USA Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

25. Canada Advanced Chip Packaging Market

• 25.1. Canada Advanced Chip Packaging Market Overview
• 25.2. Canada Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.3. Canada Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 25.4. Canada Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

26. South America Advanced Chip Packaging Market

• 26.1. South America Advanced Chip Packaging Market Overview
• 26.2. South America Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.3. South America Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 26.4. South America Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

27. Brazil Advanced Chip Packaging Market

• 27.1. Brazil Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.2. Brazil Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 27.3. Brazil Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

28. Middle East Advanced Chip Packaging Market

• 28.1. Middle East Advanced Chip Packaging Market Overview
• 28.2. Middle East Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.3. Middle East Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 28.4. Middle East Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

29. Africa Advanced Chip Packaging Market

• 29.1. Africa Advanced Chip Packaging Market Overview
• 29.2. Africa Advanced Chip Packaging Market, Segmentation By Packaging, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.3. Africa Advanced Chip Packaging Market, Segmentation By Technology, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion
• 29.4. Africa Advanced Chip Packaging Market, Segmentation By End-Use Industry, Historic and Forecast, 2019-2024, 2024-2029F, 2034F, $ Billion

30. Advanced Chip Packaging Market Competitive Landscape And Company Profiles

• 30.1. Advanced Chip Packaging Market Competitive Landscape
• 30.2. Advanced Chip Packaging Market Company Profiles
  • 30.2.1. Samsung Electronics Co. Ltd. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.2. Advanced Micro Devices Inc. Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.3. Advanced Semiconductor Engineering Inc Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.4. Henkel Group Overview, Products and Services, Strategy and Financial Analysis
  • 30.2.5. Texas Instruments Incorporated Overview, Products and Services, Strategy and Financial Analysis

31. Advanced Chip Packaging Market Other Major And Innovative Companies

• 31.1. Lam Research Corporation
• 31.2. NXP Semiconductors
• 31.3. Onsemi
• 31.4. Amkor Technology
• 31.5. Nordson Corporation
• 31.6. Siliconware Precision Industries Co. Ltd.
• 31.7. Kulicke and Soffa Industries Inc.
• 31.8. ChipMOS Technologies Inc.
• 31.9. SUSS MicroTec SE
• 31.10. EV Group
• 31.11. Indium Corporation
• 31.12. Palomar Technologies
• 31.13. Brewer Science Inc.
• 31.14. MacDermid Alpha Electronics Solutions
• 31.15. Universal Instruments Corporation

32. Global Advanced Chip Packaging Market Competitive Benchmarking And Dashboard

33. Key Mergers And Acquisitions In The Advanced Chip Packaging Market

34. Recent Developments In The Advanced Chip Packaging Market

35. Advanced Chip Packaging Market High Potential Countries, Segments and Strategies

• 35.1 Advanced Chip Packaging Market In 2029 - Countries Offering Most New Opportunities
• 35.2 Advanced Chip Packaging Market In 2029 - Segments Offering Most New Opportunities
• 35.3 Advanced Chip Packaging Market In 2029 - Growth Strategies
  • 35.3.1 Market Trend Based Strategies
  • 35.3.2 Competitor Strategies

36. Appendix

• 36.1. Abbreviations
• 36.2. Currencies
• 36.3. Historic And Forecast Inflation Rates
• 36.4. Research Inquiries
• 36.5. The Business Research Company
• 36.6. Copyright And Disclaimer