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高密度相互接続の世界市場

High Density Interconnect

出版日
ページ情報
英文 92 Pages
納期
即日から翌営業日
適宜更新あり
価格
価格表記: USDを日本円(税抜)に換算
本日の銀行送金レート: 1USD=146.99円
高密度相互接続の世界市場
出版日: 2024年10月18日
発行: Global Industry Analysts, Inc.
ページ情報: 英文 92 Pages
納期: 即日から翌営業日
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  • 概要
  • 目次
概要

高密度相互接続の世界市場は2030年までに449億米ドルに達する見込み

2023年に209億米ドルと推定される高密度相互接続の世界市場は、分析期間2023-2030年にCAGR 11.5%で成長し、2030年には449億米ドルに達すると予測されます。本レポートで分析したセグメントの1つである4-6層は、CAGR 9.6％を記録し、分析期間終了時には104億米ドルに達すると予想されます。8-10レイヤーセグメントの成長率は、分析期間中CAGR 11.6%と推定されます。

米国市場は57億米ドルと推定、中国はCAGR 10.9％で成長予測

米国の高密度相互接続市場は、2023年に57億米ドルと推定されます。世界第2位の経済大国である中国は、2030年までに69億米ドルの市場規模に達すると予測され、分析期間2023-2030年のCAGRは10.9%です。その他の注目すべき地域別市場としては、日本とカナダがあり、分析期間中のCAGRはそれぞれ9.7%と9.8%と予測されています。欧州では、ドイツがCAGR約8.2%で成長すると予測されています。

世界の高密度相互接続市場- 主要動向と促進要因のまとめ

なぜ高密度相互接続（HDI）技術がエレクトロニクスに不可欠なのか？

高密度相互接続（HDI）技術は、特にスマートフォン、ノートパソコン、ウェアラブル端末、車載用電子機器、医療機器に使用されるプリント基板（PCB）の設計・製造において、現代のエレクトロニクスに不可欠な要素となっています。HDI PCBは、より微細なラインやスペース、より小さなビア、より高密度に実装された部品を組み込むことで、より複雑な回路設計を可能にします。これにより、メーカーはより小型・軽量で高速なデバイスを生産し、性能を向上させることができます。HDI技術は、大きな演算能力と接続性を必要とする高性能エレクトロニクスの開発に不可欠であり、スペースの制約と信頼性が最優先されるIT・通信、航空宇宙、自動車などの業界にとって不可欠な技術となっています。

技術の進歩はHDI市場をどのように牽引しているか？

小型化と電子設計の技術進歩がHDI技術の需要を牽引しています。民生用電子機器の小型化と多機能化に伴い、より小型で効率的なPCBへのニーズが高まっています。レーザードリルやスタックド・マイクロビアのような高度な製造技術の開発により、HDI PCBの機能が強化され、シグナルインテグリティを損なうことなく回路密度を高めることができるようになりました。さらに、5Gネットワークとモノのインターネット（IoT）の台頭により、デバイスがより高速なデータ伝送と高い接続性を必要とするため、HDI技術への需要が高まっています。これらの進歩により、HDI PCBの製造コスト効率も向上し、より幅広いアプリケーションへの採用が拡大しています。

市場セグメンテーションはHDI市場の成長をどのように規定しているか？

HDIの種類には、4～6層、8～10層、10層以上があり、スマートフォンやタブレットなどの民生用電子機器への応用により、4～6層セグメントが優位を占めています。HDI PCBの最終用途産業には、通信、自動車、航空宇宙、ヘルスケア、産業用電子機器などがあります。通信は、スマートフォンと5Gインフラの普及に牽引され、依然として最大セグメントです。自動車業界も、特にADAS（先進運転支援システム）や電気自動車（EV）の開発でHDI技術の採用が急増しています。地域別ではアジア太平洋が市場をリードしており、中国、日本、韓国などがエレクトロニクス製造の主要拠点となっています。

高密度相互接続市場の成長を促進する要因とは？

高密度相互接続市場の成長は、小型化された電子機器に対する需要の増加、5Gネットワークの拡大、PCB製造技術の進歩など、いくつかの要因によって牽引されています。特にスマートフォンやウェアラブル端末などの民生用電子機器分野は、メーカーがより小型、高速、高性能なデバイスの実現を目指す中で、HDI採用の大きな原動力となっています。自動車業界では、ADASや車載インフォテインメント・システムにより高度な電子回路が必要となるため、電動化と自動化を推進する動きがHDI技術の需要を押し上げています。さらに、5Gネットワークの展開は、高速データ伝送と待ち時間の短縮が重要な通信インフラにおけるHDI PCBの必要性を高めています。レーザー穴あけや材料の改良など、HDI製造における技術革新は、HDI PCBの性能向上とコスト削減によって市場の成長をさらに促進しています。

調査対象企業の例（注目の36社）

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

目次

第1章 調査手法

第2章 エグゼクティブサマリー

  • 市場概要
  • 主要企業
  • 市場動向と促進要因
  • 世界市場の見通し

第3章 市場分析

  • 米国
  • カナダ
  • 日本
  • 中国
  • 欧州
  • フランス
  • ドイツ
  • イタリア
  • 英国
  • その他欧州
  • アジア太平洋
  • その他の地域

第4章 競合

目次
Product Code: MCP21955

Global High Density Interconnect Market to Reach US$44.9 Billion by 2030

The global market for High Density Interconnect estimated at US$20.9 Billion in the year 2023, is expected to reach US$44.9 Billion by 2030, growing at a CAGR of 11.5% over the analysis period 2023-2030. 4-6 Layers, one of the segments analyzed in the report, is expected to record a 9.6% CAGR and reach US$10.4 Billion by the end of the analysis period. Growth in the 8-10 Layers segment is estimated at 11.6% CAGR over the analysis period.

The U.S. Market is Estimated at US$5.7 Billion While China is Forecast to Grow at 10.9% CAGR

The High Density Interconnect market in the U.S. is estimated at US$5.7 Billion in the year 2023. China, the world's second largest economy, is forecast to reach a projected market size of US$6.9 Billion by the year 2030 trailing a CAGR of 10.9% over the analysis period 2023-2030. Among the other noteworthy geographic markets are Japan and Canada, each forecast to grow at a CAGR of 9.7% and 9.8% respectively over the analysis period. Within Europe, Germany is forecast to grow at approximately 8.2% CAGR.

Global High Density Interconnect Market - Key Trends and Drivers Summarized

Why Is High Density Interconnect (HDI) Technology Crucial for Electronics?

High Density Interconnect (HDI) technology has become an essential component of modern electronics, particularly in the design and manufacturing of printed circuit boards (PCBs) used in smartphones, laptops, wearables, automotive electronics, and medical devices. HDI PCBs allow for more complex circuit designs by incorporating finer lines and spaces, smaller vias, and more densely packed components. This enables manufacturers to produce smaller, lighter, and faster devices with enhanced performance. HDI technology is critical in the development of high-performance electronics that require significant computing power and connectivity, making it indispensable for industries like telecommunications, aerospace, and automotive, where space constraints and reliability are paramount.

How Are Technological Advancements Driving the HDI Market?

Technological advancements in miniaturization and electronic design are driving the demand for HDI technology. As consumer electronics become more compact and feature-rich, the need for smaller, more efficient PCBs has increased. The development of advanced fabrication techniques, such as laser drilling and stacked microvias, has enhanced the capabilities of HDI PCBs, allowing for higher circuit density without compromising signal integrity. Additionally, the rise of 5G networks and the Internet of Things (IoT) has increased the demand for HDI technology, as devices require faster data transmission and greater connectivity. These advancements are also making HDI PCBs more cost-effective to produce, expanding their adoption across a wider range of applications.

How Are Market Segments Defining the Growth of the HDI Market?

HDI types include 4-6 layers, 8-10 layers, and 10+ layers, with the 4-6 layer segment dominating due to its application in consumer electronics such as smartphones and tablets. The end-use industries for HDI PCBs include telecommunications, automotive, aerospace, healthcare, and industrial electronics. Telecommunications remains the largest segment, driven by the proliferation of smartphones and 5G infrastructure. The automotive industry is also witnessing rapid growth in the adoption of HDI technology, particularly in the development of advanced driver assistance systems (ADAS) and electric vehicles (EVs). Regionally, Asia-Pacific leads the market, with countries like China, Japan, and South Korea being major hubs for electronics manufacturing.

What Factors Are Driving the Growth in the High Density Interconnect Market?

The growth in the high density interconnect market is driven by several factors, including the increasing demand for miniaturized electronic devices, the expansion of 5G networks, and advancements in PCB fabrication technologies. The consumer electronics sector, particularly smartphones and wearables, is a major driver of HDI adoption as manufacturers seek to create smaller, faster, and more powerful devices. The automotive industry's push toward electrification and automation is also boosting demand for HDI technology, as more sophisticated electronics are required for ADAS and in-car infotainment systems. Additionally, the rollout of 5G networks is driving the need for HDI PCBs in telecommunications infrastructure, where high-speed data transmission and reduced latency are critical. Technological innovations in HDI fabrication, such as laser drilling and improved materials, are further propelling market growth by enhancing the performance and reducing the costs of HDI PCBs.

Select Competitors (Total 36 Featured) -

  • Austria Technologie & Systemtechnik
  • CMK
  • Compeq Co.,
  • Daeduck GDS Co.,
  • EPEC
  • Fujitsu Interconnect Technologies
  • Kingboard Holdings
  • Meiko Electronics Co.,
  • Multek
  • Ncab Group
  • Shenzhen Kinwong Electronic Co.,
  • Sierra Circuits
  • TTM Technologies
  • Unimicron
  • Zhen Ding Tech

TABLE OF CONTENTS

I. METHODOLOGY

II. EXECUTIVE SUMMARY

  • 1. MARKET OVERVIEW
    • Influencer Market Insights
    • World Market Trajectories
    • Global Economic Update
    • High Density Interconnect - Global Key Competitors Percentage Market Share in 2024 (E)
    • Competitive Market Presence - Strong/Active/Niche/Trivial for Players Worldwide in 2024 (E)
  • 2. FOCUS ON SELECT PLAYERS
  • 3. MARKET TRENDS & DRIVERS
    • Rising Demand for Miniaturized Electronic Devices Drives Growth in HDI Technology
    • Technological Advancements in PCB Manufacturing Propel Adoption of HDI Solutions
    • Increasing Focus on Lightweight and Compact Consumer Electronics Expands Addressable Market for HDI
    • Growing Adoption of HDI in Automotive Electronics Spurs Market Innovation
    • Surge in Demand for High-Speed and High-Performance PCBs Strengthens Business Case for HDI
    • Rising Use of HDI in Medical Devices and Wearable Electronics Propels Market Growth
    • Technological Integration of HDI with IoT and 5G Networks Expands Market Opportunities
    • Growing Focus on Reducing PCB Weight and Thickness Spurs Innovation in HDI Designs
    • Expansion of Advanced Driver Assistance Systems (ADAS) Drives Demand for HDI in Automotive Sector
    • Increasing Use of HDI in Aerospace and Defense Applications Sustains Market Growth
    • Rising Popularity of Flexible and Rigid-Flex HDI PCBs Expands Market Opportunities
    • Surge in Demand for Multilayer PCBs in Telecommunications Propels Growth in HDI Market
    • Regulatory Approvals for HDI PCBs in Medical and Automotive Sectors Drive Adoption
  • 4. GLOBAL MARKET PERSPECTIVE
    • TABLE 1: World Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 2: World Historic Review for High Density Interconnect by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 3: World 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets for Years 2014, 2024 & 2030
    • TABLE 4: World Recent Past, Current & Future Analysis for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 5: World Historic Review for 4-6 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 6: World 16-Year Perspective for 4-6 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 7: World Recent Past, Current & Future Analysis for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 8: World Historic Review for 8-10 Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 9: World 16-Year Perspective for 8-10 Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 10: World Recent Past, Current & Future Analysis for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 11: World Historic Review for 10+ Layers by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 12: World 16-Year Perspective for 10+ Layers by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 13: World Recent Past, Current & Future Analysis for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 14: World Historic Review for Other Applications by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 15: World 16-Year Perspective for Other Applications by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 16: World Recent Past, Current & Future Analysis for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 17: World Historic Review for Computer & Display by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 18: World 16-Year Perspective for Computer & Display by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 19: World Recent Past, Current & Future Analysis for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 20: World Historic Review for Communication Devices & Equipment by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 21: World 16-Year Perspective for Communication Devices & Equipment by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 22: World Recent Past, Current & Future Analysis for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 23: World Historic Review for Automotive Electronics by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 24: World 16-Year Perspective for Automotive Electronics by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 25: World Recent Past, Current & Future Analysis for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 26: World Historic Review for Connected Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 27: World 16-Year Perspective for Connected Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 28: World Recent Past, Current & Future Analysis for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 29: World Historic Review for Wearable Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 30: World 16-Year Perspective for Wearable Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030
    • TABLE 31: World High Density Interconnect Market Analysis of Annual Sales in US$ Million for Years 2014 through 2030
    • TABLE 32: World Recent Past, Current & Future Analysis for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 33: World Historic Review for Audio / Audiovisual (AV) Devices by Geographic Region - USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 34: World 16-Year Perspective for Audio / Audiovisual (AV) Devices by Geographic Region - Percentage Breakdown of Value Sales for USA, Canada, Japan, China, Europe, Asia-Pacific and Rest of World for Years 2014, 2024 & 2030

III. MARKET ANALYSIS

  • UNITED STATES
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United States for 2024 (E)
    • TABLE 35: USA Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 36: USA Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 37: USA 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 38: USA Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 39: USA Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 40: USA 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CANADA
    • TABLE 41: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 42: Canada Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 43: Canada 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 44: Canada Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 45: Canada Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 46: Canada 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • JAPAN
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Japan for 2024 (E)
    • TABLE 47: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 48: Japan Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 49: Japan 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 50: Japan Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 51: Japan Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 52: Japan 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • CHINA
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in China for 2024 (E)
    • TABLE 53: China Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 54: China Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 55: China 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 56: China Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 57: China Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 58: China 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • EUROPE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Europe for 2024 (E)
    • TABLE 59: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2023 through 2030 and % CAGR
    • TABLE 60: Europe Historic Review for High Density Interconnect by Geographic Region - France, Germany, Italy, UK and Rest of Europe Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 61: Europe 16-Year Perspective for High Density Interconnect by Geographic Region - Percentage Breakdown of Value Sales for France, Germany, Italy, UK and Rest of Europe Markets for Years 2014, 2024 & 2030
    • TABLE 62: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 63: Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 64: Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 65: Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 66: Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 67: Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • FRANCE
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in France for 2024 (E)
    • TABLE 68: France Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 69: France Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 70: France 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 71: France Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 72: France Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 73: France 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • GERMANY
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Germany for 2024 (E)
    • TABLE 74: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 75: Germany Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 76: Germany 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 77: Germany Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 78: Germany Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 79: Germany 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ITALY
    • TABLE 80: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 81: Italy Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 82: Italy 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 83: Italy Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 84: Italy Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 85: Italy 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • UNITED KINGDOM
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in the United Kingdom for 2024 (E)
    • TABLE 86: UK Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 87: UK Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 88: UK 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 89: UK Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 90: UK Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 91: UK 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF EUROPE
    • TABLE 92: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 93: Rest of Europe Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 94: Rest of Europe 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 95: Rest of Europe Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 96: Rest of Europe Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 97: Rest of Europe 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • ASIA-PACIFIC
    • High Density Interconnect Market Presence - Strong/Active/Niche/Trivial - Key Competitors in Asia-Pacific for 2024 (E)
    • TABLE 98: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 99: Asia-Pacific Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 100: Asia-Pacific 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 101: Asia-Pacific Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 102: Asia-Pacific Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 103: Asia-Pacific 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030
  • REST OF WORLD
    • TABLE 104: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 105: Rest of World Historic Review for High Density Interconnect by Product Type - 4-6 Layers, 8-10 Layers and 10+ Layers Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 106: Rest of World 16-Year Perspective for High Density Interconnect by Product Type - Percentage Breakdown of Value Sales for 4-6 Layers, 8-10 Layers and 10+ Layers for the Years 2014, 2024 & 2030
    • TABLE 107: Rest of World Recent Past, Current & Future Analysis for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices - Independent Analysis of Annual Sales in US$ Million for the Years 2023 through 2030 and % CAGR
    • TABLE 108: Rest of World Historic Review for High Density Interconnect by Application - Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices Markets - Independent Analysis of Annual Sales in US$ Million for Years 2014 through 2022 and % CAGR
    • TABLE 109: Rest of World 16-Year Perspective for High Density Interconnect by Application - Percentage Breakdown of Value Sales for Other Applications, Computer & Display, Communication Devices & Equipment, Automotive Electronics, Audio / Audiovisual (AV) Devices, Connected Devices and Wearable Devices for the Years 2014, 2024 & 2030

IV. COMPETITION